With Shielding Structure Patents (Class 361/800)
  • Patent number: 11121453
    Abstract: An antenna adapted for an electronic device is provided. The antenna includes a chamber, a first liquid conductor, a second liquid conductor, and a feeding portion. The first liquid conductor is located in the chamber. The second liquid conductor is located in the chamber. A specific gravity of the second liquid conductor is larger than a specific gravity of the first liquid conductor, and a conductivity of the second liquid conductor is smaller than a conductivity of the first liquid conductor. The feeding portion extends into the chamber from an outside of the chamber. The feeding portion contacts with one of the first liquid conductor and the second liquid conductor.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: September 14, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ling Tien, Pei-Chuan Huang, Pin-Tang Chiu
  • Patent number: 11102879
    Abstract: A transition between a printed circuit board and a dielectric layer with controlled impedance and reduced and/or mitigate crosstalk for quantum applications are provided. A quantum device can comprise a microwave quantum circuit on a dielectric substrate and a printed circuit board comprising a via that comprises a transmission line. A wirebond between the transmission line of the printed circuit board and a transmission line of the microwave quantum circuit operatively couples the microwave quantum circuit to the printed circuit board. The via comprises a defined characteristic impedance. The wirebond provides a microwave signal connection between the printed circuit board and the microwave quantum circuit.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: August 24, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas Torleiv Bronn
  • Patent number: 10842057
    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An
  • Patent number: 10827626
    Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 3, 2020
    Assignee: FLEX LTD
    Inventors: Zohair Mehkri, Anwar Mohammed, Jesus Tan, David Geiger, Murad Kurwa
  • Patent number: 10573603
    Abstract: A semiconductor device includes a substrate, a device layer, and a film. The substrate includes a first semiconductor element, and has a first surface, a second surface, and a side surface between the first surface and the second surface. The device layer includes a second semiconductor element electrically connected to the first semiconductor element, and is provided on the first surface of the substrate. The film includes a first film including a first region, a second region, and a third region. The substrate is positioned between the first region and the device layer in a first direction. The substrate is positioned between the second region and the third region in a second direction crossing the first direction. The first film fills the unevenness of the second surface and the side surface.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: February 25, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akira Tojo, Tatsuya Kobayashi, Kazuo Shimokawa
  • Patent number: 10163813
    Abstract: A chip package structure is provided. The chip package structure includes a redistribution structure including a dielectric structure and a grounding line in the dielectric structure. The grounding line includes a main portion and an end enlarged portion connected to the main portion and laterally accessible from the dielectric structure. The chip package structure includes a chip structure over the redistribution structure. The chip package structure includes a conductive shielding film disposed over the chip structure and a first sidewall of the end enlarged portion. The conductive shielding film is electrically connected to the grounding line. A thickness of the end enlarged portion increases from the main portion to the conductive shielding film.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai
  • Patent number: 10064302
    Abstract: A power inverter assembly provides a balanced power flow to each of a plurality of electrical machines. The power inverter assembly includes at least one heat sink having a top side and a bottom side, a plurality of pairs of power semiconductor modules mounted along the top and bottom sides of a heat sink for thermal exchange with the heat sink, and a plurality of gate driver boards configured to control the supply of DC power to each of the plurality of pairs of power semiconductor modules. A first pair of semiconductor modules is symmetrically arranged relative to second and third pairs such that the arrangement of the first, second, and third pairs of power semiconductor modules forms a geometric pattern with at least one of the second and third pairs at least partially overhanging the first pair.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: August 28, 2018
    Assignee: Caterpillar Inc.
