Abstract: A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z0; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an in

Abstract: The present invention is directed by a capacitor comprising of dielectrics formed of a plastic film in which ceramic particles are dispersed. The plastic film is manufactured by the processes comprising the steps of coating the ceramic particles with wax, dispersing the wax-coated ceramic particles in a molten plastic, and extruding the molten plastic in which ceramic particles are dispersed into a think film.

Abstract: A high energy density, high power density capacitor having an energy density of at least about 0.5 J/cm.sup.3 is provided. The capacitor comprises a plurality of interleaved metal electrode layers separated by a polymer layer. The interleaved metal electrode layers terminate at opposite ends in a solder termination strip. The high energy density aspect of the capacitors of the invention is achieved by at least one of the following features: (a) the dielectric thickness between the interleaved metal electrode layers is a maximum of about 5 .mu.m; (b) the polymer is designed with a high dielectric constant .kappa. of at least about 3.5; (c) the metal electrode layers within the polymer layer are recessed along edges orthogonal to the solder termination strips to prevent arcing between the metal electrode layers at the edges; and (d) the resistivity of the metal electrode layers is within the range of about 10 to 500 ohms per square, or a corresponding thickness of about 200 to 30 .ANG..

Abstract: A radio frequency apparatus has a tuner unit which is disposed in a tuner unit housing, and a demodulation unit which is disposed in a demodulation unit housing easily attached or removed to the tuner unit housing by a connecting device provided on side walls of the tuner unit housing and the demodulation unit housing.

Abstract: An assembly and method of assembly for shielding a radio telephone. First and second shields are disposed either side of a circuit board and urged together thereby sandwiching the circuit board. The first shield is relatively rigid compared to the second shield and can cause any deformities in the second shield to be compensated for by the second shield being urged against a rigid first shield, the shields may be removably coupled together which permits simple and quick disassembly if changes or repairs need to be made to the radio telephone.

Abstract: A ceramic multi-layer capacitor which uses specifically formulated electrode inks comprising a mixture of thermoplastic vehicles in combination with finely divided metal powders. The resultant thermoplastic electrode ink can be screen printed onto dielectric ware and immediately laminated, without a drying step. Multi-layer designs may be 50 or more layers wherein the thermoplastic components volatize at an appropriate time/temperature schedule to prevent slumping or delamination and to be chemically compatible with the organic binder components in the dielectric ware.