Abstract: Electric or electronic modules may be carried by an electrically shielded module carrier that includes a cover element and a base element enclosing at least one mounting region which is divided into a front section and a rear section by an intermediate wall card. Holding elements for inserted flat modules are laterally provided in each section and include guiding gratings which face each other in pairs and are integrated into an electromagnetic shield. The cover element and the base element are connected to the guiding gratings of the front section in a fixed manner and are detachably connected to the guiding gratings of the rear section.

Abstract: An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The electric shielding layer is inserted between the first electronic module and the second electronic module for ensuring electric insulation between the first electronic module and the second electronic module.

Abstract: A circuit pack housing for providing EMI protection for a circuit pack which may be inserted into an electronics system such as a telecommunications base station cabinet. The circuit pack housing has a single piece plastic design which surrounds the enclosed circuit pack. The internal walls of the circuit pack housing are metalized, and the inner surface of the housing comprises one or more grounding tabs with metalized surfaces. The metalized plastic circuit pack housing also comprises two opposite living hinges and a self latching mechanism, such that when the circuit pack is placed inside the housing and the housing is closed on itself (i.e., with use of the living hinges), the circuit pack is sealed within the housing and protected from EMI thereby. Moreover, the housing may include protruding flexible tabs at the ends thereof, which advantageously seals around the connector which energizes the circuit pack.

Abstract: An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board.

Abstract: A medical device is configured to attenuate emission of electromagnetic radiation and comprises a housing, a circuit assembly mounted in the housing, and a panel coupled to the housing and to the circuit assembly. The panel comprises a first conductive region on an interior surface of the panel that is configured to be capacitively coupled to the ground, an opening substantially adjacent to the first conductive region, a second conductive region on the interior surface that is configured to be coupled to ground, and a non-conductive region on the interior surface between the first conductive region and the second conductive region.

Abstract: In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

Abstract: A circuit device includes plural semiconductor circuit devices that are formed on independent substrates, respectively, and communicate with each other. Each of the semiconductor circuit devices includes: plural modules of an identical type, functions of which are substitutable for one another; a module selecting unit that selects, among the plural modules, usable modules that are a part of the plural modules; and a circuit block including an interface unit for the modules selected by the module selecting unit to exchange signals with the other semiconductor circuit devices. A logic module included in one of the semiconductor circuit devices belongs to a different type, a function of which is not substitutable for a function of a logic module included in at least one of the other semiconductor circuit devices.

Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

Abstract: A distribution box for enclosing an electrical connection in an electrical wiring system includes a housing that is resistive to penetration by electromagnetic fields and a plurality of electrical conductors that form the electrical connection. A mirror plate is disposed within the housing and generates mirror currents to suppress electromagnetic fields generated by current flowing through the plurality of electrical conductors.

Abstract: Apparatus include a substrate having a top surface, a housing having an inner surface, and a joint located between the housing and the substrate. The top and inner surfaces are located to form a cavity between the housing and the substrate. The joint is located to seal the cavity. The apparatus includes a micro-electronic structure that is exposed to the cavity and is located between the substrate and housing. The apparatus also includes a dielectric layer located over the substrate and electrical feedthroughs that traverse the joint and connect to the micro-electronic structure. Portions of the electrical feedthroughs that traverse the joint are located in trenches in the dielectric layer. The electrical feedthroughs have a density along part of the joint of at least 10 per millimeter.

Abstract: A computer enclosure includes a front panel, a drive bracket attached to the enclosure for receiving a data storage device therein, and a static protection device attached to the drive bracket. The drive bracket includes a recess with a plurality of catch orifices defined therein and a plurality of hooks formed thereon. The static protection device includes a main portion, and a side plate bent outwardly from the main portion. A plurality of catches is formed on the main portion engaging in the catch orifices of the drive bracket and a plurality of locking holes defined in the side plate corresponding with hooks of the drive bracket. The main portion and the side plate respectively connect with the data storage device and the front panel of the enclosure to provide a path to ground.

Abstract: An electronic device includes: a conductive housing having an upright end wall formed with an opening; a mother board mounted in the conductive housing and having an end that is disposed adjacent to the upright end wall of the conductive housing, and a grounding trace that has a first end portion disposed adjacent to the end of the mother board, and a second end portion distal from the end of the mother board; a connector mounted on the mother board adjacent to the end of the mother board, extending through the opening in the upright end wall of the conductive housing, and having a grounding pin in electrical contact with the first end portion of the grounding trace; and a ground-bridging mechanism disposed adjacent to the first end portion of the grounding trace and bridging electrically the conductive housing and the first end portion of the grounding trace.

