Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.

Abstract: A ceramic electronic device includes a multilayer body in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. In at least a part of a cover layer and side margins, a concentration of a specific metal of at least one of Ag, As, Au, Bi, Co, Cr, Cu, Fe, Ge, In, Ir, Mo, Os, Pd, Pt, Re, Rh, Ru, Se, Sn, Te, W or Zn is lower on an outer side than on a side of the multilayer body.

Abstract: In the sintered electrode layer covering the one end face, a wraparound dimension of a wraparound portion wrapping around from the one end face to the one main face in the facing direction is set to a dimension b, a distance between the one end face and the end portions of the plurality of second internal electrodes on the one end face side in the facing direction is set to a dimension Lg, a distance between the pair of main faces in the stacking direction is set to a dimension T, and a distance between the one main face and the second internal electrode closest to the one main face is set to a dimension Tg1, a relational expression of Lg>b?(2×b×Tg1/T) is satisfied.

Abstract: A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

Abstract: A CaTiO3—TiO2 composite electrode and method of making is described. The composite electrode comprises a substrate with an average 2-12 ?m thick layer of CaTiO3—TiO2 composite particles having average diameters of 0.2-2.2 ?m. The method of making the composite electrode involves contacting the substrate with an aerosol comprising a solvent, a calcium complex, and a titanium complex. The CaTiO3—TiO2 composite electrode is capable of being used in a photoelectrochemical cell for water splitting.

Abstract: In a multilayer ceramic capacitor, an intersection of an interface is defined by a second dielectric ceramic layer, a first internal electrode layer or a second internal electrode layer, and a third dielectric ceramic layer, on a plane including a length direction and a width direction, the second dielectric ceramic layer and the third dielectric ceramic layer include a near intersection region at or near the intersection, and an average particle size of dielectric particles in the near intersection region is smaller than average particle sizes of dielectric particles in the first dielectric ceramic layer, the second dielectric ceramic layer, and the third dielectric ceramic layer.

Abstract: A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. A ratio of min to max is not less than about 36% and not more than about 90%, where A1, A2, A3, and A4 respectively denote the surface areas of first, second, third, and fourth external electrodes that are located on the first or second main surface of the stacked body.

Abstract: A multilayer ceramic capacitor has a body including first and second internal electrodes laminated with a dielectric layer interposed therebetween, and having fifth and sixth surfaces opposing each other, third and fourth surfaces opposing each other, and first and second surfaces opposing each other. A first through-electrode penetrates through the body to be connected to the first internal electrode, and a second through-electrode penetrates through the body to be connected to the second internal electrode. First and second external electrodes are disposed on the first and second surfaces, respectively, and third and fourth external electrodes are disposed on the first and second surfaces, respectively, to be spaced apart from the first and second external electrodes. Each of the first to fourth external electrodes is a respective sintered electrode including nickel.

Abstract: A multilayer ceramic capacitor includes a body including first and second internal electrodes laminated with a respective dielectric layer interposed therebetween, and having fifth and sixth surfaces opposing each other, third and fourth surfaces opposing each other, and first and second surfaces opposing each other. A first through-electrode penetrates through the body to be connected to the first internal electrode, a second through-electrode penetrates through the body to be connected to the second internal electrode, first and second external electrodes are disposed on the first and second surfaces, respectively, and third and fourth external electrodes are disposed on the first and second surfaces, respectively, to be spaced apart from the first and second external electrodes. Each of the first and second through-electrodes has a taper.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multi-layer ceramic capacitor according to an embodiment of the present invention includes a multi-layer, side margins and offset sections. The multi-layer includes internal electrodes and dielectric layers alternately laminated. The side margins are configured of a dielectric and disposed to cover side faces of the multi-layer. The offset sections are made with amorphous areas or gap areas. The offset sections are formed between the internal electrodes and the side margins such that ends at side faces of the internal electrodes are offset from the side faces to an inward direction of the multi-layer.

