Abstract: An object of the present invention is to provide a semiconductor device in which the effect of dimensional tolerance can be reduced, and a method for manufacturing the same. The semiconductor device according to the present invention includes: a plurality of cooling plates each having a coolant passage inside; spacers disposed to stack the cooling plates with spaces; at least one semiconductor package disposed on at least one principal surface of at least one of the cooling plates; and a spring plate disposed between adjacent ones of the cooling plates, the spring plate biasing the at least one semiconductor package toward the cooling plates.

Abstract: A packaged semiconductor device includes a substrate, a heat-generating component positioned on a surface of the substrate, an enclosure at least partially surrounding the substrate and the heat-generating component, and a thermal interface material disposed between the heat-generating component and the enclosure. The enclosure includes a cover portion having a convexly curved surface configured to apply a pressure to the thermal interface material. The pressure may be substantially uniform over the area of the thermal interface material, or may be higher at a center of the thermal interface material than at a periphery of the thermal interface material.

Abstract: The present disclosure relates to a display device and an electronic device. The display device includes: a first display module having a first backplane; a second display module having a second backplane located on an opposite side of the first backplane; and a first heat sink located between the first backplane and the second backplane, and configured to radiate heat from the first backplane and the second backplane.

Abstract: Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

Abstract: A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

Abstract: A printed circuit board includes a plurality of metal layers, a plurality of insulating layers provided between the respective metal layers of the plurality of metal layers, and an electronic device provided on one metal layer of the plurality of metal layers. The plurality of metal layers include a first outer metal layer and a second outer metal layer located on the outermost side of the plurality of metal layers and a plurality of intermediate metal layers located between the first outer metal layer and the second outer metal layer. At least one of the plurality of intermediate metal layers is a thick metal layer thicker than the first outer metal layer and the second outer metal layer. The thick metal layer is connected to one of a ground terminal of the electronic device and a power supply terminal of the electronic device.

Abstract: An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.

Abstract: An IGBT serving as a heat-generating electrical component mounted on the lower surface of a lower board serving as a control circuit board of an inverter is disposed in abutment with a heat-dissipating flat section provided on an inner wall of an inverter box provided on the outer periphery of a housing so that the heat of the IGBT is dissipated toward the housing. Moreover, a spacer member is interposed between the lower board and the IGBT so as to fill a space between the lower board and the IGBT, and the spacer member is rigid enough that the lower board and the IGBT are prevented from being displaced toward and away from each other.

Abstract: An electronic device includes a circuit board, a connector and a noise suppression assembly. The circuit board includes a substrate having a surface layer. The connector is disposed on the circuit board and has at least one electrical pin. The noise suppression assembly includes a wiring area located on the surface layer and adjacent to the connector and a conductive cover member. The wiring area includes at least one electrical contact, a transmission circuit and at least one ground contact, the electrical contact is used for being in electrical contact with the electrical pin of the connector. The transmission circuit is electrically connected to the electrical contact. The ground contact is located around the wiring area. The conductive cover member has a cover plate and at least one lateral plate. The lateral plate is connected to the cover plate for forming a shielded space.

Abstract: An LED array comprises a base layer, at least one LED disposed on the base layer, and a diffusion layer including a luminescent material. The diffusion layer covers the at least one LED and the base layer in such a way that light emitted from the at least one LED passes through the diffusion layer.

Abstract: A method for making an epitaxial structure is provided. The method includes following steps. A substrate having an epitaxial growth surface is provided. A buffer layer is formed on the epitaxial growth surface. A carbon nanotube layer is placed on the buffer layer. An epitaxial layer is epitaxially grown on the buffer layer. The substrate is removed.

Abstract: The heat sink includes a fastener and a heat pipe. The fastener has a receiving space, an upper claw and a lower claw. The upper claw and the lower claw are formed in the receiving space. The heat pipe has a first end and a second end. The first end is received in the receiving space and clipped between the upper claw and the second claw, and the upper claw or the lower claw is partially embedded in the heat pipe to be flush with each other.

Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.

Abstract: A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base. A slot is defined in each retaining portion. Each fin includes a main plate and a pivoting portion formed at a bottom the main plate. The pivoting portions are respectively and pivotably received in the slots of the base.

Abstract: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).

Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

Abstract: A handheld device (10), including a projector module (20) which includes a light source having a laser or at least one light emitting diode; a thermal management system which includes a heat collector (30) formed of a material having a thermo-mechanical design constant of at least 10 mm-W/m*K and having a non-planar shape, the heat collector in thermal contact with the light source; a heat spreader (40) having a surface area at least 1.5 times that of the surface area of the heat collector and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader positioned in thermal contact with the heat collector, wherein thermo-mechanical design constant of a material is defined by thermal conductivity of the material multiplied by its average thickness.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: An integrated circuit package apparatus includes a packaging substrate, an integrated circuit coupled to an upper side of the packaging substrate, an array of contacts coupled to an underside of the packaging substrate for electrically coupling the integrated circuit to a circuit board, and a lid coupled to the upper side of the packaging substrate. In one form, the lid includes a central portion lying on a first plane, corner areas lying on a second plane, and arcuate wall portions disposed between and interconnecting the corner areas and the central portion. Other forms of the lid are provided.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

Abstract: A fixing bracket includes a bracket body, at least one connecting rod assembly, and at least one elastic buckling arm. One side of the bracket body has a first pivoting point and a second pivoting point. The at least one connecting rod assembly includes a first rod, a second rod, a third rod. The first rod has a third pivoting point and a fourth pivoting point. The second rod has a first limiting part, a fifth pivoting point, and a sixth pivoting point. The third rod has a second limiting part, a seventh pivoting point, and a eighth pivoting point. The at least one elastic buckling arm is located on the first rod. The connecting rod assembly drives the elastic buckling arm to move between a release position and a fastening position. When located at the fastening position, the first limiting part is against the second limiting part.

