Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.

Abstract: The mobile phone includes a printed circuit board (PCB), a metal hinged shield, and a connecting member. The metal hinged shield is pivoted on the PCB by the connecting member. The metal hinged shield further comprises a high metal body and a low metal body. The high metal body partially overlaps the low metal body.

Abstract: A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.

Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.

Abstract: A method for manufacturing anti-EMI shields on computer chassis, the method includes the following steps. The anti-EMI plate is glued to the computer chassis. The anti-EMI plate is pressed onto the plate by a pressing machine, and then the plate is quick dried with the anti-EMI plate by a drying machine. The plate is cut into desired dimension with the anti-EMI plate by a cutting machine, and the plate is stamped into desired shape with the anti-EMI plate by a stamping machine.

Abstract: A server enclosure includes a top plate and a bottom plate. The top plate defines a guiding channel extending along a first direction. The bottom plate parallels to the top plate. The bottom plate protrudes a guiding member. The guiding channel and the guiding member are aligned long a direction perpendicular to the top plate, and the guiding channel is boarder than the guiding member.

Abstract: A PCB assembly, includes a shield-can and a PCB, the shield-can forms resisting portions and hook members; The PCB has a top surface and an opposite bottom surface, and the PCB defines engaging holes through the top surface and bottom surface; The shield-can be detachably assembled on the PCB, the resisting portions resist against the top surface of the PCB, and the hook members pass through the engaging holes, the distal ends of the hook members resist against the bottom surface of the PCB.

Abstract: An input/output cable port assembly and electromagnetic interference (EMI) attenuation method are provided. The port assembly includes a cable port structure for an electronics rack with an opening for input/output cables to pass therethrough, and a first and a second partition. The first and second partitions couple to the cable port structure and reside within the opening. The first partition includes at least one ferrite inductor portion and the second partition includes at least one second ferrite inductor portion. The partitions are configured to be disposed adjacent to each other as adjoining partitions within the cable port structure, and when disposed as adjoining partitions, the first and second ferrite inductor portions mate and define a ferrite inductor with a central opening for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state currents on the cable(s) passing therethrough.

Abstract: An input/output cable port assembly and electromagnetic interference attenuation method are provided. The cable port assembly includes a cable port structure mounted to an electronics rack with an opening for input/output cables to pass therethrough, and multiple bottom ferrite inductor portions and multiple top ferrite inductor portions. The bottom and top ferrite inductor portions include first and second surfaces, respectively. The inductor portions are configured to be stacked within the cable port structure with their first and second surfaces in opposing relation to define at least one ferrite inductor with a central opening defined by the first and second surfaces for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state current on the cable(s) passing therethrough.

Abstract: An electronic circuit having a circuit board, a shield frame and a shield cover is provided. The shield frame is provided on the circuit board along a fringe of an area of the circuit board. The shield frame is discontinuous at a portion on the fringe. The shield cover is fastened to the shield frame so as to cover the area having the fringe along which the shield frame is provided.

Abstract: A module includes an outer housing comprising an additive. A first holder is disposed so as to be in integral relationship the outer housing. A second holder is disposed so as to be in integral relationship with the outer housing. A first circuit board is in removable engagement with first holder and the first circuit board adapted to being held in place by the holder without the use of a fastener. A second circuit board is in removable engagement with the second holder, the second circuit board adapted to being held in place by the holder without the use of a fastener. At least one electrical trace element is disposed so as to be in integral relationship with the outer housing. A conductive portion of the trace element provides a first electrical pathway between the first circuit board and the second circuit board. The insulator material and the additive act to provide electromagnetic compatibility (EMC) shielding for electrical components disposed within the outer housing.

Abstract: A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules.

Abstract: A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.

Abstract: An anti-eavesdropping device is described. The device comprises a receiving compartment for receiving an electronic device, a noise generator, and an EMI filter. The receiving compartment is sealable to minimize signal emissions from the interior to the exterior and from the exterior to the interior, and the noise generator is coupled with the receiving compartment and the EMI filter. The EMI filter is operatively coupled with the noise generator.

Abstract: When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow.

