With Shielding Structure Patents (Class 361/800)
  • Patent number: 8018739
    Abstract: A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: September 13, 2011
    Assignee: Maxwell Technologies, LLC
    Inventor: Janet Patterson
  • Patent number: 8018734
    Abstract: An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: September 13, 2011
    Assignee: Novatel Wireless, Inc.
    Inventors: Alberto Brewer, Clint Wilber, Todd Conklin, Robert Hertlein
  • Patent number: 8014167
    Abstract: A hermetically sealed housing having a base deck, a cover member and a seal assembly constructed of a liquid crystal material (LCM), the base deck and cover member forming an enclosure containing an inert gas atmosphere. Various embodiments have the LCM seal bonded to one or both of the base deck and cover member and bonded to seal the enclosure by molding, compression, adhesive bonding, thermoplastic welding or soldering, or a combination of such.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: September 6, 2011
    Assignee: Seagate Technology LLC
    Inventors: Neal F. Gunderson, Daniel D. Dittmer, Michael A. Mewes
  • Patent number: 8009433
    Abstract: A radio control device used to control a motor for driving a mobile screen which includes a printed circuit to control the motor, power supply conductors for the motor and printed circuit, and an aerial which is connected to the printed circuit and coupled electromagnetically, with galvanic insulation, to at least one of the conductors. The device also includes a box in which the printed circuit, aerial and conductors are housed.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: August 30, 2011
    Assignee: Somfy SAS
    Inventor: Claude Ares
  • Patent number: 8008753
    Abstract: An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to at least one metal trace on the first surface of the substrate. A non-conductive coating covers exposed active surfaces on the first surface of the substrate. A conductive coating is applied to the non-conductive coating, and electrically contacting ground pads exposed on the substrate.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: August 30, 2011
    Assignee: Amkor Technology, Inc.
    Inventor: David Bolognia
  • Patent number: 8004791
    Abstract: A novel information storage device is disclosed and claimed. The information storage device includes a disk drive, a disk drive printed circuit board, and a first conductive shield over the disk drive printed circuit board and electrically coupled to the disk drive. The information storage device also includes a bridge controller printed circuit board and a second conductive shield over and electrically coupled to the bridge controller printed circuit board. The first and second conductive shields are in direct contact with each other. A disk drive interface connector electrically couples the bridge controller printed circuit board with the disk drive printed circuit board. A third conductive shield is attached to the disk drive interface connector and is in direct contact with both the first and second conductive shields.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: August 23, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Wally Szeremeta, Bruce A. Cariker
  • Patent number: 8004860
    Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: August 23, 2011
    Assignee: Texas Instruments Incorporated
    Inventor: James F. Salzman
  • Patent number: 8004068
    Abstract: Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: August 23, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jinbang Tang, Jong-Kai Lin
  • Patent number: 8000110
    Abstract: A device may include a connector receptacle coupled to a motherboard; a connector hold-down disposed adjacent to the connector receptacle; and/or a connector cage coupled to the motherboard and covering the connector receptacle and connector hold-down. Additionally, a computer system utilizing a connector hold-down and a method utilizing a connector hold-down are disclosed.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: August 16, 2011
    Assignee: LSI Corporation
    Inventors: Ryan Signer, John Dunham
  • Patent number: 7995355
    Abstract: The present invention provides a configuration of an electronics enclosure, including a computer chassis in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic “patterns” may be stamped, molded, cut, or extruded into a lid and a five-sided “box” to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: August 9, 2011
    Assignee: Stealthdrive, Inc.
    Inventor: Paul Douglas Cochrane
  • Patent number: 7990725
    Abstract: A modular storage system is provided for storing a disk array consisting of multiple hard disks. Each hard disk is provided with a terminal set. The modular storage system includes a casing having a plurality of disk compartments for receiving the hard disks respectively, a front end defining a front opening and a rear end defining a rear opening; a rear cover for covering the rear opening of the casing; and a plurality of connectors mounted on the rear cover via a coupling mechanism so that each of the connectors is aligned with a respective one of the disk compartments. Once the hard disks are installed respectively in the disk compartments, the terminal set of each of the hard disks is coupled electrically to a respective one of the connectors on the rear cover.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: August 2, 2011
    Assignee: Micro-Star Int'l Co., Ltd.
