Abstract: A function module with a built-in heat dissipation fin. The function module includes a first circuit board, a second circuit board, and a heat dissipation fin. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The heat dissipation fin is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract: A computer system is provided that includes a casing and a power supplying unit combined to the casing, a pair of guiding projections protruding from opposite sides of the power supplying unit, a pair of guiding members accommodating the pair of guiding projections and guiding the power supplying unit from a released position to a combining position, a stopper provided in at least one of the two guiding members and preventing the power supplying unit from separating beyond the released position, and a supporter supporting the power supplying unit, together with the stopper, when the power supplying unit is opened by rotating through a predetermined angle. With this configuration, the computer system provides a combining structure for a power supplying unit, in which hardware components can be easily cabled, exchanged, and repaired.

Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.

Abstract: A system and method for detecting blank modules includes an information handling system including at least one computing component, a modular chassis, a management module, and one or more sensors. The modular chassis includes one or more slots where each slot is operable to receive either the computing module or a blank module. The computing module interfaces with the management module whereby the management module is operable to detect the presence of one or more of the computing modules in one or more of the slots. The sensors are associated with each of the slots and detect if one or more of the blank modules are installed in one or more of the slots. In addition, the sensors provide an indication to a user when one or more of the slots are empty and do contain neither a computing module or a blank module.

Abstract: A repeater case for high density subscriber lines includes a repeater base and a repeater housing forming a sealed enclosure and having interior walls. A plurality of module slots receive HDSL-4 circuit board modules. A heat conductive material in the housing contacts HDSL-4 modules in the slots and the housing to form a heat escape path to ambient. The HDSL-4 modules are cooled through thermal conductivity with thermally conductive contact with the interior wall of the repeater housing. The heat conductive material is not required for structural support of the modules or their electrical functioning.

Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.

Abstract: A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

Abstract: A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.

Abstract: A heat transporting electrical assemblage retained in a retaining unit transports heat between a heat sink and a thermal transport element in fluid communications with the heat sink. The thermal transport element is snugly arranged in a thermal gap between a coplanar thermal wall formed by a wall of both the heat sink and the electrical assemblage. Thermal transport element makes at least partial contact with a portion of the coplanar thermal wall and with a portion of the retaining unit thereby transporting heat from the hotter thermal wall to the cooler frame of the retaining unit.

Abstract: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

Abstract: A computer system employing redundant cooling fans. A system includes a first and a second array of circuit boards and a first and a second cooling fan. The two arrays of circuit boards are positioned such that the first array of circuit boards is substantially perpendicular to the second array of circuit boards. The first fan is positioned close to the first array of circuit boards and the second fan is positioned close to the second array of circuit boards. The first fan is positioned to force intake air across the first and the second arrays of circuit boards and the second fan is positioned to exhaust the forced intake air after it passes over the second array of circuit boards. Each of the fans may be hot swappable.

Abstract: One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the heat from the first component is transferred to a coolant through the second component, and the second component has a function in the computer system associated with an operation of the system other than transferring heat.

Abstract: A semiconductor device is configured of a first semiconductor chip mounted on a substrate, a plate member arranged on the first semiconductor chip, and a second semiconductor chip arranged on the plate member. Bonding wires electrically connect the pads of the first semiconductor chip and the pads of the second semiconductor chip to the pads of the substrate, and a sealing resin seals the first semiconductor chip and the second semiconductor chip. A first portion of the plate member is displaced away from the ends of the first and second semiconductor chips, and a second portion of the plate member extending perpendicular to the first portion, projects outward from the first and second semiconductor chips to be exposed to the outside.

Abstract: In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

Abstract: A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially protrude from the slots in the thermal plane. Slot-engaging portions of the feet freely float within the slots, allowing repositioning of the feet in two dimensions relative to the slots. Resilient devices such as springs urge outer portions of the feet into contact with the airframe. Locking mechanisms may prevent extension of the feet until after the heat-conducting device is installed in the missile. The feet self-align into contact with the airframe, automatically adjusting to compensate for misalignment and/or warping.