Abstract: A multilayer capacitor includes a capacitor body including a multilayer structure of a dielectric layer and a plurality of internal electrodes; and an external electrode including a conductive layer and a conductive resin layer covering the conductive layer. The conductive layer includes an inner connecting portion disposed on a surface of the capacitor body and connected to the internal electrodes, and an inner band portion extending from the inner connecting portion to a portion of a mounting surface of the capacitor body. The conductive resin layer includes an outer connecting portion disposed on the inner connecting portion, and an outer band portion extending from the outer connecting portion to a portion of the mounting surface and covering the inner band portion. A ratio of a length of the inner band portion to a length of the outer band portion is 0.3 to 0.7.

Abstract: An electronic device includes a component body and a terminal electrode formed on a mounting surface of the component body. The chamfered part is formed at an intersection between the mounting surface and a side surface of the component body. An edge of the terminal electrode becomes thinner toward the chamfered part.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein each of the first and second side margin portions is divided into a first region adjacent to an outer side surface of the side margin portion and a second region adjacent to the internal electrodes exposed to the first and second surfaces, and a content of magnesium (Mg) contained in the second region is higher than a content of magnesium (Mg) contained in the first region.

Abstract: To improve a mounting reliability while maintaining a thickness of the external electrode at a side face of a multilayer electronic component thin. The multilayer electronic component includes ceramic body in which ceramic layers and an external electrode formed to an end face of the ceramic body. The upper electrode layer includes an element having higher standard electrode potential than Cu. The external electrode includes an external electrode end part and an external electrode extension part which is integrally formed with the external electrode end part. 1.20?t2/t1?4.50 is satisfied in which t1 is a total thickness of a thickness of the intermediate electrode layer thickness and t2 is a length from an end of the base electrode layer to an end of the upper electrode layer along the first axis of the external electrode extension part connected by the conductive adhesive.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including a conductive powder including one or more of tungsten (W), molybdenum (Mo), chromium (Cr), and cobalt (Co), the sum of which is 1 to 20 wt %, and including tin (Sn), on the ceramic green sheet, forming a ceramic multilayer structure by stacking ceramic green sheets on which the internal electrode pattern is formed, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other; a plurality of internal electrodes disposed in the ceramic body; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein the ceramic body includes an active portion, and cover portions disposed on upper and lower surfaces of the active portion, each of the first and second side margin portions is divided into a first region and a second region, each of the cover portions is divided into a first region and a second region, and contents of magnesium (Mg) contained in the second regions of the cover portions and the first and second side margin portions are larger than those of magnesium (Mg) contained in the first regions thereof, respectively.

Abstract: A laminated ceramic capacitor has a capacitor body of roughly a rectangular solid shape defined by the length, width, and height, as well as a concaved part formed at and along the edges of one side and the other side in the height direction. An external electrode has a base conductor layer whose height-direction wrap-around part is formed inside the concaved part, and a main conductor layer whose height-direction wrap-around part is formed continuously over the height-direction wrap-around part of the base conductor layer through the planar part, except for the concaved part, of one side and the other side of the component body in the height direction. The height-direction wrap-around part of the main conductor layer has a planar connecting area constituted by a surface area over the height-direction wrap-around part of the base conductor layer and a surface area over the planar part of the component body.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layers and termination caps comprising a base metal may be cladded with a noble metal to lower costs without the tendency of base metal atoms combining with oxygen atoms in the dielectric material as the base metal does not physically contact the dielectric material. The conductive layers may comprise a wavy shape, and may comprise conductive layer ends modified to minimize or eliminate sharp edges and corners, such as comprising a convex, wavy, or bulbous shape. The noble metal portion of a conductive layer may be a minimum thickness required to prevent chemical reactions between the base metal portion and the dielectric material. In conjunction with computer modeling of Laplace's equation, the conductors can be reshaped at little material cost to make the electric field nearly uniform through adjustments of the base metal portion.