    Inventors: Jason Friedlund, Paul Thomas Schmidt, Vincent Arguelles, Saravanan Desigan, Edo Duheric, Todd Nakanishi
  • Patent number: 10064318
    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: August 28, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An
  • Patent number: 9924616
    Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: March 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyunghoon Song, Jungje Bang, Kwangsub Lee, Saebom Lee, Seyoung Jang, Younoh Chi
  • Patent number: 9759418
    Abstract: A light fixture includes one or more of light emitting diode (LED) modules. Each of the LED modules may include a substrate holding a plurality of LEDs, and a printed circuit board connected to the plurality of LEDs. Each of the LED modules may also include a flexible lens cover including a plurality of lenses, each positioned to be located over one of the LEDs. The flexible lens cover may include a side sealing structure configured to interface with the substrate and seal the lens cover to the substrate.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: September 12, 2017
    Assignee: Ephesus Lighting, Inc.
    Inventors: Christopher D. Nolan, Joseph R. Casper, Walten Peter Owens
  • Patent number: 9530286
    Abstract: A gaming machine includes: a reel having an outer circumferential surface on which symbols are lined up; a reel driving mechanism which rotates the reel to rearrange the symbols; a magnet which is provided in the reel driving mechanism to change an external magnetic field in accordance with the rotation of the reel; a magnetic force detecting mechanism which detects a magnetic force of the external magnetic field so as to output a magnetic force detection signal; a reel setting unit by which the magnetic force detection signal and arrangement positions of the symbols are associated with one another; and a reel drive control unit which controls the reel driving mechanism so that the symbols are rearranged in a predetermined arrangement based on the magnetic force detection signal and the arrangement positions of the symbols.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: December 27, 2016
    Assignees: Universal Entertainment Corporation, Aruze Gaming America, Inc.
    Inventors: Tatsuhiko Tanimura, Noritoshi Kukita, Hiroatsu Ike, Yoshitomo Sasaki
  • Patent number: 9407046
    Abstract: An electrical connector assembly includes a cage member having a plurality of walls defining an upper port and a lower port for pluggable modules. The walls define side walls along sides of the upper and lower ports. The walls are manufactured from a metal material and providing electrical shielding for the upper port and the lower port. The walls define a port separator extending between the side walls below at least one of the upper port and the lower port. The port separator has an upper plate and a lower plate extending between the side walls of the cage member. The port separator has a plurality of channel walls extending between the upper plate and the lower plate to divide the port separator into a plurality of channels. The channels are open at a front and a rear of the port separator to direct airflow through the port separator.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: August 2, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Alan Weir Bucher
  • Patent number: 9338911
    Abstract: An electronic enclosure device including an enclosure, an electric circuit device, and a sealing device is disclosed. The sealing device is provided as one, continuous gasket having a first gasket section configured to seal a first sealing area, a second gasket section configured to seal the second sealing area, and a third gasket section configured to seal the third sealing area.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: May 10, 2016
    Assignee: Valeo Powertrain Energy Conversion AS
    Inventor: Erik Spangberg
  • Patent number: 9317074
    Abstract: The invention broadly contemplates an electronic apparatus that provides improved antenna characteristics, while maintaining a thin size and light weight. The electronic apparatus of the present invention includes a display casing having a nonconductive resin region and a conductive resin region in a bottom surface thereof; a display module accommodated in the display casing; an antenna disposed in the nonconductive resin region; and a system casing accommodating a wireless module connected to the antenna. By disposing the antenna in the nonconductive resin region formed in the bottom surface of the display casing, it is possible to secure high radio wave sensitivity while preventing an antenna mounting portion from being exposed to the outside of the display casing. The casing structure of the electronic apparatus does not become thick because of butt joining even when the joint portions are in a projection area of an LCD module.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: April 19, 2016
    Assignee: Lenova (Singapore) Pte. Ltd.
    Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
  • Patent number: 9223345
    Abstract: This invention is directed to several mechanical features of an electronic device. The electronic device may include a spring for simultaneously grounding several components. The electronic device may include several interlocking fences for protecting electronic device components from RF radiation. The electronic device may include an antenna assembly that includes distinct components for functional and aesthetic purposes. The electronic device may include a window for permitting RF transmissions. The electronic device may include a metal frame for stiffening the electronic device. The electronic device may include a bezel used for aesthetic purposes and to support numerous electronic device components. The electronic device may include a flexible housing operative to elastically deform to assemble the electronic device. The electronic device may include an unsupported button.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: December 29, 2015
    Assignee: Apple Inc.
