Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Abstract: An electrical system as described herein is suitable for use in an electric or hybrid vehicle. The electrical system includes electrical devices, such as power transistors, coupled to an electrically and thermally conductive bus bar. The respective nodes of the electrical devices are coupled to the bus bar such that the bus bar carries a combined signal generated by the electrical devices. The bus bar is also thermally coupled to a conduction heat transfer system, such as a liquid cooled cold plate. Thus, the bus bar functions as both an electrical conduit and a conduction-based heat sink for the electrical system.

Abstract: An electronic assembly (1) includes a top cover (21), a bottom cover (22) and a thermal module (10). The thermal module includes a centrifugal blower (14) and a fin assembly (12). The blower includes a top lid (142) defining a first air inlet (146) therein, a bottom plate (147) defining a second air inlet (150) therein, and a sidewall (148). An air outlet (149) is defined in the blower in front of the sidewall. A first distance (H1) formed between the top cover and the top lid is greater than a second distance (H2) formed between the bottom cover and the bottom plate. A left edge (154) of the second air inlet adjacent to the air outlet offsets a distance from a corresponding left edge (155) of the first air inlet inwardly toward a rotation axis (A) of an impeller (143) of the blower.

Abstract: A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.

Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component, provides a thin printed circuit board having a superb heat releasing effect.

Abstract: Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.

Abstract: Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower surface of each module and the upper surface of the cold plate base of the rack. The mechanism for clamping a module to the rack also pulls the wedge blocks together to fill in the gap between the lower surface of the module and the upper surface of the cold plate so as to provide a complete thermal path therebetween.

Abstract: A heatsink module for electronic device includes a heatpipe, a board, a heatsink and at least a resilient plate. The board is mounted on one end of the heatpipe, and formed with at least a fixing hole. The heatsink is mounted on the other end of the heatpipe. The resilient plate fastens the board onto the electronic component of the electronic device. The resilient force of the resilient plate helps the board accommodated to the height of the electronic component and well contact with the electronic component. The board is made by stamping; therefore, the manufacture cost is lower. Also, the board and the resilient plate are thinner so as to reduce the height of the installation and help the thinness of electronic device.

Abstract: First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.

Abstract: An electronic device with a heat dissipation device is described. A printed circuit board has a first electronic component and a second electronic component thereon. The first dissipation device is attached to the first electronic component. The second dissipation device is attached to the second electronic component. At least one heat pipe includes a first straight section, a second straight section and a bent section between the former two. The heat pipe penetrates the first dissipation device and the second dissipation device, wherein the second dissipation device has at least one side engraved slot for securing the heat pipe inside.

Abstract: A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip, and one or more recesses disposed in a surface communicated to the one or more of the microchannel to enhance heat transfer rate of the microchannel heat sink. The recesses can be located in a surface of a cover that closes off the microchannels. The one or more recesses can be located at one or more local hot spot regions to enhance heat transfer rates at the local regions as well as overall heat removal rate of the heat sink.

Abstract: A heat sink is attached to a subject-side end portion of a barrel body of a lens barrel. The heat sink is provided with a large number of radiation fins formed in whorl. A heat pipe is disposed between the heat sink and a mount-side end portion of the barrel body. A CCD is fixed to the mount-side end portion of the barrel body. Heat of the CCD is transferred to the heat pipe via the mount-side end portion. Successively, the heat is efficiently transferred to the heat sink by the heat pipe. The heat having been transferred to the heat sink is efficiently radiated into the air by the whorl-like radiation fins regardless of conditions of the lens barrel.

Abstract: A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

Abstract: A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat generated by electronics components in the pluggable electronics module is conducted to the heat sink through a thermal path defined by the thermal plate, the compressible thermal pad, and the clip.

Abstract: A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the printed circuit board in contact with the waterblock cooling device and the clamp plate. A method is disclosed for connecting together a heat sink assembly and a component, the method comprising inserting standoffs of a clamp plate through passage holes in a printed circuit board; inserting the standoffs of the clamp plate through clearance holes in a waterblock cooling device; and positioning a spring component in contact with the clamp plate and the waterblock cooling device so as to position the printed circuit board in contact with the waterblock cooling device and the printed circuit board in contact with the clamp plate.

