Abstract: Non lead-based perovskite ferroelectric devices for high density memory and logic applications and methods of fabrication are described. While various embodiments are described with reference to FeRAM, capacitive structures formed herein can be used for any application where a capacitor is desired. For example, the capacitive structure can be used for fabricating ferroelectric based or paraelectric based majority gate, minority gate, and/or threshold gate.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first dielectric layer over a substrate. A first conductive structure overlies the first dielectric layer. A data storage structure is disposed between the first dielectric layer and the first conductive structure. The data storage structure comprises a data storage layer and a grid structure. The grid structure comprises a plurality of opposing sidewalls spaced across a width of the first conductive structure. The data storage layer is disposed along the plurality of opposing sidewalls. The data storage layer comprises a first material and the grid structure comprises a second material different from the first material.

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500° C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. The ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. The thermosetting resin is thermally decomposed or burned such that little or none remains, and the nickel powder and metal powder having a melting point of lower than about 500° C. are sintered to form a unified sintered metal body.

Abstract: A multilayer ceramic capacitor includes a second alloy portion including one metal element provided in a greatest amount among metal elements of an internal electrode layer, and one or more metal elements among a metal group including Sn, In, Ga, Zn, Bi, Pb, Cu, Ag, Pd, Pt, Ph, Ir, Ru, Os, Fe, V, and Y is provided between a second dielectric ceramic layer and a first internal electrode layer, and between a second dielectric ceramic layer and a second internal electrode layer, respectively.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween in a first direction; and external electrodes connected to the internal electrodes. The body has first and second surfaces opposing each other in the first direction and one or more side surfaces positioned between the first and second surfaces. The body has a protruding portion protruding in the first direction and outer peripheral portions around the protruding portion on the first surface of the body. The external electrodes cover the outer peripheral portions, the side surfaces, and the second surface of the body. In the second surface of the body, portions that are covered by the external electrodes and a portion that is not covered by the external electrodes are substantially coplanar with each other.

Abstract: A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base portion in a longitudinal direction. The second active electrode can include at least one arm extending away from a base portion towards the first end and overlapping the central portion of the first active electrode. A first shield electrode in a shield electrode region can have a central portion extending from a base portion. A second shield electrode can include an arm overlapping the central portion of the first shield electrode in the longitudinal direction. The shield electrode region can be spaced apart from the active electrode region by a shield-to-active distance that is greater than an active electrode spacing distance between respective active electrodes of the plurality of active electrodes.

Abstract: A dielectric composition that contains a first complex oxide represented by (BixNa1-x)TiO3—CaTiO3 and having a perovskite structure as a main component; and at least one second complex oxide having a perovskite structure selected from the group consisting of BaZrO3, SrZrO3, CaZrO3, NaNbO3, and NaTaO3 as an auxiliary component. A tolerance factor t when the at least one second complex oxide is BaZrO3, NaNbO3, or NaTaO3 is 0.9016?t?0.9035, a tolerance factor t when the at least one second complex oxide is SrZrO3 is 0.9005?t?0.9025, and a tolerance factor t when the at least one second complex oxide is CaZrO3 is 0.9000?t?0.9020.

Abstract: An electronic component that includes: a ceramic body; and an external electrode on a surface of the ceramic body, wherein the external electrode includes: a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase of a titanium-containing oxide present around the granulate of the metal material; and a plating layer on the base layer.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.

Abstract: A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode. The first external electrode includes a first electrode layer disposed to be in contact with the ceramic body, and a first conductive layer disposed on the first electrode layer. The second external electrode includes a second electrode layer disposed to be in contact with the ceramic body, and a second conductive layer disposed on the second electrode layer. The first conductive layer and the second conductive layer are plating layers. The first conductive layer and the second conductive layer are porous.

Abstract: A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, and external electrodes each connected to the internal conductive layers. The internal conductive layers each include holes each having a different area equivalent diameter. The holes include first holes including ceramic pillars therein and second holes not including ceramic pillars therein. The ceramic pillars connect ceramic layers on sides of the internal conductive layers. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes existing in each of the internal conductive layers is 90% is defined as an area equivalent diameter D90, an abundance ratio of the first holes in a first population including holes each having the area equivalent diameter D90 or more is about 14% or more.