Abstract: A circuit card module to be received in a card chassis includes a host card assembly and a mezzanine card assembly carried in spaced relation by the host card assembly. The host card assembly includes a host card heat sink having an end to connect to the card chassis to conduct heat thereto, and a host circuit card mounted on the host card heat sink. The mezzanine card assembly includes a mezzanine card heat sink, and a mezzanine circuit card mounted on the mezzanine card heat sink. The mezzanine card heat sink has an end to connect to the card chassis to conduct heat thereto in parallel with heat conducted from the host card heat sink to the card chassis. The mezzanine card heat sink may comprise a body adjacent the mezzanine circuit card, and a flexible strap extending outwardly therefrom to connect to the card chassis.

Abstract: There is provided an electronic apparatus that is free of the problems with the prior art and is capable of achieving higher efficiency of cooling the interior of the casing without sacrificing cost reduction and designing compact in size. A casing houses a plurality of circuit boards having electronic parts mounted thereon and at least one high load part that generates heat. The casing has exhaust ports formed therein for heat radiation and exhaust ports for heat radiation. The plurality of circuit boards are comprised of a first circuit board and a second circuit board. The first circuit board is disposed to extend substantially horizontally, and the second circuit board is disposed to extend substantially vertically with a horizontal gap provided between the first circuit board and the second circuit board. The at least one high load part is arranged below the horizontal gap, and the exhaust ports are arranged above the horizontal gap.

Abstract: To provide a computer device wherein liquid penetration into a ventilation hole from its periphery can be prevented or reduced without sacrificing design and without limitation of the size and operation. Coating films 7a and 7b in frame form are applied on a periphery of a ventilation hole 6. A wet-characteristic of the coating film 7a and 7b is different from a wet-characteristic of material composing a housing 3. For example, when an angle of contact of coating films 7a and 7b for water is larger than an angle of contact of material composing the housing 3, if water is spilled on the outside of the coating film 7b the coating film 7b prevents the water flow into the ventilation hole 6.

Abstract: Method and apparatus for fluid-based cooling of heat-generating devices are disclosed. A heat-generating device is mounted on a carrier. The heat-generating device is spatially displaced from the surface of the carrier, thereby forming a channel. The heat-generating device and the carrier are enclosed in an enclosure having an inlet and an outlet. A substantially electrically non-conductive cooling fluid for introduction into the enclosure and into the channel and expulsion from the enclosure and for extracting heat from and thereby cooling the heat-generating device and the carrier.

Abstract: One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the from the first component is transferred to a coolant through the second component, and the second component has a function in the computer system associated with an operation of the system other than transferring heat.

Abstract: A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat spreader of generally rectangular shape having a second edge portion extending upwardly; a cavity formed in-between the upper heat spreader and the lower heat spreader by engaging the first edge portion and the second edge portion together adapted for receiving an electronic device.

Abstract: Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Abstract: A dielectric coating (3), a solid electrolytic layer (4) and a collector layer (5) are provided to one face of a porous valve metal sheet (1). An insulating section (7) covers overall this metal sheet (1) including the layers (3, 4, 5) discussed above. Conductive bodies (101, 111), which are coupled with a first connecting terminal (2) and a second connecting terminal (6) respectively, are surfaced on at least one face of the insulating section (7). Connecting bumps (12) are formed on these conductive bodies (101, 111), so that ICs (17) and other parts are coupled with these bumps (12). This structure realizes a thin composite electronic component excellent in high-frequency response.

Abstract: A method of transporting heat from a heat dissipating electrical assemblage having a circuit board insertable in a card cage or retaining unit and at least one heat generating component mounted thereon. A heat sink is arranged in contact with the electrical assemblage and forms a coplanar wall spaced apart from the interior wall of the card cage. A thermal transport element is arranged in the thermal gap formed between the coplanar wall and the interior wall. The thermal transport element is at least in partial contact with the coplanar wall and interior wall thereby transporting heat from the hotter electrical assemblage to the cooler interior wall of the card cage.

Abstract: A portable data storage configuration has a card base and a display device, the display device being fixed to the card base. The display device is only partially connected to the card base by the fixed connection. This mounting technique results in that almost no lateral or shear forces act on the display device.

