With Particular Material Patents (Class 361/757)
  • Patent number: 9036366
    Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 19, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shunjiro Takemori, Shigeru Narakino
  • Publication number: 20150109738
    Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 23, 2015
    Inventors: Takafumi YAMADA, Tetsuya INABA, Yoshinari IKEDA, Katsuhiko YANAGAWA, Yoshikazu TAKAHASHI
  • Patent number: 9013889
    Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to be joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masako Tamura, Yasuhiro Takahashi, Toru Kubo, Seiji Kato, Takaaki Tanaka, Hideki Umemoto
  • Publication number: 20150103503
    Abstract: An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.
    Type: Application
    Filed: May 28, 2013
    Publication date: April 16, 2015
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Tomohiro Matsuzaki, Masahiko Kariya
  • Patent number: 9007779
    Abstract: According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Nobuhiro Yamamoto, Takahisa Funayama
  • Patent number: 8995142
    Abstract: Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention comprises a substrate where electronic parts are mounted by soldering, and a mold case housing the substrate and including bus bars for electrical connection with an external apparatus. The mold case comprises partition plates forming an electronic part mount area where electronic parts are mounted on the substrate, and a bonding area for bonding to the bus bars, a first resin cast to the electronic part mount area, and a second resin cast to the bonding area.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: March 31, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masato Saito, Hiroyuki Abe
  • Publication number: 20150077957
    Abstract: A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps.
    Type: Application
    Filed: September 4, 2014
    Publication date: March 19, 2015
    Inventors: SHIGEAKI SAKATANI, KAZUMA OIKAWA, KENTARO TAKADA, YOICHI HISATAKE, DAIDO KOHMYOHJI
  • Patent number: 8976535
    Abstract: Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to a top of the lower cover, and an upper cover coupled to the lower cover as one body to cover an upper side of the circuit board. The lower cover and the upper cover are formed of a thermo-hardening resin.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 10, 2015
    Assignee: Hyundai Mobis Co., Ltd.
    Inventors: Seung Hak Paek, Ick Tae An
  • Patent number: 8971051
    Abstract: A chip card ejecting mechanism includes a base body, a push member, a rotating member and an elastic member resisting between the base body and the rotating member. The base body includes a guiding member defining a hole and having a number of guiding rails. Each guiding rail includes a resisting surface and a guiding surface. The push member includes a push rod extending through the hole and a number of active gears. Each active gear defines an active cooperative surface. The rotating member includes a number of the passive gears. Each passive gear includes a passive cooperative surface. When the push member is pressed toward the rotating member by a transient external force, the rotating member compresses the elastic member until the active cooperative surface arrives at the guiding surface, the elastic member releases and drives the passive cooperative gears to slide along the first sliding slot.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: March 3, 2015
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Hua-Xiang Liang
  • Patent number: 8953331
    Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: February 10, 2015
    Assignee: Denso Corporation
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Publication number: 20150029671
    Abstract: An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing.
    Type: Application
    Filed: January 9, 2013
    Publication date: January 29, 2015
    Applicant: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Josef Schmidt, Martin Schörner
  • Publication number: 20150003028
    Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.
    Type: Application
    Filed: December 6, 2013
    Publication date: January 1, 2015
    Applicant: FIH (HONG KONG) LIMITED
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Publication number: 20140369012
    Abstract: Electronic devices may have housings in which components are mounted. Some of the components may be sensitive to moisture. Other components may be insensitive to moisture and may form openings in a device housing that allow moisture to escape from within the housing. Components may be mounted on substrates such as printed circuit board substrates. Moisture repelling layers and moisture attracting layers may be patterned to form channels and other structures that guide moisture away from sensitive components towards insensitive components. Moisture repelling and attracting layers may also be used to limit the lateral spread of a conformal coating layer when coating components.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Inventors: Felix Alvarez, Kyle H. Yates
  • Publication number: 20140301050
    Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.
