Abstract: An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the CPU, a fan attached to the heat sink, and an air guide member attached to the second electronic element. The air guide member includes a guiding portion to guide air from the fan to the second electronic element.

Abstract: An air baffle with an integrated expansion card attachment is disposed in a computer for receiving an expansion card having a handle attached thereto. The air baffle includes a first wall including a first guide and a second guide projecting from a side surface of the first wall. The first guide a second guide form a transverse space therebetween. The air baffle includes a second wall parallel to the first wall disposed a distance from the first wall approximately equal to a width of the expansion card. The second wall includes a snap retainer having a projected portion thereof. The transverse space formed between the first and second guides of the first wall has a size approximately equal to a thickness of the expansion card such that a first end of the expansion card is firmly held by the first guide and the second guide when the expansion card is inserted into the transverse space.

Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.

Abstract: The invention relates to a heat dissipation device with a bracket for dissipating heat of a heating element of an expansion card. The heat dissipation device also includes an auxiliary card, a heat dissipating element. The bracket includes a securing element configured for securing the heat dissipating element thereto, a locking element, and a connecting element connecting the securing element to the locking element. The securing element clamps the expansion card, and the locking element is slidably mounted to the auxiliary card, to align the heat dissipating element with the heating element of the expansion card.

Abstract: An electronic apparatus is provided with a housing, a circuit board section and a heat transfer member. The circuit board section is accommodated in the housing. The circuit board section includes a heat generating component, a heat receiving region thermally connected to the heat generating component and a heat radiating region having a lower temperature than the heat receiving region while the apparatus is operating. The heat transfer member includes a first end portion attached in the heat receiving region and a second end portion attached in the heat radiating region.

Abstract: A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that generate low thermal loads. A heat sink is in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the first and second motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the first and second motherboards.

Abstract: A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion.

Abstract: A multifunctional apparatus includes a first circuit board which is installed on a low surface of a main body, receives a current from an external power source and supplies the current to other circuit boards and devices; a second circuit board which is installed on a surface of the main body and includes a controller to control the other circuit boards and devices; and a third circuit board which is installed on an upper surface of the main body and supplies the current or transfers control signals to a scanning unit.

Abstract: According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blade attached to each of the cold blades.

Abstract: A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.

Abstract: An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.

Abstract: A multilayer, thermally-stabilized substrate, including: a thermally-conductive core structure, including a central section located horizontally between two edge sections; a top multilayer circuit board connected to the top surface of the central portion of the core structure; and a bottom multilayer circuit board connected to the bottom surface of the central portion of the core structure. The core structure has a core thermal conductance and a effective core horizontal thermal expansion coefficient. The top and bottom multilayer circuit boards each include at least one dielectric layer and at least one electrically-conductive layer, and each have a circuit board thermal conductance that is less than the core thermal conductance of the core structure. The electrically-conductive layers of the top and the bottom circuit boards each have a conductive layer horizontal thermal expansion coefficient that is less than or equal to the effective core horizontal thermal expansion coefficient of the core structure.

Abstract: Embodiments of methods, apparatuses, devices, and/or systems for power delivery for electronic assemblies are disclosed.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

Abstract: An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a heat transfer body comprising: a first heat conducting side; a second heat conducting side intersecting with the first heat conducting side to form a corner; and a contact face oriented at an acute angle relative the first and second side. The apparatus further comprises at least one wedge having a slip face oriented at an angle configured to interface with the contact face; and at least one fastener configured to apply a force to the at least one wedge. The wedge is configured to translate the force applied by the fastener into a first component in a direction normal to the first heat conducting side and a second component in a direction normal to the second heat conducting side.

Abstract: A method and apparatus for aligning a connector between a printed wiring board and a mezzanine board includes mounting the printed wiring board to a frame, locating a cover with respect to the frame by way of a first pin and a second pin, fastening the cover to the frame, locating the mezzanine board with respect to the cover by way of a third pin and a fourth pin, and fastening the mezzanine board to the cover.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.

Abstract: An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.

Abstract: I an LSI package, an interface module includes with an interposer having a signal processing LSI mounted thereon and has electric connection terminals for connection to a mounting board and a transmission line for transmitting a high-speed signal to an external wiring. An electric connection terminal is formed in each of the interposer and the interface module for electrically connecting the interposer and the interface module to each other by the mechanical contact, and a fixing holder is mounted for allowing the electric connection terminals to hold the electric connection between the interposer and the interface module. Thus, it is possible to suppress the increase in the manufacturing cost that is caused by the complex construction of the assembly.

Abstract: A circuit board assembly including: a circuit board; a plurality of circuit devices disposed on the circuit board; a plurality of heat sinks installed to contact with the circuit devices; and a support member connecting the adjacent heat sinks. The neighboring heat sinks have two facing surfaces, and the support member contacts at least a corner of one of the facing surfaces and at least a corner of the other one of the facing surfaces, so that the bending of the circuit board can be prevented.

Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

Abstract: A two-part, high-density card retention system includes a tapered channel in a chassis or housing and a mating wedge that runs the length of the housing, with the lead wedge being cammed towards a flat channel surface by drawing the wedge inwardly and locating the edge of the board to be mounted between the wedge and the opposing straight channel wall. The mounting provides continuous high-pressure contact between the board and the straight channel wall for maximal thermal transfer and robust anti-vibration and anti-shock mounting of the board to the chassis. Because no additional assemblies are mounted to the edge of the board, the boards may be spaced apart by a fine pitch, thus to minimize the size of the module into which the boards are mounted.

