With Shielding Structure Patents (Class 361/800)
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Patent number: 7321100Abstract: A system and method for placing an electro-optical assembly inside a panel. In accordance with various embodiments of the invention, the system includes a housing to house the electro-optical assembly. The housing comprises a top section, a bottom section, a front element, an attachment module, and a metallic plate. A latching unlatching mechanism facilitates removal of the hosing from the panel. The electro-optical assembly provides EMI shielding.Type: GrantFiled: January 13, 2006Date of Patent: January 22, 2008Assignee: Beam Express IncInventors: John Gerard Dewit, Jignesh Shah, Ashok Parmar
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Patent number: 7315000Abstract: An electronic module includes electronic circuitry and first and second connection mechanisms, both operationally connected to the electronic circuitry, for mounting the module in a larger electronic device by different respective methods. Preferably, the first connection mechanism is a robotic connection mechanism such as a BGA with one or more solder balls and the second connection mechanism is a manual connection mechanism such as a plug with one or more electrically conducting pads, both mechanisms being for mounting the module on a PCB.Type: GrantFiled: December 16, 2003Date of Patent: January 1, 2008Assignee: Sandisk IL Ltd.Inventor: Dov Moran
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Patent number: 7312998Abstract: According to one embodiment, a heat radiating apparatus comprises a shielding case having holding panels thereof arranged at locations substantially opposite to a circuit component to extend from a flat panel of the shielding case, which extends substantially parallel to a circuit board, towards the circuit board so as to cover the surface of the circuit board on which a circuit component is mounted. The head radiating apparatus further comprises a heat sink attached to the holding panels of the shielding case for coming into direct contact with the heat conductive sheet on the circuit component when the circuit board is covered with the shielding case.Type: GrantFiled: September 13, 2005Date of Patent: December 25, 2007Assignee: Kabushiki Kaisha ToshibaInventors: Kazuhiro Kamemoto, Hideo Tsurufusa, Takehiko Numata
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Patent number: 7313002Abstract: A shielding structure for a control module installed on the surface of a rear cover of a display comprises a plurality of engaging portions disposed at both lateral sides of the control module installed on the rear cover of the display, a shielding cover in which the control module can be accepted and a plurality of engaging sheets extended from the lateral sides of the shielding cover. When the shielding cover is assembled on the rear cover, the shielding cover can be quickly fixed on or detached from the surface of the rear cover of the display through the matching engagement of the clipping portions on the rear cover and the engaging sheets.Type: GrantFiled: August 11, 2005Date of Patent: December 25, 2007Assignee: Coretronic CorporationInventors: Min Hao Yuan, Chien Tsai Chueh
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Patent number: 7310234Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radiofrequency (RF) management system and e) a bottom panel coupled to the frame system.Type: GrantFiled: November 12, 2004Date of Patent: December 18, 2007Assignee: Purcell Systems, Inc.Inventors: William Miller, Kelly Johnson
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Patent number: 7310242Abstract: A distribution box for enclosing an electrical connection in an electrical wiring system includes a housing that is resistive to penetration by electromagnetic fields and a plurality of electrical conductors that form the electrical connection. A mirror plate is disposed within the housing and generates mirror currents to suppress electromagnetic fields generated by current flowing through the plurality of electrical conductors.Type: GrantFiled: May 21, 2004Date of Patent: December 18, 2007Inventors: Sergio Ramos, Eugene M. Steele, James P. Souther
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Patent number: 7310243Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.Type: GrantFiled: June 10, 2004Date of Patent: December 18, 2007Assignee: International Business Machines CorporationInventors: Don Alan Gilliland, Dennis James Wurth