    Type: Application
    Filed: March 13, 2014
    Publication date: October 9, 2014
    Applicant: HOYA CORPORATION
    Inventors: Takashi FUSHIE, Kunihiko UENO, Hajime KIKUCHI
  • Patent number: 8824150
    Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 2, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JungYoul Kang, SeongHun Kim
  • Patent number: 8824156
    Abstract: Systems and methods for providing biologically compatible pockets or envelopes that can contain chips and other circuit elements and can make electrical connection between those elements and living organisms. The assembled biologically compatible pockets and circuit components can have biomedical applications, such as bioimplantable devices such as retinal, cochlear and cortical prosthesis implants, muscular stimulators, and other uses. In various embodiments, the described technology explains how to make and use pocket systems for dealing with chips having connectors on one or two surfaces, and with other circuit components such as resistors, capacitors, inductors and transistors. Operation of chips encapsulated according to the described technology is demonstrated. Accelerated life testing suggests that the pocket systems described will survive for years at 37 degrees C.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: September 2, 2014
    Assignee: California Institute of Technology
    Inventors: Yu-Chong Tai, Ray Kui-Jui Huang
  • Publication number: 20140233197
    Abstract: The invention concerns a cover element (2) connectable to a housing lower portion (3) for covering same to form a housing device (1), wherein the cover element is formed in one piece as a shaped portion, the lower surface (16) of the cover element, that faces in the direction of the lower portion, is so designed that it follows the contour of the inside surface of the lower portion, and projections and recesses in the lower surface of the cover element are of such a configuration that recesses in the inside surface of the lower portion are at least partially filled and projections on the inside surface of the lower portion are at least partially surrounded in positively locking relationship.
    Type: Application
    Filed: February 4, 2014
    Publication date: August 21, 2014
    Applicant: HKR Seuffer Automotive GmbH & Co. KG
    Inventors: Oliver Schwab, Franz Herdtweck, Wolfgang Bass
  • Patent number: 8802998
    Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: August 12, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiko Okada, Osamu Chikagawa, Hidekiyo Takaoka, Shodo Takei
  • Publication number: 20140211431
    Abstract: An organic light emitting diode (OLED) display device includes: a display panel including a display area and a non-display area provided in an external side of the display area; a set frame disposed on a rear surface of the display panel and supporting the display panel; a side frame surrounding a side surface of the display panel and covering the non-display area; and a cover window covering the display area disposed in an inner space surrounded by the side frame.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 31, 2014
    Inventors: Min-Ho Um, Jong-Nam Lee, Ik-Jun Hong
  • Publication number: 20140177181
    Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.
    Type: Application
    Filed: December 26, 2012
    Publication date: June 26, 2014
    Applicant: Apple Inc.
    Inventors: Shayan Malek, Gregory N. Stephens, Michael B. Wittenberg, Jared M. Kole, Warren Z. Jones
  • Publication number: 20140180262
    Abstract: Containment devices and methods of manufacture and assembly are provided. In an embodiment, the containment device includes an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open. The containment device also include an elongated electronic printed circuit board (PCB) comprising a substrate. The elongated PCB comprises a first side on which one or more electronic components are fixed and an opposed second side on which the elongated microchip element is fixed in electrical connection to the one or more electronic components. Further, the containment device includes an elongated housing fixed to the elongated PCB. The elongated housing is configured to hermetically seal the one or more electronic components of the elongated PCB within the elongated housing.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: MicroCHIPS, Inc.
    Inventor: Robert Farra
  • Publication number: 20140126153
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takeshi MITSUHASHI, Hirofumi KATAMI
  • Publication number: 20140118971
    Abstract: A keyboard safety protection device for protecting a point of sale (POS) device keyboard area from being attacked includes: a protection layer, a metal dome, and a keyboard printed circuit board, wherein a key gold finger and a safety processor are arranged on the keyboard PCB, the protection layer is composed of a layer of PVDF film and a first and second silver slurries, the first and the second silver slurries are coated on the surface of the PVDF film, the surfaces of the first and second silver slurries are provided with a first and second thin film layers respectively, the first and second silver slurries are electrically connected with the key gold finger, and the first and second silver slurries are electrically connected with the safety processor to form a safety detection circuit through the keyboard printed circuit board and the safety processor.
    Type: Application
    Filed: October 31, 2012
    Publication date: May 1, 2014
    Applicant: PAX COMPUTER TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Bo Zhu, Shuxian Shi, Yuzhuo Wang
  • Publication number: 20140078698
    Abstract: An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor device on the circuit board, the conductive frame being fitted in the recess.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 20, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Yasushi YUI, Shuuhei FUJITA, Shinichirou OKAMOTO, Shinichirou KOUNO, Masaru SUGIE
  • Publication number: 20140077638
    Abstract: A control device of a motor unit has a gear housing having a supporting wall portion, a ceramic portion formed on the supporting wall portion, a circuit board body fixed to the ceramic portion, a power element located inside the circuit board body, and a load receiving member that is located around the power element inside the circuit board body and receives a load applied to the circuit board body.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 20, 2014
    Applicant: JTEKT CORPORATION
    Inventors: Motoo NAKAI, Yasuyuki WAKITA
  • Patent number: 8653846
    Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: February 18, 2014
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Yasuhide Takeda
  • Patent number: 8638564
    Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: January 28, 2014
    Assignee: International Business Machines Corporation
    Inventors: Daniel J Buschel, Wai M Ma, Donald A Merte
  • Publication number: 20140016287
    Abstract: A display device includes a display panel including a display part; a conductive film located on a front surface of the display panel and made of a conductive member; a non-conductive housing frame that is located on a surface of the conductive film opposite to a surface of the conductive film facing the display panel, covers a peripheral part of the display panel, and has at least one through hole penetrating the housing frame along a front-and-back direction; a conductive coupling member disposed in the through hole and electrically coupled to the conductive film; and a conductive decorative panel that covers a surface of the housing frame opposite to a surface of the housing frame facing the conductive film and is electrically coupled to the coupling member.
