Abstract: An electronic component is mounted on a printed circuit board, and a metal cooling module for cooling the electronic component is opposed to the electronic component. A vertical support mechanism supports the cooling module such that the cooling module is kept in pressure contact with the electronic component, the pressure being exerted perpendicular to the surface of the printed circuit board and falling within a predetermined range. The cooling module is grounded via an elastic member having electrical conductivity.

Abstract: A apparatus and a method of isolating two cavities within an electrical equipment by using a S-shaped plate having fingers on opposite sides such that the S-shaped plate may be installed between two open ended inner walls.

Abstract: A shielding gasket is affixed to a shield housing for interposition between the shield housing and a circuit board of an electronic device. The circuit board includes a plurality of electronic components and related circuitry and the arrangement of the shield housing and the shielding gasket provide for inter-component shielding of the plural electronic components from one another, together with corresponding related circuitry, as well as overall shielding of the plural electronic components on the circuit board. To that end, the shielding gasket includes partitions integral with the shielding gasket for extending between the electronic components, the partitions engaging the shield housing such that the shield housing and the partitions complete inter-component shielding of the electronic components and related circuitry from one another.

Abstract: A system for protecting circuit board mounting devices within an enclosure. The system includes one or more protective housings that are disposed about corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. The protective housings extend around the retainer portion, and protect the secure mounting of the circuit board to corresponding standoffs.

Abstract: Allowing printed circuit boards to be secured in a printed circuit carrier by means of a retaining bar that is secured at its ends to the printed circuit board carrier. Contact is established between the retaining bar and each individual printed circuit board by depositing a copper area on the back face of the printed circuit board and making contact with this area by the retaining bar. The conductive area is connected to the ground of the printed circuit board, and the retaining bar is conductive in nature and makes contact at either end with the printed circuit board carrier. The retaining bar is designed to provide vertical strength throughout its length.

Abstract: An electrical box assembly includes an electrical box, a ground strap and a connecting member extending between adjacent ground straps. The electrical box includes coupling members on opposite end walls. The coupling members include a pair of opposing coupling tabs for engaging the ground strap. The ground strap includes coupling tabs formed on each side of the ground strap for wedging between the tabs of the coupling members to secure the ground strap to the electrical box by an interference fit. A connecting member can be clamped between the ground straps and the bottom wall of the electrical box to provide electrical connection between each of the ground straps.

Abstract: A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.

Abstract: Electromagnetic shielding devices are provided that can be easily modified in shape and configuration to facilitate electronic device development. An electronic substrate includes a surface and a ground trace extending along the surface to define a perimeter of an area of the electronic substrate to be shielded. A plurality of electrically conductive block members are electrically secured to the ground trace in adjacent relationship. An electrically conductive cover is electrically secured to a top face of each of the block members to overlie the area of the electronic surface to be shielded.

Abstract: A block of foam is wrapped with a conductive foil to replace a metal spring used to both support and ground an electrical component in an electronic device. In particular, the foam block wrapped in foil may be used to support a video board in a display device while grounding the EMI shielding on the board and related components. The foil is preferably adhered to the foam block with an adhesive.

Abstract: The invention is an improvement to a high-frequency-shielded switchgear cabinet having a cabinet body which can be or is composed of wall elements and has at least one opening which can be closed by a cabinet door. Gaps formed in the cabinet body and between the cabinet body and door can be closed or sealed so as to be high-frequency-shielded by means of electrically and magnetically conductive sealing strips. In order to attain a corrosion-free switchgear cabinet which has a long service life and can be easily produced, the wall elements and cabinet door are made of aluminum-zinc-coated sheet metal and are provided at least in regions facing the gaps to be sealed without additional surface-protecting coverings. The sealing strips are directly connected to the untreated surface of the wall elements and/or cabinet door.

Abstract: A device housing adapted to receive a data storage device therein includes a base and a pair of grounding clips attached to the base. The base includes a pair of side walls each defining a pair of gaps. Each grounding clip forms a pair of fixing portions for engaging with the gaps of the base. A contact finger extends from each fixing portion for contacting the data storage device to form a grounding path from the data storage device internal to the housing to an outside of the side walls.

