Abstract: A cooling structure for electronic equipment includes a plurality of cooling structural members on a same substrate. In the cooling structural members, a plurality of heating components having a same shape are connected to one thermal diffusion part through a first thermal conductive member. Each of thermal diffusion parts of the plurality of cooling structural members is connected to one heat dissipator through a second thermal conductive member.

Abstract: A circuit board and a semiconductor module with high endurance against thermal cycles, and which is hard to be broken under thermal cycles, even if thick metal circuit board and thick metal heat sink are used, corresponding to high power operation of a semiconductor chip are provided. This circuit board includes, an insulating-ceramic substrate, a metal circuit plate bonded to one face of the insulating-ceramic substrate, a metal heat sink bonded to another face of the insulating-ceramic substrate, wherein (t12?t22)/tc2/K<1.5, where, a thickness of the insulating ceramics substrate is tc, a thickness of the metal circuit plate is t1, a thickness of the metal heat sink is t2, and an internal fracture toughness value of the insulating ceramics substrate is K.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

Abstract: The present invention provides a modular circuit card configuration for distributing heat among a plurality of circuit cards. Each circuit card includes a housing adapted to dissipate heat in response to gas flow over the housing. In one aspect, a gas-cooled inverter includes a plurality of inverter circuit cards, and a plurality of circuit card housings, each of which encloses one of the plurality of inverter cards.

Abstract: Provided is a mobile communication terminal that includes a case with internal and external surfaces, antenna patterns that transmit or receive radio signals corresponding to frequency bands, a circuit board that processes signals that conform to the transmitted or received radio signals, a connection unit that electrically connects the antenna patterns to the circuit board, an accommodation chamber that accommodates a battery, and a cover detachably mounted on the case and covering the accommodation chamber and the antenna patterns.

Abstract: According to one embodiment, a wiring board device is provided in which even if the temperature of a ceramic board becomes high, the influence on a connector can be reduced and the occurrence of defects due to heat can be prevented. The wiring board device includes a common member. The ceramic board and the connector are placed on the common member. A wiring pattern of the ceramic board and the connector are electrically connected by wiring.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: An electronic component board is made by attaching bus bars to an insulating plate, and by electrically connecting electronic components to the bus bars. In the electronic component board, heat radiating portions integrally formed with specific bus bars are provided along an outer periphery of the insulating plate. A width of a portion extended parallel to the outer periphery of the insulating plate of the heat radiating portion is constant. The electronic component board 1 is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating board, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion.

Abstract: The present invention provides a non-intrusive method for dissipating heat from open-frame DC-DC power converters where bottom side components are exposed. A thermal interface material is placed between the motherboard to which the power converter is soldered and power dissipating and temperature sensitive components on the bottom of the power converter. The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard.

Abstract: A power converter device is disclosed herein. The power converter device includes a printed wiring board assembly, a cold plate base and a shell plate assembly. The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly. The shell plate assembly having a top shell plate, a bottom shell plate, at least two side plates respectively mounted on the cold plate base in different orientations. The printed wiring board assembly and the cold plate base are enclosed with the shell plate assembly.

Abstract: A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding piece and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements.

Abstract: An electronic-control unit (7) includes a conductor board (12) made of a flexible substrate and defining at least one conducting path and cut (13) of the board (12). A basic body (11) is made of a thermally and electrically conductive material and thermally and electrically coupled to the board (12) and defines at least one elongated groove (15) that acts as a bending area (15) of the body (11) and expands over substantially an entire width of the body (11) in an aligned area of the cut (13) of the board (12) and a flat projection of the body (11) onto which the substrate is fastened. A basic-body-conductor-board unit is formed before the board (12) is assembled with at least one electronic component (16). The basic-body-conductor-board unit is re-shaped into a desired geometry after the assembly of the board (12) with the component (16). A method produces the basic-body-conductor-board unit.

Abstract: Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Abstract: A ground mechanism for a heat sink is attached to a circuit board. The ground mechanism includes a first latching member, a second latching member, a conductive member, and an elastic member. The first latching member and a second latching member latch the heat sink on the circuit board. The conductive member is formed on the circuit board. The elastic member is sandwiched between the first latching member and the heat sink. The elastic member electrically connects the first latching member to the heat sink, and the second latching member electrically connect the first latching member to the conductive member to conduct electromagnetic charges from the heat sink to a grounding pin of the circuit board.