    Type: Application
    Filed: January 18, 2012
    Publication date: January 16, 2014
    Applicant: PANASONIC CORPORATION
    Inventor: Taketo Kawauchi
  • Publication number: 20140003009
    Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.
    Type: Application
    Filed: March 7, 2012
    Publication date: January 2, 2014
    Inventors: Qing Ma, Johanna M. Swan
  • Patent number: 8619429
    Abstract: A control unit and a method for assembling a control unit for occupant protection means for a vehicle are described. A p.c. board is enclosed between a plastic cover and a plastic base and assembled. A non-positive and/or positive connection is implemented for this assembly, and the control unit is pre-attached. The at least one connection is produced without tools.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: December 31, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Manfred Moser, Mark Wonner, Roland Cupal
  • Publication number: 20130329385
    Abstract: An electronic device includes: a housing having a concave portion in the first surface of the housing; a lid made of a semiconductor material containing an impurity material; a first metal film formed in a metal film formation region on the first surface of the housing, wherein the metal film formation region is defined as a region surrounding the concave portion on the first surface of the housing; a second metal film formed on the first surface of the lid to overlap with the metal film formation region in a top view of the electronic device; a third metal film formed on the second surface of the lid to overlap with the metal film formation region in the top view; and an electronic component disposed in the concave portion. The lid is bonded onto the housing via the first and second metal films to cover the electronic component.
    Type: Application
    Filed: June 11, 2013
    Publication date: December 12, 2013
    Inventor: Kei MURAYAMA
  • Publication number: 20130279132
    Abstract: An electromagnetic shielding cover disposed on a printed circuit board having thereon an electronic component includes a lid and a frame which are coupled together to shield the electronic component from electromagnetic interference and allow the electronic component to be changed and tested easily during a rework process.
    Type: Application
    Filed: July 5, 2012
    Publication date: October 24, 2013
    Inventors: SHIH-PO LO, TAN-LUNG CHEN, CHING-FENG HSIEH
  • Publication number: 20130223028
    Abstract: Apparatuses and methods for hybrid housings as well as hybrid housing based implantable medical devices are provided. A hybrid housing comprises a ceramic substrate, a bonding structure formed on the periphery of the ceramic substrate, and a biocompatible metal cap coupled to the ceramic substrate using the bonding structure to form a hermetically sealed enclosure. One or more electronic elements may be formed within the hermetically sealed enclosure, and the electronic elements may be stably associated with the ceramic substrate.
    Type: Application
    Filed: July 25, 2011
    Publication date: August 29, 2013
    Applicant: PROTEUS DIGITAL HEALTH, INC.
    Inventors: Lawrence Arne, Marc Jensen, Todd Thompson
  • Patent number: 8462515
    Abstract: An exemplary electronic includes a casing and a circuit board. The casing includes a bottom plate and two side plates extending upward from two opposite sides of the bottom plate, respectively. Hooks are formed on the bottom plate. Two guiding members are located at the side plates, respectively. The circuit board defines engaging slots corresponding to the hooks of the bottom plate, respectively. During assembly of the circuit board to the casing, the circuit board is inserted into the casing and slides between the side plates with two opposite lateral sides thereof sliding along the guiding members, until the hooks of the bottom plate are received in the engaging slots of the circuit board and the circuit board is thereby secured in the casing.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: June 11, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xin-Hu Gong, Si-Wen Shu, Gao-Liang Xia
  • Publication number: 20130135831
    Abstract: A touch module includes a touch element, a shell body and a decoration film. The shell body defines a curved touch area. The curved touch area is figured to touch the touch element. The touch element covers the curved touch area. The decoration film is an outer layer of the touch module. The shell body, the touch element and the decoration film are incorporated into an integrated structure.
    Type: Application
    Filed: April 12, 2012
    Publication date: May 30, 2013
    Applicant: SHIH HUA TECHNOLOGY LTD.
