Electrically Insulating Thermally Conductive Patents (Class 361/713)
  • Patent number: 10893610
    Abstract: To provide a switching device driving unit that can shorten a connecting distance between a driver and a semiconductor switching element, while ensuring the insulation between a driver and a cooling device, even in a case of employing a semiconductor switching element which is composed of wide gap semiconductor. The switching device driving unit includes a circuit board, a semiconductor switching element composed of wide band gap semiconductor, a cooling device and a driver. The driver is surface mounted on a second face, which is an opposite side face of a first face which is a face of the circuit board on a side where the cooling device is disposed.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: January 12, 2021
    Assignee: Mitsubishi Electric Cornoration
    Inventor: Kei Hayase
  • Patent number: 10777488
    Abstract: A semiconductor device is provided with a first insulated substrate including an insulator layer and a metal layer disposed on each of two faces of the insulator layer, a first semiconductor element disposed on the metal layer on one face of the first insulated substrate, a second insulated substrate including an insulator layer and a metal layer disposed on each of two faces of the insulator layer, a second semiconductor element disposed on one of the metal layers of the second insulated substrate, and an encapsulant encapsulating the first semiconductor element and the second semiconductor element. The metal layer on the other face of the first insulated substrate and the metal layer on the other face of the second insulated substrate are exposed on a first flat surface of the encapsulant.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 15, 2020
    Assignee: DENSO CORPORATION
    Inventor: Shingo Tsuchimochi
  • Patent number: 10757846
    Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 25, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haejin Lee, Min Park, Jungje Bang, Kyungha Koo, Yunjeong Park
  • Patent number: 10665451
    Abstract: Elemental or compound semiconductors on metal substrates and methods of growing them are provided. The methods can include the steps of: (i) providing a metal substrate; (ii) adding an interlayer on a surface of the metal substrate, and (iii) growing semiconductor nanowires on the interlayer using a semiconductor epitaxy growth system to form the elemental or compound semiconductor. The method can include direct growth of high quality group III-V and group III-N based materials in the form of nanowires and nanowires-based devices on metal substrates. The nanowires on all-metal scheme greatly simplifies the fabrication process of nanowires based high power light emitters.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: May 26, 2020
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Boon Siew Ooi, Chao Zhao, Tien Khee Ng
  • Patent number: 9681533
    Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: June 13, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
  • Patent number: 9585279
    Abstract: An electrode (3) is joined to a wiring substrate (2). A nut box (7) is inserted in the bent portion (5) of the electrode (3) so that the nut (6) is positioned in alignment with the opening (4) of the electrode (3). A case (8) covers the wiring substrate (2). The nut box (7) and the case (8) are members separate from each other. The nut box (7) is fixed in the electrode (3) so as not to come off from the bent portion 5).
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: February 28, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Goro Yasutomi, Yukimasa Hayashida, Ryutaro Date
  • Patent number: 9385058
    Abstract: An Integrated Circuit device, including: a base wafer including first electronic circuits and a plurality of first single crystal transistors; at least one metal layer; and a second layer including second electronic circuits and a plurality of second single crystal transistors, the second layer overlying the at least one metal layer; the second layer includes a through layer via with a diameter of less than 150 nm; a portion of the first electronic circuits is circumscribed by a first dice lane, and there are no conductive connections to the portion of the first electronic circuits that cross the first dice lane; wherein a portion of the second electronic circuits is circumscribed by a second dice lane, and there are no conductive connections to the portion of the second electronic circuits that cross the second dice lane, and the second dice lane is overlaying and aligned to the first dice lane.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: July 5, 2016
    Assignee: MONOLITHIC 3D INC.
