Abstract: A system and method for controlling an EMC protection apparatus in a removable component. The removable component is inserted into an end product. As a result of the insertion power is applied to the EMC protection apparatus. A determination is made as to whether a power good signal is detected within the removable component. In response to a power good signal, an EMC protection device is rotated from a retracted state to an engaged state such that the EMC protection device is placed over an enclosure opening in the removable component forming an EMC seal. Full functionality of the removable component can be delayed until such time as the rotation is completed.

Abstract: An electronic device is disclosed. The electronic device may comprise: a housing; a substrate disposed inside the housing and comprising a first electric element and an adhesive material; and a shielding material fixed to the substrate by the adhesive material, the shielding member having a shielding space formed therein, the first electric element being disposed in the shielding space. The shielding member may comprise: a plate facing the substrate; and a side wall formed between the plate and the substrate so as to connect the plate and the substrate, the side wall extending in a peripheral direction so as to surround the shielding space. The adhesive material may be disposed on the substrate so as to surround at least a part of the side wall. The side wall may comprise: an outer surface directed toward the shielding space; an inner surface disposed opposite the outer surface; and a bottom surface facing the substrate.

Abstract: An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.

Abstract: Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.

Abstract: The present invention provides a receptacle structure for an optical connector comprising a receptacle body, and a first housing. The receptacle body has a first end and a second end for providing optical connector inserted thereto, respectively. Two sides of the first end respectively have first flexible plate having first attaching structure. The first housing, folded by a single piece material, is a closed structure having a first through hole wherein two walls of the first housing have first coupling structure for coupling to the attaching structure when the first end of the receptacle body is inserted into the first through hole whereby the first housing is completely assembled with the receptacle body. In addition, an optical communication device having the receptacle structure is also provided in which the optical connector can be inserted into the receptacle structure for optical communication.

Abstract: Brackets are provided for coupling a replaceable expansion card to an Information Handling System (IHS). The brackets include a riser card portion that receives a riser card that couples the expansion card to a motherboard connector of the IHS. The riser card includes pins that couple to the motherboard connector and a connector that receives the expansion card. The riser card portion of the bracket includes a first channel that receives the riser card orthogonal to the expansion card. A card-receiving portion of the bracket receives the expansion card that includes pins that couple to the riser card connector when the expansion card is inserted in the card-receiving portion. The card-receiving portion of the bracket also includes a second channel that receives the expansion card and restricts vertical movement of the installed expansion card and also restricts vertical movement of the riser card when coupled to the expansion card.

Abstract: A dust collector in one aspect of the present invention comprises a dust collection portion, a communication portion, and an interlock operation control portion. When the communication portion receives an interlock command transmitted from an electric working machine, the interlock operation control portion makes the dust collection portion operate interlocking with the electric working machine. The interlock operation control portion includes a storage portion, in which identification information specific to the electric working machine with which the dust collection portion is to be made to perform the interlock operation is stored.

Abstract: An antenna adapted for an electronic device is provided. The antenna includes a chamber, a first liquid conductor, a second liquid conductor, and a feeding portion. The first liquid conductor is located in the chamber. The second liquid conductor is located in the chamber. A specific gravity of the second liquid conductor is larger than a specific gravity of the first liquid conductor, and a conductivity of the second liquid conductor is smaller than a conductivity of the first liquid conductor. The feeding portion extends into the chamber from an outside of the chamber. The feeding portion contacts with one of the first liquid conductor and the second liquid conductor.

Abstract: A transition between a printed circuit board and a dielectric layer with controlled impedance and reduced and/or mitigate crosstalk for quantum applications are provided. A quantum device can comprise a microwave quantum circuit on a dielectric substrate and a printed circuit board comprising a via that comprises a transmission line. A wirebond between the transmission line of the printed circuit board and a transmission line of the microwave quantum circuit operatively couples the microwave quantum circuit to the printed circuit board. The via comprises a defined characteristic impedance. The wirebond provides a microwave signal connection between the printed circuit board and the microwave quantum circuit.

Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: A semiconductor device includes a substrate, a device layer, and a film. The substrate includes a first semiconductor element, and has a first surface, a second surface, and a side surface between the first surface and the second surface. The device layer includes a second semiconductor element electrically connected to the first semiconductor element, and is provided on the first surface of the substrate. The film includes a first film including a first region, a second region, and a third region. The substrate is positioned between the first region and the device layer in a first direction. The substrate is positioned between the second region and the third region in a second direction crossing the first direction. The first film fills the unevenness of the second surface and the side surface.

Abstract: A chip package structure is provided. The chip package structure includes a redistribution structure including a dielectric structure and a grounding line in the dielectric structure. The grounding line includes a main portion and an end enlarged portion connected to the main portion and laterally accessible from the dielectric structure. The chip package structure includes a chip structure over the redistribution structure. The chip package structure includes a conductive shielding film disposed over the chip structure and a first sidewall of the end enlarged portion. The conductive shielding film is electrically connected to the grounding line. A thickness of the end enlarged portion increases from the main portion to the conductive shielding film.

Abstract: A power inverter assembly provides a balanced power flow to each of a plurality of electrical machines. The power inverter assembly includes at least one heat sink having a top side and a bottom side, a plurality of pairs of power semiconductor modules mounted along the top and bottom sides of a heat sink for thermal exchange with the heat sink, and a plurality of gate driver boards configured to control the supply of DC power to each of the plurality of pairs of power semiconductor modules. A first pair of semiconductor modules is symmetrically arranged relative to second and third pairs such that the arrangement of the first, second, and third pairs of power semiconductor modules forms a geometric pattern with at least one of the second and third pairs at least partially overhanging the first pair.

Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.

Abstract: A light fixture includes one or more of light emitting diode (LED) modules. Each of the LED modules may include a substrate holding a plurality of LEDs, and a printed circuit board connected to the plurality of LEDs. Each of the LED modules may also include a flexible lens cover including a plurality of lenses, each positioned to be located over one of the LEDs. The flexible lens cover may include a side sealing structure configured to interface with the substrate and seal the lens cover to the substrate.

Abstract: A gaming machine includes: a reel having an outer circumferential surface on which symbols are lined up; a reel driving mechanism which rotates the reel to rearrange the symbols; a magnet which is provided in the reel driving mechanism to change an external magnetic field in accordance with the rotation of the reel; a magnetic force detecting mechanism which detects a magnetic force of the external magnetic field so as to output a magnetic force detection signal; a reel setting unit by which the magnetic force detection signal and arrangement positions of the symbols are associated with one another; and a reel drive control unit which controls the reel driving mechanism so that the symbols are rearranged in a predetermined arrangement based on the magnetic force detection signal and the arrangement positions of the symbols.

Abstract: An electrical connector assembly includes a cage member having a plurality of walls defining an upper port and a lower port for pluggable modules. The walls define side walls along sides of the upper and lower ports. The walls are manufactured from a metal material and providing electrical shielding for the upper port and the lower port. The walls define a port separator extending between the side walls below at least one of the upper port and the lower port. The port separator has an upper plate and a lower plate extending between the side walls of the cage member. The port separator has a plurality of channel walls extending between the upper plate and the lower plate to divide the port separator into a plurality of channels. The channels are open at a front and a rear of the port separator to direct airflow through the port separator.

Abstract: An electronic enclosure device including an enclosure, an electric circuit device, and a sealing device is disclosed. The sealing device is provided as one, continuous gasket having a first gasket section configured to seal a first sealing area, a second gasket section configured to seal the second sealing area, and a third gasket section configured to seal the third sealing area.