Abstract: A circuit element includes a multilayer body, internal elements inside the multilayer body, and first outer electrodes and second outer electrodes on outer surfaces of the multilayer body, and the multilayer body includes laminated base material layers. The internal elements include coil conductors connected to the second outer electrodes, the coil conductors have a winding axis in the laminating direction of the base material layers, the first outer electrodes are in contact with a mounting surface of the multilayer body, the second outer electrodes are in contact with side edges of the multilayer body and separated from the mounting surface, and maximum widths of the second outer electrodes are smaller than maximum widths of the first outer electrodes.

Abstract: A multilayer coil component includes a multilayer body in which a plurality of insulating layers are stacked and inside of which a coil is provided, and first and second outer electrodes provided on surfaces of the multilayer body and electrically connected to the coil. The multilayer body has first and second end surfaces, first and second main surfaces, and first and second side surfaces. The first outer electrode extends from at least part of the first end surface of the multilayer body across part of the first main surface and the second outer electrode extends from at least part of the second end surface of the multilayer body across part of the first main surface. A transmission coefficient S21 is ?1.0 dB or higher in a range from 1 GHz to 40 GHz and is ?1.5 dB or higher in a range from 40 GHz to 60 GHz.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately stacked on one another, and two external electrodes on two end surfaces of the multilayer body. The internal electrodes include first internal electrodes and second internal electrodes arranged alternately. A distance between the first internal electrodes adjacent to each other includes a distance T11 and a distance T12. The distance T11 is greater than the distance T12. A distance between the second internal electrodes adjacent to each other includes a distance T21 and a distance T22. The distance T21 is greater than the distance T22.

Abstract: A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a second external electrode layer on the first external electrode layer, and a plated layer on the second external electrode layer, the first external electrode layer includes Ni and dielectric particles, the second external electrode layer includes Cu and glass, and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first and second external electrode layers.

Abstract: A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers, first and second principal surfaces in a height direction, first and second lateral surfaces in a width direction, and first and second end surfaces in a length direction, first and second internal electrode layers on the ceramic layers and respectively exposed to the first and second end surfaces, first and second external electrodes respectively electrically connected to the first and second internal electrode layers, and portions of the first and second principal surfaces and the first and second lateral surfaces. The first and second external electrodes each include an underlying electrode layer including a metal component, a plating layer on the underlying electrode layer, and a fatty acid on at least a surface of the underlying electrode layer.

Abstract: A multilayer capacitor includes a ceramic body including a dielectric layer, and having first to sixth surfaces, connected to the first surface to the fourth surface and opposing each other, a plurality of internal electrodes disposed inside the ceramic body, exposed to the fifth surface and the sixth surface, and having one ends exposed to the third surface or the fourth surface, and a first side margin portion and a second side margin portion disposed on end portions of the internal electrode, exposed to the fifth surface and the sixth surface, the first and second side margin portions are divided into an inner layer formed to be adjacent to the ceramic body, and an outer layer formed on the inner layer, and a dielectric constant of the inner layer is lower than a dielectric constant of the outer layer.

Abstract: A conductive paste includes a core including a first metal and a shell including a second metal having a melting point higher than that of the first metal and enclosing a surface of the core. A multilayer ceramic component includes an external electrode having a sintered electrode layer made of the conductive paste.

Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage.

Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.

Abstract: A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.

Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.

Abstract: A multilayer ceramic capacitor may include a monolithic body including a plurality of dielectric layers and a plurality of electrode regions. The plurality of electrode regions can include a dielectric region, an active electrode region, and a shield electrode region. The active electrode region may be located between the dielectric region and the shield electrode region in a Z-direction. The dielectric region may extend from the active electrode region to the top surface of the broadband multilayer ceramic capacitor. The capacitor may include a plurality of active electrodes arranged within the active electrode region and at least one shield electrode arranged within the shield electrode region. The dielectric region may be free of electrode layers that extend greater than 25% of a length of the capacitor. A ratio of a capacitor thickness to a thickness of the dielectric region may be less than about 20.

