Grounding Construction Or Detail Patents (Class 361/799)
  • Patent number: 8644033
    Abstract: A handheld electronic device may include a portable housing and a shielding container within the portable housing. The shielding container may include a shielding frame and a shielding lid carried thereby. A printed circuit board may be within the shielding container. The shielding frame may include a planar base with at least one opening therein, a pair of opposing side walls integrally formed with the base and extending upwardly therefrom, and a pair of opposing end walls integrally formed with the base and extending upwardly therefrom. Also, the shielding frame may include at least one intermediate partition wall integrally formed with the base and extending upwardly therefrom to define a plurality of container compartments. The partition wall may also extend only partway between the opposing side walls to define at least one partition end gap therewith.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: February 4, 2014
    Assignee: BlackBerry Limited
    Inventors: Chao Chen, Douglas Fregin, Jana Lynn Papke
  • Patent number: 8634200
    Abstract: A portable terminal, which has easily adjustable reception sensitivity, includes an operating section side case section (2) having a first case member (30) which forms appearance; a display section side case section (3); a circuit section (33), which is arranged on the operating section side case section (2) or the display section side case section (3), and has a ground section (31), a power feed section (32), and a signal processing section (36) connected to the power feed section (32); a first conductive section (34), which is arranged on the operating section side case section (2) and electrically connected to the ground section (31); and a second conductive section (35) which is arranged on the display section side case section (3) and electrically connected to the power feed section (32). The first conductive section (34) is formed in the first case member (30).
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: January 21, 2014
    Assignee: Kyocera Corporation
    Inventor: Daisuke Togashi
  • Patent number: 8625301
    Abstract: An electronic device includes a housing, a connecting sheet, a display panel and a fixing module. The display panel is fixed on the connecting sheet. The fixing module includes a first latching member formed on the housing and a second latching member formed on the connecting sheet. The first latching member is detachably latched with the second latching member, such that the connecting sheet adhered to the display panel is detachably fixed on the housing.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: January 7, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zi-Ming Tang, Qiong Huang
  • Patent number: 8619435
    Abstract: An external EMI diverting structure to electrically shield an electronic device from EMI is presented. The electronic device is physically isolated from the case ground which interrupts the EMI or lightning fault path. This shield provides a return path to ground for the EMI away from the electronic device and replaces conventional EMI filter capacitors, which are not connected to case ground. The external EMI diverter comprises a first conducting enclosure enclosing the electrical circuit and is electrically coupled to the electric circuit and a second conducting enclosure enclosing the first conducting enclosure and being electrically isolated from the first conducting enclosure and the electric circuit. The diverter is physically and electrically connected to the case ground at an attachment point.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: December 31, 2013
    Assignee: Honeywell International Inc.
    Inventor: John Kenneth Tillotson
  • Patent number: 8616311
    Abstract: An electrical storage device includes: a conductive battery house casing electrically connected to a chassis; a plurality of battery cells held in the battery house casing; and a control unit that comprises a circuit that manages the plurality of battery cells and is mounted on the battery house casing so that a negative terminal of the circuit and the battery house casing are electrically conducting.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: December 31, 2013
    Assignees: Hitachi, Ltd., Hitachi Vehicle Energy, Ltd.
    Inventors: Yoshihisa Tsurumi, Shinichi Fujino, Sadashi Seto
  • Patent number: 8605448
    Abstract: A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: December 10, 2013
    Assignee: Ricoh Company, Limited
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki
  • Patent number: 8599574
    Abstract: An exemplary display unit includes a rear cover, a bracket disposed on the rear cover, a display mounted on the bracket, and a front cover secured to the rear cover to sandwich the display and the bracket between the front cover and the rear cover. The bracket includes a plate supporting the display, a pair of bulges protruding upwardly from two opposite sides of the plate and a pair of tabs extending upwardly from the bulges, respectively. The pair of tabs press against two opposite lateral faces of the display to dissipate static electricity on the display to ground.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: December 3, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ke-Hui Peng, Xue-Dong Tang, Ren-Wen Wang, Ping Li
  • Patent number: 8587960
    Abstract: A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: November 19, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang Sung Hwang, Hyung Suk Park
  • Patent number: 8587952
    Abstract: Insulating ribs are formed into one or more portions of a housing that encloses circuitry of an electrical device. Components mounted on a board are separated according to whether they are related to a primary side of a power transformer or a secondary side. Primary related components are typically mounted on the primary side of an isolation slot formed into a circuit board and components related to the secondary are mounted on the other side. The insulating ribs are strategically placed to protrude through the slots when circuit board is mounted to the housing portion. Thus, when the housing portion is joined to another housing portion, which also may include insulating ribs strategically placed, the ribs increase the breakdown voltage of the boundary.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: November 19, 2013
    Assignee: ARRIS Enterprises, Inc.
