Abstract: A communication device includes a case approximately in a shape of box, data circuit-terminating equipment contained in the case for connecting with a radio packet communication network, and a circuit board provided with a circuit for connecting data terminal equipment and the data circuit-terminating equipment each other and mounted with the data circuit-terminating equipment, with an attachment integrated with the outside of the case.

Abstract: A chip type solid electrolytic capacitor, in which a PCB includes anode and cathode connection lands formed on upper parts of an insulation board, and anode and cathode terminals formed on lower parts of the insulation board. The anode and cathode terminals are electrically connected to the anode and cathode connection lands, respectively, through vias. An anode connection member is formed on the anode connection land. A capacitor device having an anode lead and a cathode layer is mounted on the PCB with the anode lead weld-connected to the anode connection member and the cathode layer electrically connected to the cathode connection land via a conductive adhesive. An outer resin covers side and upper parts of the PCB including the capacitor device. The anode terminal and the cathode terminal have stepped-down surfaces which are formed along at least parts of peripheral portions thereof, respectively, and covered by the outer resin.

Abstract: A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing prevents leakage of unwanted electromagnetic waves from inside, is not affected by external electromagnetic waves, has small thickness, light weight, high strength and high rigidity, and has excellent contactability with a coating.

Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.

Abstract: A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, at least one test pad disposed on the upper circuit board surface, and a conductive pattern disposed on the lower circuit board surface and electrically connected to the test pad. Electrically connected to the conductive pattern of the circuit board is a leadframe which includes a plurality of leads, each of the leads having a signal pad portion. At least one electronic circuit element is attached to the lower circuit board surface and electrically connected to the leadframe and to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board, the leadframe and the electronic circuit element such that the test pad of the circuit board is exposed in an upper body surface of the body, and the signal pad portions of the leads of the leadframe are exposed in a lower body surface of the body.

Abstract: An electronic control unit having a flexible circuit board assembly is disclosed. The electronic control unit comprises a flexible circuit board with at least one layer having first and second portions separated by a bendable region. The electronic control unit further comprises a substantially rigid substrate having first and second portions separated by a bend region and inside and outside surfaces. The first and second portions of the circuit board are affixed to respective first and second portions of the substrate. The bend region has one of the group of a recess and aperture extending outwardly from the inside surface of the substrate with the one of the group of the recess and aperture sized to accept the bendable region of the circuit board.

Abstract: A mounting apparatus includes a lock member (20), a support panel (30), and a securing panel (40). The support panel includes a main wall (32). First and second lock plates (33, 34) and catches (35) are arranged on the main wall. The securing panel includes a base board (41) and a flange (42). Catch holes (49) are defined in the base board, the catch holes engagingly receiving the catches. Two openings (45) are defined between the base board and the flange. The lock member includes two latches (22) engaging in the openings. First and second cutouts (23, 24) are defined respectively in opposite sides of the lock member. The first and second lock plates of the support panel are passed through the first and second cutouts of the lock member, thereby enabling the lock member to be slidably retained on the main wall by the first and second lock plates.

Abstract: Circuit card mounting apparatus eliminates the need for screw fasteners when securing a circuit card within a chassis. At least one standoff member spaces the circuit card away from a wall. At least one hook member extends away from the wall slightly farther than does the standoff member so that the thickness of a circuit card can fit between the top of the standoff member and the bottom of the hook member. The hook member is designed to pass through a corresponding clearance hole in the circuit card. A flexible tab is suspended away from the wall a sufficient distance to make contact with an edge of the circuit card when the circuit card rests on the standoff member.

Abstract: An appliance comprising a housing-case, a main unit of such appliance and an optional structural member, wherein at least portions of the housing-case and the structural member are made of biodegradable material containing polylactic acid as a major component is provided. Such appliance can achieve durability sufficient for the practical use without causing environmental impact if the housing-case and structural member thereof are disposed as they are.

Abstract: A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. The microchip coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.

Abstract: An enclosure for a portable electronic device such as a mobile telephone. The enclosure includes a cover made of an elastomer so that it can be stretched over the chassis containing the device's internal components. Raised keys formed on the elastomeric enclosure surface are marked according to their function. The marked key preferably forms a raised portion on the front of the device, that is, the front cover of the enclosure, and cause key pegs extending from the interior wall to close switches on the device's internal component assembly. Various structures formed in the elastomeric cover correspond with features of the chassis so as to tend to retain it in position.

