Abstract: A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. The clip includes a pressing body, two bending portions slantwise to the pressing body and extending from two opposite ends of the pressing body, and two locking arms extending from two ends of the bending portions. The pressing body of the clip abuts against the top surface of the base. The bending portions are extended downwardly from the pressing body to be located adjacent to two sides of the base to prevent the clip from moving horizontally along a lateral direction of the heat sink.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.

Abstract: A heat sink assembly includes a first heat sink, a second heat sink, and a wire clip connecting the first and second heat sinks together. Each of the first and second heat sinks includes a base and a plurality of connecting members extending upwardly from the base. The wire clip includes a pivot portion and a pair of pressing portions extending from opposite ends of the pivot portion towards each other. The connecting members of the first and second heat sinks cooperatively clasp the pivot portion of the wire clip. The pressing members of the wire clip resiliently abut against the connecting members of the first and second heat sinks and push the connecting members of the first and second heat sink outwardly away from each other. The bases of the first and second heat sinks clamp an add-on card therebetween.

Abstract: A receptacle assembly includes a guide frame, a heat sink and a conductive gasket. The guide frame includes a top wall and defines an interior chamber that is configured to receive a mating connector. The top wall defines an opening that provides access to the interior chamber. The heat sink is held in the interior chamber such that at least an upper portion of the heat sink produces through the opening and a lower portion of the heat sink engages the mating connector when the mating connector is loaded in the interior chamber. The conductive gasket is held in the interior chamber between the guide frame and the heat sink. The gasket is configured to be compressed between the guide frame and the heat sink when the mating connector is loaded into the interior chamber such that the gasket provides a conductive path between the heat sink and the guide frame.

Abstract: An electric device includes: first and second electric elements, wherein electric power consumption and operation temperature limit of the first electric element is larger than the second electric element; a substrate made of a rigid flexible board; and a casing that accommodates the substrate with the first and second electric elements. The substrate includes first and second rigid portions and a flexible portion. The first and second electric elements are disposed on the first and second rigid portion, respectively. The flexible portion connects the first and second rigid portions. The thickness of the flexible portion is smaller than the first and second rigid portions. The flexible portion further includes a wiring for electrically coupling the first and second electric elements so that high speed communication is performed between the first and second electric elements.

Abstract: In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.

Abstract: A control box for electrical actuators comprises a cabinet consisting of a lower part (2) containing a control printed circuit board and provided with a row of gates (3) for various plugs, and an upper part (4) with a power supply and optionally also a battery pack. The lower part (2) is configured as an independent closed housing, and the upper part (4) is configured as two independent closed housings (5, 6). The upper side of the lower part (2) is provided with an area (7) for receiving a lower side of the two independent housings (5, 6) of the upper part, and means (13, 14; 16, 17) are provided in the lower part and the two housings of the upper part for securing the housings of the upper part to the lower part. The two housings of the upper part do not or essentially do not extend outside the area on the upper part.

Abstract: A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat spreader includes a first segment mountable on the module to be in thermal communication with at least one electronic component mounted on the first side, and to be substantially thermally isolated from at least one electronic component mounted on the first side. The heat spreader further includes a second segment mountable on the module to be in thermal communication with the at least one electronic component mounted on the first side that is substantially thermally isolated from the first segment.

Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are then secured by a clip to form a rigid frame.

Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

Abstract: A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.

Abstract: A light source module includes at least a light source and a housing. The housing includes a base having a slanted reflective surface, a plurality of sidewalls extending out of a peripheral of the base cooperatively defining an opening with the base, the sidewall aligned with a trough of the slanted reflective surface having an inner surface and an outer surface opposite to the inner surface, and a plurality of fin structures formed on the outer surface of the sidewall. The light source is fixed on the inner surface of the sidewall. Light rays emitted from the light source being reflected at the slanted reflective surface toward the opening. A backlight system using the light source module is also provided. The present backlight system has a good heat dissipation capability due to an employment of the present light source module, and can be configured to be a thin body.

Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.

Abstract: An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent.

Abstract: An electronic assembly includes a casing (10) of an electronic product, and a thermal module disposed in the casing. The casing has a sidewall (102) defining a plurality of slots (1011) therein. The thermal module includes a centrifugal blower (50), a fin assembly (40) and a plurality of sub-fins (701). The centrifugal blower defines an air outlet (502) therein. The fin assembly is disposed at the air outlet of the centrifugal blower and includes a plurality of fins (401) and has a plurality of air passages (402) formed between adjacent fins. The sub-fins are located between the fin assembly and the sidewall of the casing, and forming a plurality of air channels (702) therebetween. The air channels of the sub-fins communicate the air passages of the fin assembly with the slots of the sidewall of the casing.

