Abstract: In one embodiment, a cooling device for providing liquid cooling to a processor or a computing hardware/system includes a first cooling plate having a first liquid distribution channel integrated therein. The first cooling plate is to be positioned on a top surface of a processor to extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel. The cooling device further includes a second cooling plate having a second liquid distribution channel integrated therein. The second cooling plate is to be positioned at a bottom surface of the processor to extract heat from the bottom surface of the processor using cooling liquid flowing through the second liquid distribution channel. The cooling device further includes a mounting mechanism to mount the first and second cooling plates onto top and bottom of the processor to sandwich the process in between with good thermal contact.

Abstract: A cooling structure of a vehicle drive inverter includes: a switching element disposed in the vehicle drive inverter; a heat dissipation fin connected to and heat-exchangeable with the switching element; a cooling flow path in which a coolant flows and heat-exchanges with the heat dissipation fin; and an auxiliary cooling module connected to and heat-exchangeable with the switching element to be heated by a heat generation of the switching element or to be cooled together with the switching element.

Abstract: An information handling system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, and a leak detection system for detecting a leak of fluid from the liquid cooling system, the leak detection system comprising a leak detection circuit having at least one moisture-sensitive portion configured to detect the presence of moisture proximate to the leak detection circuit and circuitry configured to communicate one or more electrical signals indicative of the presence or absence of moisture proximate to the leak detection circuit and a moisture wicking material mechanically coupled to the leak detection circuit and configured to transport moisture within the moisture wicking material to the at least one moisture-sensitive portion of the leak detection circuit.

Abstract: A transmission may include a housing and also a power electronics module, the power electronics module including a carrier element with at least one power switching element with a cooling surface and also a cooling body, which may be connected in a thermally conductive manner to the cooling surface of the at least one power switching element. The housing may have an oil space for at least partially accommodating transmission components. The power electronics module may be at least partially arranged inside the oil space of the transmission.

Abstract: A cooling system for a computer server is disclosed. The system includes a flow divider within the server enclosure interior constructed to create a continuous flow path. At least one fan is positioned within the flow path. An inlet air valve is positioned to regulate airflow across the server input air vent. Likewise an outlet air valve is positioned to regulated airflow across the server output air vent. A controller is connected to the fan and the systems has two configurations.

Abstract: A method for producing a semiconductor device includes providing a carrier configured to carry at least one semiconductor chip on a first side, and dispensing a polymer onto a second side situated opposite the first side in order to produce a sealing ring. The polymer is dispensed in such a way that the sealing ring produced has different heights perpendicular to the second side along its circumference.

Abstract: A power conversion device for a vehicle, may include a power conversion module assembly having a capacitor configured to receive a direct current (DC) current from a battery of the vehicle, a power conversion module configured to convert the DC current supplied from the capacitor, into an alternating current (AC) current, and a control unit connected to the power conversion module and configured to control the power conversion module; a housing assembled with the power conversion module assembly; and an output terminal assembly including a plurality of output terminals through which the AC currents converted through the power conversion module assembly are output, a core, and a Hall integrated circuit (IC) configured to detect a variation in magnetic flux of the core when the AC currents flow in the output terminals and measure the AC currents of the output terminals.

Abstract: A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU.

Abstract: This disclosure describes systems for cooling one or more data halls of a data center that include one or more sections of a cooling spine. Each section of the cooling spine includes a riser module, a manifold module, and one or more arrays of cooling units. The riser module includes riser piping configured to fluidically couple to a liquid cooling system. The manifold module includes manifold piping fluidically coupled to the riser piping. Each array of cooling units is positioned toward a data hall of the one or more data halls of the data center and includes a heat exchanger assembly and a circulation assembly. The heat exchanger assembly is fluidically coupled to the manifold piping and configured to cool return air from a hot aisle adjacent a row of cabinets. The circulation assembly is configured to discharge supply air to a cold aisle adjacent the row of cabinets.

Abstract: A power electronic module having reduced mass and/or reduced package size as compared with conventional modules employing die cast materials, secondary machining, and/or welding operations includes a housing, a discrete cooling channel positioned in the housing and having opposing cooling surfaces, and first and second printed circuit board assemblies disposed on opposite sides of the cooling channel.

Abstract: The disclosure relates to a heat dissipation system including cabinet, coolant distribution units and adapting device. The adapting device includes casing and switch valves. The casing has first liquid inlets, first liquid outlets, second liquid inlet and second liquid outlet. The first liquid inlets are connected to distribution outlets of coolant distribution units, first liquid outlets are connected to distribution inlets of coolant distribution units, second liquid inlet is connected to cabinet, and second liquid outlet is connected to cabinet. The switch valves are connected to first liquid inlets, first liquid outlets, second liquid inlet and second liquid outlet so as to change a connection among first liquid inlets, first liquid outlets, second liquid inlet and second liquid outlet to change a connection between coolant distribution units.