    Inventors: Teodor Dabov, Fletcher R. Rothkopf, Philipe R. Manoux
  • Patent number: 9225129
    Abstract: An electrical connector has an insulative housing, a plurality of contacts retained in the insulative housing and a shell assembled to the insulative housing. The insulative housing has a mating face and a mating chamber depressing from the mating face and extending through the insulative housing along a front to back direction for receiving a mating plug. The contacts comprise a first contact with a first engaging point located in a left side of the mating chamber, and a second contact with a second engaging point located in a bottom side of the mating chamber and a third contact with a third engaging point located in a right side of the mating chamber and opposite to the first contacting portion, the third engaging point is located between the first engaging point and the second connecting portion along the front to back direction.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: December 29, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jian Shao, Zheng-Guo Sun, Guo-Hua Zhang, Qi-Sheng Zheng
  • Patent number: 9161475
    Abstract: According to an example, a multi-function module for insertion into a slot of a networking chassis includes a front plane having an opening through which a plurality of ports are accessible, a switch carrier board comprising an ASIC that is to operate as an interface between the plurality of ports accessible through the front plane and a plurality of rear connectors, and a microprocessor system board positioned in spaced relation with respect to the switch carrier board, the microprocessor system board comprising a microprocessor, a chipset, and a memory. The ASIC is positioned on a side of the switch carrier board that faces the microprocessor board and the microprocessor is positioned on a side of the microprocessor system board that faces the switch carrier board.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: October 13, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kay Seah Ng, Chadi Farid Theodossy, Irving M. Birmingham
  • Patent number: 9078378
    Abstract: The present disclosure provides a heat emission/radiation device for a junction box printed circuit board (PCB), which allows a next-generation intelligent junction box PCB to be manufactured in a dual-layer structure that maximizes heat emission effects. In other words, the present invention provides a heat emission device for a junction box PCB, in which a PCB having an IPS semiconductor device mounted thereon is mounted as a dual-layer structure by folding, such that the PCB may be easily installed in a small space of a vehicle, and a heat absorption and emission path for effectively emitting heat generated by the PCB mounted as the dual-layer structure is formed.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: July 7, 2015
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Yura Corporation Co., Ltd.
    Inventors: Young Jong Lee, Byung Kwan Kang, Jong Won Lee
  • Patent number: 9035189
    Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: May 19, 2015
    Assignee: EPCOS AC
    Inventors: Wolfgang Pahl, Hans Krueger, Peter Demmer
  • Patent number: 8988896
    Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2015
    Assignee: Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG
    Inventors: Detlev Wittmer, Ulrich Kaiser
  • Patent number: 8976540
    Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: March 10, 2015
    Assignee: LG Electronics Inc.
    Inventor: Mansung Yoo
  • Patent number: 8976539
    Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 10, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Phillip J. Edwards, Jignesh H. Shah, Lance R. Thompson, Nhan Huynh
  • Patent number: 8964385
    Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: February 24, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Mandy Hin Lam, Phillip S. Ting, Susheela Nanjunda Rao Narasimhan
  • Patent number: 8964409
    Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is also a dielectric (5) between the component (1) and the first wiring layer (3) such that the component (1) is embedded in the dielectric (5). Contact elements (6) provide electrical connection between at least some of the contact terminals (2) and at least some of the conducting lines (4). The electronic module also comprises a second wiring layer (7) inside the dielectric (5). The second wiring layer (7) comprises a conducting pattern (8) that is at least partly located between the component (1) and the first wiring layer (3) and provides EMI protection between the component (1) and the conducting lines (4).
