Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied at least in part by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets of layers, wherein each set has at least one layer formed by dissociation of a polymeric precursor and then deposition of that precursor, and another layer is a biocompatible liquid.

Abstract: An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, and an electrical feedthrough extending from a first end proximate the circuitry to a second end proximate to the outer surface. The electrical feedthrough may define a major axis extending between the first end and the second end, wherein the electrical feedthrough comprises non-uniform width measured in a direction along a plane substantially orthogonal to the major axis.

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

Abstract: Various embodiments of the present invention are directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing that has first and second parallel elongated mounting frames extending along the respective side edges of the circuit board. Each mounting frame has an elongated body portion forming a channel extending the length of the body, the channel serving to nest one of the side edges of the circuit board. The body of each mounting frame has one or more sets of orthogonally disposed, intersecting mounting holes that permit use of mounting holes to accommodate screws for attaching the mounting frames in a rack frame of a host system so that the circuit board is optionally supported in a side attached mode or in a bottom attached mode.

Abstract: A modem, in particular for subsea power line communication, has electronic components on a circuit board, and a metal encapsulation, wherein the encapsulation forms at least two chambers separated by at least one wall, wherein each of the chambers surrounds at least one of the electronic components.

Abstract: A method of forming a circuitized substrate utilizing a conductive nub structure for enhanced interconnection integrity by using a joining core layer with copper outer layer on it, and forming thru-holes in the joining layer. Placing conductive adhesive in the thru-hole prior to removing the copper outer layers from the joining core layer creates an adhesive bump on joining core layer that engages a conductive secondary metal nub placed on the circuitized substrate-to-joining layer contact points, thus creating an enhanced connection between the layers.

Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.

Abstract: An electronic device according to the present invention comprises a pair of housings coupled to each other openably and closably by a hinge mechanism, and each of the housings comprises a front cabinet and a back cabinet joined to each other. The back cabinet of at least one of the housings is formed from a material having a greater expansion coefficient than that of a material forming the front cabinet, and the back cabinet of at least one of the housings has a cutting part extending in the width direction perpendicular to the longitudinal direction thereof and longitudinally cutting at least a part of the back cabinet.

Abstract: A control unit and a method for assembling a control unit for occupant protection means for a vehicle are described. A p.c. board is enclosed between a plastic cover and a plastic base and assembled. A non-positive and/or positive connection is implemented for this assembly, and the control unit is pre-attached. The at least one connection is produced without tools.

Abstract: A pressure guide for an electric connection between strip conductors on a circuit board and electric contacts arranged in an edge connector is provided. The pressing device aligns a circuit board guided between two guide bars by a spring element arranged in the one of the guide bars, such that the electric strip conductors applied on the circuit board exactly conform to the contacts arranged within the edge connector.

Abstract: A housing for protectively enclosing a printed circuit board, including a base, and a pair of parallel spaced vertical housing side walls extending upwardly from the base to define a chamber that receives the central portion of the printed circuit board, whereby the vertical edge portions of the board extend outwardly beyond the corresponding vertical edges of the housing side walls, respectively. Vertical side members having generally U-shaped horizontal cross-sectional configurations are mounted on the outwardly extending edge portions of the printed circuit board, respectively, with the leg portions of each side member extending between the housing side walls and the printed circuit board, respectively, whereby portions of housing side walls overlap the side member leg portions. The upper end of the chamber is closed by a lid member that is fastened between the upper ends of the side members.

Abstract: According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate.

Abstract: A sensor node for deployment in association with an earth surface has a biodegradable plastic housing, an electronic circuit board within the housing, and at least one battery for providing electrical energy to the circuit board. The circuit board has a non-toxic substrate and at least one lead-free solder element. Each battery is a non-toxic battery.

Abstract: According to one embodiment, a mobile terminal is provided. The mobile terminal includes: a board in which an electronic circuit is mounted; a resin frame configured to hold the board; and a sheet metal configured to maintain strength of the resin frame. The resin frame is configured to be integrally molded with the board and the sheet metal.

Abstract: Various embodiments of the present invention are directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing that has first and second parallel elongated mounting frames extending along the respective side edges of the circuit board. Each mounting frame has an elongated body portion forming a channel extending the length of the body, the channel serving to nest one of the side edges of the circuit board. The body of each mounting frame has one or more sets of orthogonally disposed, intersecting mounting holes that permit use of mounting holes to accommodate screws for attaching the mounting frames in a rack frame of a host system so that the circuit board is optionally supported in a side attached mode or in a bottom attached mode.

Abstract: A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.

Abstract: An electrode connection structure including a first circuit component including a resin plate, a barrier film stacked on a surface of the resin plate, a circuit section formed on the barrier film and a first electrode provided on the surface of the resin plate on which the barrier film is stacked, and a second circuit component arranged to face the first circuit component and having a second electrode facing the first electrode, wherein the first and second electrodes are electrically connected via pressure applied thereto in the directions approaching each other and a portion of the barrier film surrounding the first electrode is at least partially removed from the surface of the resin plate.

Abstract: To provide an electric circuit structure with which the occurrence of sound generation caused by vibration of a circuit element mounted on a flexible substrate connected to a circuit board is suppressed.

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied at least in part by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets of layers, wherein each set has at least one layer formed by dissociation of a polymeric precursor and then deposition of that precursor, and another layer is a biocompatible liquid.

Abstract: A system component of a control device, especially for a transmission or engine controller of a motor vehicle, is provided as a closed system component for a control device which can be transported, thereby allowing decentralized manufacturing of the system component. The system component has a hybrid circuit, equipped with electronic components, which is embedded in a printed circuit board, recessed in the center, in such a manner that the hybrid circuit is completely enclosed by the printed circuit board. The hybrid circuit and the printed circuit board are mounted on a base element and connected to each other via contact elements. A cover element is positioned on top of the hybrid circuit and the contact elements in such a manner that the hybrid circuit is fully encapsulated by the base element, the cover element and the printed circuit board from environmental influences.

Abstract: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Abstract: A method of enhancing adhesion of a molding material with a substrate is provided. The method includes forming one or more perforations on a substrate, forming a coat of an affinitive material on at least one of the perforations, and filling the molding material in the perforations. The affinitive material has an affinity for the molding material. Therefore, the molding material adheres to the coat of the affinitive material.

Abstract: An assembly (10) comprises a housing (11) and a printed circuit board (14) received in the housing. The housing includes a housing body (12) and a cover (16). The housing body (12) has a first surface (26) supporting the printed circuit board (14) and also has a portion defining a second surface (22) receiving the cover (16). At least the portion of the housing body is formed of a material that is meltable by a laser welder. The second surface (22) is spaced from the first surface (26) by a distance that is at least as great as a thickness of the printed circuit board (14). The printed circuit board (14) is at least partially held in place by melted material from said portion.

Abstract: A microelectronic substrate, a method of forming the same, and a system including the same. The microelectronic substrate comprises: a conductive layer; a spacer layer disposed onto the conductive dielectric layer; a dielectric build-up layer disposed onto the spacer layer, the spacer layer being made of a material that has a lower shrinkage than a material of the embedding dielectric-build-up layer during curing, and a higher viscosity than a material of the embedding dielectric build-up layer in its pre-cure form and during curing; and active or passive microelectronic components embedded within the dielectric build-up layer.

Abstract: A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.

Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Abstract: An embodiment of a package for Micro-Electro-Mechanical Systems of the MEMS type comprising a base for the assembly of said MEMS and a protective envelope, for containing the MEMS. The base is a multi-layer structure with at least one layer of composite material to make a substrate and at least one flexible wing projecting from the substrate, such base being a monolithic element suitable for being connected to external connection tracks.

Abstract: A data processing system and method providing a jumper which provides standby power from a redundant power supply to one of at least two critical functions in a frame having bays for holding at least two nodes. The redundant power supply supplying power to one of the nodes in the frame and one of the critical functions. A jumper is slidably engageable in the frame in place of one of the nodes. The jumper, when engaged in the frame, transfers power from the redundant power supply to the other of the critical functions. The jumper is included in a jumper book of an airblock which includes passive airblock books. Mechanical keys on the passive airblock books prevent the removal of the jumper book until after the passive airblock books are removed.

Abstract: A portable terminal characterized by comprises: a first substrate; a double-sided tape adhered to a prescribed portion of said first substrate; a second substrate adhered to said double-sided tape on a side thereof that is opposite the side on which said first substrate is located and having an electronic part mounted on a side thereof that is opposite the side affixed to said double-sided tape; an upper case disposed on a side of said first substrate, opposite the side where said doubled-sided tape is located; a lower case disposed on a side of the electronic part, opposite the side where said second substrate is located, and combined with said upper case; and a frame placed between said second substrate and said lower case and having an opening at a position corresponding to said electronic part.

Abstract: A base chassis has projection parts. A surrounding part of an image display surface of a plasma display panel (PDP) is in contact with a contact part formed around an opening part of a front case. The projection parts are fixed to a chassis fixation part of the front case. The projection parts each have an elastic structure part which elastically deforms in response to a pushing force to the display surface of the PDP. An external force from a rear case side is transmitted to the chassis fixation part only, preventing impact to the PDP. When the PDP directly receives an external force from the front case side, the elastic structure part can elastically deform to alleviate the impact to the PDP. This can alleviate stress to the PDP when applied an external force from the front surface and the rear surface of the cases.

Abstract: A system, apparatus and method are described for a printed circuit board assembly. The printed circuit board assembly may include a printed circuit board, a base, and a housing that includes one or more elastomeric pads that may contact the printed circuit board when the printed circuit board assembly is assembled. Other embodiments are described and claimed.

Abstract: A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device.

Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

Abstract: An electronic device (1) has a base plate (2) and an electronics housing (3) connected thereto, with a bonding contact terminal (5). The latter is supported relative to the base plate (2) via a supporting body (6) in such a manner that the supporting body (6) exerts a pre-stressing force onto the bonding contact terminal (5). Due to this support of the bonding contact terminal (5), its position is well defined during the bonding procedure. A secure bond is the result.

Abstract: A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.

Abstract: An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time.

Abstract: An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or “shot”.

Abstract: The present invention discloses UV-epoxy and ultrasonic case assembly methods for a USB flash drive, wherein a transparent or translucent top cover is fastened to a bottom cover containing a printed circuit board assembly via an UV-cure epoxy glue or an ultrasonic weld method. As the top cover of the USB flash drive is transparent or translucent, the USB flash drive has a see-through property and presents an aesthetic taste, which can attract the attention of consumers. Further, the method of the present invention uses less case parts and fewer steps and thus can fabricate a USB flash drive having a lower cost and a better quality at a higher throughput. Furthermore, the USB flash drive fabricated according to the method of the present invention has a better moisture resistance and a better water resistance.

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Abstract: The present invention discloses a solid state drive with a coverless casing, which comprises: a printed circuit board assembly and a coverless casing. In the resent invention, the coverless casing is free of a top cover; thereby, air circulation can be enhanced to cool down the electronic components on a printed circuit board assembly more efficiently. Further, in the present invention, the coverless casing is designed to have the printed circuit board assembly electrically connected to the chassis ground of the host system via the coverless casings; thereby, unwanted electrostatic charges can be dissipated to the chassis ground of the host system before it can damage the electronic components on the printed circuit board assembly; thus, the ESD resistance thereof is promoted.

Abstract: Electronic components include a case, a circuit board, electronic parts, a plate-like electrode terminal, a metal cover, a stepped portion, a connecting terminal, and a fastening member. The case includes a connector portion and an opening. The connector portion has an external terminal. The circuit board mounting the electronic parts is accommodated in the case. The electrode terminal is accommodated in the case and electrically connected to the electronic parts. The plate-like electrode terminal includes a board-side end portion and a case-side end portion. The metal cover closes the opening so as to be spaced away from the circuit board and the electrode terminal. The connecting terminal is arranged on a stepped portion in the case. The connecting terminal is formed integrally with the external terminal. The fastening member connects the case-side end portion to the case. The fastening member electrically connects the case-side end portion to the connecting terminal.

Abstract: A housing for an electronic circuit is provided with a single-part seal for sealing a clearance space between a floor plate and a cover, through which exposed electrical conductors are led, which connect the circuit on the inside of the housing to the surroundings. The floor plate, the cover and the conductors are made of the same kind of material, e.g., a metal. The floor plate and the cover are made of aluminum and the conductors of copper.

Abstract: A printed wiring board includes a glass substrate provided with through-holes, conductive patterns provided on both surfaces of said glass substrate in such a manner as to be made conductive to each other via said through-holes, and a sealing member composed of a silver paste containing an epoxy resin as a binder provided to fill said through-holes. This printed wiring board is advantageous in that circuit parts can be connected to each other without use of any planar special region and moisture does not reach the circuit parts through the printed wiring board. A display apparatus capable of stably displaying pictures for a long-period of time is provided by using the printed wiring board.

Abstract: A protective jacket for covering an electrical device is provided. The protective jacket includes a first shell and a second shell. The first shell includes a front cover, a rear cover, and an elastic strip. The front and the rear covers are formed apart from each other and have an individual hollow for receiving the insertion of the device. The elastic strip is formed between these covers. A space is defined on the first shell by theses covers, and the elastic strip together. The second shell is configured to be disposed within the space of the first shell, and has a slot for receiving the insertion of the device. Therefore, the protective jacket conforms to the shape of the device and is capable of covering the device compactly for preventing damages due to collision and avoiding dust and mist pollution so as to increase the life of the device substantially.

Abstract: An electronic control module includes a body portion, a printed circuit board positioned within the body portion, and a cap portion adapted to mate with the body portion. One of the body portion and the cap portion is formed with a groove and the other of the body portion and the cap portion is formed with a projection that is resiliently deformable upon entry into the groove to mechanically and sealingly couple the body portion and the cap portion. In some constructions, the projection is a U-shaped flange. In some constructions, the body portion and the cap portion are formed by molding a metal alloy from a thixotropic state.

Abstract: A back plate can be connected to a circuit board, and the back plate comprises a plastic member with metal elements fixed onto it, and the metal elements have threaded holes for fixing the plastic member onto the circuit board. Compared to the prior art, the back plate has metal elements which increase the strength of the back plate. In addition, the plastic member is fixed onto the circuit board by means of threaded holes in the metal elements without the use of screw-nuts so as to reduce weight, simplify manufacturing, and reduce the costs of the back plate.

Abstract: The electronic system generally includes an electronic panel having circuitry plated on a surface thereof as well as electronic components attached thereto. The circuitry connects the electronic components for operation of the electronic device in the engine compartment. A flatwire bus electronically connects the electronic panel and the electronic device in the engine compartment for transmitting signals there between. The electronic panel is directly connected to the bulkhead.

Abstract: A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined therein is disposed between the transparent clock and a base of the demonstration tool. The base is designed to enable access to a bottom portion of the circuit board that extends outside of the transparent block and the collar. The bottom portion of the circuit board includes connection ports to power and configure the programmable logic device. A method for embedding a printed circuit board into a housing is also provided.