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Patent number: 7301762Abstract: A computer enclosure includes a front panel, a drive bracket attached to the enclosure for receiving a data storage device therein, and a static protection device attached to the drive bracket. The drive bracket includes a recess with a plurality of catch orifices defined therein and a plurality of hooks formed thereon. The static protection device includes a main portion, and a side plate bent outwardly from the main portion. A plurality of catches is formed on the main portion engaging in the catch orifices of the drive bracket and a plurality of locking holes defined in the side plate corresponding with hooks of the drive bracket. The main portion and the side plate respectively connect with the data storage device and the front panel of the enclosure to provide a path to ground.Type: GrantFiled: November 17, 2004Date of Patent: November 27, 2007Assignees: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Shao-Bo Han
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Publication number: 20070268679Abstract: An electromagnetic shielding device (ESD) is disposed on a PCB and includes a cover and a conductive rubber frame. The cover is made of a conductive material. and a through hole. The conductive rubber frame encloses the periphery region of the cover, and the partial conductive rubber frame fills in the through hole to affix the conductive rubber frame onto the cover. The conductive rubber frame contacts the PCB and is electrically connected to a ground end of the PCB. The cover and the conductive rubber frame enclose an electronic component disposed on the PCB.Type: ApplicationFiled: May 2, 2007Publication date: November 22, 2007Applicant: ASUSTEK COMPUTER INC.Inventor: Min-Che Kao
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Patent number: 7298630Abstract: A coupling mechanism mainly includes a coupling member and two bucking blades. The coupling member has two anchor ends on two sides to anchor a plugging main board on the coupling member, and a groove on an upper side and a lower side, to hold the bucking blades. The bucking blades are squeezed and deformed when the coupling member is moved and latched on a coupling interface of an electronic device to fill the tolerance between the two, thus can prevent electromagnetic waves from leaking out. The two anchor ends are made of metal and can also prevent the electromagnetic waves from leaking out from two sides. The coupling mechanism solves the interference problem during assembly occurring to conventional coupling mechanisms that use annular conductive-foamed plastics. The cost of the coupling mechanism also decreases.Type: GrantFiled: May 10, 2005Date of Patent: November 20, 2007Assignee: Inventec CorporationInventor: Ruei-Lin Chen
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Patent number: 7292459Abstract: A handheld communication apparatus includes a metallic insert molding member, a circuit board and a shielding frame. The metallic insert molding member includes a metal plate. An electronic component is mounted on the circuit board. The shielding frame defines opposite first and second openings, wherein the shielding frame is bonded to the metal plate of the metallic insert molding member at the first opening, thereby forming a shielding case. The electronic component on the circuit board is inserted into the second opening of the shielding frame to be shielded by the shielding case.Type: GrantFiled: May 31, 2006Date of Patent: November 6, 2007Assignee: Arima Communications Corp.Inventor: Szu Wei Wang
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Patent number: 7285843Abstract: There is provided an electromagnetic wave shielding sheet which can effectively prevent an adhesive layer from being colored at the time of etching. The electromagnetic wave shielding sheet comprises a laminate of at least a transparent substrate film, an adhesive layer, and an electromagnetic wave shielding layer. The electromagnetic wave shielding layer is formed of a mesh metal foil with densely arranged openings and being transparent. The adhesive layer is substantially colorless and transparent.Type: GrantFiled: December 23, 2002Date of Patent: October 23, 2007Assignee: Dai Nippon Printing Co., Ltd.Inventors: Fumihiro Arakawa, Eiji Ohishi, Yasuhiko Ishii
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Patent number: 7282906Abstract: A device for protecting an electronic circuit comprising a support to which are attached at least two circuit portions, each comprising at least one integrated circuit chip. The device comprises a wafer of a semiconductor material covered with a conductive layer arranged parallel to the support, the wafer being connected to the support by conductive pillars distributed around each circuit portion and in contact with the conductive layer.Type: GrantFiled: April 20, 2006Date of Patent: October 16, 2007Assignee: STMicroelectronics S.A.Inventor: Romain Coffy