Abstract: An electronic device includes a circuit board (20) and a shielding cove (10). The circuit board includes a plurality of mounting holes (26), a first surface (22), a second surface (24) opposite to the first surface, and at least one electronic component (28). The shield includes a top wall (12), a pair of first sidewalls (14) and a pair of second sidewalls (16) opposite to the first sidewalls. The top wall, the first sidewalls and the second sidewalls cooperatively bound a receiving portion (18) for receiving the electronic component. At least one mounting portion (162) extends from each of the second sidewalls, corresponding to the mounting holes of the circuit board.

Abstract: A vent grid has parallel first electrically-conductive members and parallel second electrically-conductive members intersecting with the first electrically-conductive members. The intersection between the first and second electrically-conductive members is forced to have a larger cross-sectional area. The characteristic impedance thus increases. The electric current flowing through the first and second electrically-conductive members turns over at the boundary between the intersection and the first and second electrically-conductive members. The flow of the electric current is in this manner interrupted. Accordingly, the vent grid fails to induce electromagnetic wave. Moreover, the electrically-conductive piece is merely located at a corner of the opening. Decrease in the percentage of the opening is thus suppressed to the utmost per a unit area. A sufficient airflow can be established through the vent grid. Decrease in the cooling efficiency and performance can be suppressed.

Abstract: A PC card is provided which can be used to add multiple capabilities to an information processing apparatus in cooperation with a conventional card only by the use of a single card slot. The PC card 1 comprises a card main body 10 which is provided with a connection plug 11 for connecting with the information processing apparatus 20 and a card connector 12 through which an additional card 30 can be connected, and which is connected to the information processing apparatus 20 to add multiple capabilities to the information processing apparatus; a pair of parallel rail members 13 serving to guide the additional card 30 for insertion; and a bridge member 14 connected between said pair of parallel rail members in order not to block the insertion path.

Abstract: An optical transceiver module that includes an enclosure within which are disposed a transmitter module and a receiver module. A primary and secondary board are disposed as well in the enclosure, and the transmitter module and the receiver module are each connected with one of the boards. The primary and secondary boards each have a ground plane, and a third ground plane is provided by a ground signal plate that disposed within the enclosure and electrically coupled with the primary board and the secondary board.

Abstract: A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.

Abstract: An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted adjacent an electronic component that it is desired shield. The shielding portion at least partially surrounds the component, thereby providing a degree of EM shielding. The assembly also includes at least one resiliently biased electrically conductive connection member in electrical communication with the shielding portion. The connection member is operable electrically to connect the shielding portion to a predetermined voltage by bearing down upon an electrically conductive contact of the circuit board.

Abstract: A circuit structural body includes a printed circuit board having a conductive pattern constituting a power circuit including a semiconductor switching element and disposed on one surface of the printed circuit board, and a conductive pattern constituting a control circuit for controlling the semiconductor switching element and disposed on the other surface of the printed circuit board. The printed circuit board has a through-hole for mounting the semiconductor switching element to both of the conductive patterns. The circuit structural body can be manufactured by a method including the step of laminating a reinforcing plate to one surface of the printed circuit board and the step of mounting the semiconductor switching element from the opposite side to the reinforcing plate.

Abstract: The present invention provides a shield case comprising a frame body having an interior divided by partition plates and housing electronic components therein and a closure for providing electric shield by covering an opening portion of the frame body, and having a slit piece integrally formed with the closure by cutting out a part of the closure along a periphery except for a base portion to a raised form, the slit piece for coming into contact with an end of the partition plate, the slit piece being formed in a gutter shape from the base portion to the other end. Furthermore, the slit piece has the gutter shape which becomes greater in curvature radius from the base portion to the other end. This enables the shield case of the high-frequency device of the present invention to strengthen the contact between the slit piece formed with the closure for providing grounding and the partition plates provided within the frame body, whereby the reliable high-frequency device can be provided.

Abstract: An electronic device utilizing an electrostatic discharge (ESD) protection structure. The electronic device comprises a housing and a printed circuit board (PCB) with an ESD protection structure disposed thereon. The PCB has at least one metal layer with a ground circuit and a functional circuit. The ground circuit includes at least one device-protecting area near the edge of the PCB and exposed on the surface thereof. The device-protecting area is covered by a thick conductive layer, and electric components are disposed nearby, such that static electricity can be transferred to ground through the ground circuit of the PCB to protect the electronic device from interferences and damages.