    Inventors: Zvi Or-Bach, Brian Cronquist, Deepak Sekar
  • Patent number: 9204572
    Abstract: A disclosed heat radiation arrangement includes a substrate that has a first surface on which a heating element is installed; a heat radiating member that abuts a surface of the heating element via a thermal conductive elastic member, the surface of the heating element being on an opposite side with respect to a side of the first surface; and a casing to which the substrate and the heat radiating member are attached, wherein the substrate is secured to the casing within a region between two extended sides and on opposite sides of the heating element when viewed in a direction perpendicular to the first surface, these two extended sides being defined by extending two opposite sides of the heating element, which form outer edges of the heating element, toward outer edges of the first surface.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: December 1, 2015
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hisao Takahashi, Satoru Anada, Toru Iwazumi
  • Publication number: 20150116946
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 30, 2015
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
  • Patent number: 9019709
    Abstract: A protection circuit board is disclosed. The protection circuit board includes a main printed circuit board and an auxiliary printed circuit board. In the auxiliary printed circuit board, a thermistor is electrically interposed between an external electrode terminal and auxiliary electrodes.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: April 28, 2015
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Young-Cheol Jang
  • Patent number: 9001512
    Abstract: A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: April 7, 2015
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Todd L. Wyatt, Thomas L. Veik
  • Patent number: 8995133
    Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 31, 2015
    Assignee: Deere & Company
    Inventors: Andrew D. Wieland, Kevin B. Larsen, John N. Oenick, Gregory K. Harmelink, Neal D. Clements
  • Patent number: 8988882
    Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: March 24, 2015
    Assignees: Molex Japan Co., Ltd., Kagoshima University
    Inventors: Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta, Masamichi Ishihara
  • Patent number: 8964401
    Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: February 24, 2015
    Assignee: SunPower Corporation
    Inventors: Eduardo Escamilla, Marco Marroquin, William John Morris, John Trevor Morrison, Thomas Paul Parker, Stephen Wurmlinger
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8917510
    Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: December 23, 2014
    Assignee: International Business Machines Corporation
    Inventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
  • Publication number: 20140369000
    Abstract: A terminal unit according to an embodiment of the present invention includes: a case forming the outer shape; and a frame disposed in the case and having a heat dissipation channel, in which the frame includes: a first panel made of a material having high thermal conductivity and disposed in the case; and a second panel made of a material having a high insulating property and combined with the first panel.
    Type: Application
    Filed: June 20, 2013
    Publication date: December 18, 2014
    Inventors: Injoong Kim, Joungwook Park
  • Patent number: 8913388
    Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: December 16, 2014
    Assignee: Finisar Corporation
    Inventors: Tat Ming Teo, Troy Wy Piew Chiang, JianBing Zhao
  • Patent number: 8867212
    Abstract: To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: October 21, 2014
    Assignee: Yazaki Corporation
    Inventors: Hiroki Shiraiwa, Kazuomi Kiyosue, Akinori Nakashima, Tomohiro Sugiura, Noriyoshi Yamazaki, Minoru Umezaki
  • Patent number: 8854820
    Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: October 7, 2014
    Assignee: Omron Corporation
    Inventors: Shingo Yamamoto, Akio Sumiya, Yasuo Matsuda, Naoto Inoue, Makoto Tami, Ryo Sugihara, Fumiaki Tanaka, Shintaro Hara, Shota Akinaga
  • Patent number: 8854783
    Abstract: A battery pack that can quickly transfer heat from a battery cell to a positive temperature coefficient (PTC) to quickly cut off a current when the battery cell is heated to a high temperature. A battery pack includes: a battery cell including a cell tab; a protective circuit module including an internal terminal connected to the cell tab, a PTC connected to the internal terminal, and an interconnection pattern between the internal terminal and the PTC and electrically connecting the internal terminal to the PTC; and a heat transfer member including a surface contacting the interconnection pattern, and opposite sides respectively connected to the internal terminal and the PTC.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: October 7, 2014
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Eunok Kwak, Youngcheol Jang, Seok Koh
  • Patent number: 8848375
    Abstract: An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: September 30, 2014
    Assignee: Lear Corporation
    Inventors: Rutunj Rai, Richard Hampo, John Mills
  • Patent number: 8804337
