Abstract: A heat sink assembly includes a heat sink (10), a fan (20), and a retaining bar (30). The heat sink includes a base (12), and a plurality of parallel fins (14) extending upwardly from the base. The fins include a first outmost fin (18) and a second outmost fin (19) at opposite sides of the heat sink. The first outmost fin and intervening fins each define a longitudinal opening. All of the openings are aligned with each other, and cooperatively define a hexahedral chamber (16) that is parallel with the base. The fan is received in the chamber. The retaining bar is secured to the first outmost fin by fasteners such as screws (40). A pressing portion (36) is formed on the retaining bar, the pressing portion resiliently pressing one side wall of the fan. The fan is thus firmly retained in the chamber.

Abstract: A heat sink assembly includes a heat-conductive base (20), and a plurality of combined fins (30) uprightly attached onto the base. Each fin includes a main body (31), a bottom flange (32) extending from the main body, and two lower abutting plates (34) extending upwardly from the flange. A pair of first locking tabs (342) is formed from outer sides of the lower abutting plate, and extends into corresponding cutouts (36) of the main body of an adjacent fin. Two upper abutting plates (34′) are formed from a top edge of the main body. A second locking tab (40) extends from an outer side of each upper abutting plate, and into a corresponding notch (38) of the main body of the adjacent fin. Then, the first and second locking tabs are bent inwardly to abut against the main body of the adjacent fin. Thus, the fins are firmly combined together.

Abstract: A pin fin heat sink for use in transferring heat away from a heat generating source is described which is manufactured by fusion or stud welding of fins to a base forming a continuous thermally conductive path for heat rejection. The method permits use of a broader range of thermally conductive materials, fin geometry and fin spacing than exists in current art. Having greater flexibility in fin design enables more efficient heat sinks with greater surface area and lower thermal resistance for any given volume. Relatively long thin pins are joined autogenously to a heat sink base with closely spaced adjacent surfaces by a capacitor discharge stud welding process without the need to apply significant force to the mating parts.

Abstract: A heat dissipating device includes an electric member, a heat sink having a base to be secured on the electric member. The base includes an upper surface and includes four corner areas, and includes four posts extended upwardly from the four corner areas thereof respectively. A fan device is disposed on and secured to the posts. The heat sink includes a number of rods extended upwardly from the upper surface of the base, and each of the rods includes an upper portion, and a recess formed in the upper portions of the rods. Each of the rods preferably includes a planar surface formed on the upper portion to form the recess on top of the rods.

Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract: A hard disc drive (HDD) heat sink and sound absorbing frame comprises a sound absorbing frame, two heat sinks with multiple heat dissipating fins and two heat conducting seals. The sound absorbing frame has an open center and multiple through holes. Each heat sink has an inner surface, multiple screw holes, multiple posts with threaded holes attached to the inner surface of the heat sink and multiple heat dissipation fins. The HDD is securely mounted in the open center of the sound absorbing frame, and the heat sinks are mounted on the sound absorbing frame with the HDD. The multiple posts on the heat sinks respectively extend through the corresponding through holes in the sound absorbing frame. Screws screw into the threaded holes in the posts to hold the assembly together.

Abstract: A heat dissipating assembly includes a heat sink (120) attached on an electronic package (110), a fan (140) mounted to the heat sink, and an air guide device (20). The air guide device includes a duct (21) fixedly attached to a computer enclosure (40) at an air opening (42) thereof, and a hood (25) adjustably connected to the duct. The hood has a connection portion (26) adjustably connected to the duct, and a cover portion (29). The duct defines annular grooves (22) in an outer circumferential surface thereof, and the connection portion forms protrusions (28) on an inner surface thereof. The protrusions are engaged in selected annular grooves, to retain the hood on the duct at a desired position. The cover portion of the hood is near to and aligned with the fan. Heated air blown by the fan passes directly through the duct and out of the enclosure.