Abstract: An EMI shielded apparatus having a substrate with at least one electrical component disposed on it; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a shield comprising a dielectric material layer having an inner surface and an outer surface and an electrically conductive layer over at least one of the inner and outer surface; a plurality of apertures formed in the shield such that the apertures correspond to the pattern of the electrically conductive fastening units; wherein at least one of the apertures has a contact region and wherein both the dielectric material layer and the electrically conductive layer of the shield at the contact region of the aperture are deflectable to the extent necessary to allow the contact region to engage and retain the electrically conductive fastening unit; and wherein the electrically conductive layer of the shield at the contact region is in electrical contact with the e

Abstract: An electronic circuit pack having a printed circuit board with a faceplate at a front of the board. The faceplate has two end regions carrying latches for holding the board into a shelf. A front wall of the faceplate has an intermediate part between the end regions, the intermediate part extending forwardly of the end regions and lying at least between the latches. Preferably, the intermediate part of the front wall extends as far as a frontal vertical plane of the shelf which is the foremost position allowable for a shelf and a circuit board combination. The intermediate part of the front wall lying in this forward position provides additional space behind it for extending the electronic circuitry of the circuit pack for a unitary shelf size. This additional space is occupied by the printed circuit board with conductors and electronic components and/or connectors for test purposes and memory cards.

Abstract: A printed circuit board comprises an insulator film extending over the front surface of a substrate. The insulator film is designed to bend around the outer periphery of the substrate so as to reach the back surface of the substrate. A wiring pattern is printed on the surface of the insulator film so as to extend over the front and back surfaces of the substrate. The wiring pattern serves to electrically connect the opposite surfaces, namely, the front and back surfaces of the printed circuit board without a conductive through hole or via. Even if input/output pins of the semiconductor chip are increased, it is possible to avoid a deteriorated efficiency and an increased cost in production.

Abstract: An integrated computer module having an EMI shielding plate which doubles as a mechanical retainer for a disk drive within the module and as an shield to insulate the disk drive's electronics from electromagnetic interference (EMI) emanating from a main PCBA located nearby. The module is adapted for removable insertion into a docking bay within a host assembly, and upon such insertion for connecting to a host connector and thereby controlling a display device.

Abstract: A device for reducing electromagnetic interference is adapted for use in a processor assembly that includes a circuit board with opposite first and second sides, a processor socket mounted on the first side of the circuit board and connected electrically to the circuit board, a central processing unit having a heat-dissipating side and a contact side that is opposite to the heat-dissipating side and that is mounted on and connected electrically to the processor socket, and a conductive heat sink in contact with the heat-dissipating side of the central processing unit. The device includes a grounding spring plate having a first end portion adapted to contact the heat sink and a second end portion adapted to be mounted on the circuit board so as to connect electrically with a ground terminal of the circuit board, thereby establishing electrical connection between the heat sink and the ground terminal.

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: A hot swap tray having a housing adapted to be slidably inserted in a rack. The tray includes an electromagnetic shield member mounted for rotation about an axis traversing the sliding direction of the tray. The shield has a resting state in which the shield presents a first dimension in a plane traversing the sliding direction and a deflected state in which the shield presents a second dimension in the plane, the first dimension being greater than the second dimension. The shield is actuated on insertion of the tray into the rack to move from the resting state to the deflected state so that the shield clears adjacent shields located within the rack and from the deflected state to the resting state so that the shield engages the adjacent shields.

Abstract: Improved electromagnetic compatibility for integrated motherboard or device board designs is provided by magnetic shielding, electric shielding, or both integrated into the chip packaging materials. Motherboard emissions may be reduced by use of the shielding. A nonconductive primary and tertiary layer sandwich a high-conductivity metal secondary layer forming a Faraday cage for electric field shielding. A nonconductive primary layer is covered by a tertiary layer formed of a composite having permeable material for magnetic shielding. The tertiary layer formed of a composite could include a high permeability particulate ferrous material. Both the secondary layer and the tertiary layer formed of a composite could be used for both electric and magnetic shielding of chips.