    Abstract: A device including a structural member having a heat spreader and an electronic device mounted directly to a first surface of the heat spreader of the structural member. The device also includes a cold plate mounted directly to the first surface of the heat spreader of the structural member.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: August 12, 2014
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: Mark A. Zaffetti, Edmund P. Taddey
  • Patent number: 8804339
    Abstract: A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: August 12, 2014
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Brian Joseph Robert
  • Patent number: 8773859
    Abstract: A driver assembly with an efficient mechanism for transferring heat away from an integrated circuit (IC) chip via a heat transfer member and conductive pattern lines formed on a substrate. The IC chip is mounted on connectors and is placed above the substrate. The IC chip operatively communicates with the display panel via at least a subset of the conductive pattern lines and a subset of the connectors. A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip. A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: July 8, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JinHyong Kim, SeungTae Kim
  • Patent number: 8760855
    Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Jeremy Charles Howes, David Levett
  • Patent number: 8749978
    Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: June 10, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Seiji Izutani, Hisae Uchiyama, Takahiro Fukuoka, Kazutaka Hara
  • Publication number: 20140104811
    Abstract: The invention relates to a cooling box (1) for electric or electronic components, consisting of a material. Said cooling box (1) is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity (4) that is enclosed by the material, said cavity (4) being closed or provided with at least one opening (2). To improve thermal dissipation, at least one surface region of the cooling box (1) is defined by functions of electrical and/or thermal conductivity.
    Type: Application
    Filed: December 6, 2013
    Publication date: April 17, 2014
    Applicant: CERAMTEC GMBH
    Inventor: Peter Claus KLUGE
  • Patent number: 8693194
    Abstract: An electronic apparatus includes a body frame, a rear frame which is pivotably attached to the body frame, a hole which is formed in a front wall of the body frame, a first heat dissipating member which is placed on the front wall to cover the hole, a thermal conductive member which contacts a portion of the first heat dissipating member at a storage space side and is placed in the hole, a semiconductor chip which is placed on the rear frame, and a second heat dissipating member which is placed on the rear frame to be in contact with the semiconductor chip and receive heat from the semiconductor chip. The second heat dissipating member being in contact with the thermal conductive member in the storage space when the rear frame closes an opening at the rear side of the body frame.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: April 8, 2014
    Assignee: Toshiba Tec Kabushiki Kaisha
    Inventors: Kiyotaka Nihashi, Isao Tsubouchi
  • Patent number: 8686295
    Abstract: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
    Type: Grant
    Filed: November 7, 2009
    Date of Patent: April 1, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun Lim, Seog Moon Choi, Sang Hyun Shin, Young Ki Lee, Sung Keun Park
  • Patent number: 8681500
    Abstract: Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners to provide structural support and/or thermal conductivity. In some instances, the carbon nanotube structure is arranged to provide substantially all structural support for an integrated circuit arrangement. In other instances, the carbon nanotube structure is arranged to dissipate heat throughout the substrate. In still other instances, the carbon nanotube structure is arranged to remove heat from selected portions of the carbon nanotube substrate.
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: March 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chris Wyland
  • Patent number: 8630092
    Abstract: A cooling box for electric or electronic components, consisting of a material, wherein the cooling box is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity that is enclosed by the material, wherein cavity being closed or provided with at least one opening.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: January 14, 2014
    Assignee: CeramTec GmbH
    Inventor: Claus Peter Kluge
  • Publication number: 20130322020
    Abstract: An electronic device for use in explosion endangered areas, comprising a superordinated electronic unit, a plurality of electronic components connected to the superordinated unit and supplied with energy by the superordinated unit, and a protective element installed in a number of connection lines for connecting respective ones of the components to the superordinated unit. In the case of a malfunctioning of one of the components, a space saving, safe conversion of the power available via the superordinated unit into heat occurs. The protective element comprises an electrically insulating, heat conductive, base body, and a number of resistors applied on the base body and corresponding to the number of connection lines, wherein each of the resistors is provided an input and output side with a connection, via which it is connected to a respective one of the connection lines.