Abstract: A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.

Abstract: The invention provides a device and method for enclosure of electronic circuits. An encapsulated electronic circuit device has a circuit board further comprising, electronic conductive paths, at least one electronic component, and an energy source, and an enclosure encapsulating the circuit board, substantially covering the front and back-side of the circuit board. The enclosure is composed of a polyurethane material. The circuit device preferably has a design imprinted on the front of the circuit board. The printing process is optionally a silk screening method.

Abstract: The invention relates to an electronic module consisting of electrical circuit board conductors (3a), one or more electronic and/or electromechanical components (5, 5′), and one or more electrical connection contacts (7) wherein the circuit board conductors (3a) and the components (5, 5′) are surrounded at least partially by a plastic material (11) having low Shore Hardness.

Abstract: The present invention protects a thin wire connection from oscillation of a resin protecting an electronic circuit module from vibration, impact, and corrosion. An electronic control unit including an electronic circuit module in which a bare chip is mounted on a circuit board and a case for housing the module, is provided, wherein the case is filled with a potting gel to protect the module. The bare chip, including its wire connection to the circuit board, is sealed in advance with a gelatinous resin having thixotropy prior to hardening. The gelatinous substance cures to form a hardened inner layer which has a penetration that is lower than that of the filled potting gel after hardening, and functions to eliminate or substantially reduce the affect of viscoelastic oscillation of the outer layer on the bare chip and the wire connection.

Abstract: A pin standing resin substrate 311 comprises a resin substrate 313 and many pins 301 soldered (HD) to a pin-pad 317A, the resin substrate comprising such as a resin and having a pin-pad 317AP whose diameter of a portion exposed in a main surface 313A is 0.9 to 1.1 mm. The kovar-made pin 301 is previously heat-treated at 700° C., whereby Vickers hardness is made Hv=around 150, and the pin has a rod-like portion 301A of a diameter being 0.3 mm and an enlarged diameter portion 301B shaped in disk being 0.60 to 0.70 mm and thickness being 0.15 to 0.20 mm, the enlarged diameter portion being formed at one end of the rod-like portion 301A. This enlarged diameter portion 301B is soldered to the pin-pad.

Abstract: A flame suppression cabinet for printed circuit boards includes intumescent material that expands at an elevated temperature to block ventilation openings in a top panel. Fire suppression plates are positioned between adjacent ones of a plurality of printed circuit boards positioned vertically on a shelf rack in side-by-side spaced-apart parallel relationship to prevent fire from spreading between the circuit boards.

Abstract: An appliance includes a housing-case, a main unit of such appliance and an optional structural member, wherein at least portions of the housing-case and the structural member are made of biodegradable material containing polylactic acid as a major component is provided. Such appliance can achieve durability sufficient for the practical use without causing environmental impact if the housing-case and structural member thereof are disposed as they are.

Abstract: According to an electronic circuit device, when a circuit board having electrical parts mounted thereon is sealed with resin, the heat and pressure of the resin is prevented from acting on the electrical parts thus mounted. A circuit board (10) having electrical parts (11) and an IC (12) mounted thereon is accommodated in a sleeve formed of a thermal-shrinkage film (16), and subjected to thermal shrinkage to intermediate-package the circuit board. Thereafter, the overall body thereof is molded with a resin (17) and the circuit board (10) is sealed.

Abstract: A semiconductor card includes a printed circuit substrate and one or more semiconductor components, such as dice or packages, mounted to the substrate. The substrate is initially a segment of a strip containing several substrates. The substrate is defined by a peripheral opening in the strip, and is connected to the strip by connecting segments. The card also includes a plastic body molded to the substrate and having notches that initially align with the connecting segments. The notches provide access for severing the connecting segments, and also enclose any slivers of substrate material resulting from severing of the connecting segments. A method for fabricating the package includes the steps of providing the strip, and providing a molding apparatus configured to mold the plastic body to the substrate. The molding apparatus includes pins configured to contact the connecting segments to form the notches.