Abstract: A mobile digital video recorder (MDVR) has a hollow shell, two board tracks, two brackets, a main board, power board, VSM board, and a storage device. The board tracks and the brackets are attached securely in the shell. The main board is mounted slidably and detachably in the shell via the tracks. The power board is mounted slidably and detachably in the shell via the tracks. The VSM board is mounted slidably and detachably in the shell via the tracks. The storage device is mounted slidably and detachably in the shell via the brackets. Therefore, the main board, power board, VSM board and the storage device are easily pulled out from the shell for repairing, replacing, or upgrading to new technology.

Abstract: A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Abstract: A shield case of the present invention include a first case; and a second case, combinable with the first case. The first and second cases are provided with a plurality of abutting parts. The abutting parts abut on all respective surfaces of the component mounting board and hold the component mounting board in suspension in a state where the first and second cases are combined.

Abstract: An electronic mobile device comprises a base forming an inner surface and having a base hinge end. A cover having a cover hinge end is engaged with the base hinge end, and the cover is pivotable about a hinge axis that is substantially parallel to the inner surface of the base. The cover is movable from a closed position to an open position and vice versa relative to the base. In the closed position the cover is disposed proximate the base, and in the open position the cover is disposed away from the base. A base magnet having a first magnetic axis is supported at the base hinge end, and a cover magnet is supported at the cover hinge end so as to move with the cover relative to the base. The cover magnet has a second magnetic axis and interacts with the base magnet. Interaction of the base magnet and the cover magnet tends to align the first magnetic axis and the second magnetic axis and thereby bias the cover towards at least one of the closed position and the open position.

Abstract: A method includes calculating a number of turns of a shield winding included in an energy transfer element of a power supply, where the calculating is to have a low noise current in an input conductor of the power supply. The method further includes: increasing the number of turns for the shield winding; operating the power supply; and adjusting a value of a shield impedance to substantially reduce the noise current. An apparatus includes a power supply having an energy transfer element and a shield impedance. The energy transfer element includes a shield winding having an end terminated externally to the energy transfer element. The shield impedance is coupled between the externally terminated end of the shield winding and an input conductor of the power supply, where the shield impedance has a non-zero finite impedance value to substantially reduce a noise current in the input conductor.

Abstract: A radiation-shielded semiconductor assembly includes at least one radiation-shielding lamina within the package. In some embodiments, a semiconductor assembly includes a microelectronic component, and at least one radiation-shielding layer affixed to a surface of the component.

Abstract: A radiation level reducing device, including: a metal plate for covering surface of an electromagnetic wave generation source for radiating an electromagnetic wave; a cover region, set within a plane of the metal plate, for covering the surface; and a plurality of slits formed to a band-shape in the cover region, and spaced apart from each other, wherein each of the plurality of slits includes, a drawing slit extending towards a central part of the cover region from an intense electric field position where an electric field generated in between the electromagnetic wave generation source by the electromagnetic wave is stronger than other positions at an outer periphery of the cover region, and a coupling slit extending so as to line in parallel to another slit from an end in the central part direction of the cover region in the drawing slit.

Abstract: An electromagnetic shield structure of an electronics housing includes a terminal having a protrusion for external connection; a substrate having the terminal disposed thereon and electrically connected to the terminal; a housing made of resin, enclosing the substrate and having an opening at a position corresponding to the protrusion of the terminal on a front surface side where the protrusion of the terminal is located; and an electromagnetic shield disposed so as to surround the substrate inside the housing, having an opening at the position corresponding to the protrusion of the terminal, and electromagnetically shielding the substrate. The electromagnetic shield has a bent portion formed on the front surface side for filling a gap between the terminal and the housing.

Abstract: A box-shaped housing of an in-vehicle electronic control unit that controls an occupant crash protection system is installed to an installation surface of a vehicle and includes an opening end that defines an opening in an imaginary plane, a ceiling wall, and a peripheral wall. The housing receives a planar control circuit board of the control unit through the opening end toward the ceiling wall and securely holds the circuit board at the peripheral wall such that a plane of the circuit board is parallel to the imaginary plane. The peripheral wall includes an opening side wall section located adjacent to the opening end, and a ceiling side wall section having a thickness larger than a thickness of the opening side wall section.