    Inventors: Kai-Kuei Wu, Hsiao-Liang Chen
  • Patent number: 7990724
    Abstract: A motherboard for a computer box having internal circuitry and communication ports comprises a portable motherboard having a connector for connection to an externally accessible connector of said computer box; wherein, connection of said portable motherboard connector to said externally accessible computer box connector enables said computer box to perform computing operations. The inventive motherboard is portably configured to serve one or more computers, preferably a personal computer or laptop. The portable motherboard provides a computer box with a brain. Alternatively, where a computer with a brain is slow, the portable motherboard may be used to boost the brainpower of the slow computer. Whether the portable motherboard brings life to a computer box or boosts the microprocessor power of a computer containing an internal microprocessor, the portable motherboard is a powerful invention that makes microprocessor power more efficient and ubiquitous.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: August 2, 2011
    Inventor: Paul R. Juhasz
  • Patent number: 7986531
    Abstract: Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: July 26, 2011
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Keun-hyuk Lee, Seung-won Lim, Seung-han Paek, Sung-min Park
  • Patent number: 7986533
    Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: July 26, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Jia Ren, Xiao-Yan Qin
  • Patent number: 7983058
    Abstract: Shielding structure for use in an electronic device comprising a housing and an electronic substrate which is arranged in the housing and which includes electronic parts, wherein the housing includes at least a surface facing the electronic parts, the surface being made of an electrically conductive substance. There is disposed a shielding member made of electrically conductive material comprising a frame-shaped section disposed on the printed board to surround a periphery of the electronic parts and a leaf spring section disposed to project from an upper-edge section of the frame-shaped section toward the inside of the frame-shaped section and upwardly in an inclined direction. The shielding member is disposed on the electronic substrate, and the surface made of an electrically conductive substance of the housing pushes the leaf spring section to be brought into contact therewith.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: July 19, 2011
    Assignee: NEC Corporation
    Inventor: Takeshi Ishihara
  • Patent number: 7965514
    Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: June 21, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Shahi Riaz
  • Patent number: 7965517
    Abstract: A digital camera contains a circuit board and a battery box inside a housing. The housing and the battery box are made of plastic. The housing is fixed to the battery box with a tapping screw. A conductive plate for preventing the tapping screw from being charged is arranged between the housing and the battery box. Projections of the conductive plate penetrate into thread grooves of the tapping screw. The conductive plate transmits static electricity of the tapping screw to a grounding member of the circuit board.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: June 21, 2011
    Assignee: FUJIFILM Corporation
    Inventors: Kazuya Mayumi, Shinji Suzuki, Takao Takasu
  • Patent number: 7957157
    Abstract: A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: June 7, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yuuichi Koga
  • Patent number: 7957152
    Abstract: A crash-hardened memory device in which only a single electronic component, such as a memory chip, mounted on a small printed circuit board (PCB), is protected against an impact. The portion of the PCB containing the electronic component is wrapped in fire-retardant material. The wrapped PCB assembly is placed in a rigid, hardened enclosure which provides an environmental seal for the portion of the PCB containing the electronic component. A portion of the PCB extends outside of the enclosure to allow electrical connections to be made to the electronic component contained inside. A score line is created on the PCB to create an acceptable shear point between the internal and external portions of the PCB in the event of a crash. Threaded fasteners extend through and beyond both enclosure halves to provide a means for mounting the crash-hardened memory device on an external surface.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: June 7, 2011
    Assignee: Appareo Systems, LLC
    Inventors: Barry Douglas Batcheller, Peder Alfred Nystuen, Robert Michael Allen
  • Patent number: 7952890
    Abstract: An electromagnetic interference shield system is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: May 31, 2011
    Assignee: Apple Inc.
    Inventors: Scott Myers, Erik Wang
  • Patent number: 7952889
    Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: May 31, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Yuan-Hsiao Chao
  • Patent number: 7929320
    Abstract: There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at least one inductor formed of a conductive pattern and provided between the conductive shield patterns.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: April 19, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Naohiro Mashino
  • Patent number: 7926166
    Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: April 19, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Allan Zuehlsdorf, Igor Vinokur
  • Patent number: 7924573
    Abstract: A card connector adapted for receiving a card, comprises an insulating housing defining a card insertion/ejection direction; a plurality of contacts received in the insulating housing, a shell and an ejector. The shell covers the insulating housing and is formed with a receiving portion. The receiving portion comprises an upper portion, a lower portion opposite to the upper portion and a connecting portion connecting the upper portion and the lower portion. The ejector has a front end received and locked in the receiving portion of the shell.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: April 12, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Yung-Chang Cheng
  • Patent number: 7916501
    Abstract: An energy transfer apparatus with a magnetic shield is configured to magnetically couple energy from a fixed location to a mobile or moveable device within a field-activated space of the energy transfer apparatus. Apparatuses include a location sensing surface and a drive coil arranged in relation to a periphery of the location sensing surface. A magnetic shield plate is disposed below the location sensing surface and the drive coil. The shield plate includes a number of radially oriented slots originating at, and distributed about, a periphery of the shield plate.
