Abstract: A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10?6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Abstract: A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto. The printed wiring board and electronic components are placed in an outer shell made of lightweight stiff material. The spaces or voids between the outer shell and the printed wiring board and the electronic components are filled with lightweight filling material and thermal filler material. The outer shell and the filling material provide increased rigidity to the electronic components and the thermal filler material increases heat transfer from a given electronic component to outside the circuit card assembly.

Abstract: A power module of the present invention mounts electronic components and comprises a circuit board that constitutes an electric power conversion circuit along with the above-mentioned electronic components; a heat sink; and a member with insulation characteristics and high thermal conductivity, which is disposed between plural devices with high heating value among the above-mentioned electronic components and the above-mentioned heat sink, embeds at least part of each of the above-mentioned plural devices with high heating value therein and transfers heat from the above-mentioned plural devices with high heating value to the above-mentioned heat sink.

Abstract: An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduce external heating of the enclosure by the electronic components contained therein. Such an arrangement reflects heat generated by internal electronic components back inside the device enclosure, thereby reducing the external temperature of the electronic device housing. The electronic device housing, for example, pertains to a portable computer. Additionally, a method for reducing the external temperature of a computer housing for a portable computer is disclosed.

Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).

Abstract: A system, includes a user input device, a temperature changing unit coupled to the user input device, and a controller, coupled to the temperature changing unit, for controlling the temperature of the user input device.

Abstract: The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface of the chip, and a field installable thermal interface phase change pad positioned between the heat sink and the microprocessor chip. The heat sink has an actuator access opening so that the actuator is operable with the heat sink positioned on top of the microprocessor. The connection between the chip and the heat sink is free of alignment features so that they may be separated by twisting the heat sink relative to the chip. The connection between the heat sink and the circuit board is also free of alignment features.

Abstract: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.

Abstract: A substrate material for mounting an integrated circuit contains a non-electrically-conductive mesh of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces that are proximate to the substrate, thereby using the circuit traces as thermally-coupled heat sinks. In a preferred embodiment, the thermally-conductive mesh replaces the structural fiberglass mesh that is conventionally used in substrates, thereby allowing the mesh to serve a dual structural and thermal function.

Abstract: To provide a semiconductor device that is capable of transmitting heat evolved in an active element efficiently to a heat sink member, and a manufacturing method for the semiconductor device. One of the terminals (such as drain electrode) of an active element formed in a substrate of, for example, GaAs, is thermally contacted with a heat sink member via an insulating member of, for example, aluminum nitride, exhibiting thermally conductive and electrically insulating properties. The heat sink member may, for example, be an electrically conductive member connected to another terminal of the active element, or a heat sink of a package.

Abstract: A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation.

Abstract: A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and a plurality of leads to a heat sink comprising a sheet of thermally conductive material. The mounting system comprises two primary elements: a rigid retainer and a pressure clamp. The rigid retainer comprises a block of non-conductive material having recess open to at least two adjacent faces of the block of non-conductive material and configured to expose at least a portion of the heat spreader when the semiconductor package is disposed in the recess with the plurality of leads extending from the retainer. The pressure clamp is configured for disposing against an exterior of the retainer opposite to the body and attaching to the heat sink, for compressing the package against the heat sink.

Abstract: A burn-in board and a method for thermally testing the burn-in board determines if the burn-in board is defective. The burn-in board includes components on a front side of the burn-in board and thermal tape on the back side of the burn-in board. Power and ground are supplied to the burn-in board and the thermal tape changes color indicating a hot spot if the burn-in board contains one or more problem areas.

Abstract: A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1° C.−in2/Watt.

Abstract: A gas stream moisture condenser assembly for use in a fuel cell power plant includes a gas stream flow path which is formed from a monolithic open cell foam body. The foam body is preferably formed from a high temperature material such as stainless steel, nickel alloys and iron-aluminum alloys, or from a ceramic material. The foam body includes open cells or pores which are contained within a metal or ceramic lattice. Coolant tubes are in contact with the foam monolith so as to cool the lattice sufficiently to cause moisture in the gas stream to condense on a lattice surrounding the pores of the foam. The condensate migrates from the foam lattice into a reservoir. The condenser can be used to remove water from gas streams, such as a cathode exhaust stream or a mixed burner and cathode exhaust stream, of a fuel cell power plant.