Abstract: A dissipating interconnection module for an M.2 form factor expansion card, includes a heat sink, which includes an enclosure including an upper wall for being in thermal contact with the first heat exchange surface of the expansion card and two tabs, each tab for being in thermal contact with the upper wall of the heat sink and for being in thermal contact with the fluid cooling system of the first electronic board, and the upper wall and the two tabs of the enclosure being arranged to form a space in which the expansion card can be received; a mechanical attachment system for removably mechanically attaching the expansion card to the heat sink; an interconnection electronic board including the second M.2 connector, a third electrical connector to be connected to a fourth electrical connector of the first electronic board.

Abstract: A magnesium alloy containing Al, Sr, Ca, and Mn, with the balance being Mg and inevitable impurities, the magnesium alloy having: a structure having an ?-Mg phase, and a precipitate dispersed in at least one of a grain boundary of the ?-Mg phase and a cell boundary, the precipitate including: at least one phase selected from a group A consisting of an Al2Sr phase, an Al4Sr phase, a (Mg, Al)2Sr phase, and a (Mg, Al)4Sr phase; and at least one phase selected from a group B consisting of an Al2Ca phase and a (Mg, Al)2Ca phase, the magnesium alloy having, in a cross section, a total area rate of a group A precipitate and a group B precipitate of greater than or equal to 2.5% and less than or equal to 30%.

Abstract: A circuit board includes an electrically insulating part and an electrically conductive part. At least one semiconductor chip is embedded into the electrically insulating part in a part of the circuit board. Through openings in the part of the circuit board provide for passage of a cooling liquid. The through openings extend from a first surface of the circuit board to a second surface of the circuit board. The electrically conductive part includes a first outer conductive layer on the first surface and a second outer conductive layer on the second surface. The electrically conductive part also includes a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the part of the circuit board.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Abstract: A semiconductor device having a semiconductor module that includes a first conductor layer and a second conductor layer facing each other, a group of semiconductor elements that are formed between the first and second conductor layers, and are connected to the second conductor layer respectively via a group of conductor blocks, and a circuit board having one end portion thereof located in a space between the semiconductor elements and the second conductor layer. Each semiconductor element includes first and second main electrodes respectively formed on first and second main surfaces thereof, and a control electrode that is formed on the second main surface. The first main electrode is electrically connected to the first conductor layer. The second main electrode is electrically connected to the second conductor layer via the respective conductor block. The circuit board includes a first wiring layer electrically connected to the control electrodes of the semiconductor elements.

Abstract: A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device has: an input terminal; a wiring portion that includes a first end portion, and a second end portion, and extends in one direction, the first end portion being connected to the input terminal; a circuit substrate that includes a top surface, and a bottom surface, the top surface being provided with a first circuit board and a second circuit board along the one direction, the bottom surface being arranged on a top surface of the cooling device; a metal body connected between the wiring portion, and a top surface of the first circuit board; and a semiconductor chip that includes a top surface electrode, and a bottom surface electrode, the top surface electrode being connected to the second end portion, the bottom surface electrode being connected to a top surface of the second circuit board.

Abstract: A vehicle driving device includes a case that accommodates therein a first rotary electric machine and a second rotary electric machine arranged with rotation axes thereof parallel to each other and radially adjacent to each other, and a power control device that controls electric power supplied to the first rotary electric machine and the second rotary electric machine. In the power control device, a control board, a power card and a cooler, a reactor and a capacitor, and a water jacket are disposed in order from top in a height direction.

Abstract: A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.

Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

Abstract: A power conversion device includes a semiconductor stack, a reactor, and a capacitor. The semiconductor stack includes a plurality of semiconductor modules stacked on one another in a stacking direction. Each semiconductor module includes a semiconductor element. The reactor constitutes a boost circuit that boosts a direct-current voltage. The capacitor is electrically connected to the plurality of semiconductor modules. The semiconductor stack, the reactor, and the capacitor each include a coolant flow passage, and the reactor and the capacitor are located adjacent to each other.

Abstract: A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.

Abstract: An apparatus for monitoring and maintaining thermal exhaust temperatures for monitored servers may include a processor in communication with an exhaust temperature control system. The processor may implement various control loops to monitor inlet and exhaust temperatures for one or more servers, and the processor may monitor temperatures of various hardware components within those one or more servers. When the processor determines that a hardware component for a given server is overheating, the processor may take steps to decrease the temperature of the overheating hardware component for the given server. To determine whether a hardware component is overheating, the processor may leverage the hardware component's operating temperature margin.

