With Housing Or Chassis Patents (Class 361/796)
  • Patent number: 7554818
    Abstract: A telecommunications system is provided to allow for the securement of a module to a chassis in multiple positions. The multiple positions may include a storage position and/or an engaged position.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: June 30, 2009
    Assignee: Telect Inc.
    Inventor: Terry T. Thom
  • Patent number: 7551449
    Abstract: The flexible circuit board according to the present invention includes a plurality of mounting portions which are mounted with electronic circuits respectively, a connector portion that performs signal transmission between the electronic circuit mounted on each of the mounting portions and the electronic circuit device, and coupling portions that couple the respective mounting portions to the connector portion in different directions. The flexible circuit board is mounted on the electronic circuit device in a state of being folded at a predetermined part of one of the coupling portions.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: June 23, 2009
    Assignee: NEC Corporation
    Inventor: Kenichiro Yasui
  • Publication number: 20090154129
    Abstract: A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.
    Type: Application
    Filed: February 13, 2009
    Publication date: June 18, 2009
    Inventors: Gordon Clark, Loren Mattson
  • Publication number: 20090154098
    Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicant: JUNIPER NETWORKS, INC.
    Inventor: Tri Luong Nguyen
  • Patent number: 7542306
    Abstract: An apparatus comprising a chassis and a cassette. The chassis includes a first electronic circuit board with a first connector, chassis flex circuitry with a disengageable contacts, a controller in communication with the chassis flex circuitry, and a power supply in communication with the controller and the first electronic circuit board. The cassette is selectively securable to the chassis, the cassette including a second electronic circuit board with a second connector, and a cassette handle with cassette flex circuitry that includes a switch and disengageable contacts, wherein securing the cassette to the chassis positions the disengageable contacts of the cassette flex circuitry in engagement with the disengageable contacts of the chassis flex circuitry to form a circuit and positions the first connector in electronic communication with the second connector, and wherein the circuit allows the controller to detect the condition of the switch.
    Type: Grant
    Filed: February 27, 2007
    Date of Patent: June 2, 2009
    Assignee: International Business Machines Corporation
    Inventor: Brian Michael Kerrigan
  • Patent number: 7539023
    Abstract: A power supply is described. The power supply includes a main power connector and one or more circuit boards rigidly connected to the main power connector, including mechanical and electrical connection. The main power connector has a body that includes a plurality of contacts. The main power connector is configured to mate with a corresponding connector on a motherboard in a computer. The motherboard is coupled to one or more processors. A first plane including a first circuit board in the one or more circuit boards is substantially parallel to a symmetry plane of the body. The symmetry plane includes a direction of insertion of the main power connector when mated with the corresponding connector. The one or more circuit boards include one or more switched mode power supplies to convert an input signal to one or more output signals.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: May 26, 2009
    Inventor: Andrei Bulucea
  • Publication number: 20090122499
    Abstract: An electric equipment assembly is sized and configured to be disposed in a machine chamber of an outdoor unit. Reduction in size of the electric equipment assembly is achieved and simultaneously visibility and serviceability of a highly frequently accessed element are ensured, while employing a structure in which a control circuit board is covered by a protection cover. The electric equipment assembly includes a frame having a substrate attachment plate to which a control circuit board mounted with various electric components is attached and a substrate protection plate which covers the control circuit board. The outer surface of the substrate protection plate has a first auxiliary attachment portion formed thereon, to which a first auxiliary circuit board different from the control circuit board and mounted with a highly frequently accessed control element is attached.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 14, 2009
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hisashi Takeichi, Naohiro Kawasaki
  • Patent number: 7529858
    Abstract: A hard disk controller (HDC) chip has interchangeable “A” and “B” ports of differential connector element pairs, with one connector element of each pair being disposed closest to the edge of the chip and with the other element inboard of it to facilitate connection to more than one printed circuit board (PCB) serial interface pinout without crossing traces of a pair and with maintaining traces of a pair parallel and on the same PCB level.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: May 5, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Philip Joseph Engelmeyer, Miroki Nonaka, Paul Emmit Larson, Jr., Dennis Carl Mairet