Abstract: A multilayer ceramic capacitor includes a laminate of ceramic layers and internal electrodes, and a pair of external electrodes located on both end surfaces of the laminate and electrically connected to the internal electrodes. Each of the pair of external electrodes includes an underlying electrode layer on the surface of the laminate and including Cu, a bonding portion partially provided on a surface of the underlying electrode layer and including a Cu3Sn alloy, and a conductive resin layer provided on surfaces of the underlying electrode layer and the bonding portion, and a total area of the bonding portion is not less than about 2.7% and not more than about 40.6% of a total area of the underlying electrode layer.

Abstract: A multilayer ceramic capacitor includes a body portion and an external electrode. The body portion has an active region in which capacitance is formed by a plurality of stacked internal electrodes having dielectric layers therebetween, a cover region disposed above the topmost and below the bottommost internal electrodes, and a side margin region disposed laterally adjacent to the active region. The plurality of internal electrodes are not formed in the cover and side margin regions. The body portion may have different additive concentrations depending on a thickness direction, and a concentration of the additive in a region of the side margin laterally adjacent to a dielectric layer of the body portion may be higher than a concentration of the additive in another region of the side margin laterally adjacent to an internal electrode of the body portion.

Abstract: A piezoelectric multilayer component having a stack of sintered piezoelectric layers and inner electrodes arranged between the piezoelectric layers. A region which has poling cracks is present on the surface of at least one electrode, and the poling cracks are separated from a surface of at least one of the inner electrodes by the region having the poling cracks.

Abstract: Improved method steps for making a multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrodes and insulating substrates are provided in an interleaved arrangement and selected portions of the electrodes are exposed along selected edges of the substrates. Anchor tabs, which are not in direct contact with the electrodes and offer additional nucleation points for plated structures, may also optionally be provided and exposed in some embodiments.

Abstract: Improved method steps for making a multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrodes and insulating substrates are provided in an interleaved arrangement and selected portions of the electrodes are exposed along selected edges of the substrates. Anchor tabs, which are not in direct contact with the electrodes and offer additional nucleation points for plated structures, may also optionally be provided and exposed in some embodiments.

Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.

Abstract: A multilayer ceramic capacitor includes a ceramic body, and external electrodes on opposite side surfaces of the ceramic body. The ceramic body includes an inner layer portion including a plurality of ceramic layers, and first and second internal electrodes each arranged at interfaces between the ceramic layers defining the inner layer portion, and also includes outer layer portions arranged on an upper surface and a lower surface of the inner layer portion. The ceramic layers defining the inner layer portion include as a main component a perovskite-type compound containing Ba and Ti. The amount of Mg contained in the ceramic layers defining the inner layer portion preferably is 0 to about 0.4 part by mole per 100 parts by mole of Ti, for example. The thickness of the ceramic layers defining the inner layer portion preferably is not more than about 0.55 ?m, for example.

Abstract: In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.

Abstract: A laminated ceramic capacitor that includes a laminated body including dielectric ceramic layers having crystal grains and crystal grain boundaries, and including internal electrode layers. An external electrode is formed on a surface of the laminated body, and is electrically connected to the internal electrode layers exposed at the surface of the laminated body. The laminated body has a composition including a calcium zirconate based perovskite-type compound as a main constituent, and further including Mn, Sr, and Si. When the laminated body is dissolved, the Si contained therein is 0.1 parts by mol or more and 10 parts by mol or less with respect to 100 parts by mol of Zr, and the molar ratio of Mn to Sr is 0.3 or more and 3.2 or less.

Abstract: A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m?3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positioned on both opposing surfaces and having the same polarity as that of the first and second inner electrodes, and classified into a plurality of groups depending on the locations of the outer electrodes connected to the first and second inner electrodes. At least one of two outer electrodes connected with inner electrodes of each group is different from an outer electrode connected with inner electrodes of a different group having the same polarity, and inner electrodes of one group are connected to outer electrodes connected with at least another one group so that all the inner electrodes belonging to the same polarity can be electrically connected.

Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 ?m or more.