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: March 29, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: M. Benton Free, Bernard O. Geaghan, Karl P. Hauck, Albert H. Libbey, Billy Lee Weaver
  • Patent number: 7916500
    Abstract: A shield for electronic elements of a circuit board includes a frame and a cover, the frame including a peripheral wall comprising a plurality of fixed portions thereon, wherein the fixed portion includes a protrusion and a gap, the protrusion formed on the inner side of the peripheral wall, and the cover has a plurality of folding pieces corresponding to the fixed portions, the folding pieces defines an aperture, and the cover is mounted on the frame, the folding pieces match with the fixed portions correspondingly, the protrusion passes the aperture and locks with the aperture. When the cover is detached, the folding pieces are resisted via the gap to make the protrusion to break away from the aperture of the folding piece, enabling the cover to be opened.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: March 29, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Zheng Shi, Chih-Chiang Chang, Hong-Wei Zhang
  • Patent number: 7916489
    Abstract: According to an aspect of the present invention, a mounting structure includes a housing, an electronic component mounted at the housing, a pin-shaped terminal arranged upright at the housing, a circuit board having a mounting through-hole into which the in-shaped terminal is inserted, and a mounting support member positioned between the housing and the circuit board and fixed to the housing with the circuit board. In the mounting structure, the mounting support member includes a through-hole for positioning the pin-shaped terminal and an inclined guiding surface formed continuously with the through-hole for guiding a distal end of the pin-shaped terminal into the through-hole.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: March 29, 2011
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventor: Hisayoshi Okuya
  • Patent number: 7916498
    Abstract: A communication device includes a first printed circuit board (PCB), a second PCB disposed parallel to the first PCB, a first shielding cage and a second shielding cage. The first and second shielding cages are fixed to the first and second PCBs and define at lease one first and second receiving space to receive at least one transceiver modules, respectively. The first and second shielding cages include at least one first and second retaining tabs, respectively. Each of the transceiver modules received in the first and second shielding cages includes a release mechanism configured with a release portion and a trigger. The release portions can match one corresponding first and second retaining tabs to release the corresponding transceiver module. The triggers are disposed on one side of the transceiver modules close to the first and the second PCBs.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: March 29, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Jian-Ping Chen
  • Patent number: 7909902
    Abstract: Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: March 22, 2011
    Assignee: International Business Machines Corporation
    Inventors: Eric A. Eckberg, James D. Gerken, Maurice F. Holahan, Gerard F. Muenkel, Joseph D. Rico, H. Burt Stone
  • Patent number: 7911806
    Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: March 22, 2011
    Assignee: Hitachi, Ltd
    Inventors: Hiroki Funato, Liang Shao, Makato Torigoe
  • Patent number: 7903431
    Abstract: A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: March 8, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Gerald Robert English, Paul Crotty, Joseph Boetto
  • Patent number: 7898819
    Abstract: A 1/16 DIN power controller configuration is provided that includes a housing, a circuit board carrier disposed within the housing and capable of engaging at least three circuit boards within the housing, a power supply circuit board disposed within the housing and engaged by the circuit board carrier, and a communications circuit board disposed adjacent the power supply circuit board within the housing and engaged by the circuit board carrier. The communications circuit board includes Ethernet/IP and/or Modbus TCP protocols, and in alternate forms includes RS-232 and RS-485 with Modbus RTU protocol, DeviceNet, Profibus DP, CanOpen, and/or EtherCat.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: March 1, 2011
    Assignee: Watlow Electric Manufacturing Company
    Inventors: Thomas Robert Pfingsten, Stanton Hopkins Breitlow, John Frederic Lemke, Keith Douglas Ness, Robert Allen Pape, Larry Emil Tiedemann, Theodore Thomas Von Arx, Dale Thomas Wolfe, Matthew Francis Yender
  • Patent number: 7889515
    Abstract: In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: February 15, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Joseph C. Boetto, James R. Fikert
  • Patent number: 7889505
    Abstract: A camouflage retractable media system for efficiently providing media devices (e.g. speakers, etc.) that retract out-of-sight when not in use. The camouflage retractable media system generally includes a casing including a first end and a second end, wherein the first end includes a first opening and wherein the first opening extends through the first end. A chamber extends within the casing, wherein the chamber interconnects with the first opening. A drive unit extends within the chamber and a media device extends from the drive unit. A cap is positioned adjacent the first opening of the casing, wherein the cap includes a camouflage covering with respect to a surrounding environment. The drive unit selectively extends the media device outwardly from the first opening when in use and retracts the media device back within the chamber when not in use.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: February 15, 2011
    Inventor: Morris L. Beard
  • Patent number: 7889506
    Abstract: A function expansion datacard including a main board, a connector, a housing and a holder is provided. Several chips and the connector are disposed on a surface of the main board. The connector is situated near the edge of the main board. The housing disposed on the main board covers the chips and exposes a connection surface of the connector. The holder movably disposed at the housing is moved in and out the housing. The holder is situated over the connector and moves in a direction perpendicular to the connection surface.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: February 15, 2011
    Assignee: Inventec Corporation
    Inventor: Cheng-Hsing Huang
  • Patent number: 7889503
    Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: February 15, 2011
    Assignee: Nintendo Co., Ltd.