Abstract: The rear cover of an electronics device is made up of two sections including an external heat sink and a rear cover frame. The electronics for the computing device are directly coupled to the heat sink section. The two sections are fastened together with a layer of cushioning material to simultaneously provide shock-vibration protection as well as efficient cooling of the electronics.

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit Board (PCB). The a multi-layer substrate has at least one substrate layer, has at least one first chip region and at least one second chip region in a lowermost substrate layer, configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a Co-Planar Waveguide guide (CPW), and has an LGP coupling pad for connecting with a Printed Circuit Board (PCB) in the lowermost layer. The at least one integrated circuit chip is coupled in the first chip region and the second chip region. The PCB is connected with the multi-layer substrate using the LGA coupling via the LGA coupling pad.

Abstract: A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract: There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.

Abstract: A sheet metal cover for a printed circuit board (PCB) includes a plurality of legs continuous with a substantially planar elevated section. The legs are attached to the PCB, and electrical connections are provided between the legs and an internal ground plane of the PCB at the attachment locations. The sheet metal cover is thereby grounded, inhibiting the transmission of electromagnetic signals through the sheet metal cover. The elevated section of the sheet metal cover prevents select electronic devices on the PCB from being viewed or probed. Openings through the sheet metal cover allow heat sinks or heat generating electronic devices (e.g., inductors) to be exposed through these openings, thereby facilitating cooling of these elements by airflow. An electrically conductive gasket attached to the underside of the elevated section may contact the heat sinks, further minimizing the radiation of EMI emissions.

Abstract: In a device for cooling an electronic circuit board comprising at least one component covered with an exchanger cover, the device includes a heat sink covering all or some of the electronic circuit board, and at least one heat pipe per component, each heat pipe being capable of carrying away the heat from the component with which it is associated to at least one end of the electronic circuit board via a zone of the heat pipe called the condensing zone. The device further includes at least one heat-exchange part located on the end of the electronic circuit board and mounted freely on the heat sink, each heat pipe being attached to the heat-exchange part by means of its condensing zone.

Abstract: Provided is a heat sink clip for fastening a heat sink on a printed circuit board (PCB). The heat sink clip includes two hooks and a wire clip. The two hooks are inversely fixed to the PCB at two opposite sides of the heat sink. The wire clip includes a pressing wire pressing the heat sink, two pairs of deforming wires extending from the lateral of the pressing wire along two radial directions of the pressing wire and away from the PCB, and two engaging wires engaging with the respective hooks such that the deforming wires are bent towards the PCB.

Abstract: A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.

Abstract: A portable power tool includes a tool housing, a motor unit located in the tool housing, and an electronic module located in the tool housing. The electronic module includes (i) an electronic module housing having at least one housing component, and (ii) at least one printed circuit board. The at least one printed circuit board is at least partially decoupled relative to the at least one housing component of the electronic module housing.

Abstract: An electronic device includes a housing, a power supply unit (PSU) bracket fixed in the housing. The PSU bracket includes an idle PSU receiving portion. A heat dissipating module is received in the idle PSU receiving portion.

Abstract: A display module including a backlight to more effectively dissipate heat generated at light emitting diodes (LEDs) and heat dissipation units to effectively dissipate heat generated at driver chips and prevent movement of the driver chips by attaching porous fillers to the heat dissipation units, and a display apparatus having the same are provided. The display module includes a display panel, a backlight disposed on a rear side of the display panel and including a plurality of printed circuit boards, a bottom chassis adapted to accommodate the backlight unit and provided with a plurality of seating grooves, a driving printed circuit board, a plurality of flexible printed circuit films which electrically connect the display panel and the driving printed circuit board, at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit and provided with a porous filler.

Abstract: A heat sink for mounting to any circuit board with locating holes is provided. The heat sink includes a main body attached on the circuit board, a number of fixing arms each defining a number of mounting holes, and a number of connecting members allowing a fixing arm to pivot about the connecting member. The fixing arms can make use of locating holes in different locations in different circuit boards for attaching the heat sink to any circuit board.

Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

Abstract: A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.

Abstract: A heat dissipation apparatus for an electronic component mounted in a casing of an electronic device includes a first heat sink attached to the component, a second heat sink located outside the casing, and a heat pipe connected between the first heat sink and the second heat sink. The heat pipe contacts the casing.