Abstract: A method of maintaining a server rack within a predetermined temperature range, including the removal of heat from the server rack by both conductive and convective heat transfer. Thermal contact structure is placed between the server rack and a heat sink. The heat sink may be in the form of a housing containing a radiator in one wall, and a bank of fans in an opposite wall to draw a coolant gas through the radiator. The coolant gas contacts the heat sink and a portion of the coolant gas is directed towards the server rack. Cooling liquid is supplied to the radiator by a chiller, which can be adjacent to the heat sink or located remotely from the heat sink.

Abstract: A color wheel heat dissipation device and a projection apparatus having the same are provided. The color wheel heat dissipation device includes a housing, a color wheel, a built-in radiator and a fan, wherein the housing includes a first cavity, a second cavity, and a third cavity that are mutually communicated with one another, the first cavity and the second cavity are sequentially arranged in an airflow direction; the built-in radiator is located in the first cavity; the fan is located in the second cavity; and the color wheel is located in the third cavity. The color wheel heat dissipation device and the projection apparatus having the color wheel heat dissipation device can maximally increase the heat exchange rate in the color wheel cavity, improve performance of the color wheel, reduce temperature of the color wheel, thereby achieving the purpose of improving efficiency and service life of the product.

Abstract: An electronic device includes a main substrate, a semiconductor package structure and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate, and includes a die mounting portion, a semiconductor die and a cover structure. The semiconductor die is disposed on the die mounting portion. The cover structure covers the semiconductor die. The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die.

Abstract: An automotive power module has a plurality of power cards stacked to form an inverter module, and a DC-link capacitor mounted against the inverter module. Each of the power cards includes a top cover having opposite sides. One of the sides has extended therefrom a first matrix of pins. Each of the power cards also includes a plurality of integrated circuits defining transistors of an inverter mounted on the other of the sides, terminals extending from a perimeter of the top cover and in electrical communication with the integrated circuits, and a bottom cover having extended therefrom a second matrix of pins.

Abstract: A liquid cooling system for a circuit board made up of a cold plate and heat sinks connected to the cold plate by flexible connections.

Abstract: A water-cooled motor controller includes a capacitor, a water-cooled plate, and a power module stacked in a controller housing. The power module is fixedly connected to the water-cooled plate. The water-cooled plate is provided with a cooling medium flow channel on one side facing the power module, and the other side of the water-cooling plate on which the cooling medium flow channel faces away from the power module side contacts the capacitor through an insulating and thermally conductive material for heat exchange. The water-cooled plate and the controller housing are fixedly connected to each other with a cooling medium passage provided therebetween. A cooling medium flows in from the controller housing, and then flows out of the controller housing after being heat exchanged by the water-cooled plate. The present invention utilizes upper and lower surfaces of the water-cooled plate to dissipate heat from the capacitor and the power module simultaneously.

Abstract: An electrical power delivery system includes a module stack, a conductive bus bar, and one or more energy storage devices. The module stack includes multiple modules stacked side by side along a stack axis. Each of the modules has a respective housing and internal electrical components within the housing. The conductive bus bar is oriented along a plane parallel to the stack axis. The bus bar is mounted along a side of the module stack and electrically connected to one or more of the modules. The one or more energy storage devices are electrically connected to the bus bar and extend from a side of the bus bar facing away from the module stack such that the bus bar is disposed between the one or more energy storage devices and the module stack.

Abstract: An auxiliary-cooled electronics assembly comprises a metal extrusion that includes: one or more cooling conduits extending axially along a length of the metal extrusion with a first open end in fluid communication with the cooling conduit(s); and a second open end in fluid communication with the cooling conduit(s); a first end cap coupled to the first open end forming a fluid-tight seal between the first end cap and the metal extrusion; a second end cap coupled to the second open end forming a fluid-tight seal between the second end cap and the metal extrusion; and one or more electrical circuit components, electrically linked together to form an electrical circuit, mounted to the metal extrusion.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.

Abstract: The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units.

Abstract: A power module includes a substrate having a first layer and a second layer which are connected to one another and arranged above one another. The first layer includes a first dielectric material having a metallization arranged on a side facing the second layer and the second layer includes a second dielectric material having a metallization arranged on a side facing away from the metallization of the first dielectric material. A power semiconductor having a first contact area and a second contact area opposite the first contact area is connected to the metallization of the first dielectric material via the first contact area and arranged in a first recess of the second layer. A metallic first encapsulation encapsulates the power semiconductor in a fluid-tight manner, with the second contact area of the power semiconductor being electrically conductively connected to the metallization of the second dielectric material via the first encapsulation.

Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.

Abstract: A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.