  • Patent number: 7522428
    Abstract: Electric device, designed to be attached to a mounting rail, comprising a body fitted with means for locking onto the rail comprising at least one lug that can be moved between a locked position and an unlocked position, designed to interact with a first edge of the rail, the lug being subjected to the action of an elastic element placed in a housing of the body and pressing on the latter and on the movable lug, wherein the elastic element is of elongated shape, substantially rectilinear in a rest position, the housing comprising an opening for the insertion of the elastic element, placed substantially along the same axis as that of the elastic element in the rest position and leading to the outside of the body, on the lateral face of the body perpendicular to the longitudinal axis of the rail.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: April 21, 2009
    Assignee: ABB France
    Inventor: Eric Nguyen
  • Patent number: 7522427
    Abstract: The invention relates to an electrical module, comprising a first electrical interface, said module being attachable to an electrical device for connecting said first electrical interface to said device. The electrical module is characterised by at least one locking device adapted to prevent movement of said module in relation to said electrical device in at least one direction, said locking device comprising a first part which is movable along a first axis and a second part which is turnable about a second axis, the second part being movable to a locking position by turning about said second axis in response to linear movement of the first part along said first axis, said second axis having an extension which is different from the extension of said first axis, and said second part being adapted for engagement with said electrical device in said locking position.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: April 21, 2009
    Assignee: HMS Industrial Networks AB
    Inventors: Leif Malmberg, Staffan Dahlström, Niklas Eliasson
  • Patent number: 7522426
    Abstract: A backplane has signal connectors for connecting signals of logical boards connected to an upper level of the backplane; signal connectors for connecting signals of logical boards connected to a lower level of the backplane; power source connectors for supplying power to the logical boards connected to the upper level of the backplane; and power source connectors for supplying power to the logical boards connected to the lower level of the backplane. Some power source connectors are formed at one end of the backplane and the other power source connectors are formed at the other end of the backplane.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: April 21, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Koga, Mitsuru Inoue
  • Patent number: 7518877
    Abstract: A mounting apparatus for mounting a circuit board that is electrically connectable with at least one hard disk drive, includes a chassis for receiving the circuit board, a bracket for receiving the at least one hard disk drive, and a securing member for pressing the circuit board. The bracket is mounted to the chassis. A rear end of the bracket faces the circuit board. The securing member is pivotably mounted to the bracket.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: April 14, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Tang Peng, Mo-Ming Yu, Shun-Hai Lin
  • Patent number: 7515431
    Abstract: A handheld computing device is disclosed. The handheld computing device includes a seamless enclosure formed from an extruded tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless enclosure, and a support structure for supporting the operational assembly during use.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: April 7, 2009
    Assignee: Apple Inc.
    Inventors: Stephen Paul Zadesky, Stephen Brian Lynch
  • Publication number: 20090086431
    Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 2, 2009
    Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.
    Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
  • Publication number: 20090086455
    Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 2, 2009
    Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.
    Inventors: Hideyuki SAKAMOTO, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
  • Publication number: 20090086454
    Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 2, 2009
    Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.
    Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
  • Publication number: 20090080163
    Abstract: A method and apparatus for aligning a connector between a printed wiring board and a mezzanine board includes mounting the printed wiring board to a frame, locating a cover with respect to the frame by way of a first pin and a second pin, fastening the cover to the frame, locating the mezzanine board with respect to the cover by way of a third pin and a fourth pin, and fastening the mezzanine board to the cover.