    Inventors: Brent Scott Hughes, Jason Pierce
  • Patent number: 8576569
    Abstract: Retention structures are provided to guide and secure a co-axial cable from an upper portion to a lower portion of a logic board having a bend region. In one embodiment, a retention structure can guide, retain, and electrically ground the co-axial cable at multiple locations. In another embodiment, a retention structure can provide route a co-axial cable around the bend region of the logic board, while providing strain relief and the ability to accommodate co-axial cables of different lengths, due to manufacturing tolerances. Multi-purpose cowling structures are also provided to minimize spacing impact within an electronic device, while maximizing functional utility. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: November 5, 2013
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Dan Jarvis
  • Patent number: 8576578
    Abstract: A robust printed circuit board (PCB) that includes at least two power layers that are used in providing power to components connected to the PCB. The power layers may be a power plane layer and a ground plane layer. The power plane layer is situated such that its edge is pulled back a second distance from the planar edge of the PCB. The ground plane layer is situated such that its edge is pulled back a first distance from the planar edge of the PCB. The second distance and the first distance are different, and as a result, the planar edges of the power plane layer and the ground plane layer respectively do not coincide.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: November 5, 2013
    Assignee: International Business Machines Corporation
    Inventors: Robert L. Ayers, Michael L. Scollard, Heidi D. Williams
  • Patent number: 8537566
    Abstract: A display unit includes a lower cover, a display disposed on the lower cover, a metal bracket securing the display on the lower cover and an upper cover fixed to the lower cover to sandwich the display and the bracket between the lower cover and the upper cover. The bracket includes a plate pressing a back side of the display towards the lower cover and a tab contacting a lateral face of the display. The bracket is grounded.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: September 17, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ji-Feng Qiu, Ke-Hui Peng, Li-Ni Liang, Ren-Wen Wang
  • Patent number: 8537564
    Abstract: An electronic device can include different components providing different functionality. Some electronic devices can include a proximity sensor for determining when a user's face is near the device. The sensor can include an emitter and a detector that are separated by a foam block to limit cross-talk between the emitter and detector. A sheet can be placed over the foam block to define openings for each of the emitter and detector. Some electronic devices can also include a camera. A glass cover secured to the device enclosure can protect the camera. To improve an adhesive bond between the glass cover and a metal enclosure, an ink layer can be placed between an adhesive and the glass. In addition, the camera or another component may need to be grounded to ensure proper operation. During assembly, however, the position of the camera can shift due to closing an enclosure. A grounding assembly that maintains contact with the camera in its initial and final positions can be provided.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: September 17, 2013
    Assignee: Apple Inc.
    Inventors: Sawyer Cohen, Mike Wittenberg, Matthew Hill, Trent Weber, Benjamin Kunst
  • Patent number: 8525024
    Abstract: A hermetically sealing device includes a conductive seal member (2) which is integrated with a conductive member (1) extending into a casing (3) and seals a space between the conductive member (1) and an inserting section for the conductive member (1) on the casing (3). In the conductive member (1), an electromagnetic wave shield layer (11) is laminated on a cover film which protects the surface of a base film having a circuit pattern, an insulating layer (12) is laminated on the electromagnetic wave shield layer (11), the insulating layer (12) has an opening section (12a) such that a part of the flat section of the electromagnetic wave shield layer (11) is exposed, and the seal member (2) is integrated with the conductive member (1) to cover the opening section (12a) and is brought into contact with the electromagnetic wave shield layer (11) through the opening section (12a).
