Abstract: A circuit assembly 1 includes a semiconductor switching element, a main substrate, a plurality of bus bars and a sub-substrate that are overlaid on the main substrate, and a jumper wire. The main substrate includes a first insulating substrate and a first conductive path. The sub-substrate includes a second insulating substrate and a second conductive path, and is overlaid on the main substrate and arranged in the same layer as the bus bars. The jumper wire connects the first conductive path with the second conductive path. A plurality of terminals of the semiconductor switching element include a drain terminal 42 and a source terminal that are connected to the bus bar and a gate terminal connected to the second conductive path. A noise reduction element is mounted on the sub-substrate.

Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.

Abstract: A power converting apparatus according to the present disclosure includes: a capacitor being supplied with a DC from a battery of a vehicle; at least one or more power converting modules including a power terminal through which a current is input and output and a signal terminal through which signals are input and output, and disposed perpendicular to the capacitor with the power terminal facing the bottom of the capacitor and the signal terminal facing the top of the capacitor; a control unit disposed over the capacitor and controlling the power converting module; and a housing assembled with the capacitor, the power converting module, and the control unit.

Abstract: In some examples, a system includes a plurality of posts and a plurality of cage panels, wherein each of the cage panels is removably coupled to one or more of the plurality of posts, wherein a nominal width of each of the cage panels is congruent based on a modulus, wherein an actual width of each of the cage panels is equal to a difference between the nominal width of the cage panel and the width of one of the plurality of posts, and wherein any combination of a subset of the plurality of cage panels coupled in a common orientation to a subset of the plurality of posts has a combined width, between respective centers of end posts of the subset of the plurality of posts, that is congruent based on the modulus.

Abstract: One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.

Abstract: A first member of a first semiconductor module and a second member of a second semiconductor module are disposed adjacent to each other along a crossing line segment crossing a longitudinal direction of the first semiconductor module as seen in a plan view. The first member is provided with a first circuit. The second member is provided with a second circuit. The first circuit does not drive when the second circuit is driving. The second circuit does not drive when the first circuit is driving.

Abstract: Embodiments of the invention provide a system design for immersion cooling. The design utilizes a single cooling loop design. An external cooling unit, such as an indirect evaporative cooling (IDEC) system, is utilized to transfer the heat to the atmosphere from the cooling loop. The fluid in the cooling loop is driven by a centralized pump or pumps and the local pumps. The fluid is supplied to the immersion cooling rack or device. The design introduces several innovations on the cooling loop infrastructure by adding heat recovery system. Under different operating conditions, both the heat recovery system and external cooing unit can be connected into or bypassed from the main immersion cooling loop. At least some of the advantages include simplified infrastructure, a total system solution, high reliability, fast deployment, feasible system operation adjustment, cost reduction, and high operating efficiency.

Abstract: A phase leg for an inverter includes a switching module having a switch device, a power lead connected to the switching module and in electrical communication with the switch device, and a drive lead. The drive lead is connected to the switching module, is in electrical communication with the switch device, and is segregated from the power lead to limit heating of a drive module connected to the drive lead from current flowing through the power lead. Multilevel inverters and methods of making phase legs for inverters are also described.

Abstract: A cooling device includes a cooling tank, a support frame, and a rotary shaft. The cooling tank accommodates coolant and an electronic device. The electronic device is immersed in the coolant. The support frame defines an opening in a first side plate and a receiving space communicating with the opening. The cooling tank is received in the receiving space. The cooling tank includes a base plate and a sidewall. The rotary shaft is rotationally mounted to a bottom corner of the cooling tank formed by the base plate and the sidewall. The rotary shaft serves as a rotating axis of the cooling tank to rotate the cooling tank out of the opening.

Abstract: An assembly for containing and detecting leaks from a coolant line includes a basin with side and end walls, and at least one U-shaped cavity in an end wall for receiving a coolant line of a liquid cooling system. A bottom of the basin includes at least one sloped interior surface arranged to divert water in the basin to a local low point, where a sensor is positioned and operable to detect liquid in the collection basin. A leak detection system can employ a leak detection assembly to detect and/or locate a leak.

Abstract: An electrical junction box configured to be disposed between a power supply and a load includes a cooling case that has an opening, a circuit assembly that is disposed closing the opening of the cooling case, and a liquid coolant that is stored in the cooling case. The circuit assembly has a case-facing surface that faces the cooling case, and includes a plurality of busbars that are disposed on the case-facing surface and constitute a conductive path between the power supply and the load. The busbars are immersed in the liquid coolant R.