Abstract: A fan holder (10) for mounting a fan (30) to a heat sink (20) includes a rectangular base (12). The base is attached to the heat sink, and supports the fan thereon. An opening (14) is defined in the base, for providing airflow access from the fan to the heat sink. A pair of tabs (16) depends from each of opposite sides of the base. Each pair of tabs is disposed at respective opposite ends of the respective side of the base. A stop (161) integrally extends from each tab, the stop engaging in a corresponding slot of the heat sink. A handle (163) integrally extends from each tab, for facilitating manual operation whereby the tab is moved resiliently. In a preferred embodiment, each stop is orthogonal to both the tab and the base. In an alternative embodiment, each stop is orthogonal to the tab and parallel to the base.

Abstract: A coupling mechanism for radiator aims to fasten a radiator to a heat generating element of a socket on a main board for absorbing the thermal energy generated by the heat generating element. The coupling mechanism includes a first anchor dock, a second anchor dock and a latch element. The first anchor dock and the second anchor dock are located on two opposite ends of the socket. The latch element passes through the gap of the radiation fins of the radiator and straddles the radiator. It has one end pivotally engaging with the first anchor dock and another end selectively engaging with the second anchor dock. The latch element further has an elastic section formed in the middle portion to put the radiator in close contact with the heat generating element. The coupling mechanism thus constructed can increase the surface area of the radiation fins of the radiator to achieve the maximum radiation effect.

Abstract: A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.

Abstract: A sealed housing of the present invention is used in an electronic device such as a communication device, and is provided with a body, a cover, and a movable fin for radiating heat while suppressing a change in internal pressure, and preventing invasion of water vapor or poisonous gas from the exterior to thereby avoid an accident caused by dew condensation, corrosion of an electrical circuit component, or the like. The movable fin is configured to be automatically slidable toward the inside or outside of the sealed housing depending on a change in internal atmospheric pressure of the sealed housing following a change in internal temperature thereof. When the temperature inside the sealed housing rises due to heat from the electrical circuit component mounted in a package inside the sealed housing, it is possible to increase a heat radiation area of the movable fin while keeping sealing tightness so that a heat radiation effect can be enhanced.

Abstract: A fastening frame of the invention includes a fastener comprised of a transversal connecting arm that connects two attachment parts at two opposite sides. The transversal connecting arm has a thickness that is smaller than the space between the fins, and an edge that is parallel to the base of the heat slug. The fastening frame is thereby mounted in a manner that the transversal connecting arm inserts in a space between two fins with the attachment parts attached to the positioning socle. The transversal connecting arm is further downwardly connected to a pressing part that presses the base of the heat slug in tight abutment against the microprocessor.

Abstract: A cooling device with an air shower is disclosed. The cooling device includes a heat mass with a plurality of spaced apart fins connected therewith. An air shower including an injector face with a plurality of disrupter orifices is positioned over the fins so that the disrupter orifices direct a second air flow into slots between adjacent fins. A first air flow flowing through the slots is impinged upon and is disrupted by the second air flow resulting in the generation of turbulence in the first air flow. Consequently, a thermal boundary layer in the first air flow is disrupted and a rate,of heat transfer from the fins and the heat mass are increased.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A heat sink clip (10) is shaped from a single piece of metal wire. Opposite ends of the metal wire are bent to form a generally twin strand structure that is the clip. The clip includes a central pressing portion (12), two resilient connecting portions (18) extending outwardly and upwardly from the pressing portion, and two arms (14) depending from distal ends of the connecting portions. The pressing portion has four contact points at a bottom thereof, for pressing a heat sink (20) onto a CPU (30). A pair of hooks (16, 16′) is inwardly formed from distal ends of the arms respectively, for engaging with a pair of retaining ears (42) at opposite sides of a CPU socket (40). The contact points of the pressing portion enable the heat sink to be securely fastened to the CPU mounted on the CPU socket.

Abstract: A fastening frame of the invention includes a fastener comprised of a transversal connecting arm that connects two attachment parts at two opposite sides. The transversal connecting arm has a thickness that is smaller than the space between the fins, and an edge that is parallel to the base of the heat slug. The fastening frame is thereby mounted in a manner that the transversal connecting arm inserts in a space between two fins with the attachment parts attached to the positioning socle. The transversal connecting arm is further downwardly connected to a pressing part that presses the base of the heat slug in tight abutment against the microprocessor.

Abstract: A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.