Abstract: The present invention is directed to a multilayer ceramic capacitor that includes a plurality of active electrodes and at least one shield electrode that are each arranged within a monolithic body and parallel with a longitudinal direction. The capacitor may exhibit a first insertion loss value at a test frequency, which may be greater than about 2 GHz, in a first orientation relative to the mounting surface. The capacitor may exhibit a second insertion loss value at about the test frequency in a second orientation relative to the mounting surface and the capacitor is rotated 90 degrees or more about the longitudinal direction with respect to the first orientation. The longitudinal direction of the capacitor may be parallel with the mounting surface in each of the first and second orientations. The second insertion loss value may differ from the first insertion loss value by at least about 0.3 dB.

Abstract: A dielectric ceramic composition includes a barium titanate, an oxide of an R element, an oxide of an M element, and an oxide containing Si. The R element is one or more elements selected from Eu, Gd, Tb, Dy, Y, Ho, and Yb. The M element is one or more elements selected from Mg, Ca, Mn, V, and Cr. A ratio of an amount of the oxide of the R element in terms of R2O3 to an amount of the oxide containing Si in terms of SiO2 is 0.8:1 to 2.2:1. A ratio of an amount of the oxide of the M element in terms of MO to the amount of the oxide containing Si in terms of SiO2 is 0.2:1 to 1.8:1.50% or more of the number of dielectric particles constituting the dielectric ceramic composition is core-shell dielectric particles having a core-shell structure.

Abstract: A multilayer electronic component includes: a body including a dielectric layer, and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. A composite layer containing Sn and Ni is disposed at an interface between the internal electrode and the dielectric layer. The internal electrode includes an interface portion between the composite layer and a central portion of the internal electrode. The interface portion includes a ceramic additive.

Abstract: An inductor component comprising a main body part including a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the main body part; an external terminal exposed from the main body part; and a lead-out wiring electrically connecting the inductor wiring and the external terminal. Also, an outer surface of the external terminal includes a concave part.

Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers stacked together, and external electrodes. The multilayer body includes an inner layer portion and outer layer portions in a stacking direction, and an electrode opposing portion and gap portions in a length direction. The multilayer body further includes conductor portions in the two outer layer portions in the gap portions, and each includes conductor layers stacked in the stacking direction. One of that conductor layers that is closest to a middle in the stacking direction of the multilayer body is closer to the middle in the stacking direction of the multilayer body than another of the internal electrode layers closest in the stacking direction to a main surface of the multilayer body.

Abstract: An electronic component that includes: a ceramic body; and an external electrode on a surface of the ceramic body, wherein the external electrode includes: a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase of a titanium-containing oxide present around the granulate of the metal material; and a plating layer on the base layer.

Abstract: The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers including Ba and Ti and each of a plurality of internal electrode layers including Ni and Sn are alternately stacked. A discontinuity is formed in at least one of the plurality of internal electrode layers, the discontinuity being a break in a cross section including a stacking direction of the multilayer structure. An Sn high concentration portion, of which an Sn concentration is higher than an average Sn concentration of the one of the internal electrode layers, is formed on a part of a surface of the at least one of the internal electrode layers, the part of the surface being exposed to the discontinuity.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip, the method includes depositing a grid layer over a substrate. The grid layer is patterned to form a grid structure. The grid structure comprises a plurality of sidewalls defining a plurality of openings. A ferroelectric layer is deposited over the substrate. The ferroelectric layer fills the plurality of openings and is disposed along the plurality of sidewalls of the grid structure. An upper conductive structure is formed over the grid structure.

Abstract: A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base portion in a longitudinal direction. The second active electrode can include at least one arm extending away from a base portion towards the first end and overlapping the central portion of the first active electrode. A first shield electrode in a shield electrode region can have a central portion extending from a base portion. A second shield electrode can include an arm overlapping the central portion of the first shield electrode in the longitudinal direction. The shield electrode region can be spaced apart from the active electrode region by a shield-to-active distance that is greater than an active electrode spacing distance between respective active electrodes of the plurality of active electrodes.

Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a bottom conductive layer positioned on the substrate; at least one bottom conductive protrusion positioned on the bottom conductive layer; an insulator layer positioned on the bottom conductive layer and the at least one bottom conductive protrusion; at least one bottom insulating protrusion protruding from the insulator layer towards the bottom conductive layer and adjacent to the at least one bottom conductive protrusion; and a top conductive layer positioned on the insulator layer. The bottom conductive layer, the at least one bottom conductive protrusion, the insulator layer, the at least one bottom insulating protrusion, and the top conductive layer together configure a capacitor structure.