Abstract: The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical component can be integrated with a flexible circuit of another electrical component. The flexible circuit can be electrically and mechanically coupled to the circuit board after the circuit board is inserted into the housing. Alternatively, electrical contacts can be disposed on a body of the electrical component and a complementary set of electrical contacts can be disposed on the circuit board. When the circuit board is disposed within a receptacle of the electrical component, the electrical contacts on the electrical component are coupled directly to the electrical contacts on the circuit board.

Abstract: A terminal box for a solar cell module is composed of, a box body, an inner cover and an outer cover, wherein the box body includes a bottom plate, an outer plate arranged in an upright manner around the bottom plate, and an inner plate arranged also in an upright manner inside the outer plate to enclose a circuit housing area; the inner cover includes a top plate and a side plate extended downward from an outer circumference of the top plate, and is formed into a lid shape and fitted around an outer surface of the inner plate to cover the circuit housing area; and the outer cover is fitted around the outer plate of the box body to thereby cover the inner cover and the box body, wherein the terminal box further includes a fitting member that causes the inner cover to be fitted to the box body to thereby prevent the inner cover from being removed from the circuit housing area.

Abstract: An electronic device is provided which makes it possible to reduce noise generated from a signal line around a connecting portion connecting a first body and a second body. The connecting portion has a first metallic portion. A first circuit board provided in the first body and a second circuit board provided in the second body. The signal line that electrically connects the first circuit board and the second circuit board via the connecting portion, in which the signal line is wound around the first metallic portion.

Abstract: An improved container configured to store a wireless-enabled device therein and also configured to prevent the wireless-enabled device from being activated by an external wireless signal.

Abstract: The invention relates to a distributor device for use in communication and data systems technology, comprising at least one distributor connection module. Said distributor connection module comprises a housing which houses input and output contacts, accessible from the exterior, for connecting lines, cables or wires. The distributor device comprises at least one additional connection module which comprises at least one SDH/SONET transport interface and outputs for electrical signals. The outputs of the connection module are connected to inputs of the distributor connection module. The connection module comprises at least one converter for converting SDH/SONET transport signals to E1 signals and vice versa. The invention also relates to a corresponding connection module and a corresponding distributor connection module.

Abstract: An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board 2, and are covered with an insulating resin portion 5 while a conductive layer 6 is formed on an upper surface of the insulating resin portion 5. The conductive layer 6 is held at the reference potential by being connected to a portion, which is held at the reference potential, of the electronic component 3 with a shielding function exposed from the insulating resin portion 5. There can be provided a small-sized circuit module superior in an electromagnetic shielding function.

Abstract: In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall.

Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).

Abstract: An optical engine is provided, including an imaging module, a driver module and a connecting unit. The imaging module includes an imaging housing with an imaging space and an imaging unit installed in the imaging space. The imaging housing is made of a conductive material. The driver module includes a driver housing with a driver space and a driver circuit board installed in the driver space. The connecting unit includes at least one of the cables is electrically connected to the imaging unit and the driver circuit board and at least a protruding module protruding from the imaging housing (or the driver housing) to contact with the driver housing (or the imaging housing). The cable is installed in the protruding module made of a conductive material.

Abstract: An EMI shield for a movable component such as an antenna of an electronic device includes a microfiber ring of densely packed microfibers extending from an EMI shielding housing across the space defined by an opening in the housing for the movable component. Multiple microfiber rings can be used separated by spacers, and an environmental shield can be included.

Abstract: A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substrate. At least one electronic component is electrically attached to a first surface of the second substrate. An RF shield is formed on the first substrate to minimizing Electro-Magnetic Interference (EMI) radiation and Radio Frequency (RF) radiation to the at least one electronic component on the first substrate to form an RF shield. A mold compound is used for encapsulating the semiconductor device.

Abstract: An apparatus (10) comprises a module (12); a chassis (30) into which the module (12) is able to be inserted; and a first resilient member (38). The resilient member (38) interposes between the module (12) and a weight bearing surface (32) of the chassis (30), when the module (12) is inserted into the chassis (30), so as to bear at least a portion of the weight of the module (12). When the first resilient member (38) bears at least a portion of the weight of the module (12), the module (12) is at a desired position inside the chassis (30).