Abstract: A heat sink apparatus is constructed from alternating longer and shorter sheets of graphite material sandwiched together such that the longer sheets extend beyond the shorter sheets to define fins. The directions of higher thermal conductivity of the anisotropic graphite material are oriented in the plane of the sheet. The longer and shorter sheets have base ends aligned together to define a generally planar base surface for engaging an electronic device to be cooled.

Abstract: In one embodiment, the invention provides a system. The system comprises using a plurality of heat absorbing fins to absorb heat from an electronic component of a substrate-mounted electronic assembly; and transporting the absorbed heat to a material of an enclosure for the electronic assembly where it is dissipated.

Abstract: A heat dissipation assembly for dissipating heat from a CPU (60) mounted to a PCB (70) includes a heat sink (40), two wire clips (30), a fixing frame (20) secured to the heat sink, and a fan (10) attached to the fixing frame. Two grooves (402) are defined in the heat sink. Each clip has a central portion (302) received in a corresponding groove, and two arms (304) extending from the central portion. A hook (306) is formed at an end of each arm. An offset part is formed at the central portion, for limiting rotation of the clip in the groove. The fixing frame includes a top wall (212) and two side walls (202). Two cutouts (206) are defined in each side wall, corresponding to the grooves of the heat sink. Opposite ends of the central portion of each clip protrude out through corresponding cutouts of the fixing frame.

Abstract: It is an exemplified object of the present invention to provide a heat sink, method of manufacturing the same, and electronic apparatus having the heat sink in which a fine and inexpensive adjustment upon placement and replacement may be made to exoergic components having various shapes and calorific values, and to placement space of various shapes and dimensions. The inventive heat sink comprises a housing, a cooling fin that is separably coupled with the housing, receives heal from the exoergic components, and dissipates heat form the exoergic components, and a cooling fan that forcefully cools the cooling fin and is connected with the housing, each element can be replaced alone.

Abstract: The present invention relates to a ruggedized enclosure for housing and protecting electronics circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to form a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.

Abstract: The present invention of a heat dissipating fin pieces interlocking mechanism includes a plurality of aluminum or copper fin pieces wherein the lower center protruding section is bent and folded into a base plate. Also located on center portion fin pieces is a plurality of venting openings; the center portion fin pieces extend on upper and lower ends into a plurality of locking elements where each is fitted with one or two claws. The claws are connected to the center portion fin piece by a perforated protruding section while the closer edge of the protruding section grows into a neck. The neck turns into a folding part with narrowed end. When a multitude of fin pieces are assembled, the narrowed end of folding part from the back fin piece penetrates through the corresponding perforations of the front fin piece locking elements then fold back flat into a secure interlocking position.

Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on another surface, at least two fins and porous reticulated foam blocks having intervening gaps that fill the width and at least a portion of the length between the fins. The foam block may be a continuous single block within the space between two adjacent fins along the length of the fins or may be an array of short-length blocks having intervening gaps along the length of the fins.

Abstract: Heat is removed from a small hand-held portable computer by dissipating the heat from surfaces that are not typically held by the user during hand-held operation. The heat is dissipated from fins located at a rear underside casing of the portable computer. Heat-generating internal electronic components or their heat sinks are placed in close proximity to the fins. Heat may also be dissipated from the backside of the display screen. The dissipation of the heat allows the portable computer to operate at higher frequencies.

Abstract: Heat is removed from a docked portable computer. Due to the heat removal, the portable computer can operate at full design voltage and frequency while docked, and thereby provide maximum performance, without sacrificing performance in order to generate less heat. A docking station provides a thermal docking connection. The thermal docking connection is implemented using a first set of fins of the portable computer that is mated to a second set of fins in the docking station. The second set of fins in the docking station is then, via use of heat conductive materials, exposed to forced airflow from a fan within the docking station. Other embodiments of heat-removal methods, such as larger surface areas, peltia devices, water cooling, and others, can be used to pull additional heat from the docked portable computer. Thus, the docking station acts as an “air-conditioner” for the portable computer, and allows the portable computer to operate at higher frequencies.

Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.