Abstract: A computer system including a chassis having a microprocessor mounted thereon. A system memory is coupled to provide storage to facilitate execution of computer programs by the microprocessor. An input is coupled to provide input to the microprocessor and a display is coupled to the microprocessor by a video controller. A mass storage is coupled to the microprocessor. A shielding body is mounted on the chassis. A pair of spaced apart contact members are attached to the shielding body. A main spring member is attached to at least one of the contact members. The main spring member includes an elongated beam offset from the contact members and a plurality of spring fingers interconnecting the beam and at least one of the contact members.

Abstract: An edge guide arrangement for circuit boards is disclosed including a guide rail having a circuit board edge-receiving channel with a grounding strip therein. The grounding strip has clips at each end for resiliently grasping the guide rail thereby holding the grounding strip in its position within the channel. The grounding strip with its end clips can be standardized and inventoried in large quantities to be assembled to a variety of guide rails.

Abstract: A system (e.g., a power supply) is presented which allows a user to electrically couple a common ground electrical potential of a circuit (e.g., a power supply circuit return) to, or electrically isolate the common ground electrical potential from, an earth grounded chassis, without having to open the chassis. The system may include a metal bolt and nut, wherein the nut is coupled to an electrically conductive bracket. The bracket is mounted upon a printed circuit board and electrically coupled to the common ground electrical potential. When an insulating bushing is installed in a hole in the chassis adjacent to the bracket, and a threaded shaft of the bolt extends through aligned holes in the insulating bushing, an insulating member positioned between the bracket and the chassis, and the bracket, and the threaded shaft engages the nut, the bolt holds the insulating bushing in place, and the bracket is electrically isolated from the chassis.

Abstract: A computer enclosure includes an outer casing having at least a bottom plate and a first front plate. A number of first tabs are formed on the first front plate. Each first tab is associated with an opening defined in the first front plate. An inner casing is received in the outer casing and is movably supported on the bottom panel. The inner casing has at least a second front plate abutting against the first front plate of the outer casing. Second tabs are formed on the second front plate for being received in the openings of the outer casing and abutting against the corresponding first tabs for positioning the inner casing with respect to the outer casing and establishing a grounding path therebetween. The openings of the outer casing are shielded by the second front plate of the inner casing thereby preventing leakage of electromagnetic radiation therethrough.

Abstract: A rack assembly (1) includes cross-connecting bars (5) and guide bars (15) for printed circuit boards (59). These guide bars each include a fixing device (36) for the placement of a receiving element (17) which has a contact zone (37) and is placed into electric contact on a cross-connecting bar. The invention also provides for front elements (13) having centering contacts (25) that protrude into, and thereby come into contact with, the contact zone, in a low-ohmic, current-carrying manner, when the front element is set in place. The receiving element preferably has a contact blade (54) which extends into a guide groove (25) of the guide bar.

Abstract: A switch operating unit for a camera is assembled in the switch supporting frame of the front cover thereof and provided with an inner button, an outer button, and a dial for switch operation. Under the buttons and the dial, there is provided a metal supporting plate for supporting same. Under the supporting plate, there is provided a flexible printed circuit (FPC). Since the contact of the supporting plate is in contact with the ground pattern on the FPC, even when static electricity is generated with or applied to those buttons or the dial, such static electricity is directed to the ground through the supporting plate. Thus, the electronic circuit element mounted on the FPC is protected against static electricity.

Abstract: According to the invention, an electromagnetic radiation shielding cap is located over an electronic cartridge substrate. The electromagnetic radiation shielding cap includes an electromagnetic radiation shielding plate and an electromagnetic radiation shielding rim extending around a periphery of the electronic cartridge substrate. An edge of the electromagnetic radiation shielding rim contacts a thermally and electrically conductive heat plate located on an opposing side of the electronic cartridge substrate. The heat plate and the electromagnetic radiation shielding cap jointly define an electromagnetic radiation shielding enclosure around the electronic cartridge substrate.

