Abstract: A fastening element for connecting a housing to a printed circuit board comprises a first surface having a through hole for receiving a connecting element for connecting the fastening element to the housing, at least one first mounting pin extending from the first surface for mounting the fastening element to the printed circuit board, a second surface from which a second mounting pin extends for mounting a fastening element to the printed circuit board and a third surface connecting the first surface and the second surface.

Abstract: The present invention relates to a method and a printed board assembly for use in a MicroTCA system, wherein backplane pin connectors of the printed board assembly are arranged to be received in receiving connectors of a backplane interconnect, characterized in that it comprises at least one switch unit which is arranged with physical output/input ports that have physical port numbers that can be overridden by logical port numbers, an optimal routing of a number of sets of conductive threads in the printed board assembly arranged so that none of the conductive threads cross over each other while connecting physical output/input ports of the switch units with the backplane pin connectors, and printed circuit board layers arranged to shield signals travelling in the conductive threads in conductive layers of the printed circuit board layers from any significant crosstalk.

Abstract: A spectrophotometric sensor is provided that includes a mating surface upon which electrical and optical components may be secured and a Faraday shield assembly secured to the mating surface enclosing a photodetector. The Faraday shield assembly includes alignment features that may be employed to provide mechanical registration and/or electrical coupling of the Faraday shield assembly. The spectrophotometric sensor may be placed on a patient's finger, toe, ear, and so forth to obtain hemoglobin oxygen saturation using pulse oximetry, or for other physiological measurements.

Abstract: A grounding apparatus (200) includes at least one conductive member (20), a sliding mechanism (30) and a flexible printed circuit board (40). The sliding mechanism is conductive and electrically connected to the conductive member. The flexible printed circuit board includes a conductive layer (421) and a grounding end (4231), the conductive layer and the grounding end are electrically connected to the sliding mechanism.

Abstract: A printed wiring board unit includes an electronic circuit component, a printed wiring board, a plurality of first conductive terminals disposed between the electronic circuit component and the printed wiring board, at least one of the first conductive terminals arranged along a quadrangular outline, and a plurality of second conductive terminals disposed between the electronic circuit component and the printed wiring board, the second conductive terminals arranged at a corner of the quadrangular outline, and the second conductive terminals contacting at least one of the printed wiring board and the electronic circuit component in a relatively displaceable manner.

Abstract: A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Abstract: A disk drive cage comprises a bracket (3) and a shielding member (1). The bracket comprises a top wall (31) and a securing wall (32) parallel to the top wall. The securing wall defines a plurality of securing holes (321) therein. The shielding member comprises a shielding cover (20) and a bezel (10) attached to the shielding cover. The shielding cover defines a plurality of cross-shaped slots (23). Each cross-shaped slot comprises a first slot (231) and a second slot (232) crossing the first slot. A receiving area (236) is defined in a crossing portion formed by the first and second slots. The bezel comprises a plurality of securing posts (12) interferentially engaging with the plurality of cross-shaped slots, and a plurality of hooks (162) engaging with the securing holes of the securing wall of the bracket. Each securing post comprises a securing portion (124). The securing portion is larger in cross-section than the receiving area. The shielding member is mounted between the top wall and the securing wall.

Abstract: A grounding connector for an electronic device having a first housing element and a second housing element comprising a ground clip, a cam surface and a follower. The ground clip is electrically coupled to a first housing element, and selectably electrically coupled with the second housing element. A cam surface is positioned on the first housing element and in proximity to the ground clip. The follower is slidably positionable on the second housing element, and has a first end that engages the cam surface and a second end that engages the ground clip. The ground clip is electrically coupled to a second housing element while the electronic device is in each of the collapsed orientation and the articulated orientation. Upon movement between the collapsed orientation and the articulated orientation, the cam surface directs the follower to electrically decouple the ground clip from the second housing element.