Abstract: A heat sink assembly includes a heat sink, two first fixing structures, and two second fixing structures. The heat sink includes a base. The base includes two opposite sidewalls each forming a fixing portion. When the heat sink is mounted to a first motherboard, the first fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the first motherboard. When the heat sink is mounted to a second motherboard, the second fixing structures are detachably connected to fixing portions of the heat sink, and fix the heat sink to the second motherboard.

Abstract: The invention relates to a method for producing an electrical circuit. A prefabricated substrate is provided, said substrate having a first and a second conductor layer and having a dielectric between the first and the second conductor layers. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer of the prefabricated substrate, forming a heat-transferring connection between the component and the first conductor layer. The invention further relates to an electrical circuit produced in said manner. According to the invention, the electrical circuit comprises a prefabricated substrate which is produced having a first and a second conductor layer and a dielectric located therebetween. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer.

Abstract: The invention provides a load distributed heat sink system for securing a heat sink to a heat-generating electronic component while distributing the load on the circuit board. Provided is a heat sink system having heat sink, a heat sink clip, and a circuit board. The heat sink is generally disposed on one side of the circuit board over a component, and the heat sink clip is generally disposed on the opposing side of the circuit board. The ends of heat sink clip reach to the other side and attach onto the heat sink on. The heat sink clip further includes a load spreader, which is urged onto the circuit board by the heat sink clip, both retaining the heat sink system in place and distributing load on the circuit board.

Abstract: A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

Abstract: A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.

Abstract: A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element.

Abstract: The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.

Abstract: An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.

Abstract: The present invention provides a back frame of a flat panel display device, which includes at least two primary assembling pieces and at least one secondary assembling piece, wherein the at least two primary assembling pieces are joined to form a main frame structure of the back frame and the secondary assembling piece is arranged inside the main frame structure and is joined to the main frame structure. The back frame further includes a bracing piece fixed to the primary assembling pieces or the secondary assembling piece and a heat dissipation fin set arranged on the bracing piece. The bracing piece fixes a circuit board and forms a thermal coupling between the circuit board and the heat dissipation fin set. The present invention also provides a backlight system.

Abstract: The present invention provides a flat panel display device, a stereoscopic display device, and a liquid crystal display device. The flat panel display device includes a backlight system and a display panel, wherein the backlight system includes a light source, a light homogenization mechanism, and a back frame; the back frame carries the light source and the light homogenization mechanism and includes at least two primary assembling pieces and at least one secondary assembling piece, wherein the at least two primary assembling pieces are joined to form a main frame structure of the back frame and the secondary assembling piece is arranged inside the main frame structure and is joined to the main frame structure. The back frame further includes a bracing piece fixed to the primary assembling pieces or the secondary assembling piece and a heat dissipation fin set arranged on the bracing piece.

Abstract: A housing for a chip arrangement is provided, the housing including: a carrier including a first carrier side configured to receive a chip arrangement, a second carrier side and one or more through-holes extending from the first carrier side to the second carrier side; at least one electrical connector inserted through a through-hole, the at least one electrical connector arranged to extend from the second carrier side to the first carrier side; wherein the at least one electrical connector may include: a first portion on the first carrier side; a second portion on the first carrier side, wherein the first portion is configured to extend away from the first carrier side at an angle to the second portion; and a third portion on the second carrier side, wherein the third portion is configured to extend away from the second carrier side at an angle to the second portion.

Abstract: An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to the said coating.

Abstract: A heat dissipating system adapted to dissipate heat generated from an electrical package mounted onto a socket connector, comprises a clip defining a downward lower pressing portion; and a heat dissipating device disposed under the clip, being adapted to in contact with a surface of the electrical package and embedded with a number of springs evenly disposed on an upper surface thereof adapted to be pressed by the pressing portion.

Abstract: The invention relates to a device comprising a first electric contact (8, 98) and a substrate (1, 91). The first electric contact (8, 98) comprises a first area (10, 110) with a first wettability, and the substrate (1, 91) comprises a second area (3) with a second wettability and a third area (2) with a third wettability and being adjacent to the second area (2). The first electric contact (8, 98) is attached on the substrate (1, 91) so that the first area (10, 110) of the first electric contact (8, 98) is adjacent to the second area (3), and the second area (3) is located between the first area (10, 110) and the third area (2). The first and the second wettability are higher than the third wettability. The invention also relates to a transponder (T1, T2, T3) which comprises the substrate (1, 91), an electric device (50, 80) and an antenna (7, 93).