Abstract: According to one embodiment, a liquid cooling module includes a chassis, a supply liquid manifold and a return liquid manifold that are both fluidly coupled to a coolant source, a piece of information technology (IT) equipment that is mounted to the chassis and has an IT component, and a frame structure that includes: a pair of primary beams that are coupled to the chassis, a pair of secondary beams, each secondary beam being coupled to both primary beams, and a cold plate that is coupled to the pair of secondary beams. The plate is arranged to come into direct contact with the component. The plate is fluidly coupled to the supply liquid manifold to receive liquid coolant from the source and is fluidly coupled to the return liquid manifold to return warmed coolant to the source that is produced when heat generated by the component is transferred into the coolant.

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

Abstract: Thermal management assemblies for cooling an electronic assembly disposed on a PCB are disclosed. The thermal management assembly includes a heatsink, a heatsink manifold formed through the heatsink and a thermal compensation base layer coupled to the heatsink. The heatsink manifold has a fluid inlet and a fluid outlet. The thermal compensation base layer thermally connects the heatsink and the electronic assembly. The thermal management assembly further includes a cooling manifold disposed through the PCB to form a fluid flow path. Two or more electrically insulated posts are disposed between the heatsink manifold and the cooling manifold. Individual electrically insulated posts have a vertical cooling channel. At least one electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an upward fluid path. At least one electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form a downward fluid path.

Abstract: The present invention relates to a condenser, and more particularly, to a condenser in which a configuration and an assembly are simplified by forming a condensation region in which plates are stacked and refrigerant is condensed and a super cooling region in which the refrigerant is supercooled, arranging a connection plate to which a gas-liquid separator is coupled between the condensation region and the super cooling region, and forming the refrigerant and cooling water to flow between the condensation region and the super cooling region, in a water cooling condenser.

Abstract: In one embodiment, a cooling device for providing liquid cooling to an electronics circuit board includes an upper module having a cooling plate forming an upper surface to receive an external circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel. The cooling device further includes a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source, and the cooling device includes a plurality of tube channels positioned between the upper module and the lower module to receive the cooling liquid from the lower module and to supply the cooling liquid upwardly to the upper module.

Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.

Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.

Abstract: A motor driving device includes a housing unit, a capacitor module, and a driving module. The housing unit includes a first compartment and a second compartment. The capacitor module is detachably mounted in the first compartment and includes a first circuit board, at least one capacitor electrically connected to the first circuit board, and two first conducting members electrically connected to the first circuit board. The driving module is mounted in the second compartment and includes a second circuit board and two second conducting members that are electrically connected to the second circuit board and that are respectively, electrically and detachably connected to the first conducting members.

Abstract: A controller of a fuel system for a vehicle is provided in which heat is dissipated outside from a printed circuit board to cool the controller. The dissipated heat is utilized to maximize the efficiency of the purge operation using a canister by waste heat. The controller is integrated with an air filter for removing foreign substances from air to be suctioned into a canister, and is configured to realize heat exchange between air passing through the air filter and a motor driver.

Abstract: The present disclosure envisages an arrangement for maintaining desired temperature conditions on and within a transformer housing of an encapsulated transformer. The arrangement comprises at least one insulation plate disposed proximal to a transformer core and coil assembly of the encapsulated transformer such that the insulating element is in surface contact with a potting compound of the encapsulated transformer and adapted to substantially contain the heat emanating from the transformer core and coil assembly, thereby maintaining desired temperature conditions on and within the transformer housing.

Abstract: A cabinet liquid cooling system is configured to dissipate heat of a cabinet. A flow allocation unit is installed on a single side of the cabinet, is located in space between a side wall of the cabinet and a mounting bar of the cabinet, and is provided with a liquid inlet and a liquid outlet. A liquid cooling system (LCS) control unit is installed at the bottom of the cabinet and cyclically supplies liquid to the flow allocation unit using the liquid inlet and the liquid outlet. A liquid supply branch includes a liquid delivery pipe and a liquid return pipe. A node pipe includes a liquid inlet pipe and a liquid outlet pipe. Both the liquid inlet pipe and the liquid outlet pipe are connected to the corresponding liquid delivery pipe and liquid return pipe using the quick male connector and the quick female connector.

Abstract: A solid state drive is disclosed including a planar array of semiconductor devices for use in a datacenter, and a system for cooling the planar array of semiconductor devices. The semiconductor devices may be arranged in a grid pattern, spaced apart from each other so as to define rows and columns of flow pathways, or cooling tunnels, around and between the semiconductor devices.

Abstract: The present invention relates to a heat exchanger for cooling an electrical element and a heat exchanger assembly for cooling an electrical element, and more particularly, to a heat exchanger for cooling an electrical element and a heat exchanger assembly for cooling an electrical element into which the electrical element may be easily inserted and in which both surfaces of the electrical element and a tube through which a coolant flows are formed to contact each other to improve cooling performance.