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: February 24, 2015
    Assignee: GE Embedded Electronics Oy
    Inventor: Risto Tuominen
  • Patent number: 8953339
    Abstract: There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 401 of the transformer facing the surface of the circuit board. There is provided a display device including such a power module.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: February 10, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Heung Gyoon Choi, Jin Woo Cho, Sung Ho Kim
  • Patent number: 8947889
    Abstract: A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: February 3, 2015
    Assignee: Lockheed Martin Corporation
    Inventors: Matthew Kelley, Christian Adams, Richard Reim
  • Patent number: 8937816
    Abstract: A carrying case having a first compartment and a second compartment for accommodating a plurality of objects; the first object which is embedded with integrated circuits that can process, store and communicate data on radio frequency identification microprocessors; said second object which is configured to process, store and communicate data on radio frequency identification microprocessors; said inner lining of said carrying case configured to include a radio frequency shielding; said shielding material including a layer of conductive material to attenuate interference fields and signals which are transmitted at varying frequencies and wavelengths; and wherein the shielding material is configured to block access to data which is stored on radio frequency identification microprocessors embedded in either the first object or second object.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: January 20, 2015
    Inventor: Marc Trombino
  • Patent number: 8923012
    Abstract: What is disclosed is a modular visualization display panel. The modular visualization display panel includes a first module having at least one surface and a connection to electrical ground. The modular visualization display panel also includes a second module having at least one surface with a plurality of raised contact nodes arranged on the one surface of the second module such that when in contact with the one surface of the first module electrostatic discharge energy is directed over at least one of the raised contact nodes to the one surface of the first module.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: December 30, 2014
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Andrew P. Kaufman, Keith O. Satula
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Patent number: 8913400
    Abstract: This is directed to systems and methods for shielding circuitry from interference with a shield assembly. In some embodiments, a shield assembly may include a shield fence having a fence body, at least one fence finger extending from the bottom of the fence body for coupling to a circuit board, and a tab extending from the fence body. The tab is configured to be removed from the shield fence after the shield fence is coupled to the circuit board.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Christopher M. Werner, Jared Mitchell Kole
  • Patent number: 8913395
    Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Scott Myers, Mattia Pascolini, Richard Dinh, Trent Weber, Robert Schlub, Josh Nickel, Robert Hill, Nanbo Jin, Tang Tan
  • Patent number: 8908381
    Abstract: A housing for an electronic device unit includes a first case and a second case that are formed in a shape of a box with one of respective surfaces thereof being opened and are formed to be a box body. The housing includes an insulating plate that extends from the opening part of the first case to a side of the second case and overlaps with a wall surface of the second case. An engaging convex part is formed on a surface where the insulating plate is overlapped and an engaging hole that engages with the engaging convex part to regulate separation of the first case and the second case is formed. The insulating plate is in a shape in which an edge of the insulating plate spreads with a predetermined width from an opening edge where the first case and the second case are butted and the engaging hole.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: December 9, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takayuki Miyazaki, Hirokazu Nomoto
  • Patent number: 8902574
    Abstract: A portable electronic device includes a case, a push-push mechanism, and an element. The push-push mechanism includes a hollow column disposed in the case and having alternately arranged long grooves and short grooves, a pushing component having an inner end portion extending into the hollow column, a rotating component movably disposed in the hollow column, and a spring disposed for biasing the rotating component toward the pushing component. The pushing component is movable together with the element relative to the hollow column between a received position and an ejected position, where the positioning teeth are slidably and respectively received in the long grooves and the element is ejected out of the case.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: December 2, 2014
