Abstract: A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

Abstract: A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover.

Abstract: A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.

Abstract: An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.

Abstract: A cooling structure for a shunt resistor has a semiconductor switching element mounted on a component side of a circuit board, a shunt resistor surface-mounted a solder side of the circuit board, a radiator for releasing heat generated from the semiconductor switching element and the shunt resistor, and an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity.

Abstract: Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract: A solid state disk assembly includes a solid state disk, a first heat conducting member and a second heat conducting member. The solid state disk includes a printed circuit board (PCB) and a chipset. The PCB includes a front surface, a rear surface, a first end, and a second end. The chipset is mounted on the front surface. The first heat conducting member abuts the chipset for absorbing heat generated by the solid state disk and includes at least a pair of elastic arms. The second heat conducting member attaches on the rear surface and includes at least a pair of engaging arms spatially corresponding to the at least one pair of elastic arms. The first end and the second end are clamped between the at least one pair of elastic arms. Each elastic arm engages with a respective one of the engaging arms.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: The universal control module is designed for controlling the operation of a plurality of motors and/or configured for a plurality of different motor applications. In an example, the control module is configurable within a housing of a power tool. The control module includes a top cover, a bottom cover and a printed circuit board (PCB) with control components thereon. The control module includes a spacer configured between the top and bottom covers and attached to the PCB for providing tolerances for the control components during a soldering process to fixedly attach the control components to the PCB.

Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

Abstract: A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.

Abstract: A display apparatus and a method of spreading heat in the display apparatus are provided. The display apparatus includes: a display panel which display an image on a front surface thereof; an intermediate panel disposed on a rear surface, opposite the front surface, of the display panel; and a heat spreader disposed on the rear surface of the intermediate panel and which spreads heat, the heat spreader extending in a longitudinal direction from a first position of the rear surface of the intermediate panel in which the heat is present to a second position of the rear surface of the intermediate panel.

Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.

Abstract: A first connector has a plurality of terminals arranged in the direction along a first pattern, and the first pattern is connected to a terminal disposed far from an image sensor in the plurality of terminals of the first connector. A second connector has a plurality of terminals arranged in the direction along a second pattern, and the second pattern is connected to a terminal disposed closer to an image processing circuit in the plurality of terminals of the second connector.

Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).

Abstract: A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Abstract: Electronic component includes a plurality of pins (10) to be soldered onto a printed circuit (2), the component furthermore including a heat-dissipating plate (11) for dissipating heat originating from the component (1), the heat-dissipating plate (11) being intended to be soldered onto a conducting region (211) on the surface of the printed circuit (2), the component further including testing elements (110, 10a) in the form of a pin (10a) directly electrically connected to the heat-dissipating plate (11) for monitoring electrical characteristics of the connection established between the heat-dissipating plate (11) and the conducting region (211), such as the continuity or the impedance. An electronic board incorporating the component is also described.

Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.

Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.

Abstract: An electronic card module which includes the function of storing information regarding the fabrication/maintenance/driving of a product. The electronic card module has a main function circuit unit configured by mounting various electronic components on a PCB substrate. The electronic card module is formed with the PCB module in one piece and includes an information provision unit which stores information including product fabrication information, maintenance information, and driving information, and which provides the information when a request is made from an external device.

Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

Abstract: Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation.

Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.

Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

Abstract: An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component.

Abstract: An electronic device includes a circuit board, a heat generating component positioned on the circuit board, a casing receiving the circuit board and the heat generating component, and a working medium. The working medium is contained in the casing and covers the heat generating component. The working medium is electrically insulated and phase-change material, and represents solid state at normal temperature.

Abstract: An electronic device includes a circuit board, a connector fixed on the circuit board, and a heat sink mounted on the circuit board. The heat sink includes a securing portion. The securing portion defines a first cutout, a second cutout, and an arm located between the first and second cutouts. The arm resiliently urges the connector against the circuit board so as to firmly hold the connector between the heat sink and the circuit board.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.

