Abstract: Embodiments for cooling electronic modules are disclosed. In accordance with at least one embodiment, an electronic module is inserted into a cooling sled that is equipped with a bay. The bay of the cooling sled is equipped with a pair of sides to retain the electronic module. The electronic module contains a working fluid that is sealed inside the module with one or more electronic components. During the operation of the electronic module, the working fluid is vaporized by the heat generated by the one or more electronic components. The electronic module is then cooled via the cooling sled. The cooling of the electronic module condenses the working fluid that is vaporized by the heat generated by the one or more electronic components. The condensed cooling fluid is then returned to the one or more electronic components via a wick structure that is also sealed in the electronic module.

Abstract: A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

Abstract: A display device includes: a display unit which displays an image; a casing which supports the display unit; a pair of supporting members which are respectively combined at peripheral areas of a backside of the display unit and are supported by the casing; and a connecting member which has higher heat resistance than the supporting members and interconnects the supporting members.

Abstract: A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat sink that is remotely located from the transfer element. A thermally conductive member extends between the heat sink and the transfer element to convey thermal energy therebetween.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.

Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.

Abstract: A modular heat-radiation structure includes a module for generating heat, including a first main unit having a heat-radiation fin, fixed to the top face of the first main unit for radiating heat generated in the module and a resin-made and insulating heat shield inserted between the printed circuit board and the first main unit.

Abstract: Modular soft starters are disclosed having a plurality of soft starter modules with stacked SCRs and heat sinks for accommodating a single phase of a three phase motor, where the modules may be connected serially for starting each phase of a higher voltage motor, and where the modules can be mounted in a cabinet in a variety of different orientations to facilitate optimized cabinet space utilization.

Abstract: A passively cooled computer includes two or more components arranged in a housing frame 41, wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation. The cooling bodies each include a cooling surface, and these cooling surfaces are arranged to oppose one another with their cooling surfaces and thereby define an air channel leading vertically through the inside of the housing frame. The cooling bodies substantially separate the air channel from the remaining volume inside the housing frame.

Abstract: A power supply assembly includes a housing having side walls, end walls, and a bottom wall defining a rectangular box with an interior space and an open top. A first dividing wall and a second dividing wall are positioned in the interior space of the housing which divides the interior space into first, second, and third compartments. A method of manufacturing a power supply with the above power supply assembly includes installing a printed circuit board in the second compartment and positioning the first wire set to terminate in the first compartment and the second wire set to terminate in the third compartment.

Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.

Abstract: A waterproof casing for a power supply has a lower casing, an upper casing, an inlet cover and an outlet cover. The lower cover contains electronic components. The upper casing is mounted on the opening of the lower casing and has an inlet cavity, at least one inlet, an outlet cavity and at least one outlet. The at least one inlet and outlet are formed through the upper casing and respectively communicate with the inlet cavity and outlet cavity. The inlet cover and outlet cover respectively seal the inlet cavity and the outlet cavity, communicate the inlet cavity and the outlet cavity with the lower casing to allow the air to flow inside the casing and to keep the water from flowing in the inlet cavity and the outlet cavity. Structure of the waterproof casing is simplified, so benefits manufacturing.

Abstract: A heat sink assembly includes a base frame and a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module. The heat sink assembly also includes transfer links extending between the heat sink and the base frame. The transfer links are movable to transfer the heat sink with respect to the base frame. The heat sink is movable between a recessed position and an elevated position, wherein the transfer links maintain the heat sink in a predetermined orientation with respect to the engagement surface of the pluggable module as the heat sink is transferred, between the recessed position and the elevated position.

Abstract: A motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve the assembly process is provided. The motor controller has a power semiconductor element closely contacted with a heatsink and mounted in a first base plate, wherein a spacer having an engaging section formed therein as a hole for the power semiconductor element is interposed between the heatsink and the base plate, and the power semiconductor element is positioned in the spacer. Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element and the heatsink.

Abstract: A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact with a second heat source and including spaced apart rows of space vertical fins extending outwardly from the second heat source, wherein the spaced apart columns of spaced horizontal and the spaced apart rows of spaced vertical fins are arranged in an interdigitated manner.

Abstract: An electric memory module is disclosed with at least two capacitors that are interconnected by an electrically conductive connection device. The memory module includes an electric insulation which electrically insulates the memory module, and the memory module includes a cooling body. According to at least one embodiment of the invention, the cooling body forms the connecting device and the electric insulation is applied to the outside of the cooling body.