    Inventors: Takeshi Nagareda, Yasuhisa Kitano, Sadayoshi Hattori
  • Patent number: 7889507
    Abstract: First and second housings of a metal sheet are superposed over each other and fixed to each other by bolts to form an element receiving space. An antenna is fixed to the second housing by a bolt so as to be adjacent to the first housing. A hook section is fixed to the first housing. The hook section is inserted in a hole of the antenna, a step-shaped forward lower step section of the hook section is engaged with the peripheral edge of the hole in the antenna, and thus the first housing and the antenna are fixed to each other. The antenna is embedded in resin and covered by the resin.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: February 15, 2011
    Assignee: NEC Corporation
    Inventors: Toshinobu Ogatsu, Toshiki Yamanaka
  • Publication number: 20110026234
    Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.
    Type: Application
    Filed: December 22, 2009
    Publication date: February 3, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Chang-Sup Ryu
  • Patent number: 7876574
    Abstract: An electric equipment assembly is sized and configured to be disposed in a machine chamber of an outdoor unit. Reduction in size of the electric equipment assembly is achieved and simultaneously visibility and serviceability of a highly frequently accessed element are ensured, while employing a structure in which a control circuit board is covered by a protection cover. The electric equipment assembly includes a frame having a substrate attachment plate to which a control circuit board mounted with various electric components is attached and a substrate protection plate which covers the control circuit board. The outer surface of the substrate protection plate has a first auxiliary attachment portion formed thereon, to which a first auxiliary circuit board different from the control circuit board and mounted with a highly frequently accessed control element is attached.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: January 25, 2011
    Assignee: Daikin Industries, Ltd.
    Inventors: Hisashi Takeichi, Naohiro Kawasaki
  • Patent number: 7869224
    Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: January 11, 2011
    Assignee: All Best Precision Technology Co., Ltd.
    Inventor: Haven Yang
  • Patent number: 7864541
    Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: January 4, 2011
    Assignee: Radisys Corporation
    Inventors: Christopher D. Lucero, Javier Leija, James C. Shipley, Christopher A. Gonzales
  • Patent number: 7859853
    Abstract: A vehicle diagnostic display unit including a case, a display screen disposed within a front portion of the case, and a main support coupled to a side of the case and having a finger compartment for receiving a user's fingers to allow the user to lift the vehicle diagnostic display unit using one hand. A navigation pad is disposed on a front surface of the main support and the main support is configured to allow a user to simultaneously lift the diagnostic display unit and access the navigation pad with a thumb. The display unit also includes a combination folding stand and hanger assembly that allows the unit to be stood up for display, or hung for display, in a hands-free manner, such that a user is free to use both hands for other purposes while still being able to view the display screen.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: December 28, 2010
    Assignee: Snap-On Incorporated
    Inventors: Gordon F. Schmeisser, Ed Cahill
  • Patent number: 7856713
    Abstract: A combined terminal is made by combination of first and second terminals. The first terminal has a first plate portion. The second terminal has a second plate portion and a window portion formed in the second plate portion. The first and second terminals are combined so that the first and second plate portions are superposed while the first terminal remains to be linked to a frame by a link portion therebetween. The combined first and second terminals are removed from the frame by cutting the link portion through the window portion.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: December 28, 2010
    Assignee: Yazaki Corporation
    Inventors: Shinobu Suzuki, Kouichi Ohyama
  • Patent number: 7857214
    Abstract: The present invention provides an intelligent track system generally mounted in a network, server, or telecom rack/enclosure rack rail that can sense the spaces, such as “U” spaces, used by electronic equipment, shelving, or blanking panels and provide such information to a remote location. Information technology (IT) managers and other decision-makers can remotely view the actual available spaces and determine appropriate locations for installing additional equipment. Criteria can be based on actual available space and for some embodiments in conjunction with predictive or actual sensed temperatures proximate to the spaces, available cooling capacity, power loads, and available power capacity. In at least one embodiment, the intelligent mounting track system can include a plurality of sensors mounted along the rack surfaces that collectively or individually uniquely identify which spaces are occupied.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: December 28, 2010