Abstract: A television tuner has a bottom chassis, a top cover and a front panel, the bottom chassis having support surfaces provided on an upper portion of a front side of the bottom chassis to extend with a rising slope in a direction from a front side toward a rear side thereof, a plurality of semi-spherical projections formed on the support surfaces, a plurality of substantially U-shaped notches provided on the support surfaces, and the top cover having a convex-shaped portion to abut against the semi-spherical projections on the bottom chassis and to project toward the semi-spherical projections to function as a reinforcement rib, and hook-shaped engagements to engage with an upper portion of an inner surface of the front panel from under.

Abstract: Apparatus for housing electrically powered components to protect such components from damage and interference caused by lightning strikes and other externally generated magnetic fields. Methods of manufacturing such enclosures are also disclosed. A cable entry port and door entry are also disclosed.

Abstract: A system is provided for channeling high frequency signals through sheet metal containment within an electronic device. In exemplary embodiments of the invention, an electronic device employing the system includes a midplane circuit board. One or more interface modules may be coupled to the midplane circuit board, for example, for providing a high frequency interconnect with other devices such as Fiber Channel or the like. A midplane chassis shield is disposed within the device's housing adjacent to the midplane circuit board so that the interface modules interconnect with the midplane circuit board through apertures formed in the shield wherein the midplane circuit board, midplane chassis shield and interface module cooperate for providing a low impedance tunnel for channeling high frequency signals to ground.

Abstract: A storage apparatus includes a first rack having electrical conductivity, on which are mounted channel control parts receiving data input/output requests, and disk control parts performing read/write of data from and to disk drives, a second rack having electrical conductivity, on which are mounted disk drives, and relay parts for relaying communications between the disk drives and disk control parts; and communication cables for connecting disk control parts to relay parts. The communication cables include a transmission medium through which to transmit data, a first conductor having electrical conductivity and surrounding the transmission medium, a second conductor having electrical conductivity and surrounding the first conductor, and a covering surrounding the second conductor. The first conductor is connected to ground potential supply circuits provided in at least either disk control parts or relay parts, and the second conductor is connected to at least one of the first and second racks.

Abstract: For a drawer, equipped with electronics cards and inserted into a drawer-receiving structure through an opening provided in the front face of the drawer-receiving structure, a device for electromagnetically protecting the cards is formed by the front face of the drawer, and by the side faces, the top face, the bottom face, and the back face of the drawer-receiving structure, the faces being electrically conductive.

Abstract: An optical transceiver module characterized by reduced electromagnetic interference (“EMI”) emissions for improved operation is disclosed. The transceiver includes a housing formed by top and bottom housing portions that are joined to define a cavity. A printed circuit board (“PCB”) is positioned within the cavity and includes an edge connector extending from one housing end. The PCB also includes two holes defined near the edge connector and lined with electrically conductive material. Conductive plates located on both the top and bottom housing portions electrically connect with the conductive holes to electrically interconnect the top and bottom housing portions. Two posts on the top housing portion are received into the conductive holes to align the PCB with the housing portions. A chassis ground from one or both of the housing portions extends through the plates and holes to create a “chassis ground fence,” preventing EMI emission from within the transceiver cavity.

Abstract: An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.

Abstract: An electronic signal filter includes a cylindrical housing and a circuit board positioned therein having a plurality of peripheral edges and at least two circular through-holes formed therein. Each through-hole is inwardly spaced from one of the peripheral edges of the circuit board, defining a first distance between a respective one of the through-holes and a respective peripheral edge of the circuit board and defining a second distance between the through-holes. The filter also includes a ground strap attached to and spaced a distance above the circuit board. The ground strap includes a first portion, an integral second portion residing in and extending through each through-hole, and an integral third portion that contacts a portion of the second surface of the circuit board. At least a portion of the first portion of the ground strap contacts the inner peripheral surface of the cylindrical housing to ground the circuit board.

Abstract: An electromagnetic-interference (EMI) prevention mechanism includes an expansion unit or base (1) having conductive hooks (20) and conductive spring biased pins (10). An electronic product (4) to be placed onto the expansion unit includes conductive connection holes (41) and conductive areas on its bottom surface. The connection holes are to be joined to the hooks and the conductive areas are to be pressed against the pins (10) whereby the product conductive holes and the conductive areas become joined electrically to the expansion unit and electromagnetic waves generated by the product are guided to the expansion unit.