Abstract: In a substrate-stacking structure, a substrate, having heat-generating parts mounted thereon, and a control substrate, having control parts mounted thereon, are held spaced a predetermined distance from each other. The substrate and the control substrate are held spaced the predetermined distance from each other through a holding plate, and a heat shielding plate is interposed between these substrates, and an air layer is formed between the heat shielding plate and the control substrate.

Abstract: The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are arranged in a star-shaped manner and are arranged radially with their inner contact strips in slots of a central plug connector. The module unit has a substantially cylindrical housing, from which an outer contact strip of the main module protrudes.

Abstract: Cold plates, permanently plumbed into card cage, cool circuit boards that are equipped with personality plates to improve thermal transfer. The personality plates have a contoured surface that is the complement of the circuit board's landscape. The personality plate made of heat transmissive material therefore contacts each heat generating component, regardless of its height. The opposite surface of the personality plate is flat, and, when installed with the circuit board in the card cage, lies parallel to the surfaces of the cold plate. A card ejector applies force on the entire board bringing the flat surfaces into intimate contact for excellent heat transfer. The assembly of circuit board and personality plates is augmented by interposing thermal interface material at each contact surface and fastening this assembly into a unit.

Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.

Abstract: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

Abstract: In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

Abstract: In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: A telecommunications equipment enclosure (10) that more effectively dissipates heat from electronic cards without transferring the heat to adjacent cards and without transferring the heat to air within an enclosed chamber surrounding the cards. The enclosure (10) includes a floor (12) and a plurality of card-receiving sleeves (14) attached to the floor (12). Each of the sleeves (14) defines a separate enclosed cell or holder that is configured for receiving and enclosing a single electronic card. The sleeves (14) are spaced apart to define a plurality of open air channels therebetween for convecting heat away from the sleeves (14) and the cards received therein while preventing heat from transferring from sleeve to sleeve.

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract: A protective pot or container to protect electronic components disposed therein and to dissipate heat generated by operation of the electronic components comprising a cover assembly, a housing assembly and a base assembly to cooperatively form at least one electronic component compartment including a top opening and a bottom opening to operatively house the electronic components therein wherein the cover assembly comprises a lid removably attached to the housing assembly to selectively close the top opening, the housing assembly comprises an outer protective housing frame having a inner heat conductive sleeve partially disposed therein to absorb heat from the electronic components and at least one external heat sink in heat transfer relationship with the inner heat conductive sleeve to receive heat therefrom and to dissipate the heat into the surrounding environs and the base assembly comprising a base member and to selectively close the bottom opening.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: A thermal connector to transfer heat from one PCB to another, without interfering with the convenient removal and replacement of the PCBs and without increasing the force required to connect or deconnect the PCBs. The thermal connector comprises a first part, fixedly attached to one PCB and thermally coupled to the end portion of a first heat pipe (thermally coupled to the device to be cooled) and a second movable part, adapted to firmly grasp the end portion of the first pipe and a second heat pipe thermally connected to a cooling system.

Abstract: Disclosed are systems and methods which utilize mounting members adapted to provide consistent compressive pressure with respect to strata of a laminated structure, such as the heat source, TEC, and heat absorbing layers of a TEC stack-up, throughout a range of operating temperatures. Preferably, mounting members of the present invention are adapted to provide uniform compressive pressure across a surface area, such as the heat transferring surfaces of a TEC, to thereby provide a sound structure which is relatively resistant to dynamic forces. Preferred embodiment mounting members are adapted to minimize the transfer of thermal energy therethrough, such as to substantially avoid a heat leak in a TEC stack-up configuration.

Abstract: A heat sink is provided that has a leg and a member coupled substantially perpendicular to the leg at a first end of the leg. The leg is surface mountable to a first surface of a printed circuit board at a second end of the leg to receive heat from an electronic device on a second surface of the printed circuit board by a thermally conductive via through the printed circuit board.

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract: A method and system for cooling a card shelf includes a backplane, a plurality of side support members disposed proximate the backplane, a top support member disposed proximate the backplane, and a bottom support member disposed opposite the top support member. The plurality of side support members, the top support member, and the bottom support member form a shelf area configured to receive electronic cards. At least one of the electronic cards includes a cover plate having an inlet operable to receive an airflow to dissipate thermal energy generated by the electronic card. The system may also include a filter to filter the airflow entering the inlet and a diffuser to diffuse the airflow about the electronic card in a desired pattern.

