Abstract: A dielectric ceramic composition includes a barium titanate, an oxide of an R element, an oxide of an M element, and an oxide containing Si. The R element is one or more elements selected from Eu, Gd, Tb, Dy, Y, Ho, and Yb. The M element is one or more elements selected from Mg, Ca, Mn, V, and Cr. A ratio of an amount of the oxide of the R element in terms of R2O3 to an amount of the oxide containing Si in terms of SiO2 is 0.8:1 to 2.2:1. A ratio of an amount of the oxide of the M element in terms of MO to the amount of the oxide containing Si in terms of SiO2 is 0.2:1 to 1.8:1.50% or more of the number of dielectric particles constituting the dielectric ceramic composition is core-shell dielectric particles having a core-shell structure.

Abstract: A multilayer electronic component includes: a body including a dielectric layer, and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. A composite layer containing Sn and Ni is disposed at an interface between the internal electrode and the dielectric layer. The internal electrode includes an interface portion between the composite layer and a central portion of the internal electrode. The interface portion includes a ceramic additive.

Abstract: An inductor component comprising a main body part including a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the main body part; an external terminal exposed from the main body part; and a lead-out wiring electrically connecting the inductor wiring and the external terminal. Also, an outer surface of the external terminal includes a concave part.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers stacked together, and external electrodes. The multilayer body includes an inner layer portion and outer layer portions in a stacking direction, and an electrode opposing portion and gap portions in a length direction. The multilayer body further includes conductor portions in the two outer layer portions in the gap portions, and each includes conductor layers stacked in the stacking direction. One of that conductor layers that is closest to a middle in the stacking direction of the multilayer body is closer to the middle in the stacking direction of the multilayer body than another of the internal electrode layers closest in the stacking direction to a main surface of the multilayer body.

Abstract: An electronic component that includes: a ceramic body; and an external electrode on a surface of the ceramic body, wherein the external electrode includes: a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase of a titanium-containing oxide present around the granulate of the metal material; and a plating layer on the base layer.

Abstract: The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers including Ba and Ti and each of a plurality of internal electrode layers including Ni and Sn are alternately stacked. A discontinuity is formed in at least one of the plurality of internal electrode layers, the discontinuity being a break in a cross section including a stacking direction of the multilayer structure. An Sn high concentration portion, of which an Sn concentration is higher than an average Sn concentration of the one of the internal electrode layers, is formed on a part of a surface of the at least one of the internal electrode layers, the part of the surface being exposed to the discontinuity.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip, the method includes depositing a grid layer over a substrate. The grid layer is patterned to form a grid structure. The grid structure comprises a plurality of sidewalls defining a plurality of openings. A ferroelectric layer is deposited over the substrate. The ferroelectric layer fills the plurality of openings and is disposed along the plurality of sidewalls of the grid structure. An upper conductive structure is formed over the grid structure.

Abstract: A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base portion in a longitudinal direction. The second active electrode can include at least one arm extending away from a base portion towards the first end and overlapping the central portion of the first active electrode. A first shield electrode in a shield electrode region can have a central portion extending from a base portion. A second shield electrode can include an arm overlapping the central portion of the first shield electrode in the longitudinal direction. The shield electrode region can be spaced apart from the active electrode region by a shield-to-active distance that is greater than an active electrode spacing distance between respective active electrodes of the plurality of active electrodes.

Abstract: A functional chip includes a substrate including a first face and a second face, the second face of the substrate forming the front face of the functional chip; a first oxide layer on the first face of the substrate; a second oxide layer on the first oxide layer; a first routing level formed on the surface of the second oxide layer in contact with the first oxide layer; a third oxide layer on the second oxide layer wherein a semiconductor component is inserted; a rear face formed by the surface of the third oxide layer opposite the second oxide layer, the rear face including superconductor routing tracks surrounded at least partially by one or more conductor routing tracks, the semiconductor component being connected to the superconductor routing tracks via superconductor vias and the conductor routing tracks of the rear face being connected to the routing level via conductor vias.

Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a bottom conductive layer positioned on the substrate; at least one bottom conductive protrusion positioned on the bottom conductive layer; an insulator layer positioned on the bottom conductive layer and the at least one bottom conductive protrusion; at least one bottom insulating protrusion protruding from the insulator layer towards the bottom conductive layer and adjacent to the at least one bottom conductive protrusion; and a top conductive layer positioned on the insulator layer. The bottom conductive layer, the at least one bottom conductive protrusion, the insulator layer, the at least one bottom insulating protrusion, and the top conductive layer together configure a capacitor structure.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; first electrode layers disposed on the ceramic body and connected to the internal electrodes, respectively; and second electrode layers disposed on the first electrode layers, respectively, and respectively including a conductive metal including silver and palladium, carbon materials, and glass particles, wherein an area ratio of the carbon materials in a cross section of at least a portion of each of the second electrode layers is 1 to 5%.

Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.