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Patent number: 7283375Abstract: An automatic switch includes a main body having a circuit board provided therein, and at least two sets of connectors connected to the main body via signal cables. The main body has an integral enclosure formed through multiple times of injection molding to include a circuit-protecting layer for enclosing the circuit board, an outer case enclosing the circuit-protecting layer, and an anti-slipping layer coating an outer surface of the outer case.Type: GrantFiled: May 10, 2003Date of Patent: October 16, 2007Assignee: ATEN International Co., Ltd.Inventor: Kevin Chen
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Patent number: 7282842Abstract: A plasma display apparatus for discharging heat from a lateral surface of a device. The plasma display apparatus includes a display panel, a chassis base supporting the display panel, and a circuit unit supported by the chassis base and for driving the display panel. A signal transmission unit couples the display panel and the circuit unit and includes at least one device mounted on itself. A lateral heat radiation member surrounds a lateral portion of the device to diffuse heat from the lateral portion of the device.Type: GrantFiled: November 22, 2004Date of Patent: October 16, 2007Assignee: Samsung SDI Co., Ltd.Inventors: Ki-Jung Kim, Kyoung-Ho Kang
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Patent number: 7277300Abstract: A vent grid has parallel first electrically-conductive members and parallel second electrically-conductive members intersecting with the first electrically-conductive members. The intersection between the first and second electrically-conductive members is forced to have a larger cross-sectional area. The characteristic impedance thus increases. The electric current flowing through the first and second electrically-conductive members turns over at the boundary between the intersection and the first and second electrically-conductive members. The flow of the electric current is in this manner interrupted. Accordingly, the vent grid fails to induce electromagnetic wave. Moreover, the electrically-conductive piece is merely located at a corner of the opening. Decrease in the percentage of the opening is thus suppressed to the utmost per a unit area. A sufficient airflow can be established through the vent grid. Decrease in the cooling efficiency and performance can be suppressed.Type: GrantFiled: July 27, 2005Date of Patent: October 2, 2007Assignee: Fujitsu LimitedInventors: Shigeo Sakamoto, Kenji Nagase, Kazuaki Taya
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Patent number: 7277301Abstract: An electronic device includes a circuit board (20) and a shielding cove (10). The circuit board includes a plurality of mounting holes (26), a first surface (22), a second surface (24) opposite to the first surface, and at least one electronic component (28). The shield includes a top wall (12), a pair of first sidewalls (14) and a pair of second sidewalls (16) opposite to the first sidewalls. The top wall, the first sidewalls and the second sidewalls cooperatively bound a receiving portion (18) for receiving the electronic component. At least one mounting portion (162) extends from each of the second sidewalls, corresponding to the mounting holes of the circuit board.Type: GrantFiled: April 28, 2006Date of Patent: October 2, 2007Assignee: Hon Hai Precision Industry Co., LTD.Inventor: Jen-Yu Liang
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Patent number: 7269030Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidates electrical terminations in one system; b) pre-terminates AC and DC equipment loads before site installation; c) provides multiple access points for facilitating equipment repair and installation; d) is easily expanded through the use of additional systems or expansion cabinets and e) is aesthetically functional given the cable entry and routing structure. Remote enclosure systems generally comprise: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) at least one removable radiofrequency (RF) port plate coupled to at least one of the side panels and/or the frame system; d) a bottom panel coupled to the frame system; and e) a cable management top assembly coupled to the frame system.Type: GrantFiled: October 30, 2002Date of Patent: September 11, 2007Assignee: Purcell Systems, Inc.Inventors: William Miller, Kelly Johnson
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Patent number: 7265989Abstract: A PC card is provided which can be used to add multiple capabilities to an information processing apparatus in cooperation with a conventional card only by the use of a single card slot. The PC card 1 comprises a card main body 10 which is provided with a connection plug 11 for connecting with the information processing apparatus 20 and a card connector 12 through which an additional card 30 can be connected, and which is connected to the information processing apparatus 20 to add multiple capabilities to the information processing apparatus; a pair of parallel rail members 13 serving to guide the additional card 30 for insertion; and a bridge member 14 connected between said pair of parallel rail members in order not to block the insertion path.Type: GrantFiled: April 7, 2004Date of Patent: September 4, 2007Assignees: Softbank BB Corp., SuncorporationInventors: Masayoshi Son, Satoru Yoshikawa
