Abstract: A memory module includes parallel first and second printed circuit boards, each having a mounting edge, a chip mounting side with a set of memory chips mounted thereon, and signal traces that extend from the mounting edge and that are connected to the set of memory chips on the chip mounting side. A signal conductor unit is disposed between the first and second printed circuit boards, and interconnects the signal traces on the first and second printed circuit boards.

Abstract: An electronic module of the invention is so structured that a plurality of first electronic components are mounted on a top surface of a card-like substrate; a first radiating board is commonly stuck to two or more top surfaces of the first electronic components; a plurality of second electronic components are mounted on a bottom surface of the substrate; and a second radiating board is commonly stuck to two or more bottom surfaces of the second electronic components. The heat generated by high-speed operation of the first and second electronic components is radiated to outside air through the first and second radiating boards.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Abstract: A heat conducting device for providing a thermal path between a circuit board and a missile airframe includes a thermal plane that is adapted to receive a circuit board and a collar that encompasses at least a portion of the thermal plane. The collar has a first position that disengages the heat conducting device from at least a portion of the airframe and a second position that engages the heat conducting device with at least a portion of the airframe to provide a thermal path between the circuit board and the airframe.

Abstract: A compact programmable logic controller provides a floating mounting of circuit cards carried by opposed terminal blocks of the industrial controller the latter only which are directly mounted to the housing. Positioning of the cards between opposed connector blocks prevents torsion on the cards resulting from unbalanced forces on the terminal blocks and provides an extremely rigid structure.

Abstract: An electronic chassis or modular rack has elements and methods for reducing emission of electromagnetic waves or interference (EMI) and at the same time ensuring that the components within the chassis or rack are properly cooled. A face plate which attaches to a printed circuit board or blank board for insertion and removal of the board from the chassis and limiting EMI emission while allowing connector and indicator accessibility. The face plate has an elongated frame having at least two planar body portions. The planar body portions are integrally formed to each other with the planes of the two planar body portions at an angle of between 25 and 55 degrees of each other. The elongated frame has a pair of free edges adjacent to the planar surfaces and the pair of side edges. The face plate has a pair of mounting devices. Each mounting device is carried by the elongated frame in proximity to one of the free edges. The pair of mounting devices are offset from each other about the planar body portions.

Abstract: A platform for holding a plurality of modules or printed circuit boards wherein the platform or chassis contains shutters placed over airflow openings in the platform. The shutters are normally closed and are opened be the act of inserting a module into the platform. The shutters are in the closed position in all slots not occupied by a module and are in the open state in all slots populated by a module. The shutters open as the module is inserted and close when the module is removed. The closed shutters prevent airflow from passing through the unpopulated slots and empty space within the platform, thus forcing the airflow to pass through the space in which the modules are present. The platform also comprises a means of controlling the number of fans that are operational in accordance with the number of modules installed in the platform. The fans closest to the modules inserted into the platform are operational while fans close to unpopulated slots are turned off.

Abstract: A printed circuit board (1) includes a multi-layered structure. One of the layers (3) provides a heating layer such that heat applied to that layer (3) is transferred to electronic components (2) mounted on the board (1). The components (2) can thus be maintained at a suitable operating temperature. The heat can be supplied by ohmic heating of a resistive element within the printed circuit board (1). In an exemplary embodiment of the invention, one of a conducting layer and a ground or earthing layer of the printed circuit board (1) provides the heating layer (3).

Abstract: A method is provided for manufacturing a housing for containing an IC card. The method includes the steps of stamping a pair of metal covers with at least one of the covers having a continuous uninterrupted edge provided with a plurality of through holes spaced inwardly of and along the edge. The covers are placed into a mold for an injection molding process. Plastic support members are injected into the mold into attachment with the covers. Plastic material of the support member surrounds the edge and flows through the holes of the cover. The covers and attached support members are removed from the mold, and the support members are bonded together so that a housing is formed with the covers and within which the IC card can be contained.

Abstract: A system and method for dissipating thermal energy created by multiple electronic circuit boards packaged within a single housing and while in operation are disclosed. The system and method enhances heat convection and heat conduction across and through the housing. A heat conductive housing having a plurality of longitudinally extending fins for increasing the surface area of the housing and correspondingly increasing heat convection to the housing is utilized. Furthermore, the multiple electronic circuit boards are packaged such that a heat conductive path, defined by a thermally conductive material, is disposed between the plurality of electronic circuit boards. Finally, the heat conductive material is applied to the inner surface of the housing and between each of the electronic circuit boards. The present invention increases heat conduction of the thermal energy generated by the plurality of electronic circuit boards to the housing, thereby preventing circuit board damage.