Abstract: A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first and second surfaces. The first surface of the uniform temperature plate is attached to an internal side of the heat dissipating plate, and the second surface of the uniform temperature plate is attached to the memory module. At least one heat dissipating body is installed on the memory module and clamped between the two heat dissipating plates and the two uniform temperature plates. The heat dissipating body includes a base and heat dissipating fins extended from the base. The base forms a straight section attached onto the second surface of the uniform temperature plate. The two heat dissipating plates are clamped and fixed by fixing elements. The structure of the invention can improve the heat dissipating effect of the memory module.

Abstract: A housing for electronic control units, in particular in motor vehicles, having a bottom section for attaching the electronic control units and having a cooling device that enables heat to be dissipated from the housing via a flowing liquid, a cooling device formed in the bottom section being provided both for improving the cooling capacity and for rigidity. The bottom section is easily manufactured with an integrated cooling channel by injection molding, while cooling is achievable by a medium available in the motor vehicle.

Abstract: A power semiconductor module and a method of manufacture thereof includes a lead frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: In one embodiment a thermal dissipation heat slug sandwich includes a circuit board, a circuit package having an integrated heat slug mounted to an obverse side of the circuit board, and a lower heat sink plate on a reverse side of the circuit board thermally coupled to the heat slug and a housing enclosing the circuit board An upper heat sink plate may be mounted to the obverse side of the circuit board to cover the circuit package. The upper heat sink plate thermally coupled to the lower heat sink plate through the circuit board. An insulating cover may also be provided to redirect radiant heat from the circuit package to the housing.

Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Abstract: A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.

Abstract: A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: The power inverter includes: a case made of a metal; a first power module provided in the case and including a DC terminal and an AC terminal; a second power module provided in the case and including a DC terminal and an AC terminal; and a cooling formation body for decreasing heat generated from the first and second power modules. The first and second power modules are disposed in a manner such that the DC terminals face each other.

Abstract: An upper lid forming an upper portion of a casing is formed by a metal (an aluminum alloy or the like) having a high heat radiation performance. The upper lid serves as a heat sink (a heat radiation member) radiating heat generated from electronic components within the casing to an external portion. A plurality of flat plate-shaped heat radiation fins are provided in an upper surface of the heat sink. A groove forming each of the heat radiation fins is open in a side surface of the heat sink without forming a step.

Abstract: A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract: According to one embodiment, an electronic device includes a casing at least a part of which is made of metal, an in-casing member which is housed in the casing and becomes warm when the electronic device is in operation, and a boss member formed separately from the casing and made of resin. The boss member is attached to the metal part of the casing and is interposed between the casing and the in-casing member.

Abstract: An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time.

Abstract: A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path.

Abstract: A memory module assembly includes a printed circuit board having a plurality of heat-generating electronic components thereon, first and second heat sinks formed by stamping a metal sheet and attached on opposite sides of the printed circuit board and a clamp clamping the first, second heat sinks and the printed circuit board together. The first and second heat sinks each comprise a plurality of fins extending therefrom and define a plurality of openings between the fins. The fins and openings are alternately arranged on each of the first and second heat sinks along a height direction thereof. The second heat sink includes a pair of positioning tongues extending from opposite side edges thereof. The first heat sink engages with the second heat sink via the positioning tongues of the second heat sink extending in and engaging with the first heat sink.

Abstract: An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.

Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.

Abstract: A heat dissipating structure of a 1U power supply is installed in an industrial computer host system of a universal standard specification 1U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage with the computer host system for guiding a heat dissipated airflow through the airflow passage to improve the poor heat dissipation at both distal ends of the traditional 1U power supply due to the same height of the power supply and the computer host system or the proximity of both sides of the power supply with an installed electronic device such as a hard disk.

Abstract: A fast terminal box includes a casing, a cover, plural wiring sockets, plural metal connection components and a plurality of wiring terminals. The wiring sockets are placed and distributed on a bottom plate of the casing one by one. The metal connection component is provided on the wiring socket for connection purpose. The casing and the cover are combined to each other. The wiring terminals are distributed at sidewall of the casing for receiving corresponding wiring plugs therein. The fast terminal box is characterized in heat sink metal fins are contained in a space around the wiring socket, and heat sink metal fins contact pins of a diode and the metal connection component respectively through corresponding connection portions thereof.

Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5).

Abstract: A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit zones; a pressurizing-down mechanism connected to the frame, a leading post received in the chute being disposed on each side arm, and a heat sink being provided on top; card insertion driving the pressurizing-down mechanism to move with its leading post in the chute for the heat sink to contact the card to conduct the heat generated from the card; and the elastic member moving the pressurizing-down mechanism into the upper limit zone to remove the card.

Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Abstract: A digital micromirror device (DMD) module includes a circuit board, a DMD element, a soft elastic pad, a heat dissipation pad and a heat sink. The circuit board includes a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface. The DMD element is electrically connected to the circuit board. The soft elastic pad is disposed on the first surface of the circuit board and surrounds the through hole. The heat dissipation pad passes through the through hole and contacts the DMD element. The soft elastic pad is sandwiched between the circuit board and the heat sink, the heat dissipation pad is sandwiched between the heat sink and the DMD element, and the heat sink contacts the soft elastic pad and the heat dissipation pad, so as to apply a force to the soft elastic pad and the heat dissipation pad.

Abstract: A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface.

Abstract: An exemplary heat dissipating fin assembly for clamping the DRAM to dissipate heat includes a number of heat dissipating fins arranged in a stacked fashion and a shaft. Each of the heat dissipating fins defines a pivoting hole and a slot therein. The slots of the heat dissipating fins are configured for receiving the DRAM. The shaft goes through the pivoting hole of each of the heat dissipating fins so as to string the heat dissipating fins. The heat dissipating fin assembly can enhance heat dissipating efficiency of the DRAM and reduce cost greatly.

Abstract: A module for an automation device with a plurality of adjacent modules is provided. The module includes a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. Further, an automation device including the module is provided. One of the side walls of the modules is embodied as being thermally conductive and that the other side wall is embodied as being thermally insulated.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A method and incorporated assembly is provided to enhance structural integrity and prevent interface deflection in a computer rack having a midplane and capable of housing a plurality of nodes. The assembly comprises at least one structural filler book capable of being disposed above or below said midplane where any node may be disposed having geometry and material properties to resist and counteract the plugging force of said node an causing a cancellation effect. The filler book have at least two horizontal supports being connected to one another via a vertical support and a plenum an air for directing air flow. The filler book is being secured to said rack or midplane via an engagement component disposed on one of its horizontal supports.

Abstract: A power control system may use power semiconductor devices such as insulated gate bipolar transistors (IGBT's) in a switching unit to provide motor control. The IGBT's may be cooled with a system that is configured and sized to provide proper cooling at steady-state operating conditions of the switching unit. The IGBT's may be placed in thermal communication with a compartment that may contain phase change material (PCM). When and if the switching unit is operated under transient high load conditions, excess heat may be absorbed by melting of the PCM. When steady state operating conditions are restored the PCM may solidify and release its latent heat to a coolant. The PCM may thus act as a thermal buffer for the cooling system and thus may provide that the cooling system may be minimally sized.

Abstract: A liquid dispensing system equipped with a modular cord set for powering an electrically-operated dispensing module of the system. The cord set includes a plug removably inserted into receptacle extending through a manifold of the system. The manifold heats and supplies liquid to the dispensing module. When the plug is positioned in the receptacle, electrical contacts on the plug are coupled with corresponding electrical contacts on the dispensing module. The cord set and dispensing module can be independently disconnected from the manifold without disturbing each other.

Abstract: Optical Network Terminals (ONTS) receive and transmit fiber optic data signals to a premises, such as a home or office, and generate heat, which must be dissipated. An outdoor installation may introduce additional heat loads over an indoor installation. An ONT designed for outdoor use may be overbuilt for indoor use and an ONT designed for indoor use may overheat in an outdoor location. Making separate ONTs for indoor and outdoor use is expensive. A heat sink according to an embodiment of the present invention is attachable to an exterior portion of an ONT and provides extra heat dissipation capability in hotter environments. Other embodiments place the heat sink in a fiber optic cable slack storage region. Other embodiments include interchangeable, different-capacity, heat sinks, and the ONT determines the capacity of the heat sink and operates at a power level appropriate for the heat sink capacity, i.e., thermal dissipation capability.