Abstract: A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover.

Abstract: The integrated device of a heat dissipation unit and a package component includes a non-insulation type package component, an insulation sheet, a heat dissipation unit, a fastener, a washer and a sleeve. The non-insulation package component has a metal tab with a through hole. The insulation sheet is provided with a via hole and attached on one side of the metal tab. The heat dissipation unit is provided with a tapped hole corresponding to the through hole. The sleeve includes a narrow portion penetrating the via hole and through and a wide portion sandwiched between the insulation sheet and heat dissipation unit. When the fastener penetrates into the through hole of the metal tab and the via hole of the insulation sheet and screws into the tapped hole, the fastener will pass through the sleeve without contact with the insulation sheet due to the protection of the narrow portion in the via hole.

Abstract: The present invention provides an electronic device, comprising: a circuit board having at least one first heat-generating element and at least one second heat-generating element mounted thereon; a heat sink connected to said at least one first heat-generating element; a fan facing said heat sink; and an airflow guiding member placed between said fan and said heat sink for guiding the cooling air from said fan to said heat sink and said at least one second heat-generating element respectively.

Abstract: A power switch and connector that are conventionally included in a body are formed in spaces created at the outer ends of the shafts of hinges other than the body and a display, whereby the body is thinned. Electronic device comprises a body, a display, and a hinge that joins the body and display so that they can be freely opened or closed. A power switch is formed at an end of the shaft of the hinge. Furthermore, the electronic device comprises the body, the display, and another hinge that joins the body and display so that they can be freely opened or closed. A port of a connector opens at an end of the shaft of the hinge.

Abstract: A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Abstract: The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.

Abstract: A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

Abstract: A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.

Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.

Abstract: Cooling arrangement for an electrically conductive element in an electrical installation. A casting body (3) is provided for electrically isolating the electrically conductive element (2). The casting body has an outer wall, part of which forms a contact surface 5 (5) for contact with a heat conducting surface (1) of the electrical installation. The outer wall of the casting body (3) is provided with an electrically conductive layer (4; 7) at its outer surface.

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.

Abstract: An electronic device including a circuit board onto which an electronic part is installed, a radiating member, and at least one fitting member that fixes the radiating member to the circuit board, the fitting member being formed with a resilient portion that is configured to produce a resilient restoring force and holds the radiating member in a state fixed to the circuit board by the resilient restoring force.

Abstract: A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer.

Abstract: Thermal communication of matched transistors formed in lower electrical resistance subregions of first and second active substrate regions is provided by thermally conductive members formed to extend over isolation regions between higher electrical resistance subregions of the first and second regions. In one form, thermal communication is done, with or without contacts, through insulating layers to metal layers formed over the substrate. In another form, thermal communication is done through a polysilicon layer formed over the substrate.

Abstract: An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.

Abstract: An electronic component module includes at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by the cooling arrangement (23, 33, 43).

Abstract: A method and device for detecting insulation degradation of a power module, which detects, in advance, degradation of an insulating sheet based on a current change immediately before breakdown of an insulation characteristic from a current value of a current flowing through the insulating sheet, thereby detecting a failure of a power module caused by the degradation of insulation.

Abstract: An electric component assembly comprising a semiconductor component (1) and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier (3) by means of the varistor body.

Abstract: A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.

Abstract: An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.

Abstract: An array of electrically conductive waveguides is made a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots registered with the planar surfaces of another slab, to form one or more closed waveguides. The waveguides may feed microchips, or act as antennas. The slabs may include electrical conductors andor heat pipes. Heat pipes are made by defining apertures with the dielectric slabs, and introducing wick material into the apertures.

Abstract: The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.

Abstract: According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed thereon. Then, a porous layer is formed on the metal layer. A barrier layer of the porous layer at the bottom of the pores is thinned down. Then, a catalyst is deposited at the bottom of the pores. Carbon nanotubes are then grown in the pores. Another layer of metal is then formed over the porous layer and the carbon nanotubes. The semiconductor wafer is then separated into microelectronic dies. The dies are bonded to a semiconductor substrate, a heat spreader is placed on top of the die, and a semiconductor package resulting from such assembly is sealed. A thermal interface is formed on the top of the heat spreader. Then a heat sink is placed on top of the thermal interface.

Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.

Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.

Abstract: A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.

Abstract: A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the device. The tensioner or other method is used to stretch the elastic material, thereby reducing the thickness of the elastic material. With the thickness of the elastic material reduced by the stretching, the device is inserted into a hole in a mating part. Then the tension on the elastic material is removed, allowing the elastic material to increase in thickness, so as to fill at least part of the gap between the device and the mating part. The coupling may act as an effective heat transfer device for transmitting (by conduction) heat produced by the heat-producing device, to the mating part, which may act as, or be thermally coupled to, a heat sink.

Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.

Abstract: An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.