    Type: Application
    Filed: February 10, 2012
    Publication date: December 5, 2013
    Applicant: Endress +Hauser Fmbh + Co. KG
    Inventors: Winfried Mayer, Roland Grozinger
  • Patent number: 8587946
    Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: November 19, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-Han Lee, Jung-Hoon Kim, Seong-Chan Han
  • Patent number: 8576566
    Abstract: Carrier device for placement of thermal interface materials. At least some embodiments are systems including a first electrical component that defines a first surface at a first elevation relative to an underlying structure, a second electrical component that defines a second surface at a second elevation relative to the underlying structure, a metallic member configured to conduct heat from the electrical components, and a carrier between the electrical components and the metallic member. The carrier includes a third and fourth surface configured to mate with the first and second surfaces, respectively, a first aperture through the third surface, and a second aperture through the fourth surface. The system further includes a first thermal interface material coupled between the first electrical component and the metallic member through the first aperture, and a second thermal interface material coupled between the second electrical component and the metallic member through the second aperture.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: November 5, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey A. Lev, Mark S. Tracy
  • Publication number: 20130279230
    Abstract: Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di>(1.36×10-8×Vt2+3.4×10-5×Vt?0.015)×?r, where a relative permittivity of the insulating member is Er and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.
    Type: Application
    Filed: December 7, 2011
    Publication date: October 24, 2013
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Tokihito Suwa, Yujiro Kaneko, Masashi Yura, Nobutake Tsuyuno, Toshiaki Ishii, Junpei Kusukawa
  • Patent number: 8564956
    Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: October 22, 2013
    Assignee: Nexxus Lighting, Incorporated
    Inventor: Zdenko Grajcar
  • Patent number: 8556466
    Abstract: The present disclosure provides a lighting apparatus using a light-emitting diode (LED), which includes: LEDs; a power transfer substrate with the LEDs thereon; a radiating member radiating heat generated in the LEDs; a driver electrically connected to the power transfer substrate and integrally coupled to the power transfer substrate and the radiating member; and a heat insulation layer reducing the amount of heat transferred from the radiating member to the driver. In addition, the present disclosure provides a lighting apparatus using an LED, which further includes a cradle fixed to a given object and detachably fixing a lighting body in which a power transfer substrate with LEDs thereon, a radiating member and a driver have been integrally coupled.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: October 15, 2013
    Assignee: Wooree Lighting Co., Ltd.
    Inventors: Sang Hyun Shin, Seung Hyun Cho, Dae Hyun Sung
  • Patent number: 8545987
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: October 1, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jason Strader, Mark Wisniewski
  • Patent number: 8537554
    Abstract: Distribution and coupling of waste heat from planar non-concentration photovoltaic cells and semiconductor electrical devices is enhanced by forming dielectric relief structures and thermal conductive and emissive coatings on the cover and/or backing plate. The composite relief structures of layers, voids, and fins on the back surface mitigate the differential thermal expansion of dissimilar material and optimize convective heat transfer and radiant heat transfer with respect to costs. This leads to higher performance of the photovoltaic and semiconductor cells, a stronger and lighter backing plate components, and lower cost per watt for mounted devices.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: September 17, 2013
    Assignee: Energy Related Devices, Inc.
    Inventor: Robert G. Hockaday
  • Patent number: 8531841
    Abstract: The present invention provides a non-intrusive method for dissipating heat from open-frame DC-DC power converters where bottom side components are exposed. A thermal interface material is placed between the motherboard to which the power converter is soldered and power dissipating and temperature sensitive components on the bottom of the power converter. The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: September 10, 2013
    Assignee: TDK-Lambda Corporation
    Inventor: Gordon K. Y. Lee
  • Patent number: 8519530
    Abstract: Disclosed is a composition, in particular a dispersion, which contains nanofiber material in at least one organic matrix component, said nanofiber material being pre-treated in at least one method step for adjusting the physical properties of the composition.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: August 27, 2013
    Assignee: Curamik Electronics GmbH
    Inventors: Ka Chun Tse, Ben Zhong Tang, Ernst Hammel, Xinhe Tang
  • Publication number: 20130188318
    Abstract: An electronic device includes a circuit board, a plurality of electronic components, a heat dissipation structure and a casing. The electronic components are disposed on the circuit board. The heat dissipation structure includes a first electrically insulating and thermally conductive layer and a metal layer. The first electrically insulating and thermally conductive layer covers the circuit board and/or the electronic components. The thermal conductivity coefficient of the first electrically insulating and thermally conductive layer is greater than 0.5 W/m.k. The metal layer is combined and thermal contacted with the first electrically insulating and thermally conductive layer. The casing has an accommodating space. The circuit board, the electronic components and the heat dissipation structure are received in the accommodating space, and the metal layer is disposed between the casing and the first electrically insulating and thermally conductive layer.