Abstract: An electronic device includes a housing filled with a liquid coolant, a first electronic device accommodated in the housing and immersed in the liquid coolant, a first heat sink provided with the first electronic device and exposed to the liquid coolant filled in the housing, a suction pipe configured to have an inlet that sucks the liquid coolant filled in the housing, a discharge pipe configured to have an outlet that faces the first heat sink via the liquid coolant filled in the housing and discharges the liquid coolant sucked from the inlet toward the first heat sink, and a pump provided in the housing to be coupled between the suction pipe and the discharge pipe, and configured to suck the liquid coolant from the inlet and discharge the liquid coolant from the outlet.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.

Abstract: A power conversion system at least includes a filter capacitor, a DC-DC converter, a smoothing capacitor, a housing and a refrigerant flow channel. The refrigerant flow channel is disposed between the housing and a flow channel cover. The refrigerant flow channel includes a converter facing portion at least partially facing the DC-DC converter. The filter capacitor at least partially overlaps with the DC-DC converter when viewed in a first direction from an opposite side of the refrigerant flow channel to the converter facing portion. The smoothing capacitor does not overlap with the DC-DC converter when viewed in the first direction and partially overlaps with the DC-DC converter when viewed in a second direction. At least two fastening sections fasten the flow channel cover to the housing and do not overlap with the smoothing capacitor when viewed in the first direction.

Abstract: A liquid-immersion cooling device includes a reservoir, a partition board, and a heat exchanger. The reservoir contains coolant to immerse the electronic device. The partition board and the heat exchanger are mounted within the reservoir. The partition board is arranged parallel to the electronic device. The heat exchanger and the electronic device are respectively arranged on opposite sides of the partition board within the reservoir. The partition board is configured to guide a flow of the coolant within the reservoir. When the coolant flows through the electronic device and carries away heat generated by the electronic device, the coolant carrying the heat is guided by the partition board to flow through the heat exchanger. After exchanging heat with the heat exchanger, the coolant is guided by the partition board to flow through the electronic device.

Abstract: An electronic device includes a first electronic component, a substrate on which the first electronic component is mounted, which includes an additional region formed on one side of the first electronic component in a first direction for adding a second electronic component, and onto which cooling air flows, and a wall member partially surrounding the additional region, wherein the wall member includes one opening for allowing the air to flow over the additional region.

Abstract: A nanotransfer printing method, including the steps of coating a polymer thin film on a template substrate where a surface pattern is formed, fabricating the polymer thin film into a thin-film replica mold by using the polymer thin film and an adhesive film, forming nanostructures on the thin-film replica mold, selectively weakening an adhesive force between the adhesive film and the thin-film replica mold, and transferring the nanostructures into a target object, is provided.

Abstract: The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.

Abstract: A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.

Abstract: A housing for a control unit of a motor vehicle has a housing element and a further element attached to the housing element by way of a joining technique that does not include a joining layer or by way of a joining layer. The housing element has a main body composed of a light metal and a protective layer applied to the main body. The protective layer is arranged between the main body and the attached further element. The invention further relates to a method for producing a housing and to a control unit.

Abstract: A semiconductor power module with which it is possible to suppress the influence of noise given from a main terminal to a control terminal is provided. At least any one of main terminals (positive electrode terminal, negative electrode terminal, alternating current terminal) is so configured that the main terminal includes two parts extended in a common direction. The two parts are, for example, formed of a single component having such as a shape that the component is bifurcated from the outside toward the inside of the semiconductor power module or two different components. The two parts are so structured that the parts are extended in a common direction. Control terminals (gate signal terminal and emitter signal terminal) are so arranged that a laminated portion of the control terminals is sandwiched between one and the other of the two parts to configure the semiconductor power module.

Abstract: An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A lighting device includes a heat sink, through which air can flow transversely to its longitudinal extension and a plurality of semiconductor light sources, in particular light-emitting diodes, arranged on the heat sink, wherein at least two of the semiconductor light sources are aligned in different directions.

Abstract: An object of the present invention is to achieve reduction in height of an electric power conversion device while maintaining high performance of the electric power conversion device.

Abstract: A cooling mechanism used inside a gimbal includes a heat dissipating module, a main board and fasteners. The main board is fixed to a lower surface of the heat dissipating module through the fasteners. The main board includes a main chip. The heat dissipating module includes an upper sealing cover; a lower sealing cover fixedly connected to the upper sealing cover, wherein a lower surface of the lower sealing cover has a hole for accommodating the main chip; an air storehouse, wherein a bottom surface of the air storehouse contacts with the main chip, a side surface of the air storehouse is adjacent to a cooling chamber; and sealing rings located between the upper sealing cover and the lower sealing cover. A cooling chamber is formed by the upper sealing cover, the lower sealing cover and a baffle, the cooling liquid is provided in the cooling chamber.