Abstract: A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A case-grounded flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips and a controller chip. The PCBA is encased inside an upper case and a lower case, with a Serial AT-Attachment (SATA) connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Dual-axis case-grounding pins draw any electro-static-discharges (ESD) current off the upper case along a primary axis and onto a PCBA ground through a secondary axis washer that is screwed into the PCBA. The primary axis body of the dual-axis case-grounding pins fits around a PCBA notch while the secondary axis passes through a metalized alignment hole for grounding. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the dual-axis case-grounding pins.

Abstract: A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module and fixed to the metal casing; a heat dissipating sheet disposed on the metal plate; and a drive circuit board disposed on the heat dissipating sheet and is equipped with a control circuit for controlling the power semiconductor devices.

Abstract: Provided is a plasma display panel that includes a panel assembly forming an image; a chassis base combined with the panel assembly and separated into pieces; and a plurality of driving circuit units combined with the chassis base and including circuit elements transferring an electrical signal to the panel assembly using signal transfer units, which more effectively transfers heat generated from the panel assembly or the signal transfer units, thereby improving a thermal dissipation function.

Abstract: A cooling fan module comprising a module housing and a fan assembly. The fan assembly comprises a blade assembly coupled to a motor disposed within a fan housing that is disposed within the module housing. The fan housing has an inlet and an outlet that is disposed within the module housing. A fan control circuit board is disposed within the module housing and outside of the fan housing. The fan control circuit board is coupled to the motor. An electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.

Abstract: An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A card slot according to the present invention is provided with a slot body, a heat sink, a first support and a second support. The slot body is configured to internally store an IC card. The heat sink is provided with a heat sink body and a first spring. The first spring is attached to the substantial center of an upper surface of the heat sink body, and supports the heat sink body. Also, the first spring is lowered with insertion of the IC card inside the slot, and presses the heat sink body downward. The first support is provided with two first leg sections, a first linking section and a first pressing spring. The two first leg sections are arranged facing positions sandwiching the heat sink body close to one end side of the slot body. The first linking section links fellow upper end vicinities of the two first leg sections.

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract: A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

Abstract: Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks.

Abstract: The present invention provides one single chip solution for a non-isolated DC-DC regulator. The advantage is high reliability, lower cost and smaller space on the motherboard. This integrated solution opens the door for a distributed architecture with few millimeter high 1?×1? regulator. Such regulators could be populated as QFP ICs are on all system boards. The present invention is based on a single VRM chip, PBGA multilayer board with processor signal pads and power points. The multilayer board periphery has SMD components such as ceramic capacitors, ICs, MOSFETs and a rectangular metal heat sink along with ferrite cores which sandwich the multilayer board and SMDs to form inductors for the multiphase solution.

Abstract: Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.

Abstract: A plasma display module including a plasma display panel adapted to display an image with gas discharge, a chassis adapted to support the plasma display panel, a driving unit arranged on the chassis and adapted to generate an electrical signal that drives the plasma display panel, an integrated circuit chip arranged on a signal transmitting unit, the integrated circuit chip being adapted to control electrical signal transfer between the driving unit and the plasma display panel, a cover plate arranged on the signal transmitting unit and adapted to cover the integrated circuit chip and a wave-type heat dissipating plate arranged on the cover plate.

Abstract: A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating layer. Circuit elements are connected to the conductive pattern. Sealing resin covers the front and side surfaces of the circuit board. Furthermore, the sealing resin also covers the edge region of the back surface of the circuit board. Thus, it is ensured that the circuit board has a dielectric strength while exposing the back surface of the circuit board to the outside.

Abstract: A heat sink and light pipe assembly is provided for an electronic module configured to be mounted on a circuit board. The assembly includes a bracket configured to be held proximate the electronic module. The bracket includes a light pipe mounting post and the bracket defines an opening therein. A heat sink includes a base having a portion configured to extend through the opening in the bracket to engage the electronic module. A light pipe is held in the light pipe mounting post. The light pipe is configured to convey a status of the electronic module.