Abstract: The present invention relates to a bus bar assembly comprising a high power transistor module directly mounted to a bus bar. The bus bar has an improved solderability characteristic and is designed so that a solid, effective soldered connection results during a conventional soldering process in which the high power transistor module is securely mounted to the bus bar to form the bus bar assembly of the present invention. Accordingly, the soldering process involves soldering a pin which is a part of the high power transistor module to a surface of the bus bar using sufficient heat. The improved solderabilty of the present bus bar results by forming a soldering island in the bus bar at predetermined points thereof. The soldering island comprises a central soldering opening, which receives the soldering pin, and a plurality of thermal barrier openings distributed around the soldering opening.

Abstract: A package substrate suitable for use with a ball grid array according to the invention includes an electrically and thermally conductive heat sink having a top surface and a bottom surface, the heat sink having a slot formed therethrough which opens onto the top and bottom surfaces. A dielectric layer is formed on the bottom surface of the heat sink proximate the slot, preferably directly thereon without an intervening adhesive layer. A circuit is selectively formed in a circuit pattern on the dielectric layer. An electrically resistive soldermask is disposed on the dielectric layer and the circuit, which soldermask has openings therethrough which expose bond pads of the circuit. Such a substrate according to the invention permits the integrated circuit die to be mounted over the slot in the manner of a lead-on-chip package, but provides bond pads to which solder balls can be mounted in order to form a ball grid array.

Abstract: A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

Abstract: Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.

Abstract: Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.

Abstract: Heat is conducted, from a heat generating electronic device that is mounted in a gap between a circuit board and a heat dissipator, along a path that includes a path segment that passes along conductive runs on the circuit board and another segment that spans the gap at a location adjacent to the device, the other path segment being spanned predominantly by a non-metallic piece that has a thermal conductivity of at least 7 W/m-°K.

Abstract: A housing for an electrical device has a plurality of housing parts, including a first housing part adapted to carry an electronic component and having a mounting surface with a crease, and a second housing part arranged on the mounting surface and formed so that it at least sealingly engages in the crease of the first housing part, so as to enhance a heat withdrawal from the electronic components.

Abstract: Since the exposed collector part 32 of one semiconductor switching element 29 is attached to the heat radiating fin 42 by coating and filling a thermal conducting filler therebetween via spacers 33, 34 and 35, and the exposed collector part 37 of another semiconductor switching element 36 is directly attached to the same heat radiating fin 42 by coating the thermal conducting filler 41 thereto without any spacer, heat resulting from switching losses can be effectively transmitted to the heat radiating fin 42 and can be radiated therefrom. To effectively transmit heat, which results from switching losses, to a heat radiating fin and to radiate the same even if two semiconductor switching elements are connected in series, a collector part is exposed on the rear side thereof, and the two semiconductor switching elements are attached to a single heat radiating fin.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Abstract: Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate such as a printed circuit board. The integral dielectric heatspreader may also support integral transmission lines, resistors, capacitors, or other bulk components. Performance of the heatspreader is enhanced through the use of thermal vias on a printed circuit board.

Abstract: Heat is conducted, from a heat generating electronic device that is mounted in a gap between a circuit board and a heat dissipator, along a path that includes a path segment that passes along conductive runs on the circuit board and another segment that spans the gap at a location adjacent to the device, the other path segment being spanned predominantly by a non-metallic piece that has a thermal conductivity of at least 7 W/m-° K.

Abstract: The object of the invention is to produce a surface layer that can prevent from uncomfortable sensation upon manual handling of component such as metal chassis used in electronic devices. The surface is coated with a special paint material or a resinous coating material that include insulating material or foamed structure. For example, gaseous entrapments are incorporated in the layer by pre-mixing a foaming material in the paint, followed by foaming the layer at a high temperature. A decline in the restoring strength of the foaming material is supplemented by the top coating with the bead-containing paint.