Abstract: A method and apparatus are provided for forming a thermal interface for an electronic product. A thermally conductive polymer having an adhesive layer formed thereon is provided, a surface of an electronic assembly is pressed against the adhesive layer, and the adhesive layer is allowed to cure so that the thermally conductive polymer and the electronic assembly are in thermal communication with each other. The electronic assembly could be pressed against the thermally conductive polymer using a press and die assembly having a pad for supporting the polymer and a controller for controlling operation of the press. The thermally conductive polymer is bonded to the electronic assembly so that no air pockets or voids are formed therebetween.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

Abstract: A high thermal conduction insulator exhibiting thermal conductivity, insulating properties and heat radiating properties is produced by supplying a molding material composed of an insulating resin, a diamagnetic material powder and a paramagnetic material (inclusive of ferromagnetic material) powder, and exhibiting fluidity into a mold, and applying a magnetic field to the molding material in the mold to orient clusters, each being composed of diamagnetic material particles of the diamagnetic material powder, which are joined together like a chain, along directions of lines of a magnetic force, and draw the paramagnetic material (inclusive of ferromagnetic material) powder with the magnetic force along one of mold surfaces of the mold, thereby forming a heat radiating layer. Heat transmitted from a facing member to one surface of the insulator is speedily transmitted to the other surface thereof via the clusters, and is effectively radiated from the heat radiating layer existing in the other surface.

Abstract: The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.

Abstract: A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface and a second member surface of the second member. An inventive assembly includes mating surfaces with at least one surface formed with a series of parallel hierarchical channels configured to control stacking of the particles during pressing together of the surfaces. The surface is substantially free of any other hierarchical channels formed thereon.

Abstract: A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.

Abstract: A fastener used in a blade server to secure a thermal module and a motherboard to a metal face panel, including a cushion member set between the metal face panel and the motherboard, an elastically compressible and electrically insulative spacer member set between the motherboard and the thermal module, a lock member fastened to the cushion member and the spacer member to lock the motherboard to the metal face panel, a locating member fastening the thermal module to the spacer member, and a spring member mounted on the locating member to keep the thermal module in close contact with a chip at the motherboard. The spacer member automatically adjusts the tightness between the thermal module and the chip at the motherboard, and isolates the digital grounding loop formed in the locating member and the thermal module from the analog grounding loop formed in the lock member and the metal face panel.

Abstract: A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the device. The tensioner or other method is used to stretch the elastic material, thereby reducing the thickness of the elastic material. With the thickness of the elastic material reduced by the stretching, the device is inserted into a hole in a mating part. Then the tension on the elastic material is removed, allowing the elastic material to increase in thickness, so as to fill at least part of the gap between the device and the mating part. The coupling may act as an effective heat transfer device for transmitting (by conduction) heat produced by the heat-producing device, to the mating part, which may act as, or be thermally coupled to, a heat sink.

Abstract: A two-dimensional image detector includes a sensitive semiconductor layer for converting optical information or radiological information corresponding to a two-dimensional image of a detection subject into electrical charge information; an active matrix substrate for retrieving the electrical charge information converted on the sensitive semiconductor layer; an amplifying electric circuit portion for amplifying the electrical charge information retrieved on the active matrix substrate and converting the electrical charge information into an electrical signal for an image; a disturbance-causing member attached to one side of the amplifying electric circuit portion which may cause a disturbance in the electrical signal. A first disturbance blocking buffer is disposed between the disturbance-causing member and the amplifying electric circuit portion for blocking the disturbance.

Abstract: A chassis base assembly including a chassis base, a driving circuit unit located at a rear side of the chassis base, the driving circuit unit including a circuit element protruding from the driving circuit unit toward the chassis base, and a heat sink attached to the circuit element, and a flat panel display device having the same.

Abstract: Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

Abstract: An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.

Abstract: Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material.

Abstract: A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, open front wall (21) and closed rear wall (22) and defining a hollow interior (27) into which the electronic part (T) is to be inserted. The interior has sufficient dimensions to accommodate the electronic part. The top and bottom walls are formed flat for slidable contact with the electronic part. The bottom wall is at least 0.1 mm thicker than the top wall.

Abstract: A device for dissipating a heat from addressing integrated circuits (addressing ICs) of a plasma display panel that uses a back plate which has a greater surface area, to dissipate the heat from the addressing integrated circuits directly. For embodiment of the device thereof, it provides a heat-conducting sheet attached on the addressing ICs to conduct the heat from the addressing ICs to the back plate rapidly, therefore increase the efficiency of the dissipation without add the volume of the plasma display panel.

Abstract: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module.

Abstract: A power supply comprising switching elements (20), wherein the power supply is provided with first heat sinks (30) having electrical conductivity to which the switching elements are fitted and a second heat sink (40) mounted with the first heat sinks which are electrically insulated, and first heat sink is used as one terminal for the switching elements, and the first heat sinks each having a projection, to be in contact with outside terminals (81), (82).