Abstract: A ground clamp for connecting an edge portion of the metallic enclosure of an electrical meter box with a ground conductor. The ground clamp includes a U-shaped clamp member, a bolt member, and means for mounting the ground conductor. First and second legs of the clamp member define a slot and a pair of openings in the first leg form a center segment which separates a pair of fingers. The edge portion of the meter box enclosure is resiliently clamped within the slot between the fingers and the second leg. The center segment includes a socket having an inner surface, at least a portion of which has a thread. The bolt member has a stud portion and a bolt head portion, the stud portion including a threaded segment disposed proximate the distal end and an unthreaded shaft segment disposed intermediate the threaded segment and the bolt head portion. At least one protrusion extends axially from the distal end of the bolt member to a sharp edge.

Abstract: The invention concerns an electrical screening housing for accommodating components or assemblies which emit electromagnetic radiation or are sensitive thereto, and for providing electromagnetic screening for the components or assemblies. The housing includes at least two parts with electrically screening walls, a sealing element being provided in an adhesive manner on at least one housing part in the region of a joint with the other housing part. The sealing element and at least one portion of the housing part bearing the latter are made of substantially non-conductive material and, for electromagnetic screening purposes, are covered with a cohesive, electrically conductive layer which extends at least over the entire width of the joint and adheres to the joint element and the housing part.

Abstract: An enclosure for electronic devices includes a frame device for moving at least one electronic device from the interior of the enclosure to a position outside to the enclosure, or a position where the device does not obstruct access to other components. A frame device may be attached to at least one interior surface of the enclosure as well as an electronic device, such that as the frame is moved within enclosure, the electronic device, connected thereto is repositioned as well. The frame may further include an additional hinge device for rotating the electronic device away from the enclosure. With this movement of the electronic device, greater access may be provided to other electronic devices and components contained therein. The enclosure may further include a specially-adapted ground bar for grounding the individual components in the enclosure. Specially marked attachments may be provided such that individual connections are established from each component as well as a connection to an electrical ground.

Abstract: An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate that forms walls of the enclosure and a dielectric material located on inner surfaces of the walls that insulate the substrate from electronics components located within the enclosure and (2) an electrically conductive pin, affixed to a sidewall of the enclosure substrate and extending to without the enclosure, that allows the substrate to be electrically coupled to a structure supporting the case for EMI (electromagnetic interference) shielding or case-grounding purposes.

Abstract: In one version, a PC card has a printed circuit board assembly (11) that is interposed between card shields (5,6). This PC card is frameless. In another version, a PC card has: card shields (103,104); a printed circuit board assembly (110) interposed between the card shields; and two interposing side frames (105, 105′).

Abstract: Apparatus and method for supporting a large number of densely arranged and electrically shielded panels are disclosed. To achieve shielding each panel has a grounded back plane which acts as shielding for circuitry on an adjacent panel as well as shielding for its own circuitry.

Abstract: A mounting device for mounting a data storage device to a receiving bracket of a computer enclosure includes a board body and at least one grounding clip. Two of the mounting devices are attached to opposite sides of the data storage device and engage with the receiving bracket. Each grounding clip includes a securing section, a first section and a second section. A bolt extends through a hole defined in the securing section of the grounding clip and a through hole defined in the board body for engaging with a screw hole defined in the data storage device thereby fixing the grounding clip and the board body to the data storage device. The fist and second sections of each grounding clip form a plurality of fingers for respectively contacting the data storage device and the computer enclosure thereby forming a grounding path therebetween while fixing the data storage device to the computer enclosure.

Abstract: An apparatus to allow a computer system board to automatically identify the chassis in which the system board is installed. The apparatus includes a) at least one conducting pad on the system board, b) at least one spring action grounding clip on the chassis, and in contact with the at least one conducting pad, and c) a logic circuit connected to the at least one conducting pad.