    Type: Application
    Filed: May 16, 2008
    Publication date: March 26, 2009
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventor: Timothy F. Lyons
  • Patent number: 7499289
    Abstract: A server wherein an interior of which is connected with five expansion boards is composed of a server at a height of 1U, an interior of which is fixed with a circuit motherboard on which is welded with expansion slots; a first riser card which is inserted into the first expansion slot; a first expansion board which is inserted into a transversal slot of the first riser card; a second riser card which is inserted into the second expansion slot; a second expansion board which is inserted into a transversal slot of the second riser card; a third riser card which is inserted into the third expansion slot; a third expansion board which is inserted into a transversal slot of the third riser card; a fourth riser card which is inserted into the fourth expansion slot; a fourth expansion board which is inserted into a lower slot; and a fifth expansion board which is inserted into an upper slot; such that the circuit motherboard, and five expansion boards are installed in the server.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: March 3, 2009
    Assignee: Super Micro Computer, Inc.
    Inventor: Chien-Fa Liang
  • Patent number: 7495169
    Abstract: A network cabinet is provided including a base member, two pairs of vertical frame rail members connected to the base member, and a top cover supported by at least one of the vertical frame rail members. The base member defines an opening and another opening is defined in the top cover. The vertical frame rail members are positioned spaced apart from four sidewalls from four corners of the cabinet formed by the four sidewalls, where each sidewall includes a panel or a door. The two pairs of vertical frame rail members and the four sidewalls define at least one cable management pathway and at least a portion of the cable management pathway is vertically aligned with at least a portion of the opening of the base member and the opening of the top cover.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: February 24, 2009
    Assignee: Panduit Corp.
    Inventors: Samuel J. Adducci, Christopher A. Dybek, Bruce R. Appino, Max W. Hibner, Michael J. McGrath
  • Patent number: 7489522
    Abstract: A case for electronic equipment includes: a chassis that includes at least a bottom plate of an enclosure having a box-shaped outer shell; a stay that holds a motherboard perpendicularly with respect to the bottom plate; guide members that are provided with slots for guiding a substrate unit to be perpendicularly plugged into the motherboard by way of a connector, the guide members being disposed on both sides for guiding the substrate unit, and being configured to pull out integrally with the motherboard towards a plug-in side from which the substrate unit is plugged in; and a cover that includes at least a top cover side of the enclosure except for a portion corresponding to the bottom plate and a portion corresponding to the plug-in side.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: February 10, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsutomu Hoshino, Akira Sugiyama
  • Patent number: 7485803
    Abstract: A network cabinet is provided includes a base member, two pairs of vertical frame rail members connected to the base member, and a top cover supported by at least one of the vertical frame rail members. The base member defines an opening and another opening is defined in the top cover. The vertical frame rail members are positioned spaced apart from four sidewalls from four corners of the cabinet formed by the four sidewalls, where each sidewall includes a panel or a door. The two pairs of vertical frame rail members and the four sidewalls define at least one cable management pathway and at least a portion of the cable management pathway is vertically aligned with at least a portion of the opening of the base member and the opening of the top cover.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: February 3, 2009
    Assignee: Panduit Corp.
    Inventors: Samuel J. Adducci, Christopher A. Dybek, Bruce R. Appino, Max W. Hibner, Michael J. McGrath
  • Patent number: 7476804
    Abstract: A network cabinet is provided includes a base member, two pairs of vertical frame rail members connected to the base member, and a top cover supported by at least one of the vertical frame rail members. The base member defines an opening and another opening is defined in the top cover. The vertical frame rail members are positioned spaced apart from four sidewalls from four corners of the cabinet formed by the four sidewalls, where each sidewall includes a panel or a door. The two pairs of vertical frame rail members and the four sidewalls define at least one cable management pathway and at least a portion of the cable management pathway is vertically aligned with at least a portion of the opening of the base member and the opening of the top cover.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: January 13, 2009
    Assignee: Panduit Corp.
    Inventors: Samuel J. Adducci, Christopher A. Dybek, Bruce R. Appino, Max W. Hibner, Michael J. McGrath
  • Patent number: 7473931
    Abstract: An improved device and method for mounting an avionic system is shown. The design provides varying locations of key components, which allows a single mounting system to be used with several varieties and configurations of aircraft within the crowded confines of an instrument panel. Ranges of flexibility with this system include the ability to arrange modules horizontally, and the ability to locate the display unit vertically. The multi-dimensional mounting flexibility of the mounting system shown allows electronic modules to be mounted in close proximity to a display unit, which greatly increases accessibility of the modules over prior configurations where modules were housed in the nose of the aircraft, the rear of the aircraft, or other remote locations. Installation, repair, and replacement are all greatly simplified with this configuration.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: January 6, 2009
    Assignee: Garmin International, Inc.