Abstract: The electronic control unit controls operation of actuators connected thereto based on sensor signals fed thereto and processed therein. The unit includes a control circuit substrate carrying control elements such as a microcomputer and a driving circuit substrate carrying driving elements such as power transistors. The driving circuit substrate handling power and the control circuit substrate handling only signals are separately positioned in a metal casing with a separating space therebetween to suppress heat transfer from the driving circuit substrate to the control circuit substrate. A connector electrically connecting the unit to outside sensors and actuators is positioned in the separating space to utilize the separating space also as a space for containing the connector.

Abstract: A mount shelf for an electronic circuit board, includes a body; a first guide which is supported by the body and has a first guide plane; a second guide which is supported by the body and has a second guide plane; a third guide which is supported by the body and has a third guide plane; and a fourth guide which is supported by the body and has a fourth guide plane. The first guide plane and the second guide plane respectively have first contact planes on which a first end plane portion of one straight first edge region of an electronic circuit board can be contact at a same time. The third guide plane and the fourth guide plane respectively have second contact planes on which a second end plane portion of another straight second edge region of the electronic circuit board can be contact at the same time. The first guide and the second guide are separated to a degree of a width in a direction in which the first edge region or the second edge region of the electronic circuit board is extended.

Abstract: A temperature stabilization scheme reduces the effects of temperature variations on the performance of an electronic system that is implemented on a circuit board. In the temperature stabilization scheme, the circuit has an isolated region that is coupled to a remainder ofthe circuit board by one or more electrical pathways. Associated with each of the electrical pathways is an incidental thermal conduction path between the isolated region and the remainder of the circuit board. A temperature sensitive component ofthe electrical system is coupled to a mounting site on the isolated region and interfaces with the remainder of the circuit board through the one or more electrical pathways. A series of heaters, thermally coupled to the isolated region provides a compensating thermal profile that opposes thermal instability caused by the incidental thermal conduction paths, where the opposition is over a portion of the isolated region that includes at least the mounting site of the temperature sensitive component.

Abstract: An amplifier for a portable telephone of the like is repaired or replaced without loss of an amplifying function even when the amplifier malfunctions. A plurality of door-shaped amplifier parts are provided on the left and right sides of an amplifier box. The left and right door-shaped amplifier parts can be mounted on opposite sides to each other. One amplifier part is in service and the other amplifier part is a backup. In a case where the amplifier part in service malfunctions, the other amplifier part is used or is mounted for use on the opposite side.

Abstract: A telecommunications equipment enclosure (10) that dissipates into the ambient environment heat internally generated by signal repeater cards and other electronic equipment stored therein, thereby prolonging equipment life and preventing premature failure due to damaging levels of retained heat. Equipment-receiving sleeves (20) are removably arranged concentrically about the interior of a cylindrical housing (12). The housing (12) is fitted with a lid (14) having a cylindrically protruding portion (48). Cooling fins (16) operable to conduct and dissipate heat are attached to the exterior of the housing (12). Each sleeve (20) is able to conduct heat away from the heat-generating equipment received therein, and to transfer the heat along two distinct thermally conductive pathways. Surge protection (60) is provided on a removable circuit board (62) located adjacent each sleeve (20) and replaceable without removing the sleeve (20) or otherwise disrupting functioning of the cards or other electronic equipment.

Abstract: A fastener (50) includes a pin (52), a spring (54) and a handle (56). The pin extends through a heat sink (10). The handle is pivotably attached to a top portion of the pin. The pin has a foot (522) extending through a mother board (30) and a supporting board (40) located under the mother board to engage with the supporting board. A CPU (20) is mounted on the mother board. The spring surrounds the pin and is located between a base of the heat sink and the handle. When the handle is rotated from a horizontal position to a vertical position, the handle compresses the spring toward the foot. The spring in turn presses the base of the heat sink against the CPU.

Abstract: A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a same plane. Between adjacent circuit boards there is a galley for passing through metal bonding wires to connect chip with circuit board and molding package body easily. The plurality of circuit boards together hold the chip so as to reduce thermal stress caused by CTE mismatch.