Abstract: A portable electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing the electrical device; and a film on the external surface including a granulated insulating material providing thermal insulation from the electrical device.

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract: A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a solid temperature. When the operating temperature falls between the liquid temperature and the solid temperature, the alloy has at least one liquid phase which is in substantial equilibrium with at least one solid phase. The thermal joint is used between a heat-generating component, such as a semiconducting device, and a heat-dissipating component, such as a heat sink. Such thermal joint substantially reduces the thermal resistance between the two components.

Abstract: An electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing the electrical device; and a film on the external surface including a foamed layer providing thermal insulation from the electrical device.

Abstract: The present invention suggests a new scheme of integrating a heat conducting promotion apparatus (or heat sink) and a chip carrier (such as a substrate) of an IC package including a chip. It is characterized by at least a cavity which is in the chip carrier and around the chip, and the configuration of the heat conducting promotion apparatus having a first part which is close to or contacts a heat conducting surface of the chip, and a second part which extends from the first part toward the cavity until it partly contacts a surface of the chip carrier and partly is inside of the cavity. It is also characterized by options of placing at least an elastic entity in the cavity to contact the heat conducting promotion apparatus' part which is inside the cavity, or twisting the heat conducting promotion apparatus' part which is inside the cavity.

Abstract: A power semiconductor device module has a plurality of spaced thermally supported substrates mounted within coplanar openings in an insulation support shall and electrically insulated from one another by the body of the insulation support shell. Each of the substrates may be a separate metal heatsink or a separate IMS sheet. Each of the substrates may receive one or more semiconductor die. A printed circuit board containing control circuits for the die is mounted above the plane of the substrate and contains openings in registry with each substrate for wire bonding the control circuits to the die. The structure permits the reduction in area of any IMS substrate or permits the elimination of the IMS.

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract: A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.

Abstract: A system and method for dissipating thermal energy created by multiple electronic circuit boards packaged within a single housing and while in operation are disclosed. The system and method enhances heat convection and heat conduction across and through the housing. A heat conductive housing having a plurality of longitudinally extending fins for increasing the surface area of the housing and correspondingly increasing heat convection to the housing is utilized. Furthermore, the multiple electronic circuit boards are packaged such that a heat conductive path, defined by a thermally conductive material, is disposed between the plurality of electronic circuit boards. Finally, the heat conductive material is applied to the inner surface of the housing and between each of the electronic circuit boards. The present invention increases heat conduction of the thermal energy generated by the plurality of electronic circuit boards to the housing, thereby preventing circuit board damage.

Abstract: A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive layer for attaching the substrate to the heat sink. The substrate is formed of multiple layers of printed circuit boards which are attached to each other, and have a cavity formed at the center thereof. A plurality of thermal vias is formed surrounding the substrate. The head sink is divided into a chip mount area and a thermal via joint area. The chip mount area is used for a chip mount pad to be disposed thereon, wherein a chip is connected to the heat sink through the chip mount pad. The thermal via area is electrically coupled to the thermal vias thereby to form an approximate short path or a short path. Thus, heat energy is transferred not only by the heat sink directly, but also from the heat sink to the substrate through the thermal vias.

Abstract: An apparatus is disclosed for attaching a thermal solution to a mini-cartridge. The apparatus comprises: a bracket adapted to be snapped into position around the mini-cartridge; two or more threads formed in the bracket, the threads positioned such that when the bracket is snapped into position around the mini-cartridge the threads are located on the side of the mini-cartridge opposite from the side adjacent to the thermal solution; and screws adapted to run through holes in the mini-cartridge to engage with the threads and to fixedly attach the thermal solution to the mini-cartridge.

Abstract: An Adaptable Planar Module (APM) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is formed in an opening in a support base and extends at or below a bottom surface of a base to allow for thermal contact with a heatsink. A circuit board for supporting and interconnecting lower power devices is mounted above and spaced from the support base and has an opening therein which is located above the IMS. The circuit board has bonding pads which are electrically connected to the low power devices. Bonding wires provide an electrical connection between the bonding pad of the printed circuit board and the power devices on the IMS substrate. Integral or procured terminals are also provided for external connections. Additional circuit boards may also be provided in the module and arranged co-planar with or above the first circuit board.