Abstract: A memory module assembly in accordance with the present invention comprises a memory module, such as a RAM module, and a pair of shells for enclosing the RAM module. The RAM module comprises a printed circuit board (PCB), a plurality of memory chips attached on the PCB and a plurality of related electronic elements disposed near the chips. A securing means comprises a clasp for fixing the PCB and the shells together at a middle portion proximate upper edges of the PCB and the shells, and a pair of rivets extending through corresponding positioning apertures defined proximate a bottom edge of the PCB and corresponding apertures defined proximate a bottom edge of the shell. The clasp is resilient and comprises a shoulder and a pair of resilient arms inwardly extending from opposite ends of the shoulder for securing the PCB and the shells together.

Abstract: A printed wiring board is adapted to be mounted to a chassis using a fastener. The chassis provides an electrical ground for the printed wiring board. The board includes first and second sides and a mounting aperture extending therethrough for receiving the fastener. A plurality of spaced apart solder pads are disposed on one side of the board and adjacent to the mounting aperture. The pads are adapted to provide an electrical connection to the chassis. At lease one aperture is disposed in each of the plurality of pads. The aperture is plated creating an electrical connection between the sides of the board.

Abstract: The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, an IC chip carrier comprises an insulating ceramic substrate and at least one internal electrically conductive layer being a circuit ground, portions of which extend to the edge of the substrate, the internal electrically conductive layer in electrical contact with an electrically conductive layer applied to a portion of the substrate edge. This provides a horizontal hybrid ground plane which can be used as an EMI shield that runs horizontally to the chip as well as a hybrid edge EMI shield perpendicular along at least a portion of the edge. This edge shield protects internal circuitry from exterior EMI emissions directed towards the chip carrier edge portion incorporating the shield.

Abstract: Since the transmit-receive unit of the prior art comprises the housing 21 made from a metal, the weight of the housing is large and the obtained transmit-receive unit for use in a portable telephone which is required to be light in weight becomes heavy. A transmit-receive unit comprises a housing which is made from a synthetic resin and has a conductive surface layer. Therefore, the housing is lighter in weight than a housing made from a metal of the prior art and makes it possible to provide a lightweight transmit-receive unit suitable for use in a portable telephone.

Abstract: An IC card connector grounding structure has an IC card connector having a housing made of an insulating material, in which a plurality of pin terminals are held, and a shield cover mounted on the upper surface of the housing; and a circuit board having a ground circuit pattern, for mounting the IC card connector. The shield cover is grounded in contact with the circuit pattern.

Abstract: A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board.

Abstract: An electric module which includes a printed circuit board and at least one electrical subassembly arranged thereon is disposed within a metallic housing and is grounded to the metallic housing by way of a wire bridge which extends transversely across a cutout disposed in the printed circuit board. The metallic housing is integrally connected to a contact tongue which extends through the cutout and the printed circuit board before engaging the wire bridge. The wire bridge connects one side of the printed circuit board to a ground conductor track disposed on the opposing side of the printed circuit board. Preferably, the contact tongue includes two closely spaced contact elements that are spaced apart for frictionally receiving the wire bridge therebetween.

Abstract: In a shield structure built within a housing for enclosing electrical conductors, a terminal cover strip for enhancing efficient grounding is mounted. The terminal cover strip is U-shaped, with one of the upbent sides having a plurality of mounting spaces for coupling with multiple conductors and the other of the upbent sides being connected to a ground plane.

Abstract: A cover for a standalone chassis may comprise a plurality of feet attached to the standalone chassis and an enclosure attached to the plurality of feet to cover a portion of the standalone chassis. The feet extend below a bottom surface of the standalone chassis to provide vertical support for the standalone chassis.