Abstract: A multilayer electronic component includes a body including an active portion inducing dielectric layers and internal electrodes, and upper and lower cover portions, and external electrodes including connection portions and band portions extending onto portions of first and second surfaces of the body, and including an electrode layer and a conductive resin layer. In a cross-section of the body, when a line along which the band portion of the conductive resin layer is in contact with the first surface is d, an area of an isosceles right triangle, in which d is a base and an extension line extending from an end of the electrode layer by a length of d is a height, is K1, and a ratio of the area occupied by dummy electrodes in the lower cover portion and the internal electrodes in K1 to K1 is K2, K2 is 20% or more.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A multilayer ceramic capacitor includes an element body. The element body includes a stack of first internal electrode layers, dielectric layers and second internal electrode layers. The element body has a first surface and a second surface opposite the first surface. The multilayer ceramic capacitor also includes a first external electrode formed on the first surface of the element body and a second external electrode formed on the second surface of the element body. The first internal electrode layer has a first current path extending in a first plane perpendicular to the first surface such that the first current path has a shorter component on the first plane in a first direction toward the first surface than in a second direction perpendicular to the first direction. The second internal electrode layer has a second current path that possesses a similar anisotropy to the first internal electrode layer.

Abstract: An electronic component includes: a body including a stack structure formed of a plurality of dielectric layers and internal electrodes alternately stacked with the dielectric layers interposed therebetween; and an external electrode disposed outside the body, connected to the internal electrode, and including conductive metal and glass, in which the external electrode includes a first electrode layer connected to the internal electrode and a second electrode layer disposed on the first electrode layer, an area proportion of the glass of the first electrode layer is greater than that of the glass of the second electrode layer, and a thickness of the second electrode layer is 6 ?m or more.

Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

Abstract: A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

Abstract: An interdigitated metal-insulator-metal capacitor structure is formed by a first unitary body of a first conductive material that includes a first metal plate, a first set of interdigitated electrodes protruding upwards from a top surface of the first metal plate, and a first set of connecting vias protruding downwards from a bottom surface of the first metal plate. A second unitary body of a second conductive material is disposed above the first unitary body and electrically separated from the first unitary body by an insulating layer. The second unitary body includes a second metal plate, a second set of interdigitated electrodes protruding downwards from a bottom surface of the second metal plate, and a second set of connecting vias protruding upwards from a top surface of the second metal plate. The first set of interdigitated electrodes are interleaved with the second set of interdigitated electrodes.

Abstract: A capacitor case sealed to retain electrolyte; a sintered anode disposed in the capacitor case, the sintered anode having a shape wherein the sintered anode includes a mating portion; a conductor coupled to the sintered anode, the conductor sealingly extending through the capacitor case to a terminal disposed on an exterior of the capacitor case; a sintered cathode disposed in the capacitor case, the sintered cathode having a shape that mates with the mating portion of the sintered anode such that the sintered cathode matingly fits in the mating portion of the sintered anode; a separator between the sintered anode and the sintered cathode; and a second terminal disposed on the exterior of the capacitor case and in electrical communication with the sintered cathode, with the terminal and the second terminal electrically isolated from one another.

Abstract: A coil component includes a first coil and a second coil that magnetically couples with the coil and causes a negative inductance to be generated. The coil component further includes an electrode that is provided at a position adjacent to or in the vicinity of a port of each of the first and second coils.

Abstract: A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. With respect to the length direction, the coil has a length from about 85.0% to about 94.0% of the length of the multilayer body.

Abstract: In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.

Abstract: A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors to one another. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. The insulating layers between the coil conductors are composed of a material containing at least one out of a magnetic material and a non-magnetic material. A content percentage of the non-magnetic material in the insulating layers changes in a direction from a first end surface toward a second end surface of the multilayer body.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.

Abstract: Disclosed embodiments include frame-array interconnects that have a ledge portion to accommodate a passive device. A seated passive device is between at least two frame-array interconnects for semiconductor package-integrated decoupling capacitors.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other; a plurality of internal electrodes disposed in the ceramic body; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein the ceramic body includes an active portion, and cover portions disposed on upper and lower surfaces of the active portion, each of the first and second side margin portions is divided into a first region and a second region, each of the cover portions is divided into a first region and a second region, and contents of magnesium (Mg) contained in the second regions of the cover portions and the first and second side margin portions are larger than those of magnesium (Mg) contained in the first regions thereof, respectively.

Abstract: An integrated circuit structure includes a first metallization layer with first and second electrodes, each of which has electrode fingers. A second metallization layer may be included below the first metallization layer and include one or more electrodes with electrode fingers. The integrated circuit structure is configured to exhibit at least partial vertical inductance cancellation when the first electrode and second electrode are energized. The integrated circuit structure can be configured to also exhibit horizontal inductance cancellation between adjacent electrode fingers. Also disclosed is a simulation model that includes a capacitor model that models capacitance between electrode fingers having a finger length and includes at least one resistor-capacitor series circuit in which a resistance of the resistor increases with decreasing finger length for at least some values of the finger length.