Abstract: A combination heat sink and electromagnetic interference shield device is provided for a point of distribution card of a television receiver. The combination POD card heat sink and EMI shield device includes a combined thermal transfer and electromagnetic conduction portion that provides thermal and EM coupling or contact between an enclosure of the POD card and the metal control module enclosure of a television. Configured metalwork of the combination heat sink and EMI shield device provides conduction of heat from the POD card to provide the heat sink and short circuiting of developed currents to provide EMI shielding. The combined thermal transfer and EM conduction portion provides a low impedance connection between the POD card and the surrounding module metalwork of the television. This low impedance path provides a short for circulating current in the exposed metalwork that diminishes or essentially eliminates EMI.

Abstract: A semiconductor memory device according to the present invention comprises a housing including a card bus connector for connection to a host device and having a PC card shape having a thickness of 5.0 mm, four SD memory cards housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards. The semiconductor memory device is suitably used as a recording medium of a host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.

Abstract: An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

Abstract: A cabinet system comprises a chassis having a plurality of openings, a plurality of modular doors, and at least one radio frequency system. Each opening has removably attached chassis-hinge portions on one of two edges. Each modular door comprises an outside surface, an inside surface opposing the outside surface, and door-hinge receptacles on at least two edges. The door-hinge receptacles receive door-hinge portions. Each door-hinge portion is positioned in a respective door-hinge receptacle on one edge of the plurality of modular doors and is configured to mate with a respective chassis-hinge portion on the one edge of one of the plurality of openings so the mated chassis-hinge portion and door-hinge portion form a hinge to rotatably attach the modular door to the one of the openings. The radio frequency system comprises electronic components attached to the inside surface of at least one of the plurality of modular doors.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed on a plane intersecting with a plane having the first output unit disposed thereon; and a controller configured to control the output units.

Abstract: A digital video recorder with a fast-detaching hard disk assembly has case, an ejector frame and a hard disk. The case has an opening and cover corresponding to the opening. The ejector frame has a hard disk housing, two X-frames, and is raiseably mounted in the case corresponding to the opening. The hard disk is mounted on the hard disk housing. To remove the hard disk from the case, a person removes the cover and the hard disk housing will automatically raise through the opening for easy replacement, removal or maintenance access.

Abstract: A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.

Abstract: A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.

Abstract: A method of cooling a module attached to a board by a spring mechanism that provides access to the module during testing. A cold plate assembly features a dry thermal interface coupled with spring loaded plunger to ensure a module, such as a dual chip module (DCM), for example, remains in place during individual cold plate removal.

Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Abstract: A display module, used for, e.g., a plasma display panel, is disclosed. In one embodiment, the display module includes a display panel, a drive circuit board driving the display panel, and a chassis base supporting the display panel and the drive circuit board. A curved portion is formed on the chassis base with a predetermined width, a boss is installed on an upper surface of the curved portion, and the drive circuit board is installed on the top of the boss. According to embodiments of the present invention, the strength of the chassis base constituting the display module is reinforced, without requiring a separate reinforcement member, and simultaneously the heat and noise generated by the display panel and the drive circuit board during operation can be appropriately dissipated and prevented.

Abstract: Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling electrical conductivity. The socket 1a has a depressed shape, and a spiral contact 1 is formed in the depression 1c. An electronic circuit module is constructed by mounting and electrically connecting a semiconductor module wherein a plurality of semiconductor packages 3 is stacked on a circuit board. A circuit board with sockets is constructed by mounting a socket board on a circuit board.

Abstract: A power electronics module includes a capacitor having a trough-shaped housing and at least one capacitor winding. An electronic unit includes a base on which the capacitor is mounted. A cooling plate in thermal contact with a cooling surface of the capacitor is formed by a bus bar. The cooling plate is on the base of the electronic unit.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.

Abstract: A system for cooling a heat-generating electronic device in a computer system includes a printed circuit board having one or more ventilation holes and coupled to a first side of the heat-generating electronic device, and a fan assembly having a top side and a bottom side and coupled to a second side of the heat-generating electronic device. The fan assembly is disposed relative to the printed circuit board to allow air to flow into the top side of the fan assembly and into the bottom side of the fan assembly through the one or more ventilation holes. One advantage of this design is that it enables a greater volume of air to flow through the fan assembly relative to prior art designs, thereby resulting in more efficient cooling of the heat-generating electronic device.