Abstract: The present invention relates to mounting an electric connector (20) onto a printed circuit board, particularly to a printed circuit board comprised of ceramic material, for instance either an LTCC substrate or an HTCC substrate. The problem addressed is one where the connector (20) tends to loosen from the substrate when the temperature varies. This is due to the difference in the coefficients of thermal expansion of the printed circuit board and the connector (20). The problem is solved with the aid of a so-called shim (10) that has a coefficient of thermal expansion between that of the printed circuit board and that of the connector. One side of the shim (10) is soldered onto the connector and the other side of the shim is soldered onto the printed circuit board. The connector (20) is therewith fastened to the printed circuit board. Shear stresses acting between the connector (20) and the printed circuit board are distributed through said board through the medium of two joints instead of one.

Abstract: A heat absorber including a container providing an internal cavity, phase change material, such as microencapsulated phase change material, residing in the cavity, the container including at least one wall of thermally conductive material in thermal contact with the phase change material, such one wall provided with a plurality of spaced apart and inwardly extending members of thermally conductive material extending inwardly into the cavity and into and in thermal engagement with the phase change material, upon heat being transferred to the phase change material the phase change material changes phase and absorbs the heat. Such heat absorber in combination with electrical apparatus which produces heat when operating.

Abstract: A rack for supporting a plurality of burn-in boards and thermal boards which carry heat sinks to be associated with circuit chips mounted on the burn-in boards, has a first side frames that support the burn-in boards in a fixed position. Movable frames adjacent each of the side frame have a plurality of supports for thermal boards which include heat sinks, temperature sensors and other components. The movable frames are slidably mountable in a direction perpendicular to the burn-in board. Cams control the movement of the movable frames so that the thermal boards and components carried thereby can be moved from a position clearing the burn-in boards to permit insertion of the burn-in boards, onto the rack to a position wherein the components contact chips on the burn-in boards for good thermal control of the circuits on the burn-in boards.

Abstract: Electrical equipment such as a personal computer includes a plurality of internal components which require different voltages including low voltages of about five volts for operation. The different voltages are supplied by an internal power supply, with a voltage regulator, which is itself connected to an appropriately transformed high voltage supply typically from an in-the-wall source. Peripherals such as a FAX/modem, CD ROM, or tape recorder are powered by cables plugged into mating sockets in the face of the computer housing. The sockets, in turn, are connected to the appropriate outputs of the internal power supply to obtain appropriate voltage power directly from the host computer in the absence of a transformed connection to a house supply. A switch may be provided at each of the sockets to vary the voltage there. The power supply may be mounted on the computer housing or it may be located away from the housing.

Abstract: A mounting plate for two printed circuit boards. The mounting plate formed of a layer of thermally conductive material with securing mechanisms fixing one of the two printed circuit boards in a spaced away relationship with each surface of the mounting plate.

Abstract: A heat dissipating structure for an information terminal device such as an electronic cash register includes a substrate mount chassis having a heat dissipating portion. The substrate mount chassis has disposed in a chamber thereof a substrate. The substrate is arranged in the chamber of the substrate mount chassis and has disposed thereon an electronic component such as a high-speed CPU which generates a relatively large amount of heat. A heat conducting member such as a silicone rubber is disposed between the CPU and the heat dissipating portion in contact therewith for dissipating the heat generated by the CPU into the surrounding atmosphere.

Abstract: An electronic device having two or more printed circuit boards with integrated heat-dissipating mechanism without a fan. A heat-generating circuit component is placed on a daughter board separated from a motherboard. An electrically insulating thermal conductor is placed between the daughter board and the motherboard for heat transfer.

Abstract: In a box-shaped molded resin body having side walls and a flat plate part in which a heat discharging plate made of a metal is embedded, a part of the heat discharging plate is exposed from a through hole in the flat plate part and the side walls, and an electronic part mounted on a printed board assembled in the molded resin body is come into contact with the heat discharging plate exposed from the through hole, thereby discharging the heat generated from the electronic part by the heat discharging plate.

Abstract: Power module for a current converter, particularly a frequency converter, having at least one printed circuit board equipped at least with power components and having a heat-conducting connection with a wall of the current converter housing serving as heat sink, the power module having electrically conducting connection parts arranged vertically to the housing wall, which parts laterally confine a chamber and are long enough to enable accommodation of large, passive electrical components, such as capacitors, in the chamber. To ensure a space saving embodiment of the power module, though maintaining a sufficient heat dissipation and simplifying the electrical connection between the power module and the remaining components of the converter, it is provided that the only electrical connection between the power module and other electrical components of the converter as well as to the supply mains and to a load supplied via the converter is established via the connection parts.