    Assignee: Wistron Corporation
    Inventor: Hou-Chu Su
  • Patent number: 8897028
    Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: November 25, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tadaji Takemura
  • Patent number: 8879021
    Abstract: An LCD device adapted to become thinner and simultaneously prevent a defect (or fault) due to static electricity is discussed. The LCD device according to an embodiment includes a liquid crystal display panel, an upper case formed from an insulation material and configured to encompass edges of the liquid crystal display panel, a driver PCB (printed circuit board) configured to apply drive signals to one edge of the liquid crystal display panel, a light source configured to apply light to the liquid crystal display panel, a bottom cover formed from a metal material and configured to receive the light source, and a shielding film disposed under one edge of the upper case opposite to the driver PCB and electrically connected to the bottom cover.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: November 4, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: Min Jae Kim, Yeong Ho Kim
  • Patent number: 8873248
    Abstract: A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: October 28, 2014
    Assignees: Dongguan Masstop Liquid Crystal Display Co., Ltd., Wintek Corporation
    Inventors: Fu-Min Hsu, Chih-Jung Teng, Kuo-Chang Su, Chin-Liang Chen
  • Patent number: 8861224
    Abstract: An electronic mobile device includes a base supporting an input panel. A cover pivotally connects to the base and is pivotable from a closed position to an open position and vice versa relative to the base. In the closed position the cover covers the input panel, and in the open position the cover is disposed away from the base. A base magnet is supported within the base and has a first magnetic axis. A cover magnet is supported within the cover so as to move with the cover relative to the base. The cover magnet has a second magnetic axis that tends to align with the first magnetic axis to thereby bias the cover towards at least one of the closed position and the open position.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: October 14, 2014
    Assignee: BlackBerry Limited
    Inventors: Jason Tyler Griffin, Julia Allwright, Martin Riddiford, James Reeves
  • Patent number: 8854835
    Abstract: An electromagnetic shield comprises a single sheet of metal having outer and inner peripheries. The outer periphery forms a plurality of outer deflectable fingers extending outward from a bent edge of the outer periphery for contacting a surface of a faceplate. The plurality of outer deflectable fingers is deflectable to allow for installation and removal of the faceplate. The inner periphery has an opening for receiving an HDMI connector and forming a plurality of inner deflectable fingers extending inwardly from a bent edge of the inner periphery. The plurality of inner deflectable fingers is deflectable to allow for insertion and removal of the HDMI connector.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 7, 2014
    Assignee: Crestron Electronics Inc.
    Inventors: Wendy Feldstein, Gregory Sorrentino, Esteban Dragonanovic
  • Publication number: 20140268578
    Abstract: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Apple Inc.
    Inventors: Dominic E. Dolci, Phillip S. Satterfield, Vikas K. Sinha
  • Patent number: 8830697
    Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: September 9, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Wook Kim, Byung Kuk Ko
  • Patent number: 8824163
    Abstract: Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: September 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Il Kim, In Sang Song, Duck Hwan Kim, Chul Soo Kim, Yun Kwon Park, Jea Shik Shin, Hyung Rak Kim, Jae Chun Lee
  • Patent number: 8822843
    Abstract: A printed wiring board including a conductive layer, the conductive layer including a network of nanotubes with respective longitudinal axes, the nanotubes arranged such that their longitudinal axes are aligned substantially parallel to one another in a configuration such that electrical current passing through the conductive layer along a first axis substantially parallel to the longitudinal axes of the nanotubes experiences one degree of dissipation, and electrical current passing through the conductive layer along a second axis experiences a higher degree of dissipation.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: September 2, 2014
    Assignee: Nokia Corporation
    Inventors: Vladimir Ermolov, Markku Anttoni Oksanen, Martti Voutilainen
  • Patent number: 8809697
    Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: August 19, 2014
    Assignee: CareFusion 303, Inc.
    Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
  • Patent number: 8797750
    Abstract: A first metal sheet and a second metal sheet are arranged opposite a printed circuit board including a second connector that fits into a first connector that is arranged at one end of a cable. A hole section through which the first connector passes is arranged in each of the first metal sheet and the second metal sheet. The first connector fits into the second connector by passing through each of the hole sections of the first metal sheet and the second metal sheet. The first metal sheet and the second metal sheet support a connector case of the first connector, thus improving the load bearing characteristics of the cable connection.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: August 5, 2014
    Assignee: Fujitsu Limited
    Inventors: Hideki Maeda, Akira Shimasaki
  • Patent number: 8787031
    Abstract: The invention relates to a case 1 intended to be fixed in an electrical cabinet, said case comprising a frontal opening which can be closed by a means of closing 3, and further comprising means of fastening 5 making it possible to fix said case 1 in said electrical cabinet, in particular on a metal rail, and said case 1 further comprising (a) at least one anti-magnetic and/or anti-static protective means 4, (b) a re-writeable medium 2, 21 for storing computer data, which is protected by said anti-magnetic and/or anti-static protective means 4.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: July 22, 2014
    Assignee: Keter Technologies Europe
    Inventor: Binhas R. Hania
  • Patent number: 8785771
    Abstract: A controller for controlling the utilization of resources within a zone having a housing having an interior carrying a barrier for utilization in defining a line voltage compartment delineated from a low voltage compartment within said housing interior. A power control board is carried within the line voltage compartment for receiving line voltage. A low voltage board is carried within the low voltage compartment for communicating with low voltage components. A controller board is carried by the housing for receiving data associated with the low voltage components and receiving line voltage from the line power control board. A first cover encloses a first portion of the interior of the housing for defining the line voltage compartment. A second cover encloses a second portion of the interior of the housing for defining the low voltage compartment.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: July 22, 2014
    Inventors: William Dunkleberger, John Evans, Mehul Laliwala
  • Patent number: 8779301
    Abstract: A housing for use in a monitoring system having at least one monitoring module includes a shell defining an interior cavity. At least one opening is defined in the shell, and the at least one opening is in flow communication with the interior cavity. The housing includes at least one gasket coupled to the shell about an outer perimeter of the at least one opening. The at least one gasket facilitates insulating the interior cavity from electromagnetic radiation when the at least one monitoring module is positioned within the housing.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: July 15, 2014
    Assignee: General Electric Company
    Inventors: Bryan Shadel, Michael Alan Tart, Sean Kelly Summers, Lysle Rollan Turnbeaugh, Han Tran, Mitchell Dean Cohen, Steven Thomas Clemens
  • Patent number: 8773867
    Abstract: A camera module is disclosed. The camera module in accordance with the present invention includes: a printed circuit board having a grounding pad formed on one surface thereof; a housing mounted on an upper side of the printed circuit board and including a lens inside thereof; a shield covering the housing in order to shield electromagnetic waves from an outside and having an opening cavity formed therein in correspondence with a location of the grounding pad; and a solder formed in the opening cavity and connecting the shield with the grounding pad.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: July 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Yong-Gu Kim
  • Patent number: 8767407
    Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: July 1, 2014
    Assignee: LG Electronics Inc.
    Inventors: Gukchan Lim, Hyokune Hwang, Hyunok Lee, Jungwoo Sohn, Jinsu Lee, Taejong Jeong, Dongsu Han, Yongheon He, Hongjo Shim
  • Patent number: 8760859
    Abstract: Electromagnetically shielded portable storage devices are disclosed. One such device includes an electromagnetically shielded enclosure having an interior volume, the electromagnetically shielded enclosure including a plurality of shielded walls and sized to be manually carried by a person. The interior volume of the enclosure is isolated from high-frequency electromagnetic energy generated external to the enclosure. The device includes at least one storage device positioned within the interior volume, and at least one communicative connection extending from the at least one storage device to a communicative socket accessible external to the electromagnetically shielded enclosure. The at least one communicative connection is configured to allow access to the storage device by a computing system external to the electromagnetically shielded enclosure.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: June 24, 2014
    Assignee: Emprimus, LLC
    Inventors: Greg Fuchs, Gale Nordling, George Anderson, David Blake Jackson