Abstract: The present invention provides methods and devices for protecting electronic components of handheld electronic devices from electrostatic discharge. An electronic device in accordance with the present invention includes an enclosure having first and second housing portions, a mating edge connection between the first and second housing portions, an electronic component, and an electrically insulating frame. The electrically insulating frame is positioned within the enclosure and surrounds at least a portion of the electronic component thus providing an electrostatic discharge barrier between the mating edge connection and the electronic component.

Abstract: A printed circuit board unit is configured so that, when a charged electrical circuit unit is electrically connected to the printed circuit board unit, first, the ground potential of the electrical circuit unit is dropped to the frame ground potential, and next, the ground potential of the electrical circuit unit is dropped to the ground potential of an electrical circuit on the printed circuit board unit.

Abstract: Included are systems and methods for providing access of test points. An embodiment of a system includes an electrical module including at least one electrical circuit configured to communicate at least one electrical signal, the electrical module further including at least one multiple access test point configured to provide access for measurements of the electrical circuit. Some embodiments include an environmental housing that includes at least one access port, the environmental housing configured to receive the electrical module such that at least one access port provides access to at least one multiple access test point.

Abstract: A structure of mounting a shield cover according to the present invention includes a shield cover having an insertion part which is inserted into a gap formed between a circuit substrate and a shield cover fastening part along the circuit substrate. The insertion part of the shield cover includes a convex part that is elastic and deformable, and the end of the insertion part and the shield cover fastening part come in contact with each other by the elasticity with the convex part being in contact with the circuit substrate as the fulcrum.

Abstract: The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.

Abstract: Various cable entry port assemblies are disclosed. One embodiment includes a single boot assembly for supporting one power cable. Another embodiment includes two or more boot assemblies supported along a horizontal axis. Other embodiments include at least two boot assemblies supported along a vertically extending axis to form a column of boot assemblies. Another embodiment includes at least one column of boot assemblies and at least one row of boot assemblies. Methods for reducing an amount of interference traveling on a cable from one component located outside of a structure to another component located within the structure are also disclosed.

Abstract: An electrical connection unit includes an electrical junction box that incorporates a capacitor and has (a) a body that has an electronic component accommodating space accommodating the capacitor via an opening; and an electric wire receiving space receiving an electric wire electrically connected to a terminal of the capacitor, and (b) an electrically conductive grounding member that grounds a grounding terminal of the capacitor and integrally includes: a connecting portion electrically connected to the grounding terminal; a cover portion covering the opening of the electronic component accommodating space; a locking to be locked with corresponding locking portions of the body; a bending preventing portion preventing inward bending one of the locking portions of the body which may cause one of the locking portions of the grounding member to be accidentally detached from the corresponding locking portion of the body; and a grounding portion.

Abstract: An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.

Abstract: A plasma display apparatus comprises a plasma display panel and a chassis disposed on a rear portion of the plasma display panel to support the plasma display panel. The chassis is formed of plastic, and thus the weight of the plasma display apparatus is reduced. A conductive grounding member is disposed between the chassis and the plasma display panel. The apparatus further comprises a circuit unit having a grounding portion electrically connected to the conductive grounding member. A thermal conductive sheet is disposed between the plasma display panel and the chassis.

Abstract: An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate.

Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.

Abstract: A highly reliable covered multilayer module includes a plurality of side electrodes extending in a lamination direction of ceramic layers are provided at least at one of side surfaces of a multilayer module body. At least one of inner conductor layers is exposed at the side surface provided with the side electrodes, in a region interposed between an adjacently arranged pair of the side electrodes. A claw portion of a metal case is soldered to the side electrodes and the inner conductor layer. The plurality of inner conductor layers may be exposed at the side surface of the multilayer module body in the region interposed between the adjacently arranged pair of side electrodes such that at least a part of the inner conductor layer is superposed on the other inner conductor layer when seen in the lamination direction of the ceramic layers.

Abstract: The present invention concerns an electronic assembly with a heat sink in particular for a discharge lamp control module for a motor vehicle headlight. The electronic assembly with heat sink comprises essentially a printed circuit and a housing able to serve for thermal insulation and/or for electrical insulation and which comprises a heat sink. The heat sink is interposed between at least one face of the printed circuit and a face of the housing, the said heat sink extending over a major part of the face of the printed circuit and comprising an adhesive face for securing it to the printed circuit on the one hand and an adhesive face for securing it to the face of the housing on the other hand.

Abstract: An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.

Abstract: An aircraft circuit breaker includes a housing and a conductive member coupled thereto. The conductive member has a first conductive portion structured to be electrically and mechanically coupled to a conductive panel and a plurality of second conductive portions with a plurality of openings therethrough. An electronic circuit cooperates with an operating mechanism to trip open separable contacts. The circuit includes printed circuit boards having a plurality of conductive pads defining a ground. Each conductive pad has an opening therethrough. Each of a plurality of threaded conductive fasteners includes a conductive end portion, a conductive shaft disposed from the conductive end portion, and a plurality of conductive threads disposed on the conductive shaft. A number of the conductive threads electrically and mechanically engage a corresponding second conductive portion at a corresponding one of the openings. The conductive end portion electrically engages a corresponding one of the conductive pads.

Abstract: On a circuit board to be mounted on a metal chassis, a tuner having a metal sleeve protruding from a side of its case is mounted, with the sleeve protruding beyond an edge of the circuit board. A metal ground plate is fitted on the sleeve. With a flexible leg portion formed at a lower portion of the ground plate disposed on the chassis, the circuit board is fixed to the chassis with screws, thereby the leg portion comes into elastic contact with the chassis.

Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.

Abstract: The present invention relates to a grounding device in which a grounding member E having a grounding conductor 2 and a conductive laminated portion 5 covering the grounding conductor 2 is integrated with a foundation member B of a building so that the grounding member E and the foundation member B overlap partly or entirely. The grounding device is configured so that the grounding member having the grounding conductor and the conductive laminated portion covering the grounding conductor is integrated with the foundation member of the building are so that the grounding member and the foundation member overlap partly or entirely. This makes it possible to easily offer a small grounding resistance. Further, the foundation member of the building contacts the earth over a large area. This enables a small grounding resistance to be stably offered for a long period.

Abstract: The disclosure relates to a signal transmitting apparatus. The signal transmitting apparatus includes a conductor, a first and a second circuit boards, and a signal transmitting medium that is electrically interconnected between the first circuit board and the second circuit board. The signal transmitting medium includes a ground wire and an insulating layer wrapping the ground wire, wherein at least an end portion of the ground wire is not wrapped by the insulating layer and is bent to overlap the insulating layer and electrically connected to the conductor via a conductive adhesive material so as to conduct the electrostatic charges accumulated in the signal transmitting medium to the conductor as a ground.

Abstract: A transceiver cage assembly includes a housing (10) and a grounding device (20). The housing includes at least one receiving space for receiving at least one transceiver module. The grounding device mounted on the housing includes a flat main member (200), and at least one resilient member (220) protruding from the main member. The grounding device provides electrical connection between the housing and bezels.

Abstract: An elastic grounding clip, set between a PCB and a housing of an electronic device, includes two first main pieces, a first connection piece connected between the two first main pieces, a second main piece adjacent one of the first main pieces, and a second connection piece connected between the one of the first main pieces and the second main piece. The two first main pieces and the first connection piece bound a first clamping part configured for clamping the PCB, and the corresponding first main piece, the second connection piece, and the second main piece bound a second clamping part configured for clamping a protruding portion of the housing of the electronic device.

Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.

Abstract: A planar circuit housing (300) for containing a planar circuit (120) is disclosed. The planar circuit housing (300) comprises a support portion (341) for supporting edges of the planar circuit (120), the support portion (341) being provided on at least one housing internal surface substantially perpendicular to the planar circuit substrate (120); an upper cavity (380) in the housing (300) above the planar circuit (120); and a lower cavity (382) in the housing (300) below the planar circuit (120), the lower cavity (382) having the same sizes as the upper cavity (380) in directions parallel with the planar circuit substrate (120).

Abstract: While gradually increasing the widths of signal lines (104a, 104b, 105a, 105b) of first and second groups of differential signal lines (104, 105) to suppress attenuation in the lines, the opening widths of slits (104s, 105s) formed in a GND layer (102) below the differential signal lines are similarly changed. Thereby, impedance matching is realized. Further, by alternately disposing a large-width side and a small-width side of the two groups of differential signal lines (104, 105), the total wiring area widths are reduced.

Abstract: A mounting assembly for shielding EMI, the mounting assembly includes a drive bracket (10) and a shielding apparatus (30). The drive bracket includes a bottom wall (11), a first retaining wall (16), a second retaining wall (18), and a dividing wall (15), the first retaining wall defines a first hole (161), the second retaining wall defines a second hole (181), the dividing wall defines an upper hole (153) and a lower hole (151). The shielding apparatus includes a shielding cover (31) and a bezel (33), the shielding cover has a first flange (36) and a second flange (38), the first flange has a protuberance (361) engaged in the first hole, the second flange has a protuberance (381) engaged in the lower hole, the second shielding apparatus (40) engaged in the upper hole of the dividing wall and the second hole of the second retaining wall.

Abstract: A grounding structure of a liquid crystal module is disclosed. The grounding structure is adapted for protecting a control printed circuit board of the liquid crystal module from electro-magnetic interference. In one embodiment, the grounding structure comprises: i) a frame configured to receive the control printed circuit board, ii) a grounding conductive sheet, wherein one end of the grounding conductive sheet is electrically connected to the control printed circuit board, and the other end comprises a first engaging member and iii) a metal bezel configured to lock around the frame, the metal bezel including a second engaging member, wherein the second engaging member engages with the first engaging member.

Abstract: A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating layer. Circuit elements are connected to the conductive pattern. Sealing resin covers the front and side surfaces of the circuit board. Furthermore, the sealing resin also covers the edge region of the back surface of the circuit board. Thus, it is ensured that the circuit board has a dielectric strength while exposing the back surface of the circuit board to the outside.

Abstract: A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.

Abstract: A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two separate, grounded portions, with a first of the portions underlying the digital circuit and a second portion underlying the analog structure. In an exemplary embodiment, the circuit board has a high density of analog-to-digital converter integrated circuits, each with two analog input signals and ten parallel high speed digital output signals corresponding to each input signal. A grounded, conductive band is placed on the board between the inputs and outputs of the integrated circuit, and a ground plane is provide which has separate, interleaved analog and digital areas, with the digital area underlying only portions of the board having digital signals and structures and the analog area underlying only portions of the board having analog signals and structures.

Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.

Abstract: A glass substrate carrier assembly has a shelf and multiple pickup caps. The shelf is connected electrically to ground and has a bar, two stands and two brackets. The bar has two ends. The stands are mounted respectively on and extend down from the ends of the bar, are connected electrically to ground and are electrically conductive. The brackets are electrically conductive, are mounted respectively on and extend perpendicularly inward from the stands below the bar and face each other, and each bracket is T-shaped and has a distal edge and multiple tabs. The tabs are electrically conductive and are mounted on and extend perpendicularly from the distal edge of the bracket. The pickup caps are electrically conductive and are mounted on the tabs. Static electricity will pass through the pickup cap, the tab, the bracket and the stands to ground so static electricity will be removed from the shelf.

Abstract: An electrical grounding strip has a first link and a second link, wherein the second link is connected directly to the first link, and each of the first and second links has a portion lying substantially in a plane and has at least one electrically conductive spike attached to the portion. The spike projects generally orthogonally to the plane of the link portion. An electrically conductive ground strap is in electrically conductive contact with the spikes of each of the first and second links.

Abstract: The invention provides a radio frequency unit including a box-shaped chassis into which an insulating board loaded with electronic components is housed, and two connectors attached to a front plate of the chassis with a space therebetween. A supporting member protruding into the chassis is provided in a position between the two connectors in the front plate. The supporting member has a flat plate portion that is bent at right angles from an end face of the front plate, and extends parallel to the insulating board, and a pair of tongue pieces that are formed so as to be bent towards the inside of the chassis from both side ends of the flat plate portion. The pair of tongue pieces are located in a cutout portion provided in the insulating board, and the tongue pieces are soldered to a grounding pattern provided in the insulating board.

Abstract: A grounding clip is a shelf-grounding device includes a resilient conductive clip that installs onto a fully assembled shelving unit, providing a plurality of electrical connections between the shelf and post to reduce the risks from electrostatic discharge, or ESD. The clip can be installed and removed without the use of tools and is held securely in place when attached. Since the clip is attached after the shelving unit is assembled, less skill is required by the installer during the installation or reconfiguration process. The clip is reusable and provides electrical connectivity between the shelf and post regardless of whether the shelving unit was assembled with conductive or plastic split sleeves.

Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.

Abstract: A data management device and library are provided for organizing, holding, and providing electrical connectivity to multiple memory cards. The data management device can comprise a device body, a plurality of sockets to accommodate the data storage media, an electrical connector, and a power management circuit. Data can be retrieved from or transferred to the selected memory cards utilizing the device. The data management library can be utilized to interconnect multiple devices and can be daisy chained to other libraries.

Abstract: An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

Abstract: A circuit structure includes a circuit board, a first circuit component mounted on the circuit board, and a second circuit component mounted on the circuit board. The first circuit board has a first ground plane layout including at least one ground plane, and a second ground plane layout including at least one ground plane, where the first ground plane layout is not electrically connected to the second ground plane layout within the circuit board. The first circuit component is electrically connected to the first ground plane layout, and the second circuit component is electrically connected to the second ground plane layout.

Abstract: An electromagnetic interference (EMI) gasket for an electronic module comprises a valley feature formed on one side of an EMI gasket and a crown feature formed on the other side of the EMI gasket in order to complement the valley. One or more EMI gaskets are used to construct a shield across the opening of a module cage or rack. Each gasket forms a link in a series of modules, in order to complete a seal across the opening in the cage. A perpendicular pressure forces the module gaskets to center and align evenly as the crown and valley of the opposite features nest together. The modules can be then pressed together and the overlap of the crown and valley acts to center the alignment and create a pressure for satisfactory EMI grounding and the reduction of EMI leakage.

Abstract: The present invention relates to a circuit board mounting panel for electrical appliance, comprising: a base panel disposing a first printed circuit board and a second printed circuit board thereon; a first shield cover disposed on the base panel and mounting the first printed circuit board therein and formed with an opening part in a vertical direction to a surface of the first printed circuit board; and a second shield cover mounting the second printed circuit board therein and inserted into the first shield cover through the opening part and coupled to the base panel. Thus, the present invention provides an improved structure of a shield cover for a circuit board mounting panel for an electrical appliance, thereby minimizing a idle mold that may be produced while developing a circuitry or a PCB.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a case which is cooperatively engaged to a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. In each embodiment of the present invention, the case is reinforced by a stiffener which effectively increases the mechanical strength of the fully fabricated memory card, thus providing the capability to withstand typical bending and twisting tests. The stiffener may be provided in any one of a plurality of different shapes or profiles, and may embedded within one or more of various locations within the case.

Abstract: A rack-mountable in-line surge protection system includes a chassis configured to mount to an equipment rack, the chassis including: an electrically-conductive buss, an electrically-conductive ground member coupled to the buss and configured and disposed to be connected to a grounding mechanism, and a plurality of electrically-conductive bias members coupled to the buss.