Abstract: A dielectric ceramic which is suitable for use in a laminated ceramic capacitor under a high-temperature environment, such as encountered in, for example, automobile use has a composition represented by the composition formula: (1?x) (Ba1-yCay)mTiO3+xCaTiO3+aRe2O3+bMgO+cMnO+dV2O3+eSiO2 in which Re is Gd, Dy, Y, Ho, and/or Er), 0.001?x?0.02, 0.08?y?0.20, 0.99?m?1.05, 0.01?a?0.04, 0.005?b?0.035, 0?c?0.01, 0?d?0.01, 0.01?e?0.04 when a, b, c, d, and e are each expressed in terms of parts by mol with respect to 1 mol of (1?x) (Ba,Ca)TiO3+xCaTiO3. This dielectric ceramic can constitute the dielectric ceramic layers of a laminated ceramic capacitor.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes a plurality of holes. An average opening diameter of the plurality of holes is not greater than about 2.5 ?m. Some or all of the plurality of holes are embedded with the metal component of the outer external electrode.

Abstract: There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.

Abstract: Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.

Abstract: Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other.

Abstract: A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.

Abstract: There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20?a?60, 20?b?60, and 2?c?25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.

Abstract: In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2?d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV.

Abstract: A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode.

Abstract: There is provided a multilayered ceramic capacitor capable of being implementing as a micro supercapacitor capable of minimizing a mounting area and increasing a mounting efficiency thereof. The multilayered ceramic capacitor includes a capacitor body in which a plurality of dielectric layers having a size of 1.6 mm in length and 0.8 mm in width are stacked; an internal electrode unit having a plurality of internal electrodes arranged on each of the plurality of dielectric layers; and an external electrode unit, having a plurality of external electrodes horizontally arranged in the capacitor body and electrically connected to the internal electrodes.

Abstract: A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.

Abstract: A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region.

Abstract: There are provided a conductive paste composition for an internal electrode and a multilayer ceramic capacitor including the same. The conductive paste composition for an internal electrode includes metal powder; and chrome oxide (Cr2O3) or titanium oxide (TiO2) powder having a melting point higher than the melting point of the metal powder. The conductive paste composition for an internal electrode may increase a sintering shrinkage temperature of the internal electrode and improve connection properties of the internal electrode.

Abstract: A laminated ceramic capacitor which provides favorable properties and characteristics such as dielectric characteristics, insulation properties, temperature characteristics, and high temperature load characteristics and provides favorable thermal shock resistance, even when dielectric ceramic layers are reduced in layer thickness to increase the number of layers has dielectric ceramic layers containing, as their main constituent, a barium titanate based compound represented by the general formula ABO3 and internal electrodes containing Ni as their main constituent, which are stacked alternately. A crystalline oxide containing at least Mg and Li is present in at least either one of the internal electrodes and the dielectric ceramic layers. The crystalline oxide is preferably present mostly in contact with Ni in the internal electrodes.

Abstract: In an electronic component, a first external electrode includes a first side surface electrode provided on a first side surface and a substantially rectangular first principal surface electrode that is connected to the first side surface electrode and provided on a principal surface so as to be in contact with a first corner of the principal surface. A second external electrode includes a second side surface electrode that is connected to a capacitor conductor and provided on a second side surface and a substantially rectangular second principal surface electrode that is connected to the second side surface electrode and provided on the principal surface so as to be in contact with a second corner, which is located opposite to the first corner, the second principal surface electrode facing the first principal surface electrode in an x-axis direction, in which long sides of the principal surface extend.

Abstract: A dielectric ceramic capacitor that has excellent reliability and particularly excellent life characteristics in a load test even when the thickness of a dielectric ceramic layer is reduced uses a dielectric ceramic as a dielectric ceramic layer in a laminated ceramic capacitor which is a substance containing, as the main component, (Ba, R)(Ti, V)O3 or (Ba, Ca, R)(Ti, V)O3 in which R is at least one selected from La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and in which both V and R are present uniformly in the main component particles.

Abstract: A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T2/T1 is in the range of about 3.4 to about 11.3, where T1 indicates the thickness of the first conductive layer and T2 indicates the thickness of the second conductive layer.