    Inventors: Jeffrey L. Beseth, Sheldon T. Wheaton, Walter J. Rolston, Jared S. Klein
  • Patent number: 7468891
    Abstract: A reduced size multiplexer and, in particular, a reduced size SONET multiplexer module is provided for use in a reduced size enclosure. The SONET multiplexer module has electrical and optical connectors on its faceplate to provide ease in access without having to remove the SONET multiplexer from the enclosure. The SONET multiplexer circuit is configured in a standard Type 400 mechanics circuit board arrangement. The SONET multiplexer module therefore can be inserted into an enclosure in a direction opposite to that in which the coaxial connector projects from the face plate, so that the coaxial connector remains freely accessible outside of the enclosure when the SONET multiplexer module is fully loaded into the enclosure. Coaxial cables and optical fibers can thus be easily coupled to the coaxial and optical connectors, respectively, when the SONET multiplexer circuit is fully loaded into the enclosure.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: December 23, 2008
    Assignee: Hubbell Incorporated
    Inventors: Bruce Lipski, Gary M. Miller, David O. Corp
  • Patent number: 7458815
    Abstract: A chassis includes a plurality of slots to receive modules. The chassis further includes a first backplane to couple to modules that are received in the plurality of slots. The modules are to couple to the first backplane via a first communication interface on each module. The chassis also includes a second backplane to couple to at least a subset of the modules via a second communication interface on each of the subset of modules. One of the backplanes may be located in an upper or lower air plenum and used to interconnect modules slid along the slots from opposite directions. Some of the module connectors may be retractable to enable the modules to move into the chassis. The interface may be electrical, optical inductive or capacitive.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 2, 2008
    Assignee: Intel Corporation
    Inventors: Hassan Fallah-Adl, Edoardo Campini, Robert J. Albers
  • Patent number: 7453706
    Abstract: A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: November 18, 2008
    Assignee: ADC Telecommunications, Inc.
    Inventors: Gordon Clark, Loren Mattson
  • Patent number: 7453707
    Abstract: A method and system for housing electronic components includes a chassis having a first sub-chassis slidably dockable into a first end of the chassis. The first sub-chassis houses a first set of electronic components and includes a backplane to electrically couple the first set of electronic components to a second set of electronic components located adjacent to the first sub-chassis. The second set of electronic components is housed in a second sub-chassis, which is accessible via a second end of the chassis. The backplane is accessible by slidably undocking the first sub-chassis without removal of any one of the second set of electronic components. Some of the second set of electronic components are accessible by slidably undocking the first sub-chassis and without removal of the backplane.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: November 18, 2008
    Assignee: Dell Products L.P.
    Inventors: Christopher S. Beall, Edmond Bailey, Alex Z. Rodriguez
  • Patent number: 7445156
    Abstract: A data management device and library are provided for organizing, holding, and providing electrical connectivity to multiple memory cards. The data management device can comprise a device body, a plurality of sockets to accommodate the data storage media, an electrical connector, and a power management circuit. Data can be retrieved from or transferred to the selected memory cards utilizing the device. The data management library can be utilized to interconnect multiple devices and can be daisy chained to other libraries.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: November 4, 2008
    Inventor: James A. McDonald
  • Patent number: 7443695
    Abstract: A system having a removable protective enclosure for an electronic component. The protective enclosure may have a base and a circuit board that may be captured by the base without use of a tool or a separate fastener. A memory module may be disposed on the circuit board. The protective enclosure may be adapted to be mechanically and electrically coupleable to an enclosure.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: October 28, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brett D. Roscoe, George D. Megason, Christian H. Post
  • Patent number: 7443844
    Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504).
