With Housing Or Chassis Patents (Class 361/796)
  • Patent number: 7813143
    Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: October 12, 2010
    Assignee: ADC Telecommunications, Inc.
    Inventors: James Dorenkamp, Vern Loch, Jeffrey Peters, Wayne Nelson
  • Patent number: 7808792
    Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: October 5, 2010
    Assignee: Juniper Networks, Inc.
    Inventor: Tri Luong Nguyen
  • Publication number: 20100248655
    Abstract: An impact resistant mobile electronic device is disclosed. A case comprises a first circuit board and a second circuit board, and is elongated in a first direction. The second circuit board is smaller than the first circuit board and is elongated in a second direction substantially perpendicular to the first direction. The second circuit board comprises one or more electrical components elongated in a fourth direction. The first circuit board may be elongated in a third direction substantially perpendicular to the second direction.
    Type: Application
    Filed: March 25, 2010
    Publication date: September 30, 2010
    Applicant: Kyocera Corporation
    Inventors: Hiroto YAHAGI, Kenichi Ozasa
  • Patent number: 7791890
    Abstract: A computer system includes a rack, a computer module and an interface-dedicated module to be mounted therein, and an intra-rack management module. The rack has a rear panel for power supply to and signal connection among modules, and the modules permit plug-in mounting onto the rear panel of the rack. The computer module has behind the computer a dedicated adapter which makes possible plug-in mounting of the computer onto the rack and coordinates signals between the computer and the rear panel.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: September 7, 2010
    Assignee: NEC Corporation
    Inventor: Hisashi Ishida
  • Publication number: 20100220456
    Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.
    Type: Application
    Filed: October 16, 2009
    Publication date: September 2, 2010
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventors: Pasi Jukka Vaananen, Stephen A. Hauser, David Paul Banasek
  • Patent number: 7782631
    Abstract: A flat panel display. A panel module and a first securing assembly. A shield has a longitudinal first opening at a side thereof, extending along a first direction. A connection member has a recess extending along the first direction and a second opening extending along a second direction. A panel module is disposed in the recess. The first securing assembly is fastened through the first and second openings and movable with respect to the first and second openings to secure the shield and the connection member.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: August 24, 2010
    Assignee: Qisda Corporation
    Inventor: Chih-Wei Tien
  • Patent number: 7782630
    Abstract: A second printed wiring board is opposed to a surface of the first printed wiring board. A support member supports the first and second printed wiring boards. A first connector is mounted on the first printed wiring board. A second connector is mounted on the second printed wiring board. A wiring connects the first printed wiring board to the second printed wiring board. The first and second connectors are separately mounted on the first and second printed wiring boards, respectively. The sizes of the first and second printed wiring boards can be reduced as compared with the case where connectors are arranged in a row on a single printed wiring board, for example. This results in a reduction in the size of the printed circuit board unit. A large number of the printed circuit board units can be coupled to the back panel.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: August 24, 2010
    Assignee: Fujitsu Limited
    Inventors: Naohiko Kajio, Masaki Yoshimaru
  • Patent number: 7768799
    Abstract: The invention is directed to an apparatus (1) for accommodating a plurality of individual inverters (2), comprising a rack, the individual inverters (2) being removably mountable to the side elements of said rack, said rack having at least one terminal block (10) for receiving cables for current supply and evacuation.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: August 3, 2010
    Assignee: SMA Solar Technology AG
    Inventors: Gunther Cramer, Bernd Engel
  • Patent number: 7764511
    Abstract: A physical hardware architecture is provided to fulfill flexibility, serviceability and configurability of a multi-processor system. The architecture mainly includes a bottom plane, plural processor boards and a function board. On the front section of the top side of the bottom plane, the processor boards are configured thereon. The function board faces downwards and is configured in an edge-to-edge connection with the front edge of the bottom plane. Function card(s) may be configured vertically on the bottom surface of the function board. On the rear section of the top side of the bottom plane expansion card(s) are configured vertically. With main system fan(s) located on the top of the function board and auxiliary system fan configured under the bottom plane, the multi-processor system will also achieve optimum cooling capability through the architecture.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: July 27, 2010
    Assignee: Mitac International Corp.
    Inventors: Mario J. D. Lee, Tomonori Hirai, Jyh Ming Jong
  • Patent number: 7746658
    Abstract: The present invention provides a circuit device in which warpage of a case member is prevented. The circuit device of the present invention includes: a circuit board having on an upper surface thereof a built-in hybrid integrated circuit constituted by a conductive pattern and a circuit element; a case member including four side wall parts forming a frame-like shape and being in contact with the circuit board so as to form on the upper surface of the circuit board a space in which the circuit element is sealed; and a lead being fixed to a pad composed of the conductive pattern and extending to the outside. The circuit device of the present invention is further provided with a supporting part arranged at a corner of the case member so as to make continuous inner walls of the respective side wall parts with each other.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: June 29, 2010
    Assignees: Sanyo Electric Co., Ltd., Sanyo Semiconductor Co., Ltd.
    Inventor: Hidefumi Saito
  • Patent number: 7738253
    Abstract: A power supply assembly includes a housing having side walls, end walls, and a bottom wall defining a rectangular box with an interior space and an open top. A first dividing wall and a second dividing wall are positioned in the interior space of the housing which divides the interior space into first, second, and third compartments. A method of manufacturing a power supply with the above power supply assembly includes installing a printed circuit board in the second compartment and positioning the first wire set to terminate in the first compartment and the second wire set to terminate in the third compartment.
    Type: Grant
    Filed: October 17, 2006
    Date of Patent: June 15, 2010
    Inventor: Richard Alberto Araujo
  • Patent number: 7724543
    Abstract: A communication apparatus which occupies small space and yet can be connected with numerous external cables and which permits a cooling arrangement to be constructed at low cost. An information processing device constituting the communication apparatus has external cable connection ports provided on both top and bottom surfaces thereof, and thus, more external cables can be connected than in the case of connecting the cables to the side surfaces. Also, the external cables connected to the ports are guided along the top and bottom surfaces toward the front of the communication apparatus with their heights restricted by external cable covers and, therefore, do not occupy substantial space above and below the device. Further, since the external cables are connected to the top and bottom surfaces, the front and rear surfaces of the device have spare space, making it possible to construct a ventilation arrangement such as vent holes and fans.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: May 25, 2010
    Assignee: Fujitsu Limited
    Inventors: Fujio Ozawa, Tetsuya Murayama, Junichi Hayama, Hiroyuki Abe, Hisato Sato
  • Patent number: 7725142
    Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: May 25, 2010
    Assignee: ADC Telecommunications, Inc.
    Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Derek Sayres, Eric Sit
  • Publication number: 20100118504
    Abstract: A method for fabricating a multi-piece board includes: preparing a board main portion having a first coupling member and multiple piece portions connected to the first coupling member, the first coupling member forming a part of a coupling member of a multi-piece board, each of the piece portions having a printed wiring board; preparing a second coupling member which forms the coupling member together with the first coupling member; and adhering the second coupling member to the first coupling member of the board main portion, thereby yielding the multi-piece board.
    Type: Application
    Filed: August 7, 2009
    Publication date: May 13, 2010
    Applicant: IBIDEN CO., LTD.
    Inventor: Yasushi HASEGAWA
  • Patent number: 7715208
    Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: May 11, 2010
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Javier Leija, William Handley
  • Patent number: 7710730
    Abstract: A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold the substrate in the electronic device. The heat conducting element is respectively connected to the heat source and the fixing element. The heat source is a part of the electronic device and the fixing element is integrated with the heat conducting element as a single component. An electronic device having the fixing heat dissipating unit is also disclosed.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: May 4, 2010
    Assignee: Arcadyan Technology Corporation
    Inventor: Liang-Wei Chen
  • Patent number: 7698491
    Abstract: A modular patch panel for interconnecting a data storage system controller to data storage enclosures is provided. The modular patch panel includes a chassis and modular interface circuitry. The chassis has a front end and a back end, the front end and the back end being horizontally opposed, the back end attaching to a panel portion of a rack system, the panel portion electrically connecting to the data storage enclosures over a set of point-to-point connections. The modular interface circuitry has (a) a data storage interface portion electrically connected to the set of point-to-point connections through the panel and (b) a controller interface portion electrically connecting to the data storage system controller through the front end. The modular interface circuitry is interchangeable through an opening in the front end.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: April 13, 2010
    Assignee: EMC Corporation
    Inventors: Joseph P. King, Jr., William Brian Cunningham, Ilhan Gundogan
  • Publication number: 20100073895
    Abstract: An electronic device includes: a housing; a first board provided with a first connector and fixed to the housing; and a second board provided with a second connector connected to the first connector, the second board being connected to the housing and having a long hole through which a fastening member for fixing is inserted. The long hole extends in a direction having a predetermined relationship with a circumference of a circle surrounding the second connector positioned in a center of the circle.
    Type: Application
    Filed: July 14, 2009
    Publication date: March 25, 2010
    Applicant: FUJITSU LIMITED
    Inventor: Takashi Yoshida
  • Patent number: 7685349
    Abstract: Embodiments of a module and backplane are presented herein.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: March 23, 2010
    Assignee: Telect Inc.
    Inventors: Brian Allen, Terry Thom, Richard Garrett
  • Patent number: 7679932
    Abstract: A housing mechanism (100) includes a main body (60) and a shield/cap (70). The main body accommodates an inner interface and defines a port (63) therein. The port is configured for allowing an outer interface to be inserted into the main body and for thereby engaging the outer interface with the inner interface. The shield is located near the port and is selectably rotatably positionable between a first position, in which the shield covers the port, and a second position, in which the shield does not cover the port. The first position and the second position cooperate to form an angle therebetween.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: March 16, 2010
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Yu-Lun Lu
  • Patent number: 7679934
    Abstract: A mounting apparatus includes a securing mechanism, a drive bracket (20), and a fastener (50). The securing mechanism has a securing hole (15) defined in a circuit board (10). The drive bracket includes first and second side plates (23, 24). The first side plate defines a mounting hole (237) therein, corresponding to the securing hole of the circuit board. The second side plate forms two lines of tabs (243) for sandwiching the circuit board therebetween. The fastener engages into the securing hole of the securing mechanism and the mounting hole of the drive bracket, for preventing the circuit board releasing from the tabs.
    Type: Grant
    Filed: May 29, 2006
    Date of Patent: March 16, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Lu Fan, Chieh Yang, Li-Ping Chen
  • Patent number: 7673022
    Abstract: In an information processing apparatus having a function for exploiting higher performance than a single server module by constituting an SMP by combining a plurality of server modules, a user is inhibited from illegally constituting an SMP construction that exceeds license information. When a partition is constituted by a construction against the SMP license information, a slot number representing the number of server modules belonging to a partition and mounted to a chassis and the number of server modules in the same partition are checked and the SMP construction is inhibited when they do not fall within the range of the slot number and the number of server modules in the license information.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: March 2, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Takuhiro Kawaji, Yoshinori Wakai, Nakaba Osano
  • Patent number: 7663886
    Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: February 16, 2010
    Assignees: Aisin AW Co., Ltd., Fuji Electric Device Technology Co., Ltd.
    Inventors: Kazuo Aoki, Junji Tsuruoka, Seiji Yasui, Yasushi Kabata, Shin Soyano
  • Patent number: 7656669
    Abstract: A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: February 2, 2010
    Assignee: Mitac International Corp.
    Inventors: Mario J. D. Lee, Tomonori Hirai, Jyh Ming Jong
  • Patent number: 7652889
    Abstract: An apparatus adapted for locating position of an electronic system or device in an information technology (IT) center comprises a connector strip adapted for attachment to a rack cabinet configured for mounting multiple electronic devices, and a jumper adapted for interfacing an electronic device of the multiple electronic devices and configured to mate with and attach to the connector strip. The apparatus further comprises a logic adapted to identify position of the interfaced electronic device in the rack cabinet based on attachment of the jumper to the connector strip.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: January 26, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thane M. Larson, Christopher G. Malone
  • Patent number: 7652891
    Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: January 26, 2010
    Assignee: RadiSys Corporation
    Inventors: Christopher D Lucero, Javier Leija, James C Shiplev, Christopher A Gonzales
  • Publication number: 20100008057
    Abstract: The invention concerns an anti-interference advice for a housing (1) including at least two electrically conductive terminals (32, 33) distinctly positioned on an electronic card (30) and connected to processing means, a protective circuit (45) positioned relative to the two electrically conductive terminals (32, 33) in such a manner as to close the electrical circuit during the normal utilisation position of the housing (1), the protective circuit (45), including means adapted for opening the electrical circuit closed in response to a deterioration in the protective circuit (45).
    Type: Application
    Filed: May 31, 2007
    Publication date: January 14, 2010
    Applicant: INGENICO FRANCE
    Inventors: Eric Bonnet, Gary Didier, Lilian Vassy
  • Publication number: 20100008031
    Abstract: A mobile device comprising a touch screen and a method for activation thereof using one hand. The device is provided with physical controls or virtual such as touch-screen controls arranged in areas reachable when using one hand, preferably for right-handed persons the right hand side of the device and the vertically middle area of the device. The user interface of various options and applications is arranged so that the relevant operations are performed via controls located in these areas. The controls may change dynamically according to the application or operation.
    Type: Application
    Filed: July 8, 2008
    Publication date: January 14, 2010
    Applicant: Emblaze Mobile Ltd
    Inventors: Eli REIFMAN, Itai VONSHAK, Alex RAPOPORT
  • Patent number: 7643307
    Abstract: A data processing system and method providing a jumper which provides standby power from a redundant power supply to one of at least two critical functions in a frame having bays for holding at least two nodes. The redundant power supply supplying power to one of the nodes in the frame and one of the critical functions. A jumper is slidably engageable in the frame in place of one of the nodes. The jumper, when engaged in the frame, transfers power from the redundant power supply to the other of the critical functions. The jumper is included in a jumper book of an airblock which includes passive airblock books. Mechanical keys on the passive airblock books prevent the removal of the jumper book until after the passive airblock books are removed.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: January 5, 2010
    Assignee: International Business Machines Corporation
    Inventors: Frank E. Bosco, Douglas A. Baska, Joseph P. Corrado, Gerald J. Fahr, William P. Kostenko, Mitchell L. Zapotoski
  • Patent number: 7643286
    Abstract: A symmetric multiprocessor computer is provided with a star interconnection architecture and a cooling system. The star interconnection architecture include a middle plane, and plural first processor boards and second processor boards configured vertically onto opposite surfaces of the middle plane. The first processor boards and the second processor boards are crisscross to each other at the opposite surfaces of the middle plane. The cooling system includes a first cooling module and a second cooling system module configured for generating a plurality of first airflows and second airflows for the first processor boards and the second processor boards respectively, wherein the paths of the first airflows and the second airflows are crisscross to each other at the opposite surfaces of the middle plane.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: January 5, 2010
    Assignee: Mitac International Corp.
    Inventors: Tomonori Hirai, Mario J. D. Lee, Jyh-Ming Jong
  • Patent number: 7643309
    Abstract: A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic sub-system environmentally sealed within the ruggedized housing. At least one electrical interface is configured to couple to an external electrical connector.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: January 5, 2010
    Assignee: Rockwell Collins, Inc.
    Inventor: Steve I. Lebo
  • Patent number: 7636243
    Abstract: A re-usable adapter card interfaces with a first card such that components requiring a lower certification level—e.g., commercial off-the-shelf (COTS) components or the like—may be isolated on the first card, wherein the adapter card includes high certification-level parts and communicates with the first card. The two cards are electronically and mechanically coupled to form the finished board assembly. The interface card may be re-used in a variety of current or future cabinet specifications, including, for example, cabinets manufactured in accordance with the Compact PCI (cPCI) 3U and 6U specifications.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: December 22, 2009
    Assignee: The Boeing Company
    Inventor: Gregory L. Sheffield
  • Patent number: 7630211
    Abstract: An electronic shelf assembly includes a frame having a plurality of card slots arranged in parallel to each other along an axis of the frame and a midplane having a plurality of connectors are arranged to align with the card slots. Conductive traces are connected to predetermined pins of the midplane connectors and provide point-to-point signaling pathways between midplane connectors aligned with different card slots. An application node card may reside in one of the plurality of card slots. The application node card may have an application processor, a disk controller, and an application card connector. The application card connector is adapted to interface with at least some of the pins of one of the plurality of midplane connectors. A disk storage card may reside in one of the plurality of card slots. The disk storage card may have at least one storage media unit and a disk interface connector.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: December 8, 2009
    Assignee: Tekelec
    Inventors: Thomas L. Bonds, Jr., Jennifer Warfel, Erick Thomas Swanson
  • Patent number: 7626826
    Abstract: An expansion card carrier is disclosed, the expansion card carrier including a top portion for covering an expansion card, at least one side portion for supporting the top portion, and at least one pair of card guides for allowing an expansion card to slide along into the expansion card carrier. A method for assembling an expansion card carrier is also disclosed, the method including casting a panel including a top portion for covering an expansion card and at least one side portion for supporting the top portion, forming at least one side portion by deforming the panel, and attaching at least one pair of card guides inside the expansion card carrier for allowing an expansion card to slide along into the expansion card carrier.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: December 1, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Thomas E. Stewart, Mark H. Chen, Alan L. Winick, Michael S. White
  • Patent number: 7626830
    Abstract: A bracket assembly includes a first expansion card (30), a second expansion card (26), a riser card (20) for horizontally receiving the second expansion card, and a retaining bracket (10) configured for securing to a computer chassis which provides connectors for the first expansion card and the riser card. The first expansion card has a first slot cover (31) at a front side thereof. The second expansion card has a second slot cover (21) at a front side thereof. The retaining bracket has a rectangular receiving wall (11). A bottom wall (14) and at least one side wall (12) extend perpendicularly from a periphery of the receiving wall. The receiving wall defines a first slot (111) and a second slot (112). The first slot and the second slot respectively receive the first slot cover and the second slot cover.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: December 1, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Lu Fan, Li-Ping Chen
  • Patent number: 7616446
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: November 10, 2009
    Assignee: NEC Corporation
    Inventor: Yousuke Watanabe
  • Patent number: 7602617
    Abstract: A backplane configuration is described for supporting a range of modular components mechanically and for making electrical connections between the components. The backplane is particularly well-suited to power distribution and control applications, such as in industrial motor drives, and so forth. The backplane includes a number of bays or slots for modular components, as well as a bus topography that allows for switched or common connections between the various components.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: October 13, 2009
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: David D. Brandt, Wayne H. Wielebski, Neil Gollhardt
  • Patent number: 7599194
    Abstract: A redundant pair of interconnected board sub-assemblies have substantially the same dimensions and level of functionality. A module interconnect card is configured to mechanically and electronically connect to the first and second board sub-assemblies. Each sub-assembly is configured (e.g., via a properly configured microcontroller) to compensate for a loss of functionality in the other sub-assembly. Each subassembly preferably includes a re-usable adapter card that interfaces with a first card such that components requiring a lower certification level—e.g., commercial off-the-shelf (COTS) components or the like—may be isolated on the first card, wherein the adapter card includes high certification-level parts and communicates with the first card. The two cards are electronically and mechanically coupled to form the finished board assembly.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: October 6, 2009
    Assignee: The Boeing Company
    Inventor: Gregory L. Sheffield
  • Patent number: 7599189
    Abstract: A resin case main body includes a connector housing, a component housing, and a joint portion. A busbar includes a reinforcement plate portion which is orthogonal to a plane of a board and is parallel to an alignment direction of the connector housing, the joint portion, and the component housing. The reinforcement plate portion is formed by insert molding in the joint portion.
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: October 6, 2009
    Assignee: Advics Co., Ltd.
    Inventors: Kosei Nishimoto, Koji Yanai, Takahiro Naganuma
  • Patent number: 7598461
    Abstract: An electronic apparatus is mountable in either of a standard mount state in a rack, or an offset mount state which offsets forward from the standard mount state in a depth direction of the rack. A pair of side boards extend rearward from a front panel in the depth direction, and are spaced apart from each other at left and right sides in a width direction perpendicular to the depth direction. A pair of rack angles are attached to the pair of the side boards, respectively. The rack angle is composed of a first mounting plate and a second mounting plate intersecting perpendicularly to the first mounting plate. One of through-holes formed in the first mounting plate of the rack angle and screw holes formed in the side board is positioned in correspondence to both of the standard mount state and the offset mount state, so that the rack angle is selectively attached to the side board in either of the standard mount state and the offset mount state.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: October 6, 2009
    Assignee: Yamaha Corporation
    Inventors: Yoshikuni Kitamura, Ken Iwayama
  • Patent number: 7595984
    Abstract: A support tray with fold-away handles is disclosed. When the support tray (which may be used to support a printed circuit board) is installed into a computer chassis, the handles are put into an upright position in which the handles extend above the support tray. In this position, the handles can be held by a user to easily lower the support tray into the chassis. When the support tray is not installed in a chassis (e.g. when the support tray is being shipped), the handles are put into a fold-away position in which the handles are situated underneath the support tray. This enables the support tray to maintain a low profile when the handles are not in use.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: September 29, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Brett C. Ong, Andrew P. Tosh, William A. De Meulenaere
  • Patent number: 7593233
    Abstract: The invention relates to a module for a measuring device and to a measuring device. The inventive module for a measuring device is provided with a plug-in contact element for the electrical contact of the plug-and-socket plate of the measuring device which is used for data transfer. Said module for the measuring device comprises a main circuit card arranged in the first circuit card space. Said first circuit card space is formed by at least one first element of the body which encompasses the circuit card in a closed manner on the level of the external periphery thereof.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: September 22, 2009
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventors: Torsten Mueller, Birgit Seitz, Reiner Hausdorf, Rudolf Reckziegel
  • Patent number: 7589974
    Abstract: A modular computer system is provided. In one embodiment, the system includes a computer server having a first printed circuit assembly disposed within a first housing and an expansion connector. The computer server is configured to be coupled to a modular expansion unit via the expansion connector to convert the computer server from a base configuration to an expanded configuration. In various embodiments, the expanded configuration may provide additional processing power, additional memory, or the like. A method of assembling a modular computer system is also provided.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: September 15, 2009
    Assignee: Helwett-Packard Development Company, L.P.
    Inventors: John R. Grady, Jeffery M. Giardina, Aaron M. Albaugh
  • Publication number: 20090215318
    Abstract: A device may include a card including a card connector and/or a card edge lockshield disposed on at least a card connector first side. Additionally, a computer system may include a motherboard including at least one mating connector and/or at Least one card including a card connector and a card edge lockshield disposed on at least a card connector first side. Further, a method for providing the device and/or computer system is disclosed.
    Type: Application
    Filed: February 25, 2008
    Publication date: August 27, 2009
    Inventor: Kenneth Hass
  • Patent number: 7576997
    Abstract: A method and apparatus for adapting a backplane from one type of connector to another type of connector is disclosed. The method includes providing a backplane with a plurality of connectors, each connector being of a first type of connector, providing at least one extension module having a plurality of connectors, each connector being of a second type of connector, and plugging the at least one extension module into at least one of the first plurality of first type of connectors, thereby converting the first type of connectors into the second type of connectors. In a preferred embodiment, the backplane is used in a SONET communications system, and the conversion is from DS1 to DS3 connectors. The conversion allows an individual user to begin with one type of connector, and later expand as the need arises to an additional type or types of connectors.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: August 18, 2009
    Assignee: Fujitsu Limited
    Inventors: Stephen J. Brolin, Albert Pedoeem, Tom Chiodo, Willie Braun
  • Publication number: 20090190297
    Abstract: The invention is to provide a motherboard expansion device that expands the possibility to use non-portable computers in different applied systems and allows them to operate with a plurality of external devices.
    Type: Application
    Filed: January 29, 2008
    Publication date: July 30, 2009
    Inventors: Michael Feldman, Alexander Feldman, Boris Feldman
  • Patent number: 7564698
    Abstract: At least one mounting member having a guide groove mounted on a side of a chassis base for supporting a plasma display panel, and at least one printed circuit board slidingly mounted along the guide groove. Such mounting of a printed circuit board enables enhancement of production efficiency. By forming a ground electrode on the PCB along a position contacting the guide groove, grounding of the PCB is enhanced and electromagnetic interference thereof is minimized.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: July 21, 2009
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Se-Il Oh
  • Patent number: 7561439
    Abstract: A first slot connector is mounted within a housing of an electronic system and is for connecting to a first plug-in card. A mezzanine board is installed within the housing. A second slot connector is mounted on the mezzanine board for connecting to a second plug-in card. The first and second plug-in cards align with similarly-shaped slot access panels in the electronic system.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: July 14, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Orville H. Orr, Edgar Hance, Ho M. Lai, John D. Nguyen, Minh H Nguyen, Christian H. Post, Karthigan Srinivasan
  • Patent number: 7558074
    Abstract: A partitioning device for holding slots of a host computer case, including: a host computer outer case provided with a horizontal upper panel; an upper cover; more than one rectangular partition; vertical connecting holes are defined in an upper side of each of the rectangular partitions, which provide for vertical penetration into the holding slot; bolts bolt into the through holes and into the vertically connecting holes, thereby fixing the partitions within the holding slot, thus partitioning the holding slot and forming at least more than two holding spaces, thereby achieving control of the number and size of the more than two holding spaces so as to accommodate he insertion of modular cases of various size specifications.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: July 7, 2009
    Assignee: Super Micro Computer, Inc.
    Inventor: Chien-Fa Liang
  • Patent number: 7558073
    Abstract: A multifunctional apparatus includes a first circuit board which is installed on a low surface of a main body, receives a current from an external power source and supplies the current to other circuit boards and devices; a second circuit board which is installed on a surface of the main body and includes a controller to control the other circuit boards and devices; and a third circuit board which is installed on an upper surface of the main body and supplies the current or transfers control signals to a scanning unit.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: July 7, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong-pil Lim, In-gu Kwak