    Type: Application
    Filed: October 5, 2012
    Publication date: July 25, 2013
    Applicant: LITE-ON TECHNOLOGY CORPORATION
    Inventor: LITE-ON TECHNOLOGY CORPORATION
  • Patent number: 8441796
    Abstract: An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to the said coating.
    Type: Grant
    Filed: January 16, 2006
    Date of Patent: May 14, 2013
    Assignee: Keronite International Limited
    Inventor: Robert Morse
  • Patent number: 8436254
    Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: May 7, 2013
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Po Yu, Han-Pei Huang
  • Patent number: 8437118
    Abstract: The subject of the invention is an electric power switchgear, an insulating radiator, and a method for installing the radiator in an electric power switchgear, and in particular in a medium or high voltage switchgear. The electric power switchgear comprising working elements placed in the housing and connected with busbars and branches, and cooled with air, is characterized in that it contains at least one insulating radiator made of thermoplastic material of increased thermal conductivity ??2 W/mK, which is placed in the electric field of the switchgear and which is connected by a non-permanent fastening to at least one busbar or/and at least one branch. The insulating radiator designed for the switchgear is an injection molding including a base plate to whose top face a system of heat evacuating elements of identical or diverse shape is attached, and to its side surfaces elastic assembly catches are fixed.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: May 7, 2013
    Assignee: ABB Research Ltd
    Inventors: Krzysztof Kasza, Lukasz Malinowski, Robert Sekula
  • Publication number: 20130083487
    Abstract: A driver assembly with an efficient mechanism for transferring heat away from an integrated circuit (IC) chip via a heat transfer member and conductive pattern lines formed on a substrate. The IC chip is mounted on connectors and is placed above the substrate. The IC chip operatively communicates with the display panel via at least a subset of the conductive pattern lines and a subset of the connectors. A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip. A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member.
    Type: Application
    Filed: March 28, 2012
    Publication date: April 4, 2013
    Applicant: LG DISPLAY CO., LTD.,
    Inventors: JinHyong KIM, SeungTae KIM
  • Patent number: 8405998
    Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: March 26, 2013
    Assignee: International Business Machines Corporation
    Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
  • Patent number: 8379390
    Abstract: A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: February 19, 2013
    Assignee: Funai Electric Co., Ltd.
    Inventor: Yoshihiko Inoue
  • Patent number: 8363409
    Abstract: The integrated device of a heat dissipation unit and a package component includes a non-insulation type package component, an insulation sheet, a heat dissipation unit, a fastener, a washer and a sleeve. The non-insulation package component has a metal tab with a through hole. The insulation sheet is provided with a via hole and attached on one side of the metal tab. The heat dissipation unit is provided with a tapped hole corresponding to the through hole. The sleeve includes a narrow portion penetrating the via hole and through and a wide portion sandwiched between the insulation sheet and heat dissipation unit. When the fastener penetrates into the through hole of the metal tab and the via hole of the insulation sheet and screws into the tapped hole, the fastener will pass through the sleeve without contact with the insulation sheet due to the protection of the narrow portion in the via hole.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: January 29, 2013
    Assignee: Chicony Power Technology Co., Ltd.
    Inventor: Yi-Chiu Chung