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: September 3, 2013
    Assignee: NOK Corporation
    Inventors: Hiroaki Kaneda, Takeshi Yamada
  • Patent number: 8520405
    Abstract: A shield case includes at least one tongue piece which is formed of a conductor and protrudes to an outside of the shield case. Further, the shield case is formed of a conductor, and an element is housed inside the shield case.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: August 27, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Ryohaku Yukiyoshi
  • Patent number: 8514589
    Abstract: According to one embodiment, an electronic apparatus is provided with a first housing that comprises a first ground and a second housing comprising a second ground. The electronic apparatus further comprises (i) a plurality of first protrusions on an inner surface of the first housing, at least one of the plurality of first protrusions comprising, on a peripheral surface thereof, a first conductor electrically connected to the first ground; (ii) a hinge pivotably connecting the first housing and the second housing; and (iii) a cable extending between inside the first housing and inside the second housing through the hinge, supported by the plurality of first protrusions, electrically connected to the first conductor in the first housing, and electrically connected to the second ground in the second housing, the cable electrically connecting the first ground and the second ground.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: August 20, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Masashi Mikami
  • Patent number: 8508948
    Abstract: A communication apparatus includes first and second housings connected to each other by a hinge mechanism. The first housing includes a first substrate having electronic components electrically connected to an antenna, a first hinge portion configuring a portion of the hinge mechanism, and a first conductive member provided in the first hinge portion. The second housing includes a second substrate having electronic components, a waterproofing partition wall surrounding the second substrate, a second hinge portion configuring a portion of the hinge mechanism, a second conductive member provided in the second hinge portion to be capacitively-coupled with the first conductive member, and a third conductive member insertion-molded therein. The third conductive member includes an inner portion positioned on an inner side of the partition wall, and an outer portion extending from the inner portion toward an outer side of the partition wall and capacitively-coupled with the second conductive member.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: August 13, 2013
    Assignee: Kyocera Corporation
    Inventor: Naohiro Katou
  • Patent number: 8503191
    Abstract: The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: August 6, 2013
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: 8503192
    Abstract: An electronic device includes an EMI shielding board, two electronic components and a flat cable. The EMI shielding board includes a first side and a second side opposite to the first side. The two electronic components are arranged at the first side of the EMI shielding board. The flat cable is connected between the two electronic components. The EMI shielding board further includes a first through slot and a second through slot both configured therein. The flat cable passes through the EMI shielding board via the first and second through slots. A part of the flat cable is on the first side of the EMI shielding board, and the remaining part of the flat cable is on the second side of the EMI shielding board.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: August 6, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ji-Feng Qiu, Hong Li, Xiao-Hui Zhou, Rui Li
  • Patent number: 8488334
    Abstract: An optical transceiver module is provided that has an EMI absorbing assembly that comprises an EMI absorbing device that is electrically grounded rather than standing in free space in the transceiver module so that the assembly absorbs both the magnetic and electrical components of the EMI. In accordance with an embodiment, the EMI absorbing assembly includes a leadframe about which an EMI absorbing material is cast. The leadframe preferably is shaped in a way that prevents or lessens the occurrence of resonant EMI modes in the transceiver module housing.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: July 16, 2013
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Laurence R. McColloch
  • Patent number: 8481851
    Abstract: A variable-length lightning strike down-conductor is provided that allows for optimized ground path length, where excess down-conductor (grounding) cable is tightly coiled (e.g., as a mono-spiral coil) on a cable reel. Specifically, a primary down-conductor cable from an adjustable-length air terminal is clamped between the air terminal and the cable reel at any intermediate length, and the clamp is shunted to the ground plane (e.g., earth ground) through a second low-impedance down-conductor cable, as opposed to the high-impedance coiled down-conductor cable, thus increasing down-conductor effectiveness by reducing the impedance seen by a lightning strike to reach the ground plane.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 9, 2013
    Assignee: Raytheon Company
    Inventor: John P. Higby
  • Patent number: 8472203
    Abstract: This invention is directed to several mechanical features of an electronic device. The electronic device may include a spring for simultaneously grounding several components. The electronic device may include several interlocking fences for protecting electronic device components from RF radiation. The electronic device may include an antenna assembly that includes distinct components for functional and aesthetic purposes. The electronic device may include a window for permitting RF transmissions. The electronic device may include a metal frame for stiffening the electronic device. The electronic device may include a bezel used for aesthetic purposes and to support numerous electronic device components. The electronic device may include a flexible housing operative to elastically deform to assemble the electronic device. The electronic device may include an unsupported button.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: June 25, 2013
    Assignee: Apple Inc.