Abstract: A functional chip includes a substrate including a first face and a second face, the second face of the substrate forming the front face of the functional chip; a first oxide layer on the first face of the substrate; a second oxide layer on the first oxide layer; a first routing level formed on the surface of the second oxide layer in contact with the first oxide layer; a third oxide layer on the second oxide layer wherein a semiconductor component is inserted; a rear face formed by the surface of the third oxide layer opposite the second oxide layer, the rear face including superconductor routing tracks surrounded at least partially by one or more conductor routing tracks, the semiconductor component being connected to the superconductor routing tracks via superconductor vias and the conductor routing tracks of the rear face being connected to the routing level via conductor vias.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; first electrode layers disposed on the ceramic body and connected to the internal electrodes, respectively; and second electrode layers disposed on the first electrode layers, respectively, and respectively including a conductive metal including silver and palladium, carbon materials, and glass particles, wherein an area ratio of the carbon materials in a cross section of at least a portion of each of the second electrode layers is 1 to 5%.

Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.

Abstract: A multilayer electronic component includes a body including an active portion inducing dielectric layers and internal electrodes, and upper and lower cover portions, and external electrodes including connection portions and band portions extending onto portions of first and second surfaces of the body, and including an electrode layer and a conductive resin layer. In a cross-section of the body, when a line along which the band portion of the conductive resin layer is in contact with the first surface is d, an area of an isosceles right triangle, in which d is a base and an extension line extending from an end of the electrode layer by a length of d is a height, is K1, and a ratio of the area occupied by dummy electrodes in the lower cover portion and the internal electrodes in K1 to K1 is K2, K2 is 20% or more.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A multilayer ceramic capacitor includes an element body. The element body includes a stack of first internal electrode layers, dielectric layers and second internal electrode layers. The element body has a first surface and a second surface opposite the first surface. The multilayer ceramic capacitor also includes a first external electrode formed on the first surface of the element body and a second external electrode formed on the second surface of the element body. The first internal electrode layer has a first current path extending in a first plane perpendicular to the first surface such that the first current path has a shorter component on the first plane in a first direction toward the first surface than in a second direction perpendicular to the first direction. The second internal electrode layer has a second current path that possesses a similar anisotropy to the first internal electrode layer.

Abstract: An electronic component includes: a body including a stack structure formed of a plurality of dielectric layers and internal electrodes alternately stacked with the dielectric layers interposed therebetween; and an external electrode disposed outside the body, connected to the internal electrode, and including conductive metal and glass, in which the external electrode includes a first electrode layer connected to the internal electrode and a second electrode layer disposed on the first electrode layer, an area proportion of the glass of the first electrode layer is greater than that of the glass of the second electrode layer, and a thickness of the second electrode layer is 6 ?m or more.

Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

Abstract: A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

Abstract: An interdigitated metal-insulator-metal capacitor structure is formed by a first unitary body of a first conductive material that includes a first metal plate, a first set of interdigitated electrodes protruding upwards from a top surface of the first metal plate, and a first set of connecting vias protruding downwards from a bottom surface of the first metal plate. A second unitary body of a second conductive material is disposed above the first unitary body and electrically separated from the first unitary body by an insulating layer. The second unitary body includes a second metal plate, a second set of interdigitated electrodes protruding downwards from a bottom surface of the second metal plate, and a second set of connecting vias protruding upwards from a top surface of the second metal plate. The first set of interdigitated electrodes are interleaved with the second set of interdigitated electrodes.

Abstract: A capacitor case sealed to retain electrolyte; a sintered anode disposed in the capacitor case, the sintered anode having a shape wherein the sintered anode includes a mating portion; a conductor coupled to the sintered anode, the conductor sealingly extending through the capacitor case to a terminal disposed on an exterior of the capacitor case; a sintered cathode disposed in the capacitor case, the sintered cathode having a shape that mates with the mating portion of the sintered anode such that the sintered cathode matingly fits in the mating portion of the sintered anode; a separator between the sintered anode and the sintered cathode; and a second terminal disposed on the exterior of the capacitor case and in electrical communication with the sintered cathode, with the terminal and the second terminal electrically isolated from one another.