Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: The present invention relates to a vehicle card key in which a manufacturing defect rate of the vehicle card key may be reduced when the vehicle card key is manufactured, and a method of manufacturing the same. A PCB substrate which has a first key holder receiving groove and a first battery cover; a case which has a second key holder accommodation groove and a second battery cover accommodation groove; a key holder which accommodates the mechanical key; a battery terminal which includes a first terminal and a second terminal; and a battery cover which allows one surface of the battery to be in contact with the first terminal and the other surface of the battery to be in contact with the second terminal.

Abstract: Used is a method for producing a thermal insulation sheet, including: composite-forming including impregnating a nonwoven fabric with a basic sol prepared by adding a carbonate ester to a water glass composition to form a hydrogel-nonwoven fabric composite; surface-modifying including mixing the composite with a silylating agent for surface modification; and drying including removing liquid contained in the composite through drying at a temperature lower than the critical temperature of the liquid under a pressure lower than the critical pressure of the liquid. Used is a thermal insulation sheet including an aerogel and a nonwoven fabric, where the thermal insulation sheet exhibits a compressibility of 40% or lower at 0.30 to 5.0 MPa.

Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to be joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.

Abstract: An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.

Abstract: According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.

Abstract: Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention comprises a substrate where electronic parts are mounted by soldering, and a mold case housing the substrate and including bus bars for electrical connection with an external apparatus. The mold case comprises partition plates forming an electronic part mount area where electronic parts are mounted on the substrate, and a bonding area for bonding to the bus bars, a first resin cast to the electronic part mount area, and a second resin cast to the bonding area.

Abstract: A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps.

Abstract: Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to a top of the lower cover, and an upper cover coupled to the lower cover as one body to cover an upper side of the circuit board. The lower cover and the upper cover are formed of a thermo-hardening resin.

Abstract: A chip card ejecting mechanism includes a base body, a push member, a rotating member and an elastic member resisting between the base body and the rotating member. The base body includes a guiding member defining a hole and having a number of guiding rails. Each guiding rail includes a resisting surface and a guiding surface. The push member includes a push rod extending through the hole and a number of active gears. Each active gear defines an active cooperative surface. The rotating member includes a number of the passive gears. Each passive gear includes a passive cooperative surface. When the push member is pressed toward the rotating member by a transient external force, the rotating member compresses the elastic member until the active cooperative surface arrives at the guiding surface, the elastic member releases and drives the passive cooperative gears to slide along the first sliding slot.

Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.

Abstract: An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing.

Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: Electronic devices may have housings in which components are mounted. Some of the components may be sensitive to moisture. Other components may be insensitive to moisture and may form openings in a device housing that allow moisture to escape from within the housing. Components may be mounted on substrates such as printed circuit board substrates. Moisture repelling layers and moisture attracting layers may be patterned to form channels and other structures that guide moisture away from sensitive components towards insensitive components. Moisture repelling and attracting layers may also be used to limit the lateral spread of a conformal coating layer when coating components.

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Abstract: Systems and methods for providing biologically compatible pockets or envelopes that can contain chips and other circuit elements and can make electrical connection between those elements and living organisms. The assembled biologically compatible pockets and circuit components can have biomedical applications, such as bioimplantable devices such as retinal, cochlear and cortical prosthesis implants, muscular stimulators, and other uses. In various embodiments, the described technology explains how to make and use pocket systems for dealing with chips having connectors on one or two surfaces, and with other circuit components such as resistors, capacitors, inductors and transistors. Operation of chips encapsulated according to the described technology is demonstrated. Accelerated life testing suggests that the pocket systems described will survive for years at 37 degrees C.

Abstract: The invention concerns a cover element (2) connectable to a housing lower portion (3) for covering same to form a housing device (1), wherein the cover element is formed in one piece as a shaped portion, the lower surface (16) of the cover element, that faces in the direction of the lower portion, is so designed that it follows the contour of the inside surface of the lower portion, and projections and recesses in the lower surface of the cover element are of such a configuration that recesses in the inside surface of the lower portion are at least partially filled and projections on the inside surface of the lower portion are at least partially surrounded in positively locking relationship.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: An organic light emitting diode (OLED) display device includes: a display panel including a display area and a non-display area provided in an external side of the display area; a set frame disposed on a rear surface of the display panel and supporting the display panel; a side frame surrounding a side surface of the display panel and covering the non-display area; and a cover window covering the display area disposed in an inner space surrounded by the side frame.

Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.

Abstract: Containment devices and methods of manufacture and assembly are provided. In an embodiment, the containment device includes an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open. The containment device also include an elongated electronic printed circuit board (PCB) comprising a substrate. The elongated PCB comprises a first side on which one or more electronic components are fixed and an opposed second side on which the elongated microchip element is fixed in electrical connection to the one or more electronic components. Further, the containment device includes an elongated housing fixed to the elongated PCB. The elongated housing is configured to hermetically seal the one or more electronic components of the elongated PCB within the elongated housing.

Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.

Abstract: A keyboard safety protection device for protecting a point of sale (POS) device keyboard area from being attacked includes: a protection layer, a metal dome, and a keyboard printed circuit board, wherein a key gold finger and a safety processor are arranged on the keyboard PCB, the protection layer is composed of a layer of PVDF film and a first and second silver slurries, the first and the second silver slurries are coated on the surface of the PVDF film, the surfaces of the first and second silver slurries are provided with a first and second thin film layers respectively, the first and second silver slurries are electrically connected with the key gold finger, and the first and second silver slurries are electrically connected with the safety processor to form a safety detection circuit through the keyboard printed circuit board and the safety processor.