    Inventors: Teodor Dabov, Fletcher R. Rothkopf, Philippe Manoux
  • Publication number: 20130155638
    Abstract: Provided are a ground device and a portable terminal having the same. The ground device for connecting an inner metallic material with an outer metallic material includes a ground piece electrically connected with the inner metallic material and a connection terminal portion which is bent to extend as one piece from the ground piece and is connected with the outer metallic material. A portable terminal includes an inner metallic material provided in an inner side of a main body of the portable terminal, an outer metallic material provided in a battery cover provided in an outer side of the main body, and a ground device for connecting the inner metallic material with the outer metallic material, and the ground device includes a ground piece mounted in the main body to be connected with the inner metallic material and a connection terminal portion which is multi-step bent as one piece from the ground piece to be connected with the outer metallic material.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 20, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Samsung Electronics Co., Ltd.
  • Patent number: 8462520
    Abstract: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: June 11, 2013
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Hsien-Min Chen, Chia-Hsien Lee
  • Patent number: 8450614
    Abstract: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: May 28, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki
  • Patent number: 8432707
    Abstract: An AMB component and a connection interface for a memory installation with fully buffered Dimm memory modules connected in series. The AMB component is disposed on a connecting line from memory modules to a memory controller of the memory installation to re-amplify the connecting line between two consecutive FBD memory modules. The connection interface includes an AMB amplifier component for the connection of a main memory card that includes at least one processor, to an auxiliary memory card of the type having a series of memory modules. Two series of FBD memory modules are connected to respective FBD channels in the auxiliary memory card using FBD connectors in a daisy-chain arrangement.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: April 30, 2013
    Assignee: Bull S.A.S.
    Inventor: Jean-Jacques Pairault
  • Patent number: 8427842
    Abstract: An electromagnetic wave suppression material is fixed to a case of a communication module. The electromagnetic wave suppression material suppresses radiation of electromagnetic waves by coming into contact with a cage that is a module insertion portion of a chassis when the communication module is inserted into the cage. A piezoelectric element is provided on the case, and located between the case and the electromagnetic wave suppression material. When the communication module is inserted into the cage, the controller applies a voltage to the piezoelectric element to stretch it by the applied voltage, thereby increasing contact pressure between the cage and the electromagnetic wave suppression material.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: April 23, 2013
    Assignee: Fujitsu Optical Components Limited
    Inventor: Katsuhiko Hakomori
  • Patent number: 8420929
    Abstract: A ground fault protection device includes an electrically-conductive main body defining a reservoir having a plurality of drainage ports, and having downwardly-extending, ground-penetrating electrodes configured for minimal ground penetration. The device has handles for manual lifting and transportation, plus grounding terminals for connection of grounding cables. The device may be installed at a desired field location by applying downward force to the device to press the electrodes into the earth, thereby establishing an electrical connection between the grounding terminals and the ground via the main body and the electrodes. Grounding cables may then be connected between the grounding terminals and structures or equipment requiring grounding.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: April 16, 2013
    Assignee: R U Grounded Energy Inc.