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 28, 2008
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventors: Douglas L. Sandy, Jeffrey M. Harris, Robert C. Tufford
  • Patent number: 7440262
    Abstract: A modular power distribution system comprises a chassis and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) a circuit protection device; and (ii) a power output connection location. Bus bars connect front power inputs to the backplane.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: October 21, 2008
    Assignee: ADC Telecommunications, Inc.
    Inventors: Joseph Coffey, David Johnsen, Duane Sand, Bradley Blichfeldt
  • Patent number: 7440450
    Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 21, 2008
    Assignee: Emerson Network Power-Embedded Computing, Inc.
    Inventors: Jeffrey M. Harris, Douglas L. Sandy, Robert C. Tufford
  • Publication number: 20080247146
    Abstract: A fixing system for printed circuit boards arranged one above the other in an electronics housing, in particular for automotive applications. One printed circuit board is fixed to the electronics housing by a rigid fixing means and all of the other printed circuit boards are fixed by way of sprung fixing means. The is provided an advantageous fixing system for printed circuit boards arranged one above the other in an electronics housing which makes it possible for the printed circuit boards to be mounted in a stress-free manner, but in the process forms defined thermal transition regions, and which requires little installation space on the printed circuit board. It is particularly suitable for automotive applications.
    Type: Application
    Filed: July 27, 2006
    Publication date: October 9, 2008
    Applicant: VDO AUTOMOTIVE AG
    Inventor: Nikolaus Kerner
  • Patent number: 7433203
    Abstract: A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: October 7, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: George Youzhi Yi, William Jeffrey Lewis, Hung-Ting Lin, Kuang Hsin Hsu
  • Publication number: 20080239688
    Abstract: An open rail card cage for electronic assemblies is disclosed. The open rail card cage includes a base, an inlet side attached to the base, an outlet side attached to the base, the outlet side offset from the inlet side, a plurality of rail mounts attached to the base and positioned between the inlet side and the outlet side, wherein the plurality of rail mounts further comprise sets of layered guide rails that orient the electronic assemblies parallel to a direction of an airflow between the inlet side and the outlet side, and at least one first set of the layered guide rails spaced apart from at least one second set of the layered guide rails by at least one first air vent.
    Type: Application
    Filed: March 27, 2007
    Publication date: October 2, 2008
    Applicant: ADC TELECOMMUNICATIONS, INC.
    Inventors: Jennifer L. Casey, Michael J. Wayman
  • Publication number: 20080242981
    Abstract: A casing mechanism according to the present invention includes a first connector fixedly mounted on a first circuit board; a second connector fixedly mounted on a second circuit board; and a stress absorbing member which absorbs stresses produced in the first connector and the second connector when the first circuit board and the second circuit board are fastened to a casing with the first connector and the second connector interconnected.
    Type: Application
    Filed: March 17, 2008
    Publication date: October 2, 2008
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Toshihiro KITAHARA
  • Patent number: 7420815
    Abstract: A computer subassembly aspect is disclosed comprising a case defining an interior, a primary circuit board located in the interior of the case, and a BIOS chip socket mounted on the primary circuit board. The case has an opening formed therein that is aligned with a position of the BIOS chip socket on the primary circuit board to permit insertion of a BIOS chip into the BIOS chip socket through the opening. A method of assembling a computer is also disclosed that comprises assembling a subassembly of a laptop computer in a first location, with the subassembly including a BIOS chip socket for receiving a BIOS chip but lacking a BIOS chip, transporting the subassembly from the first location to a second location, and installing a BIOS chip into the BIOS chip socket of the subassembly when the subassembly is in the second location.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: September 2, 2008
    Assignee: Gateway Inc.