Abstract: The invention broadly contemplates an electronic apparatus that provides improved antenna characteristics, while maintaining a thin size and light weight. The electronic apparatus of the present invention includes a display casing having a nonconductive resin region and a conductive resin region in a bottom surface thereof; a display module accommodated in the display casing; an antenna disposed in the nonconductive resin region; and a system casing accommodating a wireless module connected to the antenna. By disposing the antenna in the nonconductive resin region formed in the bottom surface of the display casing, it is possible to secure high radio wave sensitivity while preventing an antenna mounting portion from being exposed to the outside of the display casing. The casing structure of the electronic apparatus does not become thick because of butt joining even when the joint portions are in a projection area of an LCD module.

Abstract: An electrical connector has an insulative housing, a plurality of contacts retained in the insulative housing and a shell assembled to the insulative housing. The insulative housing has a mating face and a mating chamber depressing from the mating face and extending through the insulative housing along a front to back direction for receiving a mating plug. The contacts comprise a first contact with a first engaging point located in a left side of the mating chamber, and a second contact with a second engaging point located in a bottom side of the mating chamber and a third contact with a third engaging point located in a right side of the mating chamber and opposite to the first contacting portion, the third engaging point is located between the first engaging point and the second connecting portion along the front to back direction.

Abstract: This invention is directed to several mechanical features of an electronic device. The electronic device may include a spring for simultaneously grounding several components. The electronic device may include several interlocking fences for protecting electronic device components from RF radiation. The electronic device may include an antenna assembly that includes distinct components for functional and aesthetic purposes. The electronic device may include a window for permitting RF transmissions. The electronic device may include a metal frame for stiffening the electronic device. The electronic device may include a bezel used for aesthetic purposes and to support numerous electronic device components. The electronic device may include a flexible housing operative to elastically deform to assemble the electronic device. The electronic device may include an unsupported button.

Abstract: According to an example, a multi-function module for insertion into a slot of a networking chassis includes a front plane having an opening through which a plurality of ports are accessible, a switch carrier board comprising an ASIC that is to operate as an interface between the plurality of ports accessible through the front plane and a plurality of rear connectors, and a microprocessor system board positioned in spaced relation with respect to the switch carrier board, the microprocessor system board comprising a microprocessor, a chipset, and a memory. The ASIC is positioned on a side of the switch carrier board that faces the microprocessor board and the microprocessor is positioned on a side of the microprocessor system board that faces the switch carrier board.

Abstract: The present disclosure provides a heat emission/radiation device for a junction box printed circuit board (PCB), which allows a next-generation intelligent junction box PCB to be manufactured in a dual-layer structure that maximizes heat emission effects. In other words, the present invention provides a heat emission device for a junction box PCB, in which a PCB having an IPS semiconductor device mounted thereon is mounted as a dual-layer structure by folding, such that the PCB may be easily installed in a small space of a vehicle, and a heat absorption and emission path for effectively emitting heat generated by the PCB mounted as the dual-layer structure is formed.

Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.

Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.

Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.

Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is also a dielectric (5) between the component (1) and the first wiring layer (3) such that the component (1) is embedded in the dielectric (5). Contact elements (6) provide electrical connection between at least some of the contact terminals (2) and at least some of the conducting lines (4). The electronic module also comprises a second wiring layer (7) inside the dielectric (5). The second wiring layer (7) comprises a conducting pattern (8) that is at least partly located between the component (1) and the first wiring layer (3) and provides EMI protection between the component (1) and the conducting lines (4).

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 401 of the transformer facing the surface of the circuit board. There is provided a display device including such a power module.

Abstract: A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.

