Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.

Abstract: A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: According to an embodiment, a power semiconductor module comprises a heat-dissipation contact area configured to thermally connect the power semiconductor module to a cooling element. The power semiconductor module also comprises a housing and a press-on element. The press-on element comprises an anchoring region and is captively anchored in the housing. A fixing eye is resiliently coupled with the anchoring region.

Abstract: According to an aspect of the embodiment, an optical module includes a case, an optical transceiver part in the case, a radiating part on the case; a thermal conductive sheet having a property of transferring and having a first end and second end; a first fixing part for fixing the first end of the thermal conductive sheet to the optical transceiver unit; and a second fixing part for fixing the second end of the thermal conductive sheet to the radiating point.

Abstract: A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.

Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.

Abstract: A system including a heat transfer apparatus is disclosed. One embodiment provides for an electronic device and a heat transfer apparatus including a heat distribution plate with a first surface being at least in part in thermal communication with the electronic device. The thermal conductivity of the heat distribution plate is higher in a direction substantially parallel to the first surface than in a direction perpendicular to the first surface.

Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

Abstract: In a heat-radiating structure and a plasma display device including the same, an uneven shape is formed in a bed of a chassis base, and a heat sink is installed on a cover plate such that heat is radiated toward both sides of the cover plate. The heat-radiating structure includes: a signal transmission unit to which an integrated circuit is attached; a chassis having a bed for supporting the signal transmission unit formed therein; and a cover plate which covers the signal transmission unit and having a heat sink formed therein.

Abstract: There is provided a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a front cover for protecting a front portion of the flat display module, a back cover for protecting a rear portion of the flat display module, an air inlet formed on a portion of the back cover to allow external air to be introduced into the back cover, an air outlet formed on another portion of the back cover and extending along a longitudinal length of the flat panel display module; a fan disposed inside the back cover and aligned with the air outlet formed on the back cover, and an air outlet channel formed in the back cover and aligned with the air outlet formed on the back cover, the air outlet having an effective exhaust area having a longitudinal length extending in a longitudinal direction of the flat display module.

Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.

Abstract: A cooling-fan-free system module includes a housing unit, a circuit module, and a heat radiating unit. The housing unit includes a front and a rear case assembled together to define a receiving space therebetween, and the rear case is made of a highly heat conducting metal material. The circuit module is received in the receiving space of the housing unit, and includes a circuit board, and at least one heat-producing element mounted on and electrically connected to the circuit board. The heat radiating unit includes at least one insulating heat conductor bonded to an inner side of the rear case corresponding to the heat-producing element for transferring the heat produced by the heat-producing element to the rear case, and at least one heat radiating member integrally formed on a back side of the rear case and consisting of a plurality of radiating fins.

Abstract: A small-sized communication module package mountable on a main board is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate, received in the opening and encapsulated by the thermal conductive layer, and a metal layer in contact with the thermal conductive layer for enhancing heat dissipation.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract: A plasma display module with reduced driving noise and improved a heat dissipating performance. The plasma display module includes a chassis base, a plasma display panel arranged at a front portion of the chassis base, the plasma display panel being adapted to display images, a heat dissipation sheet arranged between the plasma display panel and the chassis base, the heat dissipation sheet including a plurality of pores, wherein a porosity of the heat dissipation sheet varies with distance from the plasma display panel, and a circuit unit arranged at a back portion of the chassis base to drive the plasma display. The heat dissipation sheet may be made out of three separate sheet materials, each sheet having a different porosity.

Abstract: A cooling apparatus for a flat display device includes a flat display module, a front cover for protecting a front portion of the flat display module, a back cover for protecting a rear portion of the flat display module; an air inlet formed on a portion of the back cover to allow external air to be introduced into the back cover, an air outlet formed on another portion of the back cover to allow the air introduced into the back cover to be exhausted therethrough, a cross-flow fan disposed inside the back cover and aligned with the air outlet formed on the back cover, and an air outlet channel formed in the back cover and aligned with the air outlet formed on the back cover. A ratio of an inner diameter of the cross-flow fan to an outer diameter of the cross-flow fan is 0.69±0.03.

Abstract: A method and apparatus to provision a plurality of server blades from a modular server system with operating system software is described.

Abstract: An electronic apparatus includes a main body housing having a corner portion in its rear, a display section, and a hinge device which rotatively movably connects the display section to the main body housing. The corner portion projects outward more than a side wall of the display section placed in a closed position with respect to the main body housing.

