Abstract: What is described is a connection element for fastening a metal part to a printed circuit board, wherein the connection element has a first portion, which is formed as a press-fit pin to be pressed into a bore of the printed circuit board, and a second portion, which is formed as a screw to be screwed into the metal part.

Abstract: A control terminal of an intelligent power module has a structure in which it is possible to reduce the area used exclusively by the module. An insulating circuit substrate on which power semiconductor elements are mounted, and a printed substrate having a control circuit, are arranged in a tiered structure, and a structure is adopted in which control terminals through which input control signals into a control substrate, as well as being formed into a linear shape, are caused to stand upright by being inserted into control terminal insertion holes provided in a case bottom portion of a module and the through holes of the printed substrate.

Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane (20) and a sacrificial-material piece (16) are attached to an insulator membrane (12) in the location of the flexible zone (13). An insulator layer (1), which encloses within itself a sacrificial-material piece (16) is manufactured on the surface of the conductor membrane (12). The flexible zone (13) is formed in such a way that an opening (9) is made in the insulator layer (1), through which the sacrificial-material piece (16) is removed. The flexible zone comprises at least part of the flexible membrane (20) as well as conductors (22), which are manufactured by patterning the insulator membrane (12) at a suitable stage in the method.

Abstract: A manufacturing method of substrate structure is provided. A base material having a core layer, a first patterned copper layer, a second patterned copper layer and at least one conductive via is provided. The first and second patterned copper layers are respectively located on a first surface and a second surface of the core layer. The conductive via passes through the core layer and connects the first and second patterned copper layers. A first and a second solder mask layers are respectively formed on the first and second surfaces. Portions of the first and second patterned copper layers are exposed by the first and second solder mask layers, respectively. A first gold layer is formed on the first and second patterned copper layers exposed by the first and second solder mask layers. A nickel layer and a second gold layer are successively formed on the first gold layer.

Abstract: A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.

Abstract: A handheld device includes a body and a back cover. The body has a back portion covered by the back cover. The back cover includes a yielding layer and a rigid layer. The yielding layer has an outer surface and an inner surface opposite to each other. The inner surface faces the back portion. The rigid layer is formed on the inner surface and locked to the body. The rigid layer has a hole exposing the back portion and covered by the yielding layer. When a portion of the yielding layer corresponding to the hole is pressed, the portion of the yielding layer is elastically deformed to closely lean on the back portion, and the locked body and rigid layer are released due to a force between the portion of the yielding layer and the back portion, such that the back cover may depart from the body.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: This interposer provides interconnections between stacked layers of circuits, which may include integrated circuits, PC boards, and hybrid substrates. Fabricated as an integrated circuit itself using readily available process steps, this interposer uses single and dual-damascene layers to increase the density of usable interconnections on both its top and bottom surfaces. Access from a top surface to a bottom surface is provided by conductive through-vias that may be placed at a high density. For even greater density, interconnections may be routed within silicon trenches, while damascene processing reduces the total number of steps required for fabrication. The described techniques may be used to create double-sided integrated circuits.

Abstract: A stress relief structure is provided. The stress relief structure includes a stress relief body, at least one first stress relief base and at least one second stress relief base. The stress relief body has an upper surface and a lower surface opposite to each other. The first stress relief base is disposed on the upper surface of the stress relief body. The second stress relief base is disposed on the lower surface of the stress relief body. The at least one first stress relief base and the at least one second stress relief base are interlaced to each other.

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract: An attachment mechanism for an electronic component includes a circuit board and a fastener. A first connector is fastened to the circuit board to be connected to a second connector of the electronic component. The first connector includes a mounting portion fastened to the circuit board and a large main body on a top of the mounting portion to connect to the second connector. A fastener includes a top wall, two engaging portions engaging with opposite sides of the electronic component, and two cantilevers slantingly extending toward each other from bottoms of the corresponding engaging walls. Two claws extend from each cantilever to engage with a corresponding end of the mounting portion and abut against a bottom surface of the main body.

Abstract: A substrate spacing member includes a spacer portion which is disposed between the two substrates in contact with both edge portions thereof to keep a distance between the two substrates constant, spacer member holding portions which hold the spacer members, a frame body portion that connects the spacer member holding portions to each other, a branch portion which extends toward a predetermined position between the two substrates from the frame body portion or the spacer member holding portions, and electrode holding portions which are provided at the branch portions, and hold electrodes at the predetermined positions.

Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.

Abstract: A mounting apparatus for an expansion card includes a bottom plate, a circuit board, and mounting bracket. The bottom plate defines mounting hole. The circuit board is secured to the bottom plate, and a gap is defined between the bottom plate and the circuit board. The mounting bracket includes a base secured to the bottom plate. The base includes two positioning pieces and an elastically deformable mounting portion. The two positioning pieces are received in the gap, to prevent the mounting bracket from moving along a first direction substantially perpendicular to the bottom plate, and the elastically deformable mounting portion is engaged in the mounting hole, to prevent the mounting bracket from moving along a second direction substantially parallel to the bottom plate.

Abstract: A connecting member for a portable electronic device includes a central cylinder, a first flange portion, a second flange portion, a plurality of first clasps and a number of second clasps. The first flange portion and the second flange portion surround on the central cylinder. The first clasps extend from the first flange portion, and the second clasps extend from the second flange portion.

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

Abstract: A fixing device for circuit boards with different thickness includes a base board, a number of posts, and a number of fasteners extending through the circuit board and engaging with the posts. A number of fixing holes are defined in the base board. Each post includes a first threaded portion and a second threaded portion selectively screwed in the corresponding fixing holes of the base board. The length of the second threaded portion is different from the length of the first threaded portion. The circuit board is to be supported on a distal end of one of the first and second threaded portions that is not to be screwed in the fixing hole.