Abstract: A carrying case having a first compartment and a second compartment for accommodating a plurality of objects; the first object which is embedded with integrated circuits that can process, store and communicate data on radio frequency identification microprocessors; said second object which is configured to process, store and communicate data on radio frequency identification microprocessors; said inner lining of said carrying case configured to include a radio frequency shielding; said shielding material including a layer of conductive material to attenuate interference fields and signals which are transmitted at varying frequencies and wavelengths; and wherein the shielding material is configured to block access to data which is stored on radio frequency identification microprocessors embedded in either the first object or second object.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: What is disclosed is a modular visualization display panel. The modular visualization display panel includes a first module having at least one surface and a connection to electrical ground. The modular visualization display panel also includes a second module having at least one surface with a plurality of raised contact nodes arranged on the one surface of the second module such that when in contact with the one surface of the first module electrostatic discharge energy is directed over at least one of the raised contact nodes to the one surface of the first module.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: This is directed to systems and methods for shielding circuitry from interference with a shield assembly. In some embodiments, a shield assembly may include a shield fence having a fence body, at least one fence finger extending from the bottom of the fence body for coupling to a circuit board, and a tab extending from the fence body. The tab is configured to be removed from the shield fence after the shield fence is coupled to the circuit board.

Abstract: A housing for an electronic device unit includes a first case and a second case that are formed in a shape of a box with one of respective surfaces thereof being opened and are formed to be a box body. The housing includes an insulating plate that extends from the opening part of the first case to a side of the second case and overlaps with a wall surface of the second case. An engaging convex part is formed on a surface where the insulating plate is overlapped and an engaging hole that engages with the engaging convex part to regulate separation of the first case and the second case is formed. The insulating plate is in a shape in which an edge of the insulating plate spreads with a predetermined width from an opening edge where the first case and the second case are butted and the engaging hole.

Abstract: A portable electronic device includes a case, a push-push mechanism, and an element. The push-push mechanism includes a hollow column disposed in the case and having alternately arranged long grooves and short grooves, a pushing component having an inner end portion extending into the hollow column, a rotating component movably disposed in the hollow column, and a spring disposed for biasing the rotating component toward the pushing component. The pushing component is movable together with the element relative to the hollow column between a received position and an ejected position, where the positioning teeth are slidably and respectively received in the long grooves and the element is ejected out of the case.

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract: An LCD device adapted to become thinner and simultaneously prevent a defect (or fault) due to static electricity is discussed. The LCD device according to an embodiment includes a liquid crystal display panel, an upper case formed from an insulation material and configured to encompass edges of the liquid crystal display panel, a driver PCB (printed circuit board) configured to apply drive signals to one edge of the liquid crystal display panel, a light source configured to apply light to the liquid crystal display panel, a bottom cover formed from a metal material and configured to receive the light source, and a shielding film disposed under one edge of the upper case opposite to the driver PCB and electrically connected to the bottom cover.

Abstract: A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening.

Abstract: An electronic mobile device includes a base supporting an input panel. A cover pivotally connects to the base and is pivotable from a closed position to an open position and vice versa relative to the base. In the closed position the cover covers the input panel, and in the open position the cover is disposed away from the base. A base magnet is supported within the base and has a first magnetic axis. A cover magnet is supported within the cover so as to move with the cover relative to the base. The cover magnet has a second magnetic axis that tends to align with the first magnetic axis to thereby bias the cover towards at least one of the closed position and the open position.

Abstract: An electromagnetic shield comprises a single sheet of metal having outer and inner peripheries. The outer periphery forms a plurality of outer deflectable fingers extending outward from a bent edge of the outer periphery for contacting a surface of a faceplate. The plurality of outer deflectable fingers is deflectable to allow for installation and removal of the faceplate. The inner periphery has an opening for receiving an HDMI connector and forming a plurality of inner deflectable fingers extending inwardly from a bent edge of the inner periphery. The plurality of inner deflectable fingers is deflectable to allow for insertion and removal of the HDMI connector.

Abstract: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.

Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.

Abstract: Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.

Abstract: A printed wiring board including a conductive layer, the conductive layer including a network of nanotubes with respective longitudinal axes, the nanotubes arranged such that their longitudinal axes are aligned substantially parallel to one another in a configuration such that electrical current passing through the conductive layer along a first axis substantially parallel to the longitudinal axes of the nanotubes experiences one degree of dissipation, and electrical current passing through the conductive layer along a second axis experiences a higher degree of dissipation.

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.