Abstract: An electronic assembly having one or more heat producing semiconductor components in the form of a chip or die has improved heat dissipation properties. The semiconductor components are formed into subassemblies comprising one or more of the semiconductor components bonded on opposite planar surfaces to metal lead frames. Each lead frame is bonded to a substrate which is electrically insulating and thermally conductive. The resulting assembly is submerged into a central channel of a heat sink. The channel is adapted to receive the assembly such that the channel walls compressingly engage the assembly. Heat is thereby dissipated from the semiconductor components from both planar surfaces of the component.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.

Abstract: A manufacturing module for an RF feed-forward amplifier subsystem that allows for simple and cost-effective assembly, yet provides separate compartments for the different stages of the subsystem, with low RF leakage between the compartments is disclosed. The manufacturing module comprises a printed circuit board having one or more circuit trace layers, and ground planes covering a substantial portion of the top and bottom surfaces. The printed circuited board also has numerous plated-through holes electrically connecting the top and bottom ground planes. The circuit board is sandwiched between a heatsink having a flat upper surface and a machined enclosure having an outer wall and inner divider walls. The plated-through holes, space less than 1/10 wavelength of module's highest carrier frequency apart, serve to electrically connect the heatsink to the machined enclosure, thus creating separate compartments with low RF leakage.

Abstract: Power module for a current converter, particularly a frequency converter, having at least one printed circuit board equipped at least with power components and having a heat-conducting connection with a wall of the current converter housing serving as heat sink, the power module having electrically conducting connection parts arranged vertically to the housing wall, which parts laterally confine a chamber and are long enough to enable accommodation of large, passive electrical components, such as capacitors, in the chamber. To ensure a space saving embodiment of the power module, though maintaining a sufficient heat dissipation and simplifying the electrical connection between the power module and the remaining components of the converter, it is provided that the only electrical connection between the power module and other electrical components of the converter as well as to the supply mains and to a load supplied via the converter is established via the connection parts.

Abstract: The present invention provides a multiple-component clamp for use with multiple, heat-generating components and a heatsink. In one embodiment, the multiple-component clamp comprises a clamp body having first and second regions, and a deformable region positioned between the first and second regions. The deformable region allows the clamp body to adjust to a thickness of at least one of the heat-generating components to thereby provide substantially even clamping forces against each of the heat-generating components when the multiple-component clamp is affixed to the heatsink.

Abstract: The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.

Abstract: An electronic component heat sink assembly comprising a printed circuit board having electronic components; and a box surrounding the printed circuit board. The box has a first box member with a molded plastic frame and a heat transfer member connected to the molded plastic frame. The frame of the first box member can also form part of an electrical header connector. The heat transfer member extends through the molded plastic frame and has portions which extend from different sides of the molded plastic frame. The portions of the heat transfer member extend from a first one of the sides of the molded plastic frame and are thermally connected to the electronic components such that heat from the electronic components is transferred out of the box, through the molded plastic frame, by the heat transfer member.

Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

Abstract: A sealing resin mixed with filler is used to seal a space between a flip-chip mounted semiconductor device and a printed circuit board. An integrated circuit chip joined to the printed circuit board by metal bumps, has the sealing resin interposed in the space between the chip and the board. The density of the filler in the sealing resin varies such that there is a relatively greater amount of filler at or near the integrated circuit chip. This allows the coefficient of thermal expansion of the resin layer adjacent the chip to better match the coefficient of thermal expansion of the silicon which makes up the chip.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.

Abstract: According to the present invention, functional heat conducting planar layers within a printed circuit board (PCB) are corrugated to allow for enhanced heat dissipation. According to a preferred embodiment, at least one of the power and ground planes is at least partially corrugated to extract heat from the PCB. By corrugating heat conducting structures within the PCB, additional heat dissipating surface area is provided for the PCB without the need to provide any additional heat dissipating structure.