Abstract: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: An electronic device may include at least one power component and a printed circuit board. The at least one power component may include a main body and a lead. The printed circuit board may include at least two conductive layers parallel to a plane. The printed circuit board may further include a mounting element and a conductor. The mounting element may include first conductive tubes. The conductor may include second conductive tubes. The first conductive tubes and the second conductive tubes may elongate through a thickness of the printed circuit board along a direction substantially perpendicular to the plane. The main body of the at least one power component may be fixed to the mounting element. The lead of the at least one power component may be fixed to the conductor.

Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.

Abstract: An apparatus for tracking a portable asset includes a solar panel, an electronics assembly integrated into an enclosure, and a heat spreading assembly adjacent the solar panel, the heat spreading assembly located to form an air gap separating the heat spreading assembly from the electronics assembly such that heat generated by the solar panel is dissipated in the air gap before reaching the electronics assembly.

Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Abstract: A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play.

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first portion facing the first heating element and a second portion being outside the first heating element. The first heat pipe is configured to be bent by the first pressing member. The second heat pipe is connected to the second portion of the first heat pipe and the heat sink.

Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

Abstract: An electronic module including a supporting frame, a handle, an electronic device, and a heat dissipating member is provided. The handle assembled to the supporting frame is open or closed relative to the supporting frame. The electronic device is detachably assembled on the supporting frame. The heat dissipating member detachably assembled to the handle moves relative to the supporting frame with the handle. When the handle is closed relative to the supporting frame, the electronic device is fixed on the supporting frame by the handle, and the heat dissipating member leans against the electronic device. When the handle is opened relative to the supporting frame, the heat dissipating member is far away from the electronic device.

Abstract: A receptacle including a shield housing and a heat sink. The shield housing has a first side configured to be connected to a printed circuit board. The housing has an aperture for insertion of a plug of a cable assembly. The heat sink is connected to the first side or an opposite second side of the shield housing. The heat sink has a lateral end section which extends along an exterior of a least one lateral side of the shield housing.

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.

Abstract: An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern. A resin body is wrapped around the semiconductor chip. A first metal plate has a side connected to the semiconductor chip and an other side connected to the first circuit pattern. A radiator projects toward and is connected to the first circuit pattern by a first heat conductor. As a result, heat generated by the semiconductor chip is transmitted to the radiator through the first metal plate, the first circuit pattern, and the first heat conductor during operation of the semiconductor module.

Abstract: A device including a structural member having a heat spreader and an electronic device mounted directly to a first surface of the heat spreader of the structural member. The device also includes a cold plate mounted directly to the first surface of the heat spreader of the structural member.

Abstract: A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

Abstract: The production method of a cooler includes a laminated material production step S1 and a brazing joining step. In the laminated material production step, a laminated material is formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner. In the brazing joining step, a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined by brazing.

Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

Abstract: In a manufacturing method of a package carrier, a substrate including a first metal layer, a second metal layer having a top surface and a bottom surface opposite to each other, and an insulating layer between the first and second metal layers is provided. The second metal layer has a greater thickness than the first metal layer. A first opening passing through the first metal layer and the insulating layer and exposing a portion of the top surface of the second metal layer is formed. The first metal layer is patterned to form a patterned conductive layer. Second openings are formed on the bottom surface of the second metal layer. The second metal layer is divided into thermal conductive blocks by the second openings that do not connect the first opening. A surface passivation layer is formed on the patterned conductive layer and the exposed portion of the top surface.

Abstract: A semiconductor device which provides a small and simple design with efficient cooling. A first electrically conducting cooling element is in contact with first electrodes of semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the first electrodes of the semiconductor elements to an external apparatus. A second electrically conducting cooling element is in contact with second electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the second electrodes of the semiconductor elements to an external apparatus. The semiconductor device includes an interface which is electrically connected to gates of the semiconductor elements for external control of respective states of the semiconductor elements.

Abstract: The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.

Abstract: According to embodiments, there is provided an electronic component unit, including: a circuit board including: a heat generating element that generates a heat; and a bonding metal foil layer formed on a face thereof; a heat transfer board including: a board body having a thermal conductivity higher than that of the circuit board; an insulative layer formed on a first face of the board body; and a heat transfer metal foil layer formed to cover the insulative layer; and a heat sink, wherein the circuit board is assembled with the heat sink via the heat transfer board such that (1) the heat transfer metal foil layer is soldered to the bonding metal foil layer and (2) the second face of the board body is superimposed on the heat sink.

Abstract: A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.

Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.