Abstract: The present disclosure provides a heat-dissipating apparatus for printed circuit board. The heat-dissipating apparatus adopts a ceramic device arranged between the printed circuit board and ground. Therefore, the apparatus can achieve the purpose of heat dissipation and save space of the printed circuit board and save cost of using a fan and cooling fins.

Abstract: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).

Abstract: A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: Communications system housings, assemblies, and related alignment features and methods are disclosed. In certain embodiments, communications cards and related assemblies and methods that include one or more alignment features are disclosed. In certain embodiments, at least one digital connector disposed in the communications card is configured to engage at least one complementary digital connector to align at least one RF connector also disposed in the communications card with at least one complementary RF connector. In other embodiments, printed circuit board (PCB) assemblies are disclosed that include a moveable standoff to provide an alignment feature. In other embodiments, distributed antenna systems and assemblies that include one or more alignment features are disclosed.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container.

Abstract: A computer-implemented structure for optimizing a route for power supply and heat dissipation in a multilayer chip. The method includes: setting a heat conductive thermal value for the multilayer chip by way of density, preparing a substrate that contains silicon where a wiring layer is formed facing the upper surface side of the multilayer chip, setting the power from the wiring layer of the substrate that uses silicon, manipulating the value of the power supply, and manipulating the heat conductive thermal value based on density. Both apparatus's include an organic substrate, a multilayer chip, a substrate containing silicon, a wiring layer, and a heat dissipater, wherein the components are configured to perform the steps of the above method. The method of configuring an apparatus ensures that all the multilayer chips are stored in the concave part of the organic substrate.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

Abstract: An electronic device includes a housing and a chip. The housing includes a main body and a supporting portion. The main body has an inner surface and an outer surface, and an opening disposed on the outer surface. The supporting portion is disposed on the inner surface, and has a heat dissipating chamber that communicates with the opening. The chip is disposed on the supporting portion, and the heat generated by the chip is transmitted via the housing.

Abstract: An electronic device includes a circuit board, a connector fixed on the circuit board, and a heat sink mounted on the circuit board. The heat sink includes a securing portion. The securing portion defines a first cutout, a second cutout, and an arm located between the first and second cutouts. The arm resiliently urges the connector against the circuit board so as to firmly hold the connector between the heat sink and the circuit board.

Abstract: Regarding an electrical apparatus, in an opposing part facing a board, the opposing part being on a surface of in a heat dissipator, a contact part which is brought into contact with a first region of a second main surface corresponding to an electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to a fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part. The degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface.

Abstract: A waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together.

Abstract: A heat dissipating module is mounted on a mainboard of an electronic device. The heat dissipating module includes a guiding cover mounted on the mainboard, and a heat dissipater mounted on the mainboard and received in the guiding cover. A guiding cover switch is electrically connected to the mainboard and the guiding cover, and a heat dissipater switch is electrically connected to the mainboard and the heat dissipater. The connection states of the guiding cover switch and heat dissipater switch are both required to be on, proving that the guiding cover and the heat dissipater are both mounted properly on the mainboard, before allowing startup of the electronic device.

Abstract: A control device for a motor unit includes: a housing including a bottom wall, a side wall and an accommodation space formed so as to be surrounded by the side wall; a heat sink including a first heat dissipation wall portion upright from the bottom wall in the accommodation space, the first heat dissipation wall portion upright having a first heat dissipation principal surface; a first board portion mounted on the first heat dissipation principal surface and having a first principal surface; and a circuit board including a power element mounted on the first principal surface.

Abstract: An auxiliary device for conductively removing the heat produced by one or more components on an electronic card includes a heat sink covering all or part of the card. The device includes at least a first heat-conducting element mounted to absorb the heat produced by the one or more components, a movable second heat-conducting element, a heat pipe connecting the first element with the second element, and clamping means designed to press the movable second element against a cold wall.

Abstract: A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Abstract: According to one embodiment, an electronic apparatus includes a board, a first electronic component on the board, a second electronic component on the board, and a fixing member between the first and second electronic components. The second electronic component is designed to produce less heat than the first electronic component. The fixing member is configured to secure the board to a part.

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.