    Inventor: Terry D. Mundle
  • Patent number: 8422247
    Abstract: An electric apparatus module 1 includes an upper casing 6, a lower casing 7 to which the upper casing 6 is attached and which is attached to a rear panel 2, an electronic device unit 8 accommodated in the upper casing 6 and the lower casing 7, a conductive shield shell 9 covering the electronic device unit 8, and a conductive ground shell 10 which is attached to the lower casing 7 at a side of the rear panel 2. The ground shell 10 includes a flat plate portion 83 piled on the rear panel 2, a contact piece 84 erected from an outer edge 83c of the flat plate portion 83 toward the lower case 7, and a contact member 85 protruded from a rear surface 83b of the flat plate portion 83 at the side of the rear panel 2. The contact piece 84 is inserted through a through hole 56 formed on the lower casing 7 to contact with the shield shell 9. The contact member 85 is inserted through a through hole 11 formed on the rear panel 2 to contact a cylindrical shield member 22 of an external device.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: April 16, 2013
    Assignee: Yazaki Corporation
    Inventor: Isao Kameyama
  • Patent number: 8422246
    Abstract: An electronic apparatus includes a front case, a rear case whose peripheral portion is brought into engagement with a peripheral portion of the front case and an electrostatic capacity type sensor portion which is encompassed by the front case and the rear case. A primary conductive portion, which is brought into engagement with the sensor portion for electrical connection, is formed on part of an inner surface of the peripheral portion of one of the cases which extends to the engagement portion. By adopting this configuration, the electronic apparatus can be fabricated easily and the operation of a touch switch provided in the electronic apparatus can be stabilized.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: April 16, 2013
    Assignee: Casio Computer Co., Ltd.
    Inventors: Wataru Nimura, Kenzo Ichikawa
  • Patent number: 8420953
    Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: April 16, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Meng-Che Yu
  • Patent number: 8406008
    Abstract: A portable electronic device includes a main housing, a metal frame, and at least one metal elastic member. The main housing includes a peripheral wall. The peripheral wall defines a recessed portion and includes at least one latching portion at the recessed portion. The metal frame clips the peripheral wall in the recessed portion. The at least one elastic member is detachably attached to the at least one latching portion. The at least one elastic member electronically connects the metal frame to the housing.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: March 26, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: De-Zhi Han
  • Patent number: 8391024
    Abstract: A shield case is configured for supporting a memory card. The shield case includes a recessed portion, and a first edge, a second edge, and a third edge arranged around the recessed portion. The first edge forms a first support plate. The second edge forms a second support plate. The first support plate and the second support plate cooperatively support the memory card.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: March 5, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Song-Ling Yang
  • Patent number: 8385084
    Abstract: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: February 26, 2013
    Inventors: Jinbang Tang, Jong-Kai Lin, Ronald V. McBean
  • Patent number: 8378223
    Abstract: A delay line structure disposed on a substrate having a dielectric base layer formed with a via, a layout layer and a grounding layer with a grounding circuit, includes two parallel spiral delay lines having a first outer straight section, a first outer bent section, an inner spiral region, a second outer bent section and a second outer straight section. The inner spiral region bends reciprocally between the first and second outer straight sections to form several inner bent parts and several inner straight parts. A grounding guard trace is disposed among the first and second outer straight sections and the inner straight parts and is coupled electrically to the grounding circuit, wherein each of the first and second outer bent sections and the inner bent parts has a width smaller than each of the first and second outer straight sections and the inner straight parts.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: February 19, 2013
    Assignee: Chung Yuan Christian University
    Inventors: Guang-Hwa Shiue, Jia-Hung Shiu
  • Patent number: 8373998
    Abstract: A shield that protects high-value input resistors in a power meter against unwanted effects due to electromagnetic interference from a nearby power supply and/or due to crosstalk from adjacent phases. The shield includes multiple printed circuit board shields that are arranged between each of the input resistors on a main printed circuit board in the power meter. Each PCB shield has a conductive layer that provides the shielding against unwanted energy. The resistors are arranged in a diagonal or parallel manner between each pair of PCB shields to prevent the resistor from movement, which prevents pin fatigue and fixes the value of the parasitic capacitance that is produced in the resistor-PCB-shield combination. In another configuration, the PCB shield is made of a flexible material, and snakes between and over the top or around the side ends of each resistor in a serpentine fashion, protecting the resistors from unwanted energies from both the top and the sides.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: February 12, 2013
    Assignee: Schneider Electric USA, Inc.