Abstract: A radio module for use in an electronic device is disclosed. The radio module has a shield for reducing electromagnetic interference on the radio module. The shield may include a heat-spreading layer made of a material including graphite. The heat-spreading layer may spread heat generated by the radio module. The shield may also include a reflective layer overlapping the heat-spreading layer and configured to reflect electromagnetic energy to the heat-spread layer. The heat-spreading layer is also configured to absorb at least a portion of the electromagnetic energy, thereby reducing the electromagnetic interference on the radio module.

Abstract: A portable electronic device includes a circuit board and at least one treatment element mounted adjacent to the circuit board and storing volatile maintaining matters therein. The circuit board generates heat when the portable electronic device is working to heat the treatment element, and then the maintaining matters volatilize to maintain the portable electronic device.

Abstract: A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid.

Abstract: An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield connected to the tie bar; and encapsulating the integrated circuit and the shield. An integrated circuit package system also includes: forming a lead and a support structure with substantially the same material as the lead and elevated above the lead; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield on the support structure; and encapsulating the integrated circuit and the shield.

Abstract: In accordance with one embodiment, an electrical assembly comprises a housing having a recess in the housing. A first connector portion is securable to the housing. The connector portion comprises a dielectric body and connector terminals. A subscriber identification module is located in or mounted in the housing and has device terminals. A substrate comprises a first section that intersects at an angle a second section. The first section comprises first conductive traces electrically connected to the device terminals. The second section comprises second conductive traces electrically connected to the connector terminals. Conductors are electrically connected to the first conductive traces and the second conductive traces.

Abstract: A housing of a Quad Small Form-Factor Pluggable transceiver module includes a metallic casing and a plurality of elastic grounding assemblies. The metallic casing has a lower casing, a plurality of partitions and an upper casing. The lower casing is connected to the upper casing. The partitions are provided between the lower casing and the upper casing at intervals, thereby separating the interior of the metallic casing into a plurality of accommodating spaces. The accommodating spaces each receives a connector of a transceiver module, thereby forming a plurality of ports. Thus, the connectors of the transceiver modules share the common housing, thereby reducing the occupied space on the circuit board and increasing the number of the transceiver modules arranged on the circuit board.

Abstract: A lock for a housing may have a protrusion, an opening, a receptacle, and a ramp. The protrusion is formed in a first side wall of a first member of the housing, and the opening is defined in the first side wall. The receptacle extends from a second side wall of a second member of the housing, and is in some ways complementary in shape and in dimensions to the protrusion. The ramp is formed in the second side wall. When the first member and the second member are assembled, the protrusion and the receptacle are mated to form a water-tight seal therebetween, while the ramp is received within the opening.

Abstract: A storage device backplane and an identification circuit for identifying using situations of the storage device backplane are provided. The storage device backplane possesses a first connection interface and a second connection interface, for being used as a first backplane supporting a motherboard, or a second backplane cascaded to the first backplane, or a first backplane supporting a daughterboard of the motherboard. The first and second backplanes possess the same storage device backplane structure. If the storage device backplane is used as the first backplane, a first connection interface of the first backplane is coupled to the motherboard or the daughterboard thereof; if the storage device backplane is used as the second backplane, a first connection interface of the second backplane is coupled to a second connection interface of the first backplane. The identification circuit identifies using situations of the storage device backplane and display corresponding correct indicator number.

Abstract: Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias 201, an assembly of ground vias 202 surrounding the signal via, ground plates from conductor layers of the PCB connected to the ground vias, closed ground striplines 205 connecting the ground vias and power supply layer.

Abstract: In the invention, a finger board is bent like a “letter V”, and a thickness adjustment plate is provided between the finger boards of modules to be able to move, thereby being able to adjust the height of a finger. Such a configuration enables to increase the contact pressure of the finger by increasing the height of the finger when the finger is inserted, and when the finger is detached, reduce the contact pressure by reducing the height of the finger. This accordingly provides a shield chassis of suppressing any possible noise with no loss of insertability/removability.

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

Abstract: A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.