Abstract: An electronic apparatus includes a housing, a first heat-generating member provided in the housing, a heat-radiating member thermally connected to the first heat-generating member, a first fan module guiding air to the heat-radiating member, a second heat-generating member provided in the housing, a second fan module discharging air out of the housing, and a wall section provided in the housing, located between the first fan module and the second fan module.

Abstract: A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The PCB is disposed on the surface of the substrate, such that the positioning part is located in the positioning hole. The LED chip is disposed on the positioning part and electrically connected to the PCB.

Abstract: A power semiconductor module has a heat-dissipation contact surface (16) for a thermally conductive connection to a cooling element (17). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to the latter by at least one pressure element (18, 19) which is permanently connected to the power semiconductor module. When mounted, the pressure element (18) presses the heat-dissipation contact surface (16) against the cooling element (17).

Abstract: The present invention provides a heat dissipater for use on a circuit board. The invention includes a circuit board having components on at least one side, a rigid plate having thermal conductive properties, and a spring clip that couples said rigid plate to said circuit board and provides a retaining force against the rigid plate. Both the rigid plate and spring clip provide thermal paths to ambient for the circuit board, and in one embodiment, a heat sink or cold plate may be coupled to the rigid plate. Thermal interface material may be filled in between the rigid plate, circuit board and spring clip to provide an efficient thermal path to ambient. The rigid plate, spring clip, and thermal interface material may be electrically insulated.

Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A user identification card connecting device for a broadcast reception apparatus and a broadcast reception apparatus having the same are provided. The user identification card connecting device includes a frame which is provided with an insertion part into which a user identification card is inserted, a heat radiation device which is movably mounted to the frame to contact the user identification card, and an elastic member which biases the heat radiation device toward the user identification card to enable the heat radiation device to be kept in contact with the user identification card. Accordingly, the user identification card can be easily mounted and demounted to/from the connecting device, and heat from the user identification card can be effectively dissipated.

Abstract: A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.

Abstract: An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.

Abstract: A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface which has a plurality of first grooves formed thereon. At least one platform is formed between two adjacent ones of the first grooves for mounting the at least one circuit substrate. The heat sink has a second lower surface and a second upper surface which has a plurality of second grooves formed thereon and is connected to the first lower surface.

Abstract: An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermally conductive member mountable on an opposite face of a circuit board from a face of the circuit board on which an electrical component is mounted, the thermally conductive member operable to conduct heat generated by the electrical component away from the electrical component.

Abstract: An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.

Abstract: A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.

Abstract: Apparatus and methods for housing an electronic device are provided. In some implementations an apparatus is provided. The apparatus includes a base, an electronic device positioned on the base, and a lid positioned to cover the base and at least a portion of the electronic device. The lid and the base form a housing for the electronic device, the lid including a lid aperture, the lid aperture exposing at least a portion of the electronic device. The apparatus also includes a transparent portion positioned such that a first region of the transparent portion is positioned within the lid aperture and where at least a portion of the electronic device is covered by the transparent portion.

Abstract: A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A shielding plate is provided with a second crew hole in a position that corresponds to the first screw hole. A control substrate is provided with third screw holes in positions that correspond to the projections. The shielding plate and the TPM are joined by putting a first screw through the first and second screw holes and temporarily fastening the tip of the first screw by a temporary fastening member at the rear main surface of the TPM. The control substrate and the TPM are joined by second screws via the third screw holes.

Abstract: In a disk array apparatus according to an aspect of the invention, temperatures of disk drives arranged in a casing are equalized to reduce a noise. A disk array apparatus 50 comprises plural disk drives 2, fans 5, and a casing 1. The disk drives 2 are arranged in an array, the fans 5 are provided on one end side of rows of the disk drives, and the casing 1 accommodates the disk drives 2 and the fans 5. Air which has already cooled the disk drives flows through an air duct 10. A sub-fan 6 exhausts the air flowing through the air duct to the outside of the casing 1. A nozzle 11 is arranged in a front end portion of the air duct. One end portion of the nozzle 11 is arranged between the disk drives.

Abstract: An external AC power adaptor having an additional compartment for cooling. The adaptor has a housing that defines a first compartment having power circuitry for converting an AC input to a DC output and a second compartment that has an opening formed in the adaptor housing. A heat transfer plate is disposed between the first and second compartments.