Abstract: A heat dissipating assembly (1) includes a plurality of fins (10), three heat pipes (20), and a base (30). Each fin defines three through holes (11) across a middle portion thereof. A plurality of dome-shaped protruding portions (14) is formed in each fin. The protruding portions are arranged in a regular array of offset rows. Adjacent protruding portions in any row protrude from front and rear faces of the fin in a regular alternating configuration. One end of each heat pipe is respectively inserted into the corresponding through holes of the fins, and an opposite end of each heat pipe is attached in the base. The base is attached on an electronic device, for absorbing heat produced by the electronic device. The protruding portions increase a heat dissipating surface area of the fins, and deflect airflow that passes across the fins in a direction parallel to the fins.

Abstract: This invention relates to a heat transfer surface (3) or tubular or plate-like bodies (4) having a microstructure (7) projecting out of the base surface (3a) and consisting of projections (6) which are galvanized onto the base surface (3) with a minimum height of 10 &mgr;m. The object of this invention is to create a heat transfer surface (3) of this type which is characterized by an increase in thermal efficiency of its heat transfer surfaces (3) with the smallest possible temperature differences and is suitable for both nucleate boiling and film condensation with a justifiable manufacturing expense. The object is achieved according to this invention by the fact that the base surface (3a) is covered entirely or partially with projections (6); these projections (6) are applied in the form of ordered microstructures (7) and they have a pin shape, extending with their longitudinal axis (6c) either at a right angle to the base surface (3a) or at an angle (&agr;) between 30° and 90°.

Abstract: A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more components through the use of pins oriented at more than one angle with respect to the base of the tandem heat sink. An airflow across one or more electronic components is disrupted by the geometry of the different pin angles of the tandem heat sink, thereby creating turbulence which increases the efficiency of the heat sink and prevents thermal shading from occurring. When the heat sink is placed on a single component, the heat sink may be situated without any overhang relative to the component due to the turbulence induced by the different pin angles and the resulting increase in heat dissipation efficiency.

Abstract: A retaining device includes a retention frame (20), a back plate (40), a clip (10) and a wire arm (30). The retention frame forms a pair of protrusions (24, 25) at respective opposite sides thereof and an ear (26) at one of said sides of the retention frame. A pair of posts (44) extends from the back plate and further protrudes from the protrusions. The clip comprises a pressing lever (12) and a pair of legs (14, 16) depending from the lever. A pair of hooks (142, 162) is inwardly formed from the legs for engaging with the posts. The wire arm comprises a locating portion (34) positioned on the retention frame, a pressing portion (32) resting on the clip and an operating portion (36) clamped under the ear of the retention frame. The locating portion and the operating portion extend in opposite directions from the pressing portion.

Abstract: A heat sink extends beyond the outer boundaries of a component cooled by the heat sink. In one embodiment, the heat sink may have a cutout shaped and located so that a protruding portion of a clip can extend through the cutout from one surface of the heat sink and mechanically fasten the component to another surface of the heat sink. There may be more than one cutout. Heat transfer values can be optimized by adjusting the number and the location of the cutouts and the size of the heat sink relative to the component and the fastening mechanism (e.g., a clip). In another embodiment, the clip that extends through the cutout holds the heat sink against a motherboard, pressing against a component located between the heat sink and the motherboard.

Abstract: A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

Abstract: A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.

Abstract: Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a heat sink protrusion adapted to capture the retention clip between the hip and the heat sink body. One embodiment of a method for forming the hip consists of using a tool to deform the heat sink protrusion. One embodiment of heat sink lateral retention apparatus consists of one or more split bobbins adapted to attach to the retention clip to prevent lateral motion of the heat sink with respect to the clip.

Abstract: A heat sink apparatus includes a heat sink having a plurality of circuit board component contact portions and a plurality of fin portions extending from the contact portions. The circuit board component contact portions of the heat sink conform to a surface of the circuit board component when coupled to the circuit board component, thereby providing a thermal coupling between the fin portions of the heat sink and the associated circuit board component. The heat sink apparatus also includes a retainer, such as a double buckling beam retainer, that secures the heat sink to the circuit board component. The retainer causes the circuit board component contact portions of the heat sink conform to the surface of the circuit board component, thereby providing thermal contact between the heat sink and circuit board component contact portions and alleviating the need for a base portion associated with the heat sink, as in conventional mechanisms.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top part or a heat-sink member snapped-on through the central opening of the base member by irreversibly deforming bendable lugs which may have a radial or any other suitable shape. The bottom of the heat-sink member may be pushed down to physical contact with the top of the chip or to a position that leaves a space between the bottom of the heat-sink member and the top of the chip, so that the aforementioned space may be filled with a heat-conducting medium. It is an option to use the base part only. If necessary, a second heat-sink member of the same type, which could have different dimensions, can be soldered to the PC board side opposite to the chip. The heat sinks could be used with or without a fan.