    Inventor: John Love
  • Publication number: 20080205018
    Abstract: The invention provides, in one aspect, an access control system that comprises an access control panel coupled to an access control expansion box. The access control panel includes one or more access control boards disposed within a first rack-mount enclosure, each control board providing at least an interface for monitoring and/or controlling access to one or more building entry points or zones via associated sensors and/or intrusion prevention devices, collectively, “security devices.” The access control expansion box includes a plurality of input/output (I/O) boards disposed within a second rack-mount enclosure. The I/O boards provide an interface for at least (i) sending signals received from one or more additional security devices to the control boards, and/or (ii) sending signals received from the control boards to one or more of the additional security devices.
    Type: Application
    Filed: March 12, 2008
    Publication date: August 28, 2008
    Applicant: Surveillance Specialties Ltd.
    Inventors: Robert A. Burwell, Andrew J. Pavlik
  • Publication number: 20080205017
    Abstract: An interconnection and packaging method is provided for manufacturing of Lab-on-chip (LOC) and Micro Total Analyses Systems. Different functions, such as biosensors, heaters, coolers, valves, and pumps, are combined in an electronic/mechanical/fluidic module by flip-chip technology using an ultrasound bounding process. A predefined polymeric ring on the chip serves as a seal.
    Type: Application
    Filed: July 12, 2006
    Publication date: August 28, 2008
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
    Inventors: Ton Nellissen, Reinhold Wimberger-Friedl
  • Patent number: 7417868
    Abstract: In a casing unit for accommodating a printed circuit board, a case has a plurality of walls, one of the walls being partially or entirely open to form an open surface through which the board is inserted into the case. Guides, secured on side walls, comprise two guide protruding members each formed to protrude from the side walls and positioned to partly contact both sides of the board to be inserted into the case, whereby the board is positioned in a planar direction thereof. A cover, applied to the case to cover the open surface of the case, comprises a vertically positioning member positioning the board in a vertical direction, when the cover is applied to the case to cover the open surface, by pinching an end of the board in the vertical direction. The end of the board is located in the open surface of the case.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: August 26, 2008
    Assignee: DENSO CORPORATION
    Inventor: Kazutoshi Morisada
  • Patent number: 7414859
    Abstract: A mounting apparatus for an expansion card (30) includes a computer panel (12), a bracket (14) mounted to the computer panel, and a card holder (20) mounted to the bracket. At least a post (1416) is formed on the bracket. The card holder includes a body (22) glidingly mounted to the bracket for installing the expansion card and a handle (24) resisted by the post of the bracket for preventing the body from sliding out so as to fix the card holder in position.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: August 19, 2008
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Lang Tao, Chieh Yang, Li-Ping Chen
  • Patent number: 7414852
    Abstract: A chassis shelf may include an upper guide adapted to receive a first edge of a first card and a lower guide adapted to receive a first edge of a second card. The chassis shelf may include an alignment device adapted to align the chassis shelf with respect to a chassis. The chassis shelf may include an attachment device for removably coupling the chassis shelf to the chassis.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: August 19, 2008
    Assignee: Juniper Networks, Inc.
    Inventor: Christopher J. Otte
  • Publication number: 20080192454
    Abstract: The present invention relates to a subrack for housing printed boards in a telecommunication system wherein the subrack is adapted to be mounted in a rack, and the inner dimensions of the rack is such that it is adapted to mount printed boards of a first type via a plurality of conventional subracks. The subrack is adapted to mount at least one printed board of a second type essentially perpendicular, when mounted in the rack, compared to the printed boards of the first type mounted in the plurality of conventional subracks when mounted in the rack, wherein the size of at least one dimension of the or each printed board of the second type is greater than the size of at least one of the dimensions of the printed boards of the first type. Moreover, the invention relates to a cable adapter for connecting a connector of the rack comprising the subrack according to the invention to a printed board of the second type mounted in the subrack.