    Inventors: YU-JU HSU, PO-SHENG SHIH
  • Patent number: 8446740
    Abstract: Even in a location where, for example, a notch section is formed, sufficient rigidity is secured. For this purpose, in reinforcing structure of a front case, a horizontal hemming-bent section 18 formed by folding work is disposed not only in a notch section 9, but also in regions near neighborhood regions 15 and 16. As a result, in the neighborhood regions 15 and 16 of the notch section 9, there is formed a location in which the horizontal hemming-bent section 18 overlaps with a sidewall section 7 along a side end edge to thereby provide reinforcement. Hence, also in the notch section 9, sufficient rigidity is secured.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: May 21, 2013
    Assignee: NEC Corporation
    Inventor: Takaya Yoshida
  • Publication number: 20130100621
    Abstract: A semiconductor device package assembly increased in production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing molded of white-colored resin, which holds a plurality of bent contact, is covered by a second housing molded of black-colored resin, and a plurality of second housings are supported by a secondary molding carrier in high density. A linking portion of each contact and one or both of the first and second housings are integrated by insert molding.
    Type: Application
    Filed: September 13, 2012
    Publication date: April 25, 2013
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Takaaki Kudo, Naofumi Ikenaga, Tetsu Urano
  • Publication number: 20130094163
    Abstract: A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated.
    Type: Application
    Filed: December 6, 2012
    Publication date: April 18, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130094151
    Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.
    Type: Application
    Filed: November 9, 2011
    Publication date: April 18, 2013
    Applicant: SOLARBRIDGE TECHNOLOGIES, INC.
    Inventors: Eduardo Escamilla, Marco Marroquin, William John Morris, John Trevor Morrison, Thomas Paul Parker, Stephen Wurmlinger
  • Patent number: 8416362
    Abstract: To provide an electric circuit structure with which the occurrence of sound generation caused by vibration of a circuit element mounted on a flexible substrate connected to a circuit board is suppressed.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: April 9, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Tadashi Inui
  • Publication number: 20130083501
    Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Applicant: STMICROELECTRONICS LTD (MALTA)
    Inventor: STMicroelectronics Ltd (Malta)
  • Publication number: 20130083500
    Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings are able to be interferometric colors and/or black.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Inventors: Christopher D. Prest, Dermot J. Stratton, Joseph C. Poole, Matthew S. Scott, Michael S. Nashner
  • Patent number: 8411453
    Abstract: An exemplary motherboard fixing device is for fixing a motherboard onto a case plate inside a computer case. The motherboard fixing device is fixable on the case plate, and includes a first fixing strip and a second fixing strip. The first fixing strip includes a first, second, and third flat plates. The second flat plate is between the first and third flat plates. The first and second flat plates cooperatively define a slide groove for receiving an edge of the motherboard. The second fixing strip includes a bottom plate and a lateral plate. The third flat plate and the bottom plate include first latch hooks. The first latch hooks is engagable in corresponding through holes of the case plate, such that the first and second fixing strips are fixed on the case plate. The lateral plate includes second latch hooks for being latchable on an opposite edge of the motherboard.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: April 2, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zhong-Ping Yang, Guang-Dong Yuan, Chung-Chi Huang, Hai-Qing Zhou
  • Publication number: 20130070434
    Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.
    Type: Application
    Filed: September 15, 2011
    Publication date: March 21, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel J. Buschel, Wai M. Ma, Donald A. Merte
  • Publication number: 20130039024
    Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 14, 2013
    Applicant: DENSO CORPORATION
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Patent number: 8361591
    Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied at least in part by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets of layers, wherein each set has at least one layer formed by dissociation of a polymeric precursor and then deposition of that precursor, and another layer is a biocompatible liquid.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: January 29, 2013
    Assignee: Medos International Sarl
    Inventors: Andreas Hogg, Herbert Keppner, Jerome Charmet, Thierry Aellen, Juergen Burger
  • Publication number: 20120300421
    Abstract: An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, and an electrical feedthrough extending from a first end proximate the circuitry to a second end proximate to the outer surface. The electrical feedthrough may define a major axis extending between the first end and the second end, wherein the electrical feedthrough comprises non-uniform width measured in a direction along a plane substantially orthogonal to the major axis.
    Type: Application
    Filed: May 23, 2011
    Publication date: November 29, 2012
    Applicant: MEDTRONIC, INC.
    Inventors: Mohsen Askarinya, Erik J. Herrmann
  • Patent number: 8313819
    Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 20, 2012
    Assignee: Medos International S.A.R.L.
    Inventors: Andreas Hogg, Herbert Keppner, Thierry Aellen, Juergen Burger
  • Patent number: 8313811
    Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 20, 2012
    Assignee: Medos International S.A.R.L.
    Inventors: Andreas Hogg, Herbert Keppner, Thierry Aellen, Juergen Burger