Abstract: A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.

Abstract: The object of the invention is a power inverter, the bottom of the housing (1) of the power inverter being configured to be stepped, cooling bodies (10, 11) being disposed on the exterior face of the stepped bottom, at least two printed circuit boards (6, 8) that overlap each other and communicate with the respective one of the cooling bodies (10, 11) through semiconductor components being provided.

Abstract: A pressure-contact power semiconductor module is arranged on a heat sink. The power semiconductor module is used with at least one substrate provided with conductor tracks and power semiconductor components. The module has a mounting body, on the underside of which the at least one substrate is arranged, and which is formed with cutouts. The module also includes a load connection element which is provided with contact feet that project away from strip sections and make pressure contact with the conductor tracks. The power semiconductor module additionally has a dimensionally stable cover, which covers the mounting body on all sides and is connected to the mounting body by means of snap-action latching connections. At least one pad element is restrained between the cover and the strip sections of the load connection elements.

Abstract: A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even when a dual central processing unit (CPU) is constituted by extension of CPU. A main board has an opening. A CPU is mounted on a main surface of the main board. A sub board is attached on the main surface of the main board to permit the opening to be covered. An extension CPU is mounted on the sub board through the opening from a rear face side of the main board. A first heat sink is mounted in the main surface side of the main board to permit the CPU and the opening to be covered. A second heat sink is mounted in the rear face side of the main board to permit the extension CPU and the opening to be covered.

Abstract: A housing structure of an acoustic controller, in which a lower case of the controller has an increased rigidity and improved moldability. The lower case is integrally formed by a resin and has a bottom surface thereof disposed to face a tabletop surface when the controller is in a stationarily placed thereon. The bottom surface of the lower case is formed to have a concave-forming portion that defines a concave space communicating with the outside of the controller on the left and right sides thereof and which is upward convex as viewed when the controller is stationarily placed, thus increasing the rigidity of the lower case. Bosses and vertical ribs formed to project upward from a horizontal part of the concave-forming portion of the lower case each have a reduced height, thereby improving the moldability of the lower case.

Abstract: A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured through a clamping mechanism that may be a screw type or cam lever action by clamping down on the exposed card edges, thus allowing thermal transfer to begin on all cards. The apparatus may be used with any enclosure requiring thermal transfer from PCBs to the enclosure, including cages and enclosures that may or may not use forced airflow (fans or blowers) for heat dissipation.

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.

Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.

Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.

Abstract: An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board mounted with power electronic components which has a substrate that not only has electrically insulating properties but also good thermal conductivity, a cooling element in thermally conductive contact with the substrate of the second circuit board and a motor housing connected to the cooling element. Since the first circuit board can be constructed in a conventional manner and satisfactory cooling of the power electronic components arranged on the second circuit board has been provided for by the provision of the second circuit board that conducts heat to the cooling element, a compact, cost-saving overall design and construction has been achieved which is reliable when the electric motor is in operation.

Abstract: A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electronics board is mounted to one side of the frame, and a power board is mounted to an opposite side of the frame. The electronics board carries a plurality of electronic components, and the power board carries a plurality of replaceable power elements. Each power element is a fuse, relay and/or circuit breaker. A housing encloses the electronics board and the power board. The housing includes an access cover to the power board.

Abstract: A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices on one surface of the first circuit board and the electronic devices on one surface of the second circuit board. The circuit boards are supported by fixing elements of the cooling body.

Abstract: An air cooling apparatus for an aircraft includes a cabinet that is configured to house a plurality of modules in a plurality of module accepting regions, respectively, wherein the cabinet has a backplane region. The apparatus further includes a plurality of air flow passages provided between adjacent ones of the respective module accepting regions of the cabinet. The apparatus also includes a primary air flow unit for providing primary air flow from the backplane region and through the plurality of air flow passages, to thereby cool the plurality of modules housed within the cabinet.

Abstract: A heat dissipation apparatus includes a heat transfer base that is operable to couple to a heat producing component that is operable to couple to a first component connector and be located in a first component slot defined by the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member extends from the heat transfer base such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boards 3 are mounted on a control section 1D of a disc array device 1. The circuit component 4A for realizing the NAS function, liable to become hot, is provided with a heat sink 5. The aperture of the main air inlet section (Wb) is covered with a top plate 8. Airflow guidance sections (Wa, Wc) are respectively provided on both sides of the main air inlet section. Since the fin pitch of the airflow guidance sections is set narrow, the air inflow resistance (airflow resistance) of these is higher than that of the main air inlet section. Due to this difference in airflow resistance, the air in the vicinity of the airflow guidance sections is guided into the main air inlet section. The top plate 8 prevents outflow of air that has flowed into the main air inlet section to outside the heat sink 5.

Abstract: A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.

Abstract: A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

Abstract: A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the memory chips and for communicating with a system that is external to the memory module, the buffer chip being arranged in a second region of the printed circuit board and being contact-connected by the printed circuit board; wherein the first and second regions of the printed circuit board are essentially thermally decoupled from one another.

Abstract: A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.