Abstract: A shunt activation signal is transmitted by an external control terminal through an external transmission interface to switch a flash memory controller in a shunt mode. The shunt activation signal of the external transmission interface can set up a switch as shunt. When the flash memory controller is defective due to errors or damage, the shunt mode enables the external control terminal to directly process data saving/retrieving to the flash memory chip or testing through the external transmission interface. Thus, the user need not purchase a new flash memory to replace the defective flash memory with the damaged flash memory controller.

Abstract: A substrate structure for a semiconductor a package and a package method thereof are disclosed. A plurality of independent module substrates are arranged on a metal or heat-resistant frame that has a hollow portion and those module substrates are suspended and connected with the frame by a plurality of connecting bars. A molding component is utilized to respectively cover those module substrates. Then punch, and grind the plurality of rugged bumps of those connecting bars to form a plurality of independent module packages, wherein the cover area of the molding component is larger than the size of each the module substrate. The metal or heat-resistant frame is utilized to replace the conventional side rail design so as to increase the usable area of the substrate to substantially come to the cost reduction of the substrate.

Abstract: An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a transceiver module space. The rail further includes a blocking structure coupled to the component. The blocking structure is adapted to (i) permit a connecting portion of a transceiver module to connect with a connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a circuit board side of the transceiver module faces the printed circuit board, and (ii) prevent the transceiver module from contacting the connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a heat dissipation side of the transceiver module faces the printed circuit board.

Abstract: An electrical connector assembly (100) comprises an insulative housing (1), a plurality terminals (100) received therein, a chip module (2) attached on the housing (1), an cover (4) mounted on the chip module (2) and a printed circuit (3) mounted below the housing (1), a heat cooling device (5) assembled through the cover (3), the chip module (2) and the housing (1), and the printed circuit board (4) for transmitting airflow into a interface formed between the housing (1) and the printed circuit board (3).

Abstract: A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through which a main current flows, joined to the first main surface, an electrode through which the main current flows, joined to the second main surface, and a resin portion sealing the semiconductor substrate, the capacitor and the electrodes. The capacitor includes electrodes. The electrode of the capacitor and the electrode of the semiconductor element are joined to each other by solder such that surfaces exposed through the resin portion are arranged on one continuous surface on which a cooler can be attached. Therefore, a power semiconductor module can be provided in which the capacitor and the power semiconductor element can effectively be cooled and the surge voltage can be reduced.

Abstract: The invention provides a semiconductor memory module. The semiconductor memory module includes a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board. The semiconductor memory module also includes memory parts mounted on the printed circuit board. The metal core has a folding structure having at least one bent portion to substantially cover the memory parts.

Abstract: A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening hole and a second connecting portion which has a positioning concave portion and a positioning protrusion. The heat-dissipating elements are assuredly assembled with each other through the engagement and fastening connection of the first connecting portion and the second connecting portion.

Abstract: A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of fins. A heat conduction member is connected with the cooling unit and inserted into a slot defined in one of the two side boards so as to directly in contact with the memory chips of the memory device. The heat is directly conducted to the heat conduction member and can be dispensed by the fins of the cooling unit.

Abstract: An embodiment of the present invention includes a super slim compact flash (CF) light Universal Serial Bus (USB) device having a top cover, a top cover slot formed within the top cover and forming a top cover slot cavity, a sliding plug connector positioned within the cavity and flexibly movable therein, a plastic frame disposed below and around the top cover, a retractable slim USB plug connector sub-assembly on top of which and connected thereto is placed the sliding plug connector, the sub-assembly including a retractable slim USB plug connector positioned within the device to be flexibly retracted from or pulled into the device by the sliding plug connector for causing connection to a mating USB plug connector.

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

Abstract: A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider pins secured in one of the holes in the elastomeric base. The alignment frame supporting and aligning the slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base. A method of assembling a heat spreader is also described.

Abstract: A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing plate-heat dissipaters 17 and 18 at the upper and lower edges of a printed circuit board 12 on which a heat-generating component 19 is mounted. Heat generated by component 19 is conducted to the reinforcing plate-heat dissipaters by passing a fluid in a heat pipe 21, a heat-conducting sheet 31 or a heat radiation circulation pipe 41 to be removed into the air. The reinforcing plates-heat dissipaters 17 and 18 are formed with a plurality of air vents 17a and 18a.

Abstract: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.