    Assignee: Liebert Corporation
    Inventor: David G. Saliaris
  • Publication number: 20100315792
    Abstract: A module includes an outer housing comprising an additive. A first holder is disposed so as to be in integral relationship the outer housing. A second holder is disposed so as to be in integral relationship with the outer housing. A first circuit board is in removable engagement with first holder and the first circuit board adapted to being held in place by the holder without the use of a fastener. A second circuit board is in removable engagement with the second holder, the second circuit board adapted to being held in place by the holder without the use of a fastener. At least one electrical trace element is disposed so as to be in integral relationship with the outer housing. A conductive portion of the trace element provides a first electrical pathway between the first circuit board and the second circuit board. The insulator material and the additive act to provide electromagnetic compatibility (EMC) shielding for electrical components disposed within the outer housing.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 16, 2010
    Inventor: Thomas L. Jones
  • Patent number: 7848114
    Abstract: An electronic ballast and ballast housing having an integral ground for a circuit board positioned within the housing. A ‘snap in’ capture means holds circuit board under flexion so as to press a circuit grounding means in electrical contact with an integral grounding device attached to the ballast housing and providing electrical continuity between the circuit grounding means and the ballast housing. The coupler includes a grounding tab with a fulcrum extension extending from the housing and holding a ground plane surface of the circuit board by means of serrated teeth. An alignment tab disposed on a housing wall receives an alignment slot disposed in the circuit board so as to provide proper alignment of the electrical contacts. The coupler includes an overhead extension that engages a jumper wire in the circuit of the circuit board.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: December 7, 2010
    Assignee: Universal Lighting Technologies, Inc.
    Inventors: James Van Pelt, David McCarty, J. C. Kelley
  • Patent number: 7848112
    Abstract: On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: December 7, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventor: Manabu Matsumoto
  • Patent number: 7843361
    Abstract: A transfer switch configured particularly for use with traffic signal controllers, to enable a traffic signal controller to be powered by a portable electrical generator, when utility line power is unavailable. A housing, configured to be mounted either on the surface of a traffic signal controller cabinet, or recessed into an opening of the cabinet, so as to be flush to the surface thereof, is provided. The housing is configured to be substantially weatherproof without requiring the use of gaskets.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: November 30, 2010
    Assignee: Gen-Tran Corporation
    Inventor: Paul Schnackenberg
  • Patent number: 7839655
    Abstract: A key fob includes an upper housing and a lower housing that are attachable by way of a snap fit. A pin on the upper housing interfaces with the lower housing and can be selectively filled with an accessible material to bond and substantially permanently affix the upper housing to the lower housing such that any attempts at disassembly results in evident destruction of the either the upper housing or the lower housing.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: November 23, 2010
    Assignee: Continental Automotive Systems US, Inc.
    Inventor: Jeffrey Allen Clark
  • Patent number: 7839656
    Abstract: A shielded circuit assembly includes first and second circuit support structure, e.g. circuit boards having electrical or electronic components thereon, flexible connection between the circuit support structures, e.g., a flexible printed circuit (FPC), flat flexible cable (FFC), or other connection, the first and second circuit support structures adapted for positioning in generally overlying spaced apart relation with the flexible connection providing electrical connection therebetween while having floor plans that tend to efficiently conserve space between the circuit support structures, and electromagnetic energy shielding adapted to provide shielding of space between the circuit support structures in such generally overlying spaced apart relation. A method of making a shielded circuit assembly includes folding one printed circuit board that is flexibly attached to another printed circuit board to a generally parallel spaced apart relation and providing shielding of space between the circuit boards.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: November 23, 2010
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Göran Walter Schack, Gustav Fagrenius