Abstract: An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: An assembly for mitigating at least one of an electrostatic discharge and electromagnetic interference is provided. The assembly includes (a) first and second spaced apart electrical conductors 108 and 116 and (b) a mitigation module 300 electrically coupled to the first and second spaced apart electrical conductors to control a magnitude of an electrostatic discharge and/or electromagnetic interference in the first and second electrical conductors 108 and 116. One or more of the following statements is true: (i) the mitigation module 300 comprises a ferrite material 304; (ii) the mitigation module 300 comprises a lossy dielectric material 308; and (iii) an equivalent electrical circuit for at least part of the mitigation module 300 comprises at least a first circuit segment 512 comprising a first inductor and a first capacitor electrically connected in parallel and a second capacitor 504 electrically connected in series with the first circuit segment 512.

Abstract: Apparatus for providing an electrical ground connection through a pipe or conduit system including electrically non-conductive portions. A pipe fitting, preferably although not necessarily made of electrically non-conductive material, is equipped with an electrically conductive member extending within the fitting for intimate contact with a fluid carried by the fitting. A portion of the conductive element extends outside the pipe fitting, for connection to a suitable electrical ground. The conductive element within the fitting thus is at electrical ground potential, and that ground potential is transferred through an electrically conductive fluid medium within the pipe system to any electrically conductive element of the pipe system.

Abstract: An enclosure for computer-based telephone switching equipment that suppresses the radiation of electromagnetic interference through the use of multiple overlapping seals and apertures.

Abstract: An AD adapter module including an AD adapter device, a socket, shielding case and a supporting part. The socket has a lateral side with a side protrusion on the lateral side, and is installed on the AD adapter device. The shielding case has a hole penetrating through the shielding case. The AD adapter device is disposed within the shielding case with the lateral side and side protrusion of the socket exposed from the hole. The supporting part has a securing protrusion and is disposed on the shielding case. The securing protrusion penetrates through the hole of the shielding case so the securing protrusion makes contact with the side protrusion and the shielding case. When a plug is inserted into the socket, the securing protrusion of the supporting part is pushed against the side protrusion of the socket.

Abstract: A computer chassis having tabs extending from the inside of its side panels and springs extending from the bottom panel, for spring-mounting a circuit board, such as a motherboard or other circuit board oriented parallel to the bottom surface of the chassis. The tabs and springs may also be used to ground the circuit board.

Abstract: A power feedforward amplifier uses integral cavities to provide RF isolation between subcircuits of the power amplifier. The chassis includes a main chassis body and a lid structure adapted to couple with the chassis body and define the subcircuit cavities. The inner lid includes an amplifier dividing wall and interstage walls adapted to isolate the main and error amplifier subcircuits of the feedforward power amplifier and further to isolate individual components of the subcircuits. In one embodiment, the amplifier subcircuits are mounted on a single circuit board and isolated from each other by the dividing wall. A delay line subcircuit portion is integral with the main chassis body and is coupled beneath the error amplifier subcircuit to contain and electromagnetically shield a delay line filter subcircuit while providing direct connection with the error amplifier.

Abstract: A grounding connector having at least a first layer and a second layer. A conductor, such as a grounding wire, is secured between the first layer and the second layer. The first and second layers are made of a material with the same or similar galvanic potentials as the conductor such that galvanic corrosion between the conductor and the first and second layers is minimized.

Abstract: A memory card with a static electricity conducting board has a circuit board, a partitioning board and a conducting board. The circuit board has two contacts. The partitioning board is mounted on the board and has two slots. The conducting board is mounted on the partitioning board and has two conducting tabs located respectively inside the slots and pressing respectively against the contacts on the circuit board. The conducting board attracts static electricity on the circuit board and the chip and keeps the circuit board and the chip from being damaged by the static electricity.

Abstract: An electrostatic discharge protection cover is described. The electrostatic discharge protection cover enhances the strength of an upper cover of a PC card socket and protects the socket from electrostatic discharge pulse. The electrostatic discharge protection cover has a protection plate assembled on a PC card socket upper side for guiding the pulse of electrostatic discharge to a ground, and a stair-type enhancing edge to enhance the strength of the protection plate. The stair-type enhancing edge further couples with a metal crossbeam of a computer to enhance the strength and electrostatic discharge protection capacity.