Abstract: An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor device on the circuit board, the conductive frame being fitted in the recess.

Abstract: A control device of a motor unit has a gear housing having a supporting wall portion, a ceramic portion formed on the supporting wall portion, a circuit board body fixed to the ceramic portion, a power element located inside the circuit board body, and a load receiving member that is located around the power element inside the circuit board body and receives a load applied to the circuit board body.

Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.

Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.

Abstract: A display device includes a display panel including a display part; a conductive film located on a front surface of the display panel and made of a conductive member; a non-conductive housing frame that is located on a surface of the conductive film opposite to a surface of the conductive film facing the display panel, covers a peripheral part of the display panel, and has at least one through hole penetrating the housing frame along a front-and-back direction; a conductive coupling member disposed in the through hole and electrically coupled to the conductive film; and a conductive decorative panel that covers a surface of the housing frame opposite to a surface of the housing frame facing the conductive film and is electrically coupled to the coupling member.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: A control unit and a method for assembling a control unit for occupant protection means for a vehicle are described. A p.c. board is enclosed between a plastic cover and a plastic base and assembled. A non-positive and/or positive connection is implemented for this assembly, and the control unit is pre-attached. The at least one connection is produced without tools.

Abstract: An electronic device includes: a housing having a concave portion in the first surface of the housing; a lid made of a semiconductor material containing an impurity material; a first metal film formed in a metal film formation region on the first surface of the housing, wherein the metal film formation region is defined as a region surrounding the concave portion on the first surface of the housing; a second metal film formed on the first surface of the lid to overlap with the metal film formation region in a top view of the electronic device; a third metal film formed on the second surface of the lid to overlap with the metal film formation region in the top view; and an electronic component disposed in the concave portion. The lid is bonded onto the housing via the first and second metal films to cover the electronic component.

Abstract: An electromagnetic shielding cover disposed on a printed circuit board having thereon an electronic component includes a lid and a frame which are coupled together to shield the electronic component from electromagnetic interference and allow the electronic component to be changed and tested easily during a rework process.

Abstract: Apparatuses and methods for hybrid housings as well as hybrid housing based implantable medical devices are provided. A hybrid housing comprises a ceramic substrate, a bonding structure formed on the periphery of the ceramic substrate, and a biocompatible metal cap coupled to the ceramic substrate using the bonding structure to form a hermetically sealed enclosure. One or more electronic elements may be formed within the hermetically sealed enclosure, and the electronic elements may be stably associated with the ceramic substrate.

Abstract: An exemplary electronic includes a casing and a circuit board. The casing includes a bottom plate and two side plates extending upward from two opposite sides of the bottom plate, respectively. Hooks are formed on the bottom plate. Two guiding members are located at the side plates, respectively. The circuit board defines engaging slots corresponding to the hooks of the bottom plate, respectively. During assembly of the circuit board to the casing, the circuit board is inserted into the casing and slides between the side plates with two opposite lateral sides thereof sliding along the guiding members, until the hooks of the bottom plate are received in the engaging slots of the circuit board and the circuit board is thereby secured in the casing.

Abstract: A touch module includes a touch element, a shell body and a decoration film. The shell body defines a curved touch area. The curved touch area is figured to touch the touch element. The touch element covers the curved touch area. The decoration film is an outer layer of the touch module. The shell body, the touch element and the decoration film are incorporated into an integrated structure.

Abstract: Even in a location where, for example, a notch section is formed, sufficient rigidity is secured. For this purpose, in reinforcing structure of a front case, a horizontal hemming-bent section 18 formed by folding work is disposed not only in a notch section 9, but also in regions near neighborhood regions 15 and 16. As a result, in the neighborhood regions 15 and 16 of the notch section 9, there is formed a location in which the horizontal hemming-bent section 18 overlaps with a sidewall section 7 along a side end edge to thereby provide reinforcement. Hence, also in the notch section 9, sufficient rigidity is secured.

Abstract: A semiconductor device package assembly increased in production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing molded of white-colored resin, which holds a plurality of bent contact, is covered by a second housing molded of black-colored resin, and a plurality of second housings are supported by a secondary molding carrier in high density. A linking portion of each contact and one or both of the first and second housings are integrated by insert molding.

Abstract: A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated.

Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.

Abstract: To provide an electric circuit structure with which the occurrence of sound generation caused by vibration of a circuit element mounted on a flexible substrate connected to a circuit board is suppressed.

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings are able to be interferometric colors and/or black.

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract: An exemplary motherboard fixing device is for fixing a motherboard onto a case plate inside a computer case. The motherboard fixing device is fixable on the case plate, and includes a first fixing strip and a second fixing strip. The first fixing strip includes a first, second, and third flat plates. The second flat plate is between the first and third flat plates. The first and second flat plates cooperatively define a slide groove for receiving an edge of the motherboard. The second fixing strip includes a bottom plate and a lateral plate. The third flat plate and the bottom plate include first latch hooks. The first latch hooks is engagable in corresponding through holes of the case plate, such that the first and second fixing strips are fixed on the case plate. The lateral plate includes second latch hooks for being latchable on an opposite edge of the motherboard.

Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.

Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.