Abstract: An environmental sensitive electronic device package may include a first substrate, a second substrate, an environmental sensitive electronic device, a first adhesive, a third substrate, at least one first side wall barrier structure, and a second adhesive is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located between the first and second substrates and covers the environmental sensitive electronic device. The third substrate is located below the first substrate. The first substrate is located between the second and third substrates. The first side wall barrier structure is located on the third substrate and between the first and the third substrates, wherein the first side wall barrier structure is embedded in the first substrate. The second adhesive is located between the first and third substrates and covers the second side wall barrier structure.

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

Abstract: An electronic device includes a chassis, a circuit board and a fastening member. The chassis includes a bottom plate. The bottom plate defines a through hole and a securing hole. The circuit board is located on the bottom plate in the chassis. A securing member and a positioning member are secured to the circuit board. The positioning member makes contact with the circuit board and the bottom plate, defines a through opening, and includes a latch engaged in the securing hole. The securing member defines a mounting hole and extending in the through opening. The fastening member is locked in the through hole and the mounting hole.

Abstract: Various embodiments of an electronic assembly with increased standoff height are provided. In one exemplary embodiment, a substrate is provided. A metallic interconnection land is disposed over the substrate. A solder resist material is applied on a predefined portion of the metallic interconnection land. A metallic solder material is disposed over at least a portion of the solder resist material and contacts a surface of the metallic interconnection land. An air pocket is formed within the metallic solder material over at least a portion of solder resist material. The air pocket acts as a lifting mechanism to increase a standoff height between the substrate and a surface mount component.

Abstract: Embodiments include but are not limited to apparatuses and systems including a die package including a substrate, a die coupled with a top surface of the substrate, a package wall disposed on the top surface of the substrate and bounding the die, and a package lid coupled with the package wall, and including at least one protrusion facilitating a coupling of the package lid with the package wall. At least one edge of the top surface of the die pad may include an etched portion such that a width of the top surface is narrower than a width of the bottom surface. At least one edge of a top surface of at least one of the leads may include an etched portion such that a width of the top surface is narrower than a width of the bottom surface. Other embodiments may be described and claimed.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: A chassis includes a number of fixing apparatuses, which enables various motherboards with different mounting holes layouts to be selectively mounted in the chassis. Each of the fixing apparatuses includes a base member secured to the chassis, and a fastening member rotatably connected to the base. The fastening member defines a fastening hole extending through an end of the fastening member. Each of the fixing apparatuses is rotatable between a fastening position and an interference avoiding position. To mount one of the motherboards, some of the fastening members are rotated to the fastening-ready positions to align the fastening holes of the fastening members with the corresponding mounting holes of the motherboard, and other fastening members are rotated to the interference-avoiding position to avoid interfering with the motherboard.

Abstract: To provide a printed board fixing device capable of reducing the thickness and size with a simple structure. The printed board fixing device includes a coupling member which two-folds a flex rigid printed board that includes one and the other rigid printed boards via a flexible part and mutually couples and fixes the one and the other boards. The length of the coupling member is set to be within a range of entire thickness including the one and the other rigid printed boards. The coupling member is provided at two points on the one and the other rigid printed boards.

Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.

Abstract: A pad mechanism includes a step fixing structure having a plurality of step platforms. A height difference is formed between the two step platforms. A first engaging portion is formed on each step platform. The pad mechanism further includes a pad component having a pad body, a sleeve and a constraining portion. A second engaging portion is formed on the pad body for selectively engaging with the corresponding first engaging portion so as to adjust a height of the pad body protruding from the step fixing structure. The pad mechanism further includes a resilient component sheathing with the sleeve for driving the sleeve, and a constraining component installed on a side of the resilient component and connected to the constraining portion so as to prevent the resilient component from separating from the sleeve.

Abstract: The disclosure concerns an electrical connection assembly comprising: a conductive plate with a drillhole, a first column with a hole passing axially through it and comprising a shoulder to abut against one of the faces of the conductive plate, and a second column with a hole passing axially through it and comprising a shoulder to abut against the other face of the conductive plate, a first cylinder with a radius sized to enable it to enter the hole in the first column and a length sized such that, when the shoulder is in abutment, the free end of the first cylinder projects beyond the conductive plate, and a second cylinder with a radius sized to enable it to enter the drillhole, wherein the free end of the first cylinder is crimped by radial expansion and then by axial compression in the hole in the first column.

Abstract: An electronic device includes a supporting member, a circuit board fixed to the supporting member, a bottom cover assembled with the supporting member, and at least one conductive resilient sheet fixed on the circuit board. The conductive resilient sheet includes a fixing portion fixed on the circuit board and a conductive portion. The conductive portion defines a first elastic sheet and a second elastic sheet. The bottom cover is fixed between the first elastic sheet resisting the outer side of the bottom cover and the second elastic sheet resisting the inner side of the bottom cover.

Abstract: A vibratile display device includes a back plate, a panel assembly and at least one flexible pin. The back plate has a plurality of first fixing holes. The panel assembly is fixed to the back plate and includes a base and a display panel. The base has a carrier portion and a plurality of lugs extending outward from the carrier portion. Each lug has at least one second fixing hole corresponding to the first fixing holes. The display panel is disposed on the carrier portion of the base. An insert portion of the flexible pin is inserted into the first fixing hole of the back plate, and a neck portion of the flexible pin is inserted into the corresponding second fixing hole. A lean portion of the flexible pin is located between the base and the back plate. A top portion of the flexible pin protrudes a surface of the lugs.

Abstract: Disclosed is a damper that is easy to mount and capable of attenuating to a sufficient degree a vibration generated by an electronic component; also disclosed are an electronic component and an electronic apparatus that are provided with such a damper. A mounting insertion portion is provided with a hard portion maintