Abstract: Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate.

Abstract: A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.

Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.

Abstract: An metal housing comprising an electrical device includes electrical pins that protrude from the metal housing, and the metal housing formed with a compressible protrusion around the pins.

Abstract: A grounding structure, for connecting to an opposite connecting electrical device with a metal casing, is assembled on a circuit board having at least one grounding component. The grounding structure includes a conductive mechanism electrically connected to the metal casing of the opposite connecting electrical device; and at least one conductive pad, disposed between the conductive mechanism and the circuit board, and contacting the conductive mechanism and the grounding component of the circuit board. The grounding structure of the invention can transmit the disturbance to be advantageous for signal transmitting between the opposite connecting electrical device and the circuit board.

Abstract: A structure for supporting a printed wiring board housed in a housing of an electronic device. The supporting structure includes a first projection formed on the housing and projecting toward the printed wiring board. The electronic device includes a conductor plate, which is grounded and accommodated in the housing. A second projection is formed on the conductor plate and projects toward the printed wiring board. The printed wiring board includes a substrate and a ground layer, which is arranged on the substrate. The first projection of the housing and the second projection of the conductor plate hold and support the printed wiring board in between and thereby electrically connect the ground layer to the conductor plate.

Abstract: A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules.

Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.

Abstract: A retaining assembly for retaining a first member with a second member is provided. The retaining assembly is capable of retaining the first member. The retaining assembly includes a body and at least one retaining device retained to the body. Each retaining device includes a supporting member and a latching member corresponding to the supporting member. The supporting member and the latching member cooperatively define a space for receiving the second member, and further cooperatively secure the member after the member is retained in space. An apparatus using the retaining assembly are also provided.

Abstract: An anti-eavesdropping device is described. The device comprises a receiving compartment for receiving an electronic device, a noise generator, and an EMI filter. The receiving compartment is sealable to minimize signal emissions from the interior to the exterior and from the exterior to the interior, and the noise generator is coupled with the receiving compartment and the EMI filter. The EMI filter is operatively coupled with the noise generator.

Abstract: An electronic device includes: a metal housing with an opening; a metal lid that is attached to the housing so as to cover the opening; a first substrate fixed in the housing and spread facing and parallel to the opening; two connectors that are fixed in the housing at a position facing and closer to the opening than the first substrate and are spread facing and parallel to the opening, the two connectors extending parallel to each other such that there is a predetermined space between the two connectors, the two connectors each being capable of receiving a second substrate that is inserted therein toward the space; and a metal plate member disposed in the space so that the metal plate member is fastened to the housing and resiliently contacts a surface of the first substrate, thereby electrically connecting a ground of the first substrate to the housing.

Abstract: A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Abstract: According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.

Abstract: A folded EBG structure has a plurality of cells arranged in a two-dimensional array. Each of the cells has an electrically conductive patch and an electrically conductive via coupled between the patch and a ground plane. In one dimension of the folded EBG structure, at least one patch in that dimension is folded into three sections located in different planes. In general, both ends of the folded EBS structure have folded patches. Via walls having electrically conductive vias are provided on both ends of a folded EBG structure for connecting the cell vias to the ground plane. The distance between each via wall and the folded EBGs is substantially equal to the length of the vias connected to patches.

Abstract: A circuit interrupter includes a housing having a molded case made of liquid crystal polymer. Separable contacts are disposed within the housing. An operating mechanism is disposed within the housing and is structured to open and close the separable contacts. A trip mechanism is disposed within the housing and is structured to cooperate with the operating mechanism to trip open the separable contacts. The trip mechanism includes an electronic trip circuit and a rigid, conductive base providing a ground to the electronic trip circuit. The rigid, conductive base is insert molded to a portion of the molded case.

Abstract: A printed circuit board is disclosed. The printed circuit board includes an insulation layer and a conductor layer having a GND pattern. The printed circuit board has a center portion, to which an element is to be mounted. The printed circuit board has a periphery portion and a slit pattern separating the periphery portion from the center portion. The GND pattern extends through the center portion and the periphery portion.

Abstract: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.

Abstract: A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substrate. At least one electronic component is electrically attached to a first surface of the second substrate. An RF shield is formed on the first substrate to minimizing Electro-Magnetic Interference (EMI) radiation and Radio Frequency (RF) radiation to the at least one electronic component on the first substrate to form an RF shield. A mold compound is used for encapsulating the semiconductor device.

Abstract: Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.

Abstract: A radio module for use in an electronic device is disclosed. The radio module has a shield for reducing electromagnetic interference on the radio module. The shield may include a heat-spreading layer made of a material including graphite. The heat-spreading layer may spread heat generated by the radio module. The shield may also include a reflective layer overlapping the heat-spreading layer and configured to reflect electromagnetic energy to the heat-spread layer. The heat-spreading layer is also configured to absorb at least a portion of the electromagnetic energy, thereby reducing the electromagnetic interference on the radio module.

Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

Abstract: An electrostatic discharge guide using metal sputtering process and modifying plastic case is applied to an electronic device. The plastic case and a metal case are laminated. The plastic case is defined with a tip portion spaced from the metal case on side wall thereof. A conductive layer formed on the surface of the plastic case opposite to the metal case extends to the tip of the tip portion, and is electrically connected to a ground of the electronic device. Therefore, when electrostatic charges accumulated on the metal case exceed a specific value, the static electricity is discharged to the ground of the electronic device based on the point discharge principle, instead of causing an electric shock to a user.

Abstract: A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks.

Abstract: Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias 201, an assembly of ground vias 202 surrounding the signal via, ground plates from conductor layers of the PCB connected to the ground vias, closed ground striplines 205 connecting the ground vias and power supply layer.

Abstract: Insulating ribs are formed into one or more portions of a housing that encloses circuitry of an electrical device. Components mounted on a board are separated according to whether they are related to a primary side of a power transformer or a secondary side. Primary related components are typically mounted on the primary side of an isolation slot formed into a circuit board and components related to the secondary are mounted on the other side. The insulating ribs are strategically placed to protrude through the slots when circuit board is mounted to the housing portion. Thus, when the housing portion is joined to another housing portion, which also may include insulating ribs strategically placed, the ribs increase the breakdown voltage of the boundary.

Abstract: An electronic device includes: a board having a first connector; a housing in which the board is disposed and which has a work opening for allowing external work for the board; and a cable which has an end reaching the board by passing through a path within the housing and has a second connector to be mated with the first connector and disposed at the end. The electronic device further includes a cable holding section provided at an inner wall of the housing and having a slit whose width is smaller than a size of the second connector. The cable holding section holds the cable so that a part of the cable reaches the work opening.

Abstract: An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A1, A2) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A1, A2). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface B1 and provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B1).

Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.

Abstract: An arrangement for installing a communication unit in an apparatus having a security housing, such as a mail processing apparatus, including a cavity bay located at a non-secure region of the apparatus that is accessible by a cover that is non-destructibly detachable from the security housing. The bay receives a pluggable communication unit that has a connection element connectible by a plug-in movement with a connection element of a motherboard located in the secure region of the apparatus: The cavity has at least one further connection element that is electrically conductively and mechanically connected with a metal chassis part of the apparatus in the security housing. This further connection element protrudes into the cavity and establishes contact with the communication unit for grounding thereof.

Abstract: In a semiconductor device provided with terminals for external connection, input terminals, power supply terminals and ground terminals are disposed close together on part of one edge portion of two opposing edge portions. Output terminals are disposed in the vicinity of both ends of the one edge portion and on another edge portion of the two edge portions. A ground wiring is routed from the other edge portion and connected to the ground terminals. In so doing, elemental devices connected to the input terminals are disposed close together, whereby needless gaps do not arise between the elemental devices. A ground potential is also supplied by the ground wiring.

Abstract: A digital camera contains a circuit board and a battery box inside a housing. The housing and the battery box are made of plastic. The housing is fixed to the battery box with a tapping screw. A conductive plate for preventing the tapping screw from being charged is arranged between the housing and the battery box. Projections of the conductive plate penetrate into thread grooves of the tapping screw. The conductive plate transmits static electricity of the tapping screw to a grounding member of the circuit board.

Abstract: An electronic module (10) includes a housing having outer surface, a metal gasket (5) attached to the housing and covering the outer surface. The gasket (5) has a set of first detents (53) and a set of second detents (52). The set of first detents (53) are spaced apart from each other and the set of second detents (52) substantially cover seams between the set of the first detents (53).

Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.

Abstract: According to one embodiment, an electronic apparatus is provided with a case, a module contained in the case, a ground provided in the case, a plurality of protrusions which protrude from an inner surface of the case, and a cable connected electrically to the module. At least one of the protrusions includes, on a side face thereof, a conductor connected electrically to the ground. The cable includes an electrically conductive film and is supported by the respective side faces of the protrusions.

Abstract: An anti-electromagnetic interference (anti-EMI) shielding device for fastening to a PC board is disclosed. The anti-EMI shielding device includes a frame having an upper lid closed onto an open top thereof, the frame including a plurality of side walls sequentially connected to one another to enclose a space therein and having a receiving hole formed on one of the side walls at a predetermined position; a connector including an annular ring portion, a body portion, and a tubular portion following the body portion, the annular ring portion being located at a front end of the connector for engaging with the receiving hole on the side wall of the frame; and a sealing structure forming a 360-degree sealing between the frame and the connector to effectively prevent electromagnetic wave from leaking out of and entering into the shielding device.

Abstract: An electromagnetic interference shielding device includes a printed circuit board, a metal member and an elastic member. The elastic member includes a first resisting portion which contacts the printed circuit board and a second resisting portion which contacts the metal member, and the second resisting portion is saw-toothed, and is capable of piercing an oxidized layer of the metal member. Thus, the elastic member keeps contacting the metal member maximally no matter the metal member is oxidized or not, and reduces the electromagnetic interference effectively.

Abstract: A tightly-coupled printed circuit board (PCB) circuit includes components mounted on a PCB enabling smaller integrations using decoupled lines extending between reference layers, such as ground planes, form isolation islands on the PCB. The decouplers are capacitors, inductors and/or resistors in tandem with ground layers of the PCB. The isolated components can comprise high-frequency RF antennas and receivers, for example in a GNSS antenna-receiver circuit. Multiple antennas can be connected to one for more receivers with multiple, independent RF front end components by RF traces, which are either embedded within the PCB between the ground planes, or by surface microstrip antenna traces.

Abstract: A lightning resistive bush body includes a cylindrical bush body. The bush body is composed of an inner insulative layer, a center electric-magnetic absorbing metal layer and an outer insulative layer, wherein the inner insulative layer, the center electric-magnetic absorbing metal layer and the outer insulative layer is integrated, and the center electric-magnetic absorbing is provided between the inner insulative layer and the outer insulative layer, and two axial edges of the center electric magnetic absorbing metal layer shape having radial openings.

Abstract: A communication device includes a first printed circuit board (PCB), a second PCB disposed parallel to the first PCB, a first shielding cage and a second shielding cage. The first and second shielding cages are fixed to the first and second PCBs and define at lease one first and second receiving space to receive at least one transceiver modules, respectively. The first and second shielding cages include at least one first and second retaining tabs, respectively. Each of the transceiver modules received in the first and second shielding cages includes a release mechanism configured with a release portion and a trigger. The release portions can match one corresponding first and second retaining tabs to release the corresponding transceiver module. The triggers are disposed on one side of the transceiver modules close to the first and the second PCBs.

Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.

Abstract: A display device includes a panel assembly which forms an image, an accommodating member which accommodates the panel assembly, at least one printed circuit board (“PCB”) installed on a back side of the accommodating member, and an electromagnetic wave shielding member disposed between the accommodating member and the PCB, and including a plurality of protrusions.

Abstract: There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.

Abstract: The invention relates to an assembly of at least one carrier (12), at least one telecommunications module (10) mounted on the carrier (12) and at least two grounding elements (14, 16), at least one grounding element (14) being fitted to the telecommunications module, and at least one grounding element (16) being fitted to the carrier (12), wherein the grounding elements (14, 16) are in direct contact with each other and can be pivoted with regard to each other while keeping the contact.

Abstract: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.

Abstract: A grounding apparatus for connecting electrical equipment to ground comprises a plate comprising a top surface, a bottom surface and first and second end portions. Typically, the plate is connected to opposing support legs, such that an open space is provided under the bottom surface of the plate. The top surface of the plate may comprise one or more raised surfaces and also define a plurality of apertures for use in securing one or more lugs to the plate. The grounding apparatus optionally comprises a port connected thereto and comprising an exterior surface defining an opening for receiving a plug.

Abstract: An electronic device including a first portion, a second portion, and a circuit board is provided. The first portion has a first surface including a first conductive region. The second portion has a second surface including a second conductive region and a second nonconductive region. The second conductive region and the second nonconductive region are respectively in contact with a part of the first conductive region. The circuit board has a plurality of electronic components thereon, and the circuit board is disposed at one side of the first portion and the second portion.

Abstract: An electronic device includes a shell, a printed circuit board, and a dummy connector. The shell defines a through hole and accommodates the printed circuit board. The dummy connector includes a main body and a grounded portion. The main body includes a projection engaging the through hole. The grounded portion extends from the main body and is electrically fixed to the printed circuit board to be grounded.

Abstract: An electronic ballast and ballast housing having an integral ground for a circuit board positioned within the housing. A ‘snap in’ capture means holds circuit board under flexion so as to press a circuit grounding means in electrical contact with an integral grounding device attached to the ballast housing and providing electrical continuity between the circuit grounding means and the ballast housing. The coupler includes a grounding tab with a fulcrum extension extending from the housing and holding a ground plane surface of the circuit board by means of serrated teeth. An alignment tab disposed on a housing wall receives an alignment slot disposed in the circuit board so as to provide proper alignment of the electrical contacts. The coupler includes an overhead extension that engages a jumper wire in the circuit of the circuit board.

Abstract: An input device of the invention includes a body formed with an accommodating part; an operation member having a basal end accommodated in the accommodating part and a distal end projected in a swinging operable manner to either side in a width direction and in a pushing operable manner from an neutral position; and an earth terminal for dissipating static electricity charged in the operation member. The input device is attachable to a circuit board. The earth terminal, being a metal plate insert molded in a wall, includes a contacting portion and first and second projections arranged near the operation member, and connecting parts exposed from the other end face of the body and solder connectable to respective earth patterns of the circuit board.