    Type: Application
    Filed: April 1, 2005
    Publication date: August 14, 2008
    Inventor: Hans Knutsson
  • Publication number: 20080186691
    Abstract: The main new features of the disclosure relate to the ability to add stiffness to a shield portion of an active implantable medical device (AIMD) without increasing the net displaced volume to the AIMD in application. A number of techniques for adding stiffness are disclosed, depicted and claimed herein; for example using a sheet or strip(s) of material. A sheet of material can be bonded to a portion of an AIMD housing where an internal component makes contact with and/or is otherwise supported by the housing. The sheet and/or rib can be adhered or welded, soldered, brazed, etc. The sheet or rib can couple to the interior and/or exterior of the housing. Also, preproduction preparation of bulk material used to fabricate the shields can include region(s) of increased cross section (thickness). Such bulk material can have regions of increased cross section (thickness) that correspond to production equipment for punching, shaping and/or trimming the bulk material into the desired AIMD housing.
    Type: Application
    Filed: April 28, 2006
    Publication date: August 7, 2008
    Inventors: John C. Mertz, Robert A. Youngman, Terry L. Sterrett
  • Patent number: 7408789
    Abstract: A mounting device for a circuit card includes a motherboard adapted for receiving the circuit card inserted therein, a computer enclosure configured for accommodating the motherboard, a securing plate mounted on the computer enclosure, and a retaining member with a receiving slot. The retaining member slides along the securing plate and in parallel with one end edge of the circuit card to have the end edge of the circuit card received in the receiving slot. A locking structure is formed between the retaining member and the securing plate for locking the retaining member to the securing plate.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: August 5, 2008
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Lang Tao, Chieh Yang, Li-Ping Chen
  • Patent number: 7397670
    Abstract: A power supply device equipped with AC and DC power supply structures aims to separate an AC connection structure and a DC connection structure of the power supply device of a given size specification to replace the conventional DC and AC connection structures that are coupled on a single connection board so that the DC connection board may be extended to the maximum width of the power supply device specification to increase output legs and maximize the output power of the power supply device.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: July 8, 2008
    Assignee: Zippy Technology Corp.
    Inventor: Chun-Lung Su
  • Patent number: 7394667
    Abstract: A power distribution unit (306) may include a power distribution unit frame (310), where the power distribution unit frame has a 2U form factor (312), and where the power distribution unit frame is coupled to mount in an embedded computer frame (102). A plurality of power ingress sites (330) may be coupled to a rear portion (320) of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin (332) coupled to interface with an ingress in-line, hyperboloid radial socket (334), and where the power distribution unit has a current-capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: July 1, 2008
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventors: John H. Kelly, Naufel C. Naufel, Irena Borucki, Eugene R. Pilat, Markus Tegethoff
  • Patent number: 7391621
    Abstract: In an electronic device printed circuit boards in a housing are kept parallel to each other by guiding means. One or a plurality of these printed circuit boards is connected with a housing part each on their corresponding edge by means of electronic plug-in connections. To secure the electronic plug-in connections, spring means are provided which exert pressure on opposite edges of the printed circuit boards in the direction of the plug-in connection.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: June 24, 2008
    Assignee: Thomson Licensing
    Inventors: Wolfgang Metje, Nicolaas Johannes Damstra
  • Patent number: 7388758
    Abstract: A computer enclosure includes a base (10), a cover (30), and a connecting device (40). The connecting device pivotably connects the cover to the base. The connecting device includes a first lever (42), a second lever (44) and a supporting arm (46). The second lever can be stopped by the first lever, for positioning the cover when the cover is in an open position.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: June 17, 2008
    Assignees: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Yu-Ming Xiao
  • Patent number: 7388757
    Abstract: A subrack having a front side and a rear side, wherein the subrack is coupled to receive an Advanced Mezzanine Card module, the subrack includes a monolithic backplane having a first portion and second portion, where the first portion runs substantially along the front side and the second portion runs substantially along the rear side. A first slot is to receive the Advanced Mezzanine Card module inserted via the front side and connect the Advanced Mezzanine Card module directly to the second portion of the monolithic backplane. A second slot is to receive the Advanced Mezzanine Card module inserted via the rear side and connect the Advanced Mezzanine Card module directly to the first portion of the monolithic backplane.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: June 17, 2008
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventors: Paul A. Moakes, Brian A. Carr