Abstract: An intrinsically safe portable programmer for communicating with the electronic process control equipment over a wireless communication link. The portable programmer comprises a microprocessor controlled electronic circuit housed in an enclosure formed from a polymers polystyrene having a low surface resistivity. The electronic circuit is mounted inside the enclosure with a low voltage battery supply and encased in epoxy to prevent sparking. The electronic circuit includes an infrared transmitter and a keypad. In response to keypad inputs, the electronic circuit generates control signals which are transmitted to the electronic process control equipment via the infrared transmitter.

Abstract: Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch pitch such that multiple wiring channels are formed between adjacent vias, wirability is improved and the number of signal distribution layers may be reduced. The new structure thus shows improved electrical properties over the state-of-the-art structures, combined with a cost reduction of about 35%.

Abstract: A handling and mounting protection device is described that has a cap-shaped configuration with a covering layer which covers a contact-sensitive upper side of a component which is to be protected. Extending from the covering layer are locking arms with locking hooks which, in the state in which they are fitted onto the component, engage behind undercuts in the component in such a way that even after the component has been mounted they can still be released from it.

Abstract: A cylindrical or sheet-like thermoplastic film is decompressed and used to cover a board to protect the board and components.

Abstract: A printed circuit card assembly for preventing flame spread in an equipment assembly includes a printed circuit board having first and second sides, at least one of the first and second sides of the printed circuit board adapted for mounting a plurality of electronic components thereon; and a heat absorbing flame resistant shield facing one side of the printed circuit board for absorbing heat energy from an adjacent printed circuit card assembly thereby reducing heat transfer to the printed circuit board.

Abstract: A portable electronic apparatus has a one-piece cover which is moulded directly onto the internal components of the apparatus.

Abstract: A handling and mounting protection device is described that has a cap-shaped configuration with a covering layer which covers a contact-sensitive upper side of a component which is to be protected. Extending from the covering layer are locking arms with locking hooks which, in the state in which they are fitted onto the component, engage behind undercuts in the component in such a way that even after the component has been mounted they can still be released from it.

Abstract: A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin recessed bottom of the supporter. The method prepares a card-type support frame member from resin and a sheet material, cuts the sheet material into the size of the support frame member, to form a support sheet, bonds the support sheet to a bottom surface of the support frame member, to form a frame, and fits a memory module to be fixed in an opening of the support frame member in the frame, thereby completing the card-type storage device.

Abstract: In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

Abstract: A rack (70) for a plurality of electronics modules (36) that does not include inlet and outlet air cooling plenums. The rack (70) includes a heat exchanger (72) including three separate sections (78, 80, 82), where each section (78, 80, 82) include spaced-apart parallel fins (84, 86, 88). First and second end sections (80, 82) of the heat exchanger (72) include cooling fins (86, 88) that extend parallel to each other in a front-to-back direction relative to the direction the modules (36) are slid into the rack (70). The first and second end sections (80, 82) are positioned at opposite ends of a center section (78), where the fins (84) of the center section (78) extend in a direction transverse to the direction the modules (36) are slid into the rack (70). The channels between the fins (86, 88) in the first and second end sections (80, 82) are aligned with inlet and outlet ports (94, 98) extending through a back panel (52) of the rack (70).

Abstract: A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.

Abstract: An electronic device having two or more printed circuit boards with integrated heat-dissipating mechanism without a fan. A heat-generating circuit component is placed on a daughter board separated from a motherboard. An electrically insulating thermal conductor is placed between the daughter board and the motherboard for heat transfer.

Abstract: A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Abstract: A mounting apparatus includes a bracket having plural sides adapted to accommodate a board between the sides. First fasteners on the plural sides of the bracket are disposed to connect the board to the bracket, wherein the fasteners are adapted to vertically restrain movement of the board relative to the bracket. At least one second fastener on one of the sides releasably secures the bracket to a mounting surface. A process for mounting a board on a surface includes the steps of fitting a board onto a bracket having plural sides, fastening the board to the bracket with first fasteners, and engaging a second fastener with a mounting surface. The board may be a printed wiring board or a printed wiring assembly. The plural sides may include left, right, back, and front sides. The sides may be perpendicular to each other. The first fasteners may be clips, screws, or channels found on the inside of the plural sides. A second fastener may also be included, and may be a slot, a clip, or a tab.

Abstract: A computer component carrier isolates components from vibration, reduces noise, reduces assembly time, improves airflow to critical components, and reduces EMI. The component carrier is fabricated from a vibration damping material such as urethane foam. The component carrier contains cavities to accommodate electronic components. These cavities are interconnected via airways that direct airflow between the cavities. The component carrier includes two or more pieces. Components are placed in the cavities of the component carrier designed to accommodate the components and the pieces of the component carrier are mated and secured. In this manner, the components are firmly held in position by the component carrier. The component carrier can be fabricated with a hard exterior finish that replaces a computer casing or cabinet. The component carrier can also be fabricated from a recyclable and/or recycled material.

Abstract: A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.

Abstract: A high efficiency radio frequency (RF) impedance matching network containing an "L-type" inductor-capacitor (LC) circuit where the capacitor is a variable capacitor coupled from an input port to ground and the inductor is a variable inductance inductor coupled from the input port to an output port. A blocking capacitor is provided between the inductor and the output port and a ceramic capacitor is coupled in parallel across the variable capacitor. The impedance match is tuned by physically adjusting tuning elements of both the inductor and capacitor. The variable inductor contains an improved inductor tuning element that optimizes current flow in the tuning elements and inductor. To further improve the efficiency of the matching network, the assembly uses an improved enclosure interior finish and various circuit optimization techniques that reduce contributions to match loop resistance.

Abstract: A CPU heat sink including a heat sink body and a cover plate covered on the heat sink body, the heat sink body having a circular recessed chamber at an eccentric location which receives a fan, and a plurality of radiating fins spirally arranged around the circular recessed chamber and defining a plurality of spiral air passages adapted for guiding currents of air out of the circular recessed chamber, the cover plate having a circular opening corresponding to the circular recessed chamber of the heat sink body, rows of air vents, and a plurality of sloping wind guide strips respectively projecting into the air vents for guiding outside air through the air vents into the spiral air passages of the heat sink body.

Abstract: The present invention relates to the packaging of commercial off-the-shelf (COTS) electronic modules and equipment for use in harsh military or commercial environments. The ruggedized container of this invention is a light-weight container weighing less than half of the weight of commercially available containers having similar functionalities and which is intended for use in similar harsh environments. The reduced weight and size of the ruggedized container of this invention are consistent with size and/or weight critical applications such as transport of portable flight line testers, submarines, space craft, air craft, and the like. The ruggedized container of this invention, comprises five major components: a transit case, a card cage, a vibration isolator assembly, cooling system, and power supply. Each element of the chassis is individually enhanced for size and weight.

Abstract: According to the present invention, a method is provided for attaching a package substrate to a circuit board. In one version of the invention, the package substrate has a semiconductor die disposed thereon, and the semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on the package substrate. In one embodiment of the invention, the method comprises the steps of attaching a first surface of an electrical connector to one of the conductive traces by thermoplastic adhesion; and attaching a second surface of the electrical connector to a conducting pad on the circuit board, also by thermoplastic adhesion.

Abstract: A chassis of a device, for example an electronic device, comprises a support unit made of plastic material which carries the components of the device, such as printed circuit boards, a data storage disk, a ventilator, and a loudspeaker. The components are held in place in corresponding recesses of the chassis by a form-locking connection with the plastic material. The components are carried by the chassis without requiring any fastening elements. For assembling the device, the components are inserted into the lower part of the chassis. Thereafter, the upper part is positioned on top of the lower part. The chassis can be enclosed in a metal enclosure. The chassis is preferably manufactured by a plastic molding process. Ventilation ducts can be provided in the plastic material to ensure cooling of the components.

Abstract: The assembly comprises a U-shaped frame to which the card may be secured. The frame is defined by spaced parallel side elements and a connecting end element. Intermediate the ends of the frame a tie bar bridges flatly across the top of the frame and is adapted to hold down the card and tie the side elements together. The bar has downward legs at its opposite ends secured to the frame.

Abstract: A computer component carrier isolates components from vibration, reduces noise, reduces assembly time, improves airflow to critical components, and reduces EMI. The component carrier is fabricated from a vibration damping material such as urethane foam. The component carrier contains cavities to accommodate electronic components. These cavities are interconnected via airways that direct airflow between the cavities. The component carrier includes two or more pieces. Components are placed in the cavities of the component carrier designed to accommodate the components and the pieces of the component carrier are mated and secured. In this manner, the components are firmly held in position by the component carrier. The component carrier can be fabricated with a hard exterior finish that replaces a computer casing or cabinet. The component carrier can also be fabricated from a recyclable and/or recycled material.

Abstract: A case houses a portable telephone apparatus having a display portion, an operating portion, a speaker portion and a microphone portion provided with respect to two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge portion is formed of a soft resin having a resiliency, and the main portion is formed of a hard resin and integral with the hinge portion. A wiring member for provide an electric connection between the main portions extend through the hinge portion.

Abstract: This invention is directed to a PCMCIA Type II memory card holder assembly for a spread spectrum radio communication card that provides radio frequency interference shielding, electrostatic discharge resistance and heat dissipation. The card holder assembly consists of a multilayer circuit board and a card holder. The multilayer circuit board has a ground plane disposed between a plurality of analog circuit layers and a plurality of digital circuit layers. The ground plane is connected by through vias to ground traces on the surfaces of the circuit board. The card holder consists of a card holder frame in which the memory card is slidably and rotatably mounted so that the ground traces continuously contact the frame, and two outer cover plates which are adhered to the opposing surfaces of the card holder frame.

Abstract: A card cage for mounting circuit boards comprises lateral panels and an electrically connecting panel extending between the lateral panels. Opposed sets of two spaced rails span the lateral panels and support extruded grille units substantially transverse to the connector panel and the lateral panels to define a cavity for receiving the circuit boards. A plurality of guides formed integrally with each grille unit receive edges of circuit boards inserted in the cavity. Each set of rails and associated grille units define a grille structure of the card cage. A method for forming a grille structure for use in a card cage comprises the steps of forming a support member and support rails. Forming the support member includes extruding a metal piece with a planar portion and a plurality of elongated, U-shaped members carried by the planar portion, cutting the metal piece transverse to the U-shaped members and forming a connecting surface.

Abstract: The invention provides a low cost apparatus assembly of an electrotechnical apparatus. The housing walls consist of plate-shaped elements. The dimensions and weight of the plate-shaped elements are considerably reduced as compared to the existing elements. The assembly has a housing wall with plate-shaped elements. At least part of the plate-shaped elements are synthetic plastic plates, which are metal-coated over a continuous surface area on one side. The metal-coated surfaces are interconnected electrically conductively. One or several of the metal-coated synthetic plastic plates are designed as printed circuit boards. They are provided with electrical and/or mechanical elements on the side which is not metal-coated. As the case may be, they are provided with strip conductors. The plate-shaped elements of metal, if present, are electrically conductively connected to the metal-coated surface of the synthetic plastic plates.

Abstract: A chassis of a device, for example an electronic device, includes a support unit made of plastic material which carries the components of the device, such as printed circuit boards, a data storage disk, a ventilator, and a loudspeaker. The components are held in place in corresponding recesses of the chassis by a form-locking connection with the plastic material. The components are carried by the chassis without requiring any fastening elements. For assembling the device, the components are inserted into the lower part of the chassis. Thereafter, the upper part is positioned on top of the lower part. The chassis can be enclosed in a metal enclosure. The chassis is preferably manufactured by a plastic molding process. Ventilation ducts can be provided in the plastic material to ensure cooling of the components.

Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

Abstract: An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of electronic components (12) thereon. The case main body (10) comprises a case body (13) and a flat plate-shaped lid (17) positioned properly with respect to the case body (13) to seal the interior space. A vent hole (20) is formed in the bottom wall of the case body (13) for communicating the interior of the case body (13) with ambient atmosphere. A cover member is attached to the case body (13) to cover the vent hole hermetically. By using a cover member, the interior space of the case body (13) is sealed for protecting electronic components (12) on the electronic circuit board (11) from moisture and rainwater and, for absorbing a pressure fluctuation therein. A mounting flange extends from the case body and surrounds the vent hole. The cover member is a flexible diaphragm with a circumferential bulge.