    Inventors: Marc A. Ricci, Jonathan Knoll
  • Patent number: 8369106
    Abstract: A plasma display apparatus having a structure of a base chassis to reduce EMI emission is provided. The plasma display apparatus includes a panel, a driving circuit, and a base chassis having at least one slit formed thereon.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: February 5, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hong-jin Kim, Young-ki Shon, Jae-wook Jung
  • Patent number: 8363422
    Abstract: An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: January 29, 2013
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kaoru Sakinada, Yasuyuki Oda
  • Patent number: 8363424
    Abstract: A grounding mechanism includes a grounding end, and a clip device connected to the grounding end for electrically connecting an electronic device to the grounding end. The clip device includes a first clip for contacting against a lateral side of the electronic device in a first direction so as to ground the electronic device in the first direction, and a second clip for contacting against another side of the electronic device in a second direction different from the first direction so as to ground the electronic device in the second direction.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: January 29, 2013
    Assignee: Wistron Corporation
    Inventor: Kun-Hui Lai
  • Patent number: 8358515
    Abstract: A low noise block converter includes a first printed circuit board, a second printed circuit board, and a housing. The first printed circuit board includes a metal layer disposed on a surface of the first printed circuit board. The second printed circuit board includes at least one chip. The housing includes a support surface configured to support the first printed circuit board, and a cavity formed on the support surface and configured to receive the second printed circuit board, wherein the first printed circuit board is placed on the support surface with the metal layer facing the cavity for shielding the electromagnetic fields radiated from the at least one chip.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: January 22, 2013
    Assignee: Microelectronics Technology, Inc.
    Inventors: Ruei Yuen Chen, Hsiang Hao Sung
  • Patent number: 8358512
    Abstract: According to one embodiment, an electronic device includes a housing which has a shielding layer on its inner surface and is provided with an opening, a housed component which is contained inside the housing, and a module which is provided at the exterior of the housing, and has a first conducting section that is electrically connected to the housed component and a second conducting section that is different from the first conducting section. The electronic device includes a connection portion, and the connection portion has a contact portion and an elastic support portion which is extended to a part near the opening and supports the contact portion. The contact portion equalizes the potential of the shielding layer with the potential of the second conducting section by electrically connecting to the shielding layer by the opening, and contacting the second conducting section.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: January 22, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshikazu Shiroishi, Tomohiro Hamada, Toshio Konno, Kohei Wada, Ryosuke Saito
  • Patent number: 8351221
    Abstract: The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: January 8, 2013
    Assignee: RF Micro Devices, Inc.
    Inventors: John Robert Siomkos, Mark Alan Crandall, Carl Hinshaw
  • Patent number: 8351219
    Abstract: An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: January 8, 2013
    Assignees: VisEra Technologies Company Limited, OmniVision Technologies, Inc.
    Inventors: Chun-Chi Lin, Jau-Jan Deng, Wei-Ping Chen
  • Patent number: 8345443
    Abstract: A circuit board includes a substrate and a supporting frame fixed to, and supporting, the substrate. The supporting frame includes a main body, a pressing supporting portion, two pulling supporting portions and two fixing portions. The main body includes a first arm and a second arm connected to the first arm. The pressing supporting portion extends downwards from a junction of the first arm and the second arm for counterbalancing a downward force applied upon the substrate. The pulling supporting portions respectively extend downwards from distal ends of the first arm and second arm for counterbalancing an upward force applied upon the substrate. The two fixing portions are respectively formed on the first arm and second arm. Each of the fixing portions is located between the pressing supporting portion and one corresponding pulling supporting portion and is closer to the corresponding pulling supporting portion.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: January 1, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zheng-Heng Sun
  • Patent number: 8335087
    Abstract: A wireless data terminal device comprises a detachable USB connector and a main circuit board, where at least two redundancy grounding connections are provided between the detachable USB connector and the main circuit board, and the grounding points of the at least two redundancy grounding connections are not adjacent to each other. A method for improving the radio performance of the wireless data terminal device is further provided. With the wireless data terminal device or the method for improving the radio performance of the wireless data terminal device, the connection of the grounding plane of the wireless data terminal device with the grounding plane of a computer is effectively enhanced. Therefore, the radio performance of the wireless data terminal device is improved.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: December 18, 2012
    Assignee: Huawei Device Co., Ltd.