Abstract: A self contained multiple dimming channel package includes a housing with a main power circuit board supported on its bottom wall and a control circuit board extending laterally and vertically to baffle air flow through the housing. A cross flow cooling fan forces air through an opening in the control board and across power switching modules and toroidal chokes mounted to the main board. Each power switching module includes a heat sink with fins parallel to the air flow, and the chokes are mounted in rows with their central openings aligned with the air flow. The power switching modules include circuits attached to the heat sinks with terminals releasably plugged into mating connectors on the main board. Circuit breaker switches are snapped into place in the housing. The front corners of the housing are provided with integral mounting bracket and handle members.

Abstract: A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more components through the use of pins oriented at more than one angle with respect to the base of the tandem heat sink. An airflow across one or more electronic components is disrupted by the geometry of the different pin angles of the tandem heat sink, thereby creating turbulence which increases the efficiency of the heat sink and prevents thermal shading from occurring. When the heat sink is placed on a single component, the heat sink may be situated without any overhang relative to the component due to the turbulence induced by the different pin angles and the resulting increase in heat dissipation efficiency.

Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A heat sink assembly includes a clip (10), a heat sink (50), and a retention module (60). The clip has two main bodies (20) and a beam portion (40). The beam portion includes a top plate (42), a side plate (44), and a connecting plate (48). Two through slots (49) are defined in opposite ends of the connecting plate (48). Two mounting slots (43) are defined in opposite ends of the top plate. Each main body includes a first leg (26), a central pressing portion (22), and a connecting portion (28). The connecting portion passes through a corresponding through slot, and is snappingly received in a corresponding mounting slot. Two recessed portions (56) are defined at opposite sides of the heat sink. The pressing portions are for pressing on the recessed portions. The retention module engagingly receives the first legs, and second legs of the beam portion.

Abstract: A heat sink apparatus is constructed from alternating longer and shorter sheets of graphite material sandwiched together such that the longer sheets extend beyond the shorter sheets to define fins. The directions of higher thermal conductivity of the anisotropic graphite material are oriented in the plane of the sheet. The longer and shorter sheets have base ends aligned together to define a generally planar base surface for engaging an electronic device to be cooled.

Abstract: A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and a bottom surface for attaching to the electronic device. At least two vertical plates are affixed to and extend substantially perpendicularly from the top surface in a spaced apart manner and are parallel one to the other. A secondary fin is affixed to and extends between an upper portion of the vertical plates. The secondary fin has a top convoluted edge and a bottom convoluted edge and is oriented such that the bottom convoluted edge faces the top surface of the base plate. The secondary fin includes a plurality of individual fins formed in a convoluted accordion-like manner. The plurality of individual fins define a plurality of secondary fin passageways between adjacent ones of the individual fins wherein each secondary fin passageway extends from the top convoluted edge to the bottom convoluted edge.

Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: A distribution cabinet (1) for accommodating weak-current distribution installations, in particular for arranging outdoors, having a base box (2), an outer cabinet body (3) with at least one door (4), a cabinet cover (5), and an inner installation frame (6), the installation frame (6) being made up of profile sections (50), of which the cross-sectional shapes has two insertion pockets (51a,b), of which the insertion directions (52a,b) run at right angles to one another.

Abstract: A cooling apparatus and method of fabrication are provided for cooling one or more heat generating components. The cooling apparatus includes a heat sink structure and an airflow tube assembly. In one embodiment, the heat sink structure has a first surface for coupling to one or more heat generating components, and a second surface having at least one fin extending therefrom. The airflow tube assembly has at least one airflow tube which is sized to at least partially receive the at least one fin of the heat sink structure, wherein an annular airflow can be established between the at least one airflow tube and the at least one fin of the heat sink structure, thereby enhancing heat transfer from the heat sink structure to the airflow and cooling of the heat generating component(s).

Abstract: A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.