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Patent number: 7265984Abstract: A heat sink is attached to fixing plates of a shield case. When a circuit board is covered by the shield case, the heat sink comes into contact with a circuit component mounted on the circuit board through a heat conduction sheet. Further, clearance holes, which are approximately closed by first heat dissipation plates, are formed to the shield case.Type: GrantFiled: February 22, 2006Date of Patent: September 4, 2007Assignee: Kabushiki Kaisha ToshibaInventor: Takehiko Numata
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Patent number: 7259969Abstract: The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at least a portion of a perimeter of the EMI shield. One or more connectors coupled to the flange removably contact the flange to a ground trace of the printed circuit board.Type: GrantFiled: February 26, 2004Date of Patent: August 21, 2007Assignee: WaveZero, Inc.Inventors: John Zarganis, Rocky R. Arnold
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Patent number: 7254042Abstract: An Electro Magnetic Interference (EMI) shielding device (20) includes a body (201), at least a first engaging portion (203) extending from the body, and a pair of second engaging portions (205) formed on the body. A liquid crystal display device adopting the above mentioned EMI shielding device includes a TFT LCD panel, a power supply (12), an inverter (14) and an interface board (13). The power supply, the inverter and the interface board are formed on a printed circuit board (10). The EMI shielding device is positioned between the power supply and the inverter, with the first engaging portion inserted into the printed circuit board and the second engaging portions engaging with the printed circuit board. The EMI shielding device can reduce or potentially avoid the occurrence of EMI that would otherwise be produced by the printed circuit board.Type: GrantFiled: September 16, 2005Date of Patent: August 7, 2007Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Lan Huang
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Patent number: 7251142Abstract: The present invention discloses a timer switch that uses an integrated circuit to control the time and a self-locking electromagnetic coil solenoid valve to drive the operation of a microswitch, which is particularly applicable to be installed on a wall as a timer switch. The switch device uses the electronic control of two 1.5V AA batteries to enter a set time through input keys, and a CPU will issue a pulse with very short timing of 30 ms to the solenoid to produce a magnetic field to drive a turning rod and open a primary switch in order to turn on or off a circuit.Type: GrantFiled: December 15, 2004Date of Patent: July 31, 2007Assignee: Advanced Timer Technologies LimitedInventor: David Ping Lai Lui
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Patent number: 7250875Abstract: A transfer switch configured particularly for use with traffic signal controllers, to enable a traffic signal controller to be powered by a portable electrical generator, when utility line power is unavailable. A housing, configured to be mounted either on the surface of a traffic signal controller cabinet, or recessed into an opening of the cabinet, so as to be flush to the surface thereof, is provided. The housing is configured to be substantially weatherproof without requiring the use of gaskets.Type: GrantFiled: June 21, 2005Date of Patent: July 31, 2007Assignee: Geh-Tran CorporationInventor: Paul Schnackenberg
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Patent number: 7245498Abstract: An optical transceiver module that includes an enclosure within which are disposed a transmitter module and a receiver module. A primary and secondary board are disposed as well in the enclosure, and the transmitter module and the receiver module are each connected with one of the boards. The primary and secondary boards each have a ground plane, and a third ground plane is provided by a ground signal plate that disposed within the enclosure and electrically coupled with the primary board and the secondary board.Type: GrantFiled: March 30, 2005Date of Patent: July 17, 2007Assignee: Finisar CorporationInventors: Chris K. Togami, Stephan C. Burdick, Stephen C. Gordy
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Patent number: 7245497Abstract: A modular electronics enclosure for one or more circuit card assembly includes top and bottom lids formed substantially the same with at least one intermediate circuit card support member disposed therebetween. At least one spring clip clamps the top and bottom lids together around the intermediate support member.Type: GrantFiled: May 17, 2005Date of Patent: July 17, 2007Assignee: ITT Manufacturing Enterprises, Inc.Inventors: Robert D. Klein, Robert E. Kartman, Charles A. Geswein
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Patent number: 7242593Abstract: A thermally efficient motor housing assembly including a plurality of transistors and a printed wire board (pwb) for controlling a stepper motor and also including a plunger array and a spring array along with a combined heat sink and pwb enclosure.Type: GrantFiled: July 8, 2005Date of Patent: July 10, 2007Assignee: IMS Inc.Inventor: David Coutu
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Patent number: 7242586Abstract: A small form factor transceiver module includes a cage (1) and a transceiver (2). The cage has a top wall (11), and two sidewalls (12) and a rear wall (13) integrally formed with the top wall. The transceiver received in the cage has a printed circuit board (3) and at least one optical-electric diode electrically connected to the printed circuit board. The sidewalls have two bottom boards (121), each with a flange (120). A plurality of pins (123, 125, 133) is integrally formed with and extends from the bottom boards, the sidewalls and the rear wall.Type: GrantFiled: May 7, 2004Date of Patent: July 10, 2007Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Yung Chang Cheng, Chung Hsing Mou
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Patent number: 7242590Abstract: An electronic instrument system uses a “DualPlay” concept comprising first and second mutually-exclusive modes of operation. The system includes an instrument module having first and second communications channels, each for linking the instrument module to one or more processors. The first communications channel comprises a first connector attached to the instrument module for mating to a backplane connector electrically connected to traces. The system operates in the first mode when the instrument module communicates through the first communications channel. Additionally, the system operates in the second mode when the instrument module communicates through the second communications channel, the first connector is disengaged from the backplane connector and the electronic instrument is not communicating through the first communications channel.Type: GrantFiled: March 15, 2006Date of Patent: July 10, 2007Assignee: Agilent Technologies, Inc.Inventors: Boon Leong Yeap, Shiew Foe Foo, Cheo Bong Lim, Eng Su Tay
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Patent number: 7238893Abstract: A resilient, electrically conductive EMI gasket is disposed between two jaws. A cam-lever or other actuator is operably linked to the jaws. The cam-lever can be used to drive the jaws closer together, thereby squeezing the gasket and causing a portion of the gasket to protrude, preferably beyond an edge of at least one of the jaws. The protruding portion of the gasket contacts a mating surface of an opening, through which a device was installed, or a mating surface on an adjacent device. This contact seals the space between the EMI gasket mechanism and the mating surfaces, i.e. the contact closes a gap and thus maintains a continuous EMI shield therebetween. The gap is closed against passage of EMI radiation without relying on device insertion force to cause the EMI gasket to adequately contact the mating surface. Alternatively, an inflatable resilient EMI gasket is in fluid communication with a pump, and an actuator is operably linked to the pump.Type: GrantFiled: September 22, 2003Date of Patent: July 3, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: James Hensley, Andrew H. Dickson, Andrew M. Cherniski
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Patent number: 7233502Abstract: A twin-substrate wireless electronic module includes a main substrate, a plurality of integrated circuit chips, a frame substrate, a filter, and a shield member. The main substrate has a first surface and a second surface, and is formed with a notch that extends from the first surface through the second surface. The integrated circuit chips are surface-mounted on the first and second surfaces of the main substrate. One of the integrated circuit chips disposed on the first surface is a transceiver integrated circuit chip. The frame substrate has a first frame surface and a second frame surface. The first frame surface has a filter-mounting area aligned with the notch. The filter is surface-mounted on the filter-mounting area and is accommodated in the notch. A method for manufacturing the twin-substrate wireless electronic module is also disclosed.Type: GrantFiled: March 15, 2006Date of Patent: June 19, 2007Assignee: Universal Scientific Industrial Co., Ltd.Inventor: Cho-Hsing Chang
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Patent number: 7230836Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radio frequency (RF) management system.Type: GrantFiled: March 4, 2004Date of Patent: June 12, 2007Assignee: Purcell Systems, Inc.Inventors: William Miller, Kelly Johnson
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Patent number: 7227755Abstract: An adapter assembly including a base for supporting a SINCGARS radio and a radio frequency power amplifier, a first connector for electrically connecting with the SINCGARS radio and a second connector for electrically connecting with the power amplifier, a first power supply electrically connected with the first connector and a second power supply and a third power supply, the second power supply and the third power supply each being electrically connected with the second connector.Type: GrantFiled: July 21, 2004Date of Patent: June 5, 2007Assignee: Perkins Technical Services, Inc.Inventors: Ken Arnold, Michael Samuel Hamilton, Frank N. Perkins, III, Hubert Sims, Jr., Jeffrey K. Taylor, Robert A. Walls
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Patent number: 7190595Abstract: A protecting device of a memory module comprises two protecting sheets capable of covering a memory. Each upper edge of the protecting sheet has a buckling sheet and a buckling seat. One buckling sheet of one protecting sheet is capable of being buckled to the buckling seat of another protecting sheet. A front edge of each buckling seat is lowered so as to form an upper section surface and a lower section surface. The buckling hole has a lower buckling hole in the lower section surface and an upper buckling hole at the upper section surface. A front edge of the buckling sheet is lowered so as to form an upper section surface and a lower section surface. The lower section surface of the buckling sheet is formed with a buckling piece; and the buckling piece is extended with at least one tenon.Type: GrantFiled: September 22, 2004Date of Patent: March 13, 2007Inventor: Wan Chien Chang
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Patent number: 7177161Abstract: A compact radio equipment includes internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure. With this structure, a first metal shield frame is mounted on a first printed circuit board to cover components mounted on the first printed circuit board. A second printed circuit board is mounted on the first metal shield frame.Type: GrantFiled: September 3, 2004Date of Patent: February 13, 2007Assignee: Seiko Epson CorporationInventor: Makoto Shima
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Patent number: 7170013Abstract: In various embodiments, an electromagnetic shielding apparatus and method is provided. In one representative embodiment, an electromagnetic shielding apparatus is provided that comprises a plurality of spring fingers ganged together. At least one of the spring fingers includes an end extension adapted to facilitate a corner-to-corner contact with a mounting slot in a panel.Type: GrantFiled: January 10, 2005Date of Patent: January 30, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventor: Jeffrey M. Lewis
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Patent number: 7164587Abstract: An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted adjacent an electronic component that it is desired shield. The shielding portion at least partially surrounds the component, thereby providing a degree of EM shielding. The assembly also includes at least one resiliently biased electrically conductive connection member in electrical communication with the shielding portion. The connection member is operable electrically to connect the shielding portion to a predetermined voltage by bearing down upon an electrically conductive contact of the circuit board.Type: GrantFiled: January 14, 2004Date of Patent: January 16, 2007Assignee: Sun Microsystems, Inc.Inventors: Paul J. Garnett, Sean Conor Wrycraft
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Patent number: 7162793Abstract: Reflow soldering of a variety of circuit boards (9, 11, 15) in a variety of sizes and shapes to assigned locations on the base or carrier (13) of the electronic module housing (3) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled (22) with particulate, such as small beads (17), covering the circuit boards, but leaving the edges of the upstanding metal shields (5 and 7) visible. A plate (21) backed foam sheet (19) is placed over the module housing (24) and clamped down (26), pressing against the beads. The clamped assembly is then heated (28) to reflow the solder, soldering the circuit boards in place.Type: GrantFiled: November 7, 2003Date of Patent: January 16, 2007Assignee: Northrop Grumman CorporationInventors: Mark Kintis, Charles G. Turner
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Patent number: 7158388Abstract: At the opening (3) for insertable electronic or similar cards in a housing (1) for electronic circuits a frame is mounted including separate frame parts (5, 5?, 5?) having outer portions connecting to the edges of the opening. The frame can by its modular construction be adapted to an arbitrary number of shielding or cover plates (7) that are comprised in such cards and are placed or are to be placed in the opening. A simple mark-up of the position for a card can be easily made on a frame part located at the part opening for the card. The frame parts form together with the cover plates a whole continuous surface. Intermediate frame parts (5) divide the opening in part openings, each intended for only one cover plate. Elastic contact elements (27) are provided mounted in recesses in the frame parts to electrically connect adjacent cover plates to each other and a frame part to that cover plate or those cover plates which are located at the frame part.Type: GrantFiled: June 27, 2002Date of Patent: January 2, 2007Assignee: Bertil Lohman Design ABInventor: Bertil Lohman
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Patent number: 7154761Abstract: A backplane assembly includes a main backplane having a first power conductor, a backplane strip having a second power conductor, and connecting members disposed between the main backplane and the backplane strip. The connecting members hold the backplane strip in a fixed position relative to the main backplane and electrically connect the first power conductor and the second power conductor. In one arrangement, the connecting members include source standoffs which extend from a source area of the main backplane to the backplane strip, and target standoffs which extend from a target area of the main backplane to the backplane strip. The source and target standoffs and the second power conductor provide a current path which increases current carrying capacity from the source area to the target area above that provided by the first power conductor alone. Thus, the backplane assembly is well-provisioned for distributing high currents to circuit boards.Type: GrantFiled: February 13, 2004Date of Patent: December 26, 2006Assignee: Cisco Technology, Inc.Inventors: Sergio Camerlo, Irfan Elahi
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Patent number: 7154050Abstract: A cable arranging structure for exchanging electric signals between a pair of printed circuit boards includes at least a pair of electrically conductive members adapted to arrange the cable between them over the entire length thereof. The electrically conductive members show an electric potential substantially equal to that of the ground. Such a structure requires only the two electrically conductive members to be rigidly secured so that radiant noises generated by the cable can be effectively suppressed by means of the structure without the need of deforming the cable.Type: GrantFiled: September 30, 2003Date of Patent: December 26, 2006Assignee: Canon Kabushiki KaishaInventors: Daishiro Sekijima, Hideho Inagawa, Satoshi Sugimoto, Seiji Hayashi, Shinichi Nishimura
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Patent number: 7148418Abstract: A holder located on a casing using for loading a hard disk includes a bottom surface, at least a first elastic element and at least a second elastic element. The bottom surface is facing to a first surface of the casing. The first elastic element is located on the bottom surface having a first end connected to the bottom. At least a part of the first elastic element is configured through an opening and clipped on a second surface of the case. There is at least an opening configured through the first surface and the second surface. The second surface is in opposition to the first surface. A third end of the second elastic element is connected to the bottom surface, and at least a part of the second elastic element contacts against the first surface.Type: GrantFiled: October 14, 2004Date of Patent: December 12, 2006Assignee: ASUSTeK Computer Inc.Inventors: Hung Chung Ku, Pin An Hsieh
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Patent number: 7145773Abstract: A pluggable electronic module is provided that has an electronic component and a module body enclosing the electronic component. The module body has a first surface and a second surface. The first surface has a first area substantially parallel to the second surface and a second area that defines a non-zero angle with respect to the first area. The second area contacts a thermal sink to dissipate heat generated by the electronic component. The pluggable electronic module has a reduced insertion force in comparison with conventional pluggable electronic modules.Type: GrantFiled: February 26, 2004Date of Patent: December 5, 2006Assignee: Nortel Networks LimitedInventors: Simon Shearman, John Atkinson, Jon Bulman-Fleming
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Patent number: 7142434Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 26, 2002Date of Patent: November 28, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
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Patent number: 7142433Abstract: A method of embedding at least one flexible conductive track foil in a plastics material, wherein a prefabricated stiffening element is provided, said stiffening element accommodates said at least one flexible conductive track foil and secures it against bending, and said plastics material is injection-molded around said flexible track foil and said stiffening element in an injection-mold.Type: GrantFiled: February 4, 2002Date of Patent: November 28, 2006Assignee: Pollmann Austria OHGInventor: Johannes Lechner
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Patent number: 7130194Abstract: A transceiver module including a primary printed circuit board and a secondary printed circuit board in an enclosure is presented. The primary printed circuit board is coupled to the secondary printed circuit board by a connector pin that protrudes out of a critical surface of the enclosure. The printed circuit boards may be positioned substantially parallel to the critical surface of the enclosure. When a transmitter is electrically connected to the primary printed circuit board and a receiver is electrically connected to the secondary printed circuit board, the transmitter and the receiver may be positioned in a plane that is also substantially parallel to the plane of the critical surface.Type: GrantFiled: October 31, 2002Date of Patent: October 31, 2006Assignee: Finisar CorporationInventors: Chris K. Togami, Stephan C. Burdick, Stephen C. Gordy
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Patent number: 7113410Abstract: An electromagnetic shield structure (100) has an elongated conductive wall (102) that continuously or discontinuously defines a shielding perimeter and has a flange (104) laying over laterally to form a J-shaped hook (106) in cross section. A conductive cover or lid (108) engages over the standing wall (102) and has a depending side wall skirt (110) that has a flange (112) and forms a J-shaped hook (114) facing opposite from the hook (106) of the elongated wall (102). The cover (108) is pressed onto the wall (102) for assembly, causing the flanges (104) and (112) to deflect and snap over one another in the space between the overlapping skirt (110) and wall (102). The shield enclosure (122) can be disassembled without damage by applying a tool (116) through an opening (118) in the outer one of either the skirt (110) or wall (102), to deflect and disengage the flanges (104) and (112) in the space between the overlapped skirt (110) and wall (102).Type: GrantFiled: April 1, 2004Date of Patent: September 26, 2006Assignee: Lucent Technologies, Inc.Inventors: Ivan Pawlenko, Larry Samson
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Patent number: 7102897Abstract: The disclosure is concerned with An electromagnetic shielding plate comprising an electromagnetic shielding member of electrical conductivity and a front panel disposed to an end of the electromagnetic shielding member. The disclosure is also concerned with a circuit board chassis, which comprises a casing, guide rails disposed in the inside of the casing for inserting circuit boards and a plurality of electromagnetic shielding plates each comprising an electromagnetic shielding member and a front panel, the electromagnetic shielding plates being located between the circuit boards, wherein the electromagnetic shielding plates and the casing are electrically connected by means of front panels.Type: GrantFiled: April 30, 2004Date of Patent: September 5, 2006Assignee: Hitachi High-Technologies CorporationInventors: Tsukasa Sugawara, Akira Fujii, Hajime Shimada
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Patent number: 7099159Abstract: An appliance circuitry housing is designed so a circuit board can be attached directly to the housing interior with circuit board electric terminals being accessible from the housing exterior. An integral door on the housing exterior can be pivoted to a closed position over the electric terminals and connected plugs. A plurality of housing legs with slots engage in openings in the appliance to secure the housing to the appliance. A resilient latch on the housing exterior holds the housing in its attached position to the appliance.Type: GrantFiled: December 5, 2002Date of Patent: August 29, 2006Assignee: Emerson Electric Co.Inventors: Michael W. Major, Stephen J. Burton
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Patent number: 7095627Abstract: A shield structure that transmits a radio wave in a specific frequency band and that exhibits a high shield characteristic in other bands. An opening portion having a specific shape and a specific perimeter length is formed on a conductor. A filter having a specific shape and a specific size is connected to the opening portion.Type: GrantFiled: January 14, 2004Date of Patent: August 22, 2006Assignee: Hitachi, Ltd.Inventor: Hitoshi Yokota