    Inventors: Yanping Xie, Shuhui Sun, Qizhi Zhan, Shuqiang Gong, Chaoyan Zhang
  • Patent number: 8315059
    Abstract: A screw-less fixing assembly for an interface card having a fixing support includes a frame, a movable cover module and an elastic member. The frame has an I/O opening. One side of the I/O opening is provided with an accommodating space. A long plate of the fixing support is positioned to correspond to the I/O opening, and a short plate of the fixing support is received in the accommodating space. The movable cover module is mounted in the accommodating space. The elastic member has an elastic protrusion positioned to correspond to the short plate of the fixing support. The movable cover module is moved to drive the elastic protrusion to tightly fix the short plate of the fixing support to the frame. With this arrangement, the interface card can be rapidly detached from the frame or attached thereto without using screws.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: November 20, 2012
    Assignee: Super Micro Computer Inc.
    Inventor: Te-Chang Lin
  • Patent number: 8305771
    Abstract: An electromagnetic interference suppressing device includes a plurality of signal guiding units coupled to a metal housing of an electronic component for receiving a plurality of signals transmitted from the metal housing (the electronic component is installed on a circuit board), a plurality of grounding units coupled to a plurality of ground pads of the circuit board for transmitting the plurality of signals to the plurality of ground pads, and a main body coupled to the plurality of signal guiding units and the plurality of grounding units for transmitting the plurality of signals between the plurality of signal guiding units and the plurality of grounding units so as to implement a return path.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: November 6, 2012
    Assignee: Wistron Corporation
    Inventors: Lung-Fai Tuen, Chiu-Hsien Chang, Hong-Kuei Lee, Chi-Fang Weng, Chen-Yu Li
  • Patent number: 8297450
    Abstract: A modular rack for mounting avionics equipment comprises an upper rectangular frame, a lower rectangular frame, and a plurality of struts interconnecting the upper rectangular frame and the lower rectangular frame. Each strut is at least partially formed of an electrically conductive carbon fiber composite material and includes at least one flange extending substantially orthogonal to the strut. The flange includes a plurality of mounting holes to allow avionics equipment to be mounted to the rack. A method of mounting avionics equipment in an aircraft is also provided.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: October 30, 2012
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Martin P. Zavidniak, Dale J. Shabra, Phillip Y. Chou, George Gaffoglio
  • Patent number: 8295058
    Abstract: An apparatus is provided that comprises a plurality of signaling planes providing signal pathways and at least one internal reference plane providing either a voltage or a ground connection. The at least one internal reference plane are provided between at least two of the signaling planes. The apparatus further comprises a signal blind/buried via coupling a signal pathway of a first one of the at least two signaling planes with a signal pathway of a second one of the at least two signaling planes. The blind/buried via runs through the at least one internal reference plane. The apparatus also comprises at least one first conductive feature in the first one of the at least two signaling planes. The at least one first conductive feature is in close proximity to the signal blind/buried via and increases the capacitive coupling of currents in the reference planes of the apparatus.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: October 23, 2012
    Assignee: International Business Machines Corporation
    Inventors: Joseph J. Cahill, Anand Haridass, Roger D. Weekly
  • Patent number: 8289726
    Abstract: An electronic device (10) has a screen (12) protecting against radiofrequency electromagnetic fields, wherein the screen is formed by an at least partially conductive cap (12). In order to avoid the formation of a defined conductive connection between the cap (12) and a reference potential, conductive two-dimensional regions (30) of the cap (12) are arranged in electrically insulated fashion at a short distance parallel to at least one two-dimensional region (42) of a conductor (22) of a reference potential. The two-dimensional regions act as a capacitor and a capacitive coupling (12) to the reference potential is produced which eliminates or attenuates radiofrequency electromagnetic interference fields, which enter the electronic device or are emitted from it.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: October 16, 2012
    Assignee: Continental Automotive GmbH
    Inventors: Stefan Köhler, Peter Wiese