Abstract: A power conversion device includes a casing, a structural plate, a converter module, an auxiliary circuit board module and a top cover. The casing includes a base plate and a side wall, and the base plate and the side wall form a chamber. The structural plate is located in the chamber. The converter module is located between the base plate and the structural plate. The auxiliary circuit board module is located at a side of the structural plate in the chamber away from the base plate, and is electrically connected with the converter module. The top cover seals the chamber.

Abstract: Provided is an outdoor unit of an air conditioner capable of obtaining efficient air blowing performance by optimizing a length dimension of a heat exchanger and a relative position of a blower. A front end portion is disposed closer to the left side panel than a rotation shaft of the first blower, and a rear end portion is disposed closer to the right side panel than a rotation shaft of the first blower in the first heat exchanger, and a front end portion is disposed closer to the right side panel than a rotation shaft of the second blower, and a rear end portion is disposed closer to the left side panel than a rotation shaft of the second blower in the second heat exchanger.

Abstract: A computer cooling assembly for a computer of a vehicle, such as an autonomous driving vehicle, includes a shell that defines an interior space. The shell is configured to house the computer. A cooling loop is positioned in the interior space proximate to the computer. The cooling loop is configured to couple to an air conditioning system of the vehicle. A heat transfer medium is positioned in the interior space. The heat transfer medium is in contact with the cooling loop and the computer. The heat transfer medium is configured to transfer heat that is generated by the computer to the cooling loop.

Abstract: An electric power converter includes a positive and a negative electrode terminals being disposed parallel and adjacent to each other, a positive electrode side switching device connected to the positive electrode terminal, a negative electrode side switching device connected to the negative electrode terminal, an output terminal connected to a connection point between the positive and the negative electrode side switching devices, and a counter conductor facing at least a portion of the positive electrode terminal and at least a portion of the negative electrode terminal in a height direction, the height direction being a direction perpendicular to both an aligned direction and a protruding direction of the positive and the negative electrode terminals. The counter conductor is disposed along a current path of an alternating current flowing through the positive electrode terminal, the positive electrode side switching device, the negative electrode side switching device, and the negative electrode terminal.

Abstract: A vehicle-mounted power conversion device including: a capacitor for smoothing DC voltage; a power module for converting the smoothed DC voltage into AC voltage; a control substrate provided with a connector for a harness; a power module substrate provided with a connector for a harness; a harness connected to the control substrate at one end and connected to the power module substrate at the other end, thereby connecting the control substrate and the power module substrate electrically; and a case and cover for housing the capacitor, the power module, the control substrate, the power module substrate and the harness. In this device, a housing space defined between the case and cover is an integrated space, and a divided position between the case and cover is located further toward bottom wall of the case than the connector of the control substrate and the connector of the power module substrate.

Abstract: A system and method for provisioning within a system design to allow the storage and IO resources to scale with compute resources are provided.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: The present disclosure provides a power electronic module that includes a first power device having a first switching element and a second power device having a second switching element. The power electronic module further includes a cooler having a coolant passage to cool the first and second power devices. The cooler includes a first inner fin and a second inner fin in the coolant passage. The first power device and the second power device are disposed along a flow direction of the coolant passage so that the first power device is arranged on an upstream side of the coolant passage from the second power device. The first inner fin and the second inner fin are disposed along the flow direction corresponding to the first and second power devices so that the first inner fin is arranged on the upstream side from the second inner fin. The first inner fin has a corrugated passage and a straight passage. The straight passage bypasses the corrugated passage along the flow direction of the coolant passage.

Abstract: An object of the invention is to diagnose whether an overcurrent detecting function with respect to a power semiconductor element of a power conversion apparatus is normal. The power conversion apparatus of the invention is provided with IGBTs as the power semiconductor element which performs a switching operation to convert DC power supplied from a DC power source into AC power, an overcurrent detecting circuit, and an overcurrent simulating circuit. The IGBTs include an emitter sensing terminal which outputs a sense current according to a current flowing to an emitter electrode. The overcurrent detecting circuit detects the overcurrent flowing to the IGBTs on the basis of the sense current output from the emitter sensing terminal. The overcurrent simulating circuit outputs a simulation signal which simulates the overcurrent flowing to the IGBTs and toward the overcurrent detecting circuit.

Abstract: An information processing device includes: a device main body including a cooling plate; and a heat generating unit including a heat generating element and a contact plate thermally coupled to the heat generating element, the heat generating unit being detachable from the device main body, wherein the cooling plate includes a heat transfer spring configured to come into contact with the contact plate, the heat transfer spring includes a spring portion configured to come into elastic contact with the contact plate, and a thermally conductive portion disposed between a surface of the spring portion on an opposite side from a contact surface of the spring portion that comes into contact with the contact plate, and the cooling plate.

Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: A manifold for cooling electronic equipment, the manifold including a facility side coolant supply line, a facility side coolant return line, liquid-to-liquid heat exchangers, and pumps. The liquid-to-liquid heat exchangers are connected in parallel to the facility side coolant supply line. Each of the pumps is coupled to a liquid-to-liquid heat exchanger and regulates coolant flow through the coupled liquid-to-liquid heat exchangers.

Abstract: A vehicle power module assembly including an array of frames each defining a passthrough and step is provided. The frames may be stacked such that the passthroughs are in at least partial registration with one another and the steps align to define an inlet manifold having first and second chambers extending a length of the array. The chambers may be partially open to one another such that the steps influence a momentum of coolant traveling from the first to the second chamber. A pair of endplates may be disposed on either end of the array and configured to retain the frames therebetween. Each of the frames may further define a pair of channels and may be arranged with one another to define a power stage cavity therebetween. A power stage may be disposed within the power stage cavity.

Abstract: Disclosed is a cooling system for a conversion device that includes a heat sinking plane, a main cooling jacket, and a sub-cooling jacket. The main cooling jacket is connected with the heat sinking plane and provided with a first component disposed thereto. The sub cooling jacket is connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second component which generates a relatively lower amount of heat than the first component. A main inlet is disposed in the main cooling jacket for supplying coolant to the main cooling jacket, and an outlet is disposed in the sub cooling jacket for exhausting the coolant which has passed through the sub cooling jacket. A sub inlet is formed in the heat sinking plane for the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket.

Abstract: Disclosed is a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is suitable for a processor in an electronic device. The heat dissipation apparatus includes a housing including an inlet for introducing a cooling fluid into the housing and an outlet for allowing the cooling fluid to exit from the housing. The heat dissipation apparatus includes a heat dissipating member disposed in the housing. The heat dissipation apparatus includes a buffer member disposed between the inlet and the heat dissipating member. The buffer member includes through-holes for inhibiting a flow of the cooling liquid from the inlet of the housing to the dissipating member to transfer heat across the heat dissipating member to the cooling fluid. The electronic device may include a processor and the heat dissipation apparatus.

Abstract: Methods and systems for a semiconductor device with through-silicon via-less deep wells are disclosed and may include forming a mask pattern on a silicon carrier, etching wells in the silicon carrier, and forming metal contacts in the etched wells, wherein the metal contacts comprise a plurality of deposited metal layers. Redistribution layers may be formed on a subset of the contacts and a dielectric layer may be formed on the silicon carrier and formed redistribution layers. Vias may be formed through the dielectric layer to a second subset of the contacts and second redistribution layers may be formed on the dielectric layer. A semiconductor die may be electrically coupled to the second formed redistribution layers and formed vias. The semiconductor die and top surface of the dielectric layer may be encapsulated and the silicon carrier may be thinned to a thickness of the contacts or may be completely removed.

Abstract: An electric vehicle includes a motor, an inverter, a battery, a cooler configured to cool the inverter, and an electronic control unit. The electronic control unit is configured to execute following when abnormality occurs to the cooler: i) set a vehicle speed, at which an induced voltage by the motor becomes at most equal to an input voltage that is input to the inverter from the battery side, as vehicle speed limit, and ii) control the motor such that the electric vehicle travels within a range of the vehicle speed limit.

Abstract: Methods of fabricating cooling apparatuses with coolant filters are provided which facilitate heat transfer from an electronic component(s). The method includes providing a cooling apparatus which includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. A coolant loop is also provided coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink.

Abstract: An electric power converter has a semiconductor stacked unit, auxiliary electronic components, a pressing member, and a case for accommodating these components. The case has a front wall in a stacking direction, a rear wall, a pair of side walls, and inner walls. The inner walls include a partition wall that is disposed opposing the front wall, and a support wall that is formed so as to extend toward the rear wall from a rear end surface of the partition wall. A unit accommodation space for accommodating the semiconductor stacked unit and the pressing member is formed between the partition wall and the front wall. Auxiliary accommodation spaces for accommodating the auxiliary electronic components are formed between the partition wall and the rear wall.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Abstract: A heat exchanger is configured to be arranged on a first housing of an electronic device, wherein the first housing has a top surface and a sidewall neighboring on the top surface, wherein the first housing has multiple first metal sheets protruding from the sidewall of the first housing. The heat exchanger includes a second housing configured to be mounted to the first housing, wherein a first opening is at a bottom of the second housing and configured to have the electronic device extend into an inner space in the second housing through the first opening, and a second opening is at a wall of the second housing and communicates with the inner space. The heat exchanger includes multiple second metal sheets in the inner space, wherein the second metal sheets are configured to be arranged over the top surface of the first housing, and a first heater in the inner space and thermally connected to the second metal sheets.