Abstract: A cabinet having a plurality of compartments adapted to have disposed in a corresponding one thereof one of a plurality of processing unit modules. Each one of the modules includes a case. The case has a motherboard mounting surface adapted to have mounted thereto one of a plurality of differently configured motherboards, each one of the differently configured motherboards having a different arrangement of a CPU, main memory and I/O adapted cards. The case also has a bulkhead mounting surface adapted to have mounted thereto one of a plurality of differently configured I/O bulkheads, each one of the differently configured bulkheads being configured for a corresponding one of the differently configured motherboards. The case has a fan mounting surface adapted to have mounted thereto one of a plurality of differently configured fan assemblies, each one of the differently configured fan assemblies being configured for a corresponding one of the differently configured motherboards.

Abstract: The invention concerns a power electronic module comprising two individual modules (1) each comprising a power electronic component (5) having a contact face (6) mounted on a metallic face (7) of a substrate (8), power connections (11, 13, 20) a metallic heat exchanger (2) mounted on the other face (12) of the substrate (8).In accordance with the invention the two individual modules (1) are face to face, the power electronic component (5) of one individual module (1) facing the power electronic component (5) of the other individual module (1), and separated from each other by at least one spacer (3) comprising control leads (14) for controlling the individual modules (1) and power leads (13) for transmitting power to the individual modules (1) or between individual modules (1).

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.

Abstract: The present invention aims to radiate heat efficiently from the inside of an equipment housing, with a simple structure. First and second through air passageways are formed at the sides of first to third equipment housings and the second through air passageway communicates with a recess air passageway to supply air from the first through air passageway into the first to third equipment housings, discharge the exhaust from the first equipment housing directly out of the equipment through a second window portion, and lead the exhaust from the second and third equipment housings into the second through air passageway through the second window portion and the recess air passageway and discharge it out of the equipment.

Abstract: In a control device for a motor vehicle having a cooling plate between an upper component of the housing and a lower component of the housing wherein a first printed circuit board which is fitted with an electrical circuit is mounted on the cooling plate. Arranged underneath the cooling plate is a plug component on the lower component of the housing. Plug pins of the plug component are fitted into a second printed circuit board which is also arranged underneath the cooling plate. The plug pins are electrically connected to the first printed circuit board via conductor tracks of the second printed circuit board and connecting elements between the second printed circuit board and the first printed circuit board.

Abstract: A daughter-board cover of a system board device which daughter-board cover covers daughter boards can be removed by a simple operation in a short time. The system board device is adapted to be subjected to forced-air cooling. At least one electronic part generating heat is mounted on a motherboard. A plurality of daughter boards are removably mounted on the motherboard. The daughter boards are mounted so as to be perpendicular to the motherboard. A ventilation cover is attached to the motherboard so as to form an air passage therebetween so that the electronic part and the daughter boards are accommodated in the air passage. The ventilation cover includes the daughter-board cover covering the daughter boards. The daughter-board cover is displaceable so that each of the daughter boards are accessible.

Abstract: A three-dimensional multi-chip module is formed as a stack of two-dimensional multi-chip modules comprising substrates which have electrically signal paths connecting integrated circuit chips and has vertical interconnections of the signal paths, provided by interconnection or via chips. The individual chips or other inner components on a substrate are in mechanical contact with a surface of an adjacent substrate and constitute the distance device maintaining the substrates spaced from each other. Thus heat developed in components can be conducted essentially perpendicularly to the substrates. Thermally conducting chips can be used for improving the conducting of heat. Cooling devices are located only at the top and bottom surfaces of the stack.

Abstract: An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.

Abstract: A system for securing an electronic component, such as a CPU, includes a support extending substantially in a plane and a fastener coupled to the support. The support may be a heat sink secured to a component for dissipating heat generated during operation of the component. The fastener extends through extensions or fins of the heat sink, generally parallel to the plane of the heat sink and component package. A biasing spring urges the fastener toward a disengaged position. A biased retainer maintains the biasing spring and fastener within the assembly. The component is initially engaged in a receiving socket for installation. The fastener is then engaged in the mechanical support to draw the component into full engagement. A reference surface on the securement assembly contacts the mechanical support to limit engagement of the component. The fastener may include a torque-limiting assembly for limiting the torque applied to the mechanical support upon full engagement of the component.

Abstract: A device which houses the active and passive nodal point modules of telecommunication installations in the ground comprises a metal container with a removable cover and a removable support for the modules housed in the container. The modules are attached in a heat-conductive manner to the internal surface of the support. The support is made of heat-conductive material and its external surface has a number of cooling fins. Through the cooling fins, the support makes heat-conductive contact with the internal surface of the container.

Abstract: A clamping device comprising: a mounting member having at least one slot, the slot having a flat reference surface and an opposed camming surface spaced therefrom; a clamp located in the at least one slot, the clamp having a flat surface parallel to but spaced from the flat surface of the slot for receiving an edge of a flat plate and having a camming surface which contacts the camming surface of the slot; an off-center spring located between the clamp and the member; and a tensioned screw for mounting the clamp to the mounting member.

Abstract: A heat sink board structure includes a thermal/structural base having a composite core layer of a mass of graphitized carbon fibers infiltrated with a first resin material matrix. The graphitized carbon fibers of the composite core are substantially unidirectional and oriented parallel to the face of the composite core layer. Transverse reinforcement layers are bonded to the oppositely disposed faces of the composite core layer. Each transverse reinforcement layer is formed of carbon fibers embedded in a resin material matrix, with the carbon fibers lying substantially in a plane of the transverse reinforcement layer and perpendicular to the carbon fibers in the composite layer. Heat generating and heat dissipating components are bonded to the thermal/structural base. Metallic contact strips are bonded to the surfaces of the transverse reinforcement layers.

Abstract: A processor book includes a processor card having front and rear surfaces, and at least one high heat component attached to the front surface. Two separate flows of cooling gas are conveyed to the processor card from two separate directions. A cooling duct is provided adjacent to the front surface of the processor card, and conveys one of the flows of cooling gas. The cooling duct has an outlet in a region of the high heat component.

Abstract: An electronic assembly that includes a plurality of electronic substrates that are plugged into a polygonal shaped motherboard. The polygonal shape of the motherboard minimizes the electrical path between electronic substrates while providing enough space between adjacent substrates to allow a fluid to sufficiently remove heat generated by integrated circuits of the substrates.

Abstract: Circuit panel rack apparatus includes a hanging rack having a slot with a sloping surface. A roller is movable along the sloping surface. The roller moves downwardly along the sloping surface to hold a circuit panel in the rack, and the roller moves upwardly along the sloping surface to release the panel. The upward movement of the roller along the sloping surface is caused by the upward movement of a stem secured to the roller. The roller is biased downwardly along the sloping surface and against the circuit panel by a compression spring disposed about the stem.

Abstract: An outdoor electronics enclosure which provides both weather protection and heat dissipation. The plastic enclosure is divided into two compartments. The first compartment has apertures in its exterior walls and contains an inner metal heat radiating box containing active electronic components. The second compartment is weathertight and contains passive components.

Abstract: An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a first substrate and a second substrate. A first electronic device is encapsulated within an opening of the first substrate, and a second electronic device is encapsulated within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration.

Abstract: This invention describes a triangular heat sink and circuit enclosure for high power dissipation electronic circuits. The heat sink uses a number of cooling fins to provide cooling of the circuitry and equipment contained in the circuit enclosure and can handle power dissipation levels of up to 15 kilowatts. The circuit enclosure uses air moving devices and triangular heat sinks to provide both conduction cooling and heat transfer to a stream of air. The cooling fins of the heat sink are sealed away from the electronic components when the circuit enclosure is assembled.

Abstract: A cabinet for electronic equipment comprises an array of printed circuit boards stacked in horizontal planes. The circuit boards are interconnected by a vertically extending rear mother board, and the cabinet includes a plenum chamber defined by a partition having a plurality of vertically arrayed ventilation openings through which air can be drawn from the lateral spaces between the circuit boards and exhausted from the rear of the cabinet by a blower.

Abstract: Apparatus for housing circuit cards that comprises a cylindrical housing having an internal wall having a single diameter. First and second cylindrical heat sinks are provided that each comprise a sloped outer surface. The heat sinks are disposed such that the sloped outer surfaces face each other. First and second circuit cards are secured to distal edges of respective heat sinks, or pairs of circuit cards are secured to both edges of respective heat sinks. Each circuit card comprises at least one internal interface connector that is designed to mate with an internal interface connector of an adjacent circuit card. A cylindrical card lock is provided that has an outer surface that is designed to contact the internal wall of the housing and an inner surface that has a V-shaped cross section having oppositely sloped surfaces. The respective sloped surfaces of the card lock are designed to mate with the sloped outer surfaces of the respective heat sinks.

Abstract: A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween. A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally. The circuit board can be formed to be compact. In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner. It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer. Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

Abstract: A device and method for interconnection packages in a stack. Each package encapsulates, for example a semiconductor chip containing an integrated circuit, which for example may be a memory. The packages (2) which have connecting pins (21) are mounted on support grid (4) which preferably act as a heat shunt, and are stacked and linked to each other with a resin coating (5). A stack (3) is cut out so that the pins on the packages and one edge of the grids are flush with faces (31, 32) of the stack (3). Connections between the packages themselves, and between the packages and stack connecting pads, are made on the faces of the stack. The connecting pads are where necessary fitted with connecting pins.

Abstract: In the present invention, a mother board is fixed perpendicularly to the center of a support table of a system. On one side of the mother board, any number of floppy disk drives and hard disk drives are mounted. On the other side of the mother board, a power source and any number of function modules are mounted. The function modules include a CPU, a memory, an input/output controller, a communication controller, etc. Each of the function modules and units is stored in its own case. The function modules are airtight. Thus, since each unit and function module is protected in its own case, large case for covering the whole system is not required. Therefore, the units and function modules are well ventilated and have a good heat radiation effect. Each case also acts as a heat radiator and eliminates the necessity of a forcible cooling unit, and the fault rate is thus reduced.

Abstract: A PCMCIA card manufacturing process is disclosed, including the steps of (1) providing a top cover and a bottom cover made of a metal, preferably stainless steel, each of the top cover and bottom cover being provided with a plurality of hooks along two opposite lateral edges, (2) placing the top cover and bottom cover respectively into a first mold and a second mode for injection molding a first frame member on the top cover with the hooks of the top cover embedded in the first frame member and a second frame member on the bottom cover with the hooks of the bottom cover embedded in the second frame member, each of the first and second frame member being provided with at least one notch that match each other to define at least a connector slot, (3) disposing a circuit board between the first and second frame members with the connector thereof received within the connector slot, and (4) jointing the first and second members together, preferably by ultra sonic welding.

Abstract: An apparatus and method for using a circuit board as a heat sink for another circuit board which effectively draws heat away from the other circuit board while the one circuit board is actively producing its own heat. Since the one circuit board is much larger than the other circuit board, the thermal mass of the one circuit board is great enough to absorb and spread the heat generated by both boards in the presence of forced air cooling. The method includes the steps of mounting a thermal conductivity layer on a predetermined area on the one circuit board and mounting the other circuit board over the area on the one circuit board such that components on an underside of the other circuit board firmly contact the thermal conductivity layer so as to conduct heat from the components through the one circuit board.

Abstract: A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally, The circuit board can be formed to be compact, In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner, It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer, Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

Abstract: An optical network unit for field installation adjacent to an optical fiber transmission line, for separating multiplexed video and telephony signals for delivery to subscribers residences as electrical signals over metallic drop cables, has a hollow housing formed of heat-conductive material. The unit has a sealing front cover and rear cover, a cable entrance port for cable connections, and a backplane assembly mounted in the housing which incorporates optical-to-electrical signal conversion components and connectors for electrical signals. Slots are formed in the interior surfaces of the housing for positioning a plurality of printed circuit board cards for sliding installation into electrical contact with the backplane assembly.

Abstract: A high-density electronics package (10) that houses a plurality of circuit cards (21,22,25,26), heat sinks (23,27) and circuit interconnections (33) in a single housing (12). The electronics package (10) uses conical shaped interfaces for locating and locking components, which greatly enhances the serviceability, thermal management and strength of the electronics package (10). Assembly is accomplished by using a selected conical angle on a first heat sink (23) that mates with a matching conical surface (13) on the housing (12). A second heat sink (27) has a conical angle (located in the opposite direction of the conical angle of the first heat sink) that mates with an identical angle on an expandable wedge ring (31) used for positioning purposes.

Abstract: A molded connector housing (10) has respective pairs of integrally-molded latching fingers (18,20,21) for quick assembly to respective mother and daughter boards (11,12). A locking plunger (25) is received between the pairs of latching fingers (18,20,21) to secure the assembly. The plunger (25) may also be used with an axially-compressible fastener or grommet (43). In lieu of the latching fingers, an integrally-molded fastener (50) cooperates with a conical nut (52) having circumferentially-spaced ears (53) slidably received in slots (51) in the fastener.