Abstract: A disc storage subsystem includes a housing, at least one disc drive assembly received in a front portion of the housing, first and second controllers, and an intermediate electronic component. The disc drive assembly includes a carrier supporting a disc drive having an Advanced Technology Architecture (ATA) data interface. The first and second controllers each include a data port corresponding to the disc drive. The intermediate electronic includes multiplexing electronics having first and second data communication paths. The first data communication path provides electronic communication between the data port of the first controller and the data interface of the disc drive. The second data communication path provides electronic communication between the data port of the second controller and the data interface of the disc drive. The multiplexing electronics selectively opens and closes the first and second data communication paths in response to at least one control signal.

Abstract: A structure and associated method comprising contact pads on a surface of a substrate for coupling signal, power, and ground connections for an electrical device to a plurality of conductive wires on the substrate. The contact pads are formed in single lines along radial edges of sectors on the substrate. Each of the sectors comprise a predetermined angle between the radial edges of each of the sectors. The plurality of sectors collectively form a circular area. The contact pads comprise signal, power, and ground connections located at predetermined positions on the single lines along the radial edges of each of the sectors on the substrate.

Abstract: The card reader includes a circuit board in a housing as a principal unit, the circuit board is provided with a circuit connector to connect with a main circuit of an electric equipment. The circuit board is provided on the front surface thereof at least with an insertion slot for insertion of a memory card; and an integrated circuit is connected between the insertion slot and the circuit connector to control the operation of the entire card reader, and further to form the connection between the memory card and the main circuit. The structure is characterized by that, the structure is provided in the section between the integrated circuit and the housing with a plurality of electrically conductive areas formed of electrically conductive material; the electrically conductive areas are connected with the grounding line of the circuit board to form a function of grounding to scatter electric waves, so that the integrated circuit can avoid damaging and destroying by piercing of external electric waves.

Abstract: The card reader includes a circuit board in a housing as a principal unit, the circuit board is provided with a circuit connector to connect with a main circuit of an electric equipment. The circuit board is provided on the front surface thereof at least with an insertion slot for insertion of a memory card; and an integrated circuit is connected between the insertion slot and the circuit connector to control the operation of the entire card reader, and further to form the connection between the memory card and the main circuit. The structure is characterized by that, the structure is provided in the section between the integrated circuit and the housing with a plurality of electrically conductive areas formed of electrically conductive material; the electrically conductive areas are connected with the grounding line of the circuit board to form a function of grounding to scatter electric waves, so that the integrated circuit can avoid damaging and destroying by piercing of external electric waves.

Abstract: A circuit board arrangement facilitates a direct connection to a chassis mounted connector. The arrangement comprises a printed circuit board with a first signal conductor terminating at an edge of the printed circuit board. A second signal conductor is disposed adjacent to the first signal conductor and terminates at the edge. A conductive metallic spring clip has a relieved area and is formed to fit over the edge of said printed circuit board. The conductive metallic spring clip is positioned on the edge of said printed circuit board such that the relieved area straddles the first signal conductor and the conductive metallic spring clip grips the second signal conductor for coupling the second signal conductor to the chassis mounted connector.

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: A power amplifier assembly combines a single printed circuit board with a housing for providing isolation between subcircuits of the circuit board. The printed circuit board is provided with four conductive layers and contains a power supply subcircuit, an upconverter subcircuit, a monitor and control subcircuit, a low power gain subcircuit, and a high power gain subcircuit. The printed circuit board is further provided with plated-through vias in an isolation path which, in conjunction with internal chassis lid walls, serves to increase electromagnetic and radio frequency isolation between subcircuits on the printed circuit board.

Abstract: An electromagnetic radiation shield useful to attenuate or prevent the escape of electromagnetic radiation from the front of transceiver opto-electronic subassemblies resident in an opening or port in the housing of an electronic system is formed with both an aperture for each barrel of the opto-electronic subassemblies and a plurality of extensions projecting outwardly from the shield. The distal ends of the extensions are bent or shaped to form smoothly curved contact surfaces that project outside the transceiver module to make contact with a grounded member of the housing or other electrically grounded portion of the electronic system of which the transceiver module is a part. The electromagnetic radiation shield is assembled with the transceiver subassemblies and disposed within a transceiver module to be inserted into a communications port of a computer or server. The transceiver module contains elements that may generate and radiate electromagnetic energy.

Abstract: Methods and apparatus to secure a ground strap assembly to an electrically conductive member are disclosed. In a disclosed example, a ground strap assembly includes a bendable ground strap, and a grounding clip having at least one flange located to substantially prevent rotation of the clip relative to the bendable strap. The example ground strap assembly also includes a fastener securing the grounding clip to the bendable strap. It is not necessary to remove the fastener from the bendable ground strap to secure the ground strap assembly to an electrically conductive member.