Abstract: An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted adjacent an electronic component that it is desired shield. The shielding portion at least partially surrounds the component, thereby providing a degree of EM shielding. The assembly also includes at least one resiliently biased electrically conductive connection member in electrical communication with the shielding portion. The connection member is operable electrically to connect the shielding portion to a predetermined voltage by bearing down upon an electrically conductive contact of the circuit board.

Abstract: A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Preferably, the stretched heat-dissipating metal plate has a thickness smaller than that of the heat-dissipating metal plate before stretching by not more than 20%. The chip has good compression strength in the radial direction and the heat-dissipating metal plate has higher tensile strength after being stretched and taking shape, providing a more stable structure and avoiding damage to the chip due to radially outward tension. The combined chip/heat-dissipating metal plate thus obtained is more stable and thus benefits the subsequent cutting by a laser cutting apparatus.

Abstract: A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.

Abstract: A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical attachment, as by wire bonding, to conductive traces on the opposite side of the interposer substrate. One or more reinforcements in the form of crosspieces or bridges span and segment intermediate portions of the substrate slot to resist bending stresses acting in the slot region proximate the centerline of the interposer substrate tending to crack or delaminate a polymer wire bond mold cap filling and covering the slot and the wire bonds. Various interposer substrate configurations are also disclosed, as are methods of fabrication.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

Abstract: This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circuit communication between the communication wafers (12) is provided from wafer to wafer through the cooling plates (14). In addition, the communication wafers (12) may have integrated circuit chips (18) deposited on both sides of the wafer, and chip-to-chip communication may be provided from one surface of the wafer to another through the wafer. The resulting integrated circuit package may have any desired geometrical shape and will permit heat exchange, power and data exchange to occur in three generally mutually orthogonal directions through the package.

Abstract: A module includes a cold plate. Solid-state heat sources are thermally mounted on the cold plate in a chamber defined by the cold plate and a lid. Cooling of the heat sources is enhanced by a dielectric liquid within the chamber. The liquid has a boiling point slightly below the temperatures of “hot” spots, to form small bubbles during operation, which enhance convection flow. The liquid may be a mixture of fluorocarbons of different boiling points. The liquid may contain diamond particles.

Abstract: A substrate holder for supporting a substrate, including an exterior supporting surface, a cooling component, a heating component positioned adjacent to the supporting surface and between the supporting surface and the cooling component, and a contact volume positioned between the heating component and the cooling component, and formed by a first internal surface and a second internal surface. The thermal conductivity between the heating component and the cooling component is increased when the contact volume is provided with a fluid.

Abstract: A cylindrical tubing hinge extends around and couples two segments of rigid or semi-rigid tubing and enables rotational motion of one segment relative to the other.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

Abstract: A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and the second substrate. The device also includes a circuit chip connected to the transmission line.

Abstract: An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.

Abstract: A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.

Abstract: A semiconductor cooling device includes at least one cold plate for cooling a semiconductor element, a condenser adapted to be cooled by a fan, and a refrigerant pump. The refrigerant pump is electrically connected to an inverter controller that controls the number of revolutions of the refrigerant pump.

Abstract: An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials having a higher coefficient of thermal expansion (CTE) than the fastener.

Abstract: A cooling device for semiconductor modules having: a cooler bar for accommodating at least one, particularly actively cooled semiconductor module; at least one first channel, particularly a bore hole, in the cooler bar for the passage of a, in particular, liquid coolant; and at least one second channel, particularly a bore hole, in the cooler bar for the feeding and/or return of the coolant to/from the semiconductor module.

Abstract: Multilayer circuit board (10b) for electrically interconnecting components (12b) of an electronic circuit, wherein one of the components (12b-1) has a cooling plane (14b) which is in planar contact over at least one cooling plane section (16b) of the cooling plane with a metal plane (22b-1) disposed in the topmost circuit board layer (20b-1) and possessing a first electrical potential, wherein there is provided a metal plane (24b-1) possessing a second electrical potential which is in electrical contact with at least one (12b-2) of the components (12b), and wherein there is formed at least one pair of overlapping metal planes from one of the metal planes (22b) possessing the first electrical potential and one of the metal planes (24b) possessing the second electrical potential, the overlap of the two metal planes being at least as large as the cooling plane section (16b).