Abstract: An I/O shield for an electronic assembly comprises a shielding plate having a reinforcing plate and a resilient plate attached together with a pair of side walls respectively extending from opposite edges thereof and a number of receiving slots disposed therein. The shielding plate is guided into an opening disposed in a chassis of the electronic assembly by the side walls. A number of spaced spring contacts is formed on the side walls by stamping and bending. Each spring contact comprises a base integrally formed with the side wall, a bend and a free end. The tip of the bend is located nearer to the base than to the free end. Thus, the free end will not warp or engage with notches disposed in a peripheral flange of the opening thereby facilitating removal of the I/O shield.

Abstract: A peripheral device isolator (32) is provided which consists of an insulating material (33) having a first conductive area (34) on a top surface and a second conductive area (35) on a bottom surface. A transient voltage suppressor (36) provides an electrical connection between the first conductive area (34) and second conductive area (35) through a first lead (38) and a second lead (40). When the peripheral device isolator (32) is placed between an internal peripheral device (12), having a common logic and chassis ground, and a host frame (10), having a host system frame ground (16), an electrical path for a voltage spike occurring on the internal peripheral device (12) is provided so that the voltage spike can be diverted away from host system logic ground (22) and into host system frame/safety ground (16).

Abstract: Embodiments of the invention include connector assembly for a handheld computer. The connector assembly includes a plurality of conductive elements disposed on a first side of a printed circuit board housed with the handheld computer. One or more of the conductive elements has a pointed end.

Abstract: An FPC assembly (10) includes a circuit unit (12) with two different pitch arrangement connectors (14, 16) at two opposite ends. The circuit unit (12) includes a signal FPC (18) and a grounding FPC (20). A buffer layer (22) with adhesives on two opposite surfaces (24, 26) is sandwiched between the signal FPC (18) and the grounding FPC (20), and thus the signal FPC (18), the buffer layer (22) and the grounding FPC (20) are adhesively fastened with one another as one circuit unit (12). The signal FPC (18), the buffer layer (22) and the grounding FPC (20) respectively include contact tail holes (34, 35) at two opposite ends for receivable engagement with the corresponding contact tails (36, 37) of the connectors (14, 16).

Abstract: Methods and apparatuses for installing and grounding a motherboard in a chassis of a computer. In one embodiment of the invention, a computer chassis includes a movable cover plate having a grounding contact. The cover plate is releasably attachable to a panel of the chassis and covers an input/output aperture in a chassis panel. The cover plate is movable to a first position in which the cover plate closes the input/output aperture in the panel and the grounding contact on the cover plate engages a ground contact on a motherboard installed in the chassis. The cover plate is also moveable to a second position in which a fastening portion of the cover plate is disengaged from the panel and the grounding contact is disengaged from the ground contact on the motherboard. When the cover plate is in the disengaged position, the motherboard can pass into or out of the component cavity of the chassis without contacting the grounding contact of the cover plate.

Abstract: A thin, compliant, electrically and thermally conductive aluminum shim for providing minimum distance circuit path from a power amplifier (or transistor) to the underside of the circuit board (ground). The aluminum shim creates an interference fit between the underside of the circuit board and chassis, which guarantees an electrical connection with the bottom of amplifier and underside of the circuit board. Additionally, with the present invention, post-machining of the chassis during assembly of components is not required since the aluminum shim is sufficiently compliant to conform to both the bottom surface of the amplifier and the existent flatness and surface finish on the chassis produced from the initial machining step. This ensures superior electrical and thermal contact to the chassis regardless of slight imperfections in chassis flatness and surface finish at the seat location, thereby improving reliability and decreasing cost of manufacture and assembly.

Abstract: An on-vehicle electronic device assembly includes a mount frame fixed on a metallic portion of a vehicle body, a carriable unit removably disposed in the mount frame, and a metallic urging member mounted on the mount frame for urging the carriable unit in a direction of moving the carriable unit away from the mount frame. The carriable unit includes a carrier case having a grounding metal piece insertion hole formed therein in a position corresponding to the urging member, a metallic chassis disposed in the carrier case so as to shield electronic components, and a grounding metal piece loosely fitted into the grounding metal piece insertion hole for electrically connecting the metallic chassis and the urging member.