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a surface partially provided with a resin lump including an electrically insulating resin. The resin lump includes a surface exposed from the plating layer.

Abstract: A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively. The first and second external electrodes comprise first and second base electrodes disposed to be in contact with the ceramic body and having a first conductive metal, and first and second conductive layers disposed on the first and second base electrodes and having a second conductive metal, and the first and second conductive layers have an average surface roughness (Ra) of 10.0 ?m or more.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first side surface facing in a direction of a first axis, a second side surface facing in a direction of a second axis orthogonal to the first axis, a ridge that connects the first side surface and the second side surface to each other, and internal electrodes laminated along a third axis orthogonal to the first axis and the second axis and led out in a lead-out region. The external electrode includes a protrusion provided at a position along the ridge and protruding in the directions of the first axis and the second axis, and a first base portion and a second base portion extending from the protrusion along the first side surface and the second side surface, respectively, the external electrode covering the lead-out region.

Abstract: The invention relates to a refractory container 1 for use in a furnace for heat treatment of workpieces, comprising a mat 5 of long fibers that are embedded in a ceramic shell, with the mat 5 being shaped into a container that forms a receiving space for workpieces, and to a green body of such a container 1. Furthermore, advantageous uses of the container 1 as well as a method for manufacturing a green body or container 1 according to the invention are specified.

Abstract: An icemaker employs a thermoformed ice tray that may have preprinted conductors providing for heating elements in capacitive sensing. Capacitive sensing may be used to control a water fill level and/or to detect complete freezing of the ice cubes and/or to detect complete ejection of the ice cubes.

Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

Abstract: An electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode including a conductive resin layer, disposed on the body, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a metal particle, a first intermetallic compound, and a base resin, and a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.

Abstract: A free-flowing dry mix of various chemical components can be applied in its dried form, as is contemplated by typical powder coating operations, as well as dispersed within a liquid carrier and applied in liquid form. When liquefied, this bifunctional composition retains similar viscosity to liquid coatings, while simultaneously avoiding any reaction with or degradation by the liquid carrier. The liquefied powder is preferable to existing liquid coatings because it avoids the use of any volatile organic compounds or other solvents, whereas the final, cured coating produced by these bifunctional compositions are indistinguishable regardless of whether they are applied in dry or liquefied form.

Abstract: Provided is a multi-layer chip ceramic dielectric capacitor, relating to the field of capacitor technologies. For the multi-layer chip ceramic dielectric capacitor provided in the present disclosure, first to fifth internal electrodes are reasonably arranged, and a first capacitance component, a second capacitance component, a third capacitance component and a fourth capacitance component are connected in series to form the capacitor, with the same capacitance, then according to the voltage division principle of capacitor, when each of the small capacitors connected in series bears a voltage of U0, the whole capacitor can withstand a voltage of 4U0. Therefore, the multi-layer chip ceramic dielectric capacitor, in a series structure, provided in the present disclosure can withstand higher direct current and radio-frequency voltages.

Abstract: A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 ?m or more and about 12 ?m or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 ?m or more.

Abstract: A multilayer ceramic capacitor includes a multilayer body and outer electrodes. The multilayer body includes first and second multilayer ceramic structures and an intermediate body between the first and second multilayer ceramic structures, first to fourth connection electrodes electrically connecting first inner electrodes, second inner electrodes, third inner electrodes, and fourth inner electrodes, respectively, a first connection wire electrically connecting the first connection electrode and one of the third connection electrode and the fourth connection electrode, and a second connection wire electrically connecting the second connection electrode and the other connection electrode. A current route from the first connection electrode via the first connection wire to the one connection electrode and a current route from the second connection electrode via the second connection wire to the other connection electrode have different lengths.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multi-layer ceramic capacitor includes a ceramic body and external electrodes. The ceramic body includes ceramic layers laminated in a first direction, first and second internal electrodes between the ceramic layers, a facing portion in which the internal electrodes face in the first direction, and a cover that covers the facing portion in the first direction. The facing portion includes a first region including at least one element of manganese, a rare-earth element, or magnesium and having a flat distribution of a concentration of the element along the first direction, and a second region disposed between the cover and the first region and having an increasing concentration of the element from the first region toward the cover. The ceramic layers include a capacitance forming layer between the first and second internal electrodes, and a dummy layer between the first or second internal electrodes and across the first and second regions.

Abstract: A method of manufacturing a ceramic dielectric, including: heat-treating a barium precursor or a strontium precursor, a titanium precursor, and a donor element precursor to obtain a conducting or semiconducting oxide, preparing a mixture including the conducting or semiconducting oxide and a liquid-phase acceptor element precursor, and sintering the mixture to form a ceramic dielectric, wherein the ceramic dielectric includes a plurality of grains and a grain boundary between adjacent grains, and wherein the plurality of grains including an insulating oxide comprising an acceptor element derived from the acceptor element precursor.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes.

Abstract: A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.