Abstract: An LED matrix module of the invention has a circuit board, a thermally conductive plate and a plurality of LED chips. A plurality of slots is formed through a circuit surface and a bonding surface of the circuit board. A positive trace and a negative trace respectively extend from an edge of the circuit board. The thermally conductive plate is attached onto the bonding surface of the circuit board. The LED chips are respectively mounted through the slots of the circuit board in a manner to attach on the thermally conductive plate. Each LED chip is further electrically connected to the positive and negative traces on the circuit surface of the circuit board respectively via a positive electrode wire and a negative electrode wire. The LED chips are directly attached onto the thermally conductive plate through which the heat dissipates. The high brightness of the LED is thereby ensured.

Abstract: A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.

Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.

Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.

Abstract: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

Abstract: A method of making an integrated circuit device using an encapsulated semiconductor die having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant surfaces thereof. One or both of the heat spreaders has a pair of end posts configured for allowing further encapsulation of portions thereof and insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.

Abstract: Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.

Abstract: The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 that is in thermal contact with the surface opposite the principal surface of the semiconductor chip 3. One region of said heat-radiating element 7 is externally exposed from the package that encloses the semiconductor chip 3. The heat-radiating element 7 is in thermal contact with a metal pattern 12 that is formed on the substrate 10 on which the semiconductor device is mounted. The heat from the semiconductor chip is transferred to the mounting substrate 10 side via the heat-radiating plate 7, and heat dissipation is conducted efficiently.

Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration.

Abstract: Cold plates, permanently plumbed into card cage, cool circuit boards that are equipped with personality plates to improve thermal transfer. The personality plates have a contoured surface that is the complement of the circuit board's landscape. The personality plate made of heat transmissive material therefore contacts each heat generating component, regardless of its height. The opposite surface of the personality plate is flat, and, when installed with the circuit board in the card cage, lies parallel to the surfaces of the cold plate. A card ejector applies force on the entire board bringing the flat surfaces into intimate contact for excellent heat transfer. The assembly of circuit board and personality plates is augmented by interposing thermal interface material at each contact surface and fastening this assembly into a unit.

Abstract: A new design is provided for the heat spreader of a semiconductor package. Grooves are provided in a surface of the heat spreader, subdividing the heat spreader for purposes of stress distribution into four or more sections. This division of the heat spreader results in a reduction of the mechanical and thermal stress that is introduced by the heat spreader into the device package. Mechanical and heat stress, using conventional heat spreader designs, has a negative, stress induced, effect on the semiconductor die, on the contact points (bump joints) of the semiconductor die and on the solder ball connections of the package.

Abstract: A heat dissipating assembly for electronic components mounted on a circuit board includes a first thermal plate (10), a second thermal plate (30), and a copper adjusting screw (60). The first thermal plate forms a plurality of offset portions (12) and thereby defines a plurality of recesses at the offset portions respectively. Depths of the recesses correspond to heights of the electronic components. The first and second thermal plates are secured to opposite sides of the circuit board. The first and second thermal plates respectively define first and third holes (14, 32) movably receiving the adjusting screw therein. The adjusting screw is tightened so that it improves thermal contact between the offset portions and the electronic components. Because the adjusting screw is made of highly heat conductive material, heat in the first thermal plate is conducted to the second thermal plate through the adjusting screw.

Abstract: An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.

Abstract: An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

Abstract: A package according to the present invention includes: a support for mounting a semiconductor component on the upper surface thereof; a positioning control plate, which is secured to the support and includes an opening or a notch; and a lead provided on the support for establishing electrical continuity between the semiconductor component mounted on the support and an external component. The positioning control plate houses at least a lower part of the semiconductor component inside the opening or the notch, thereby controlling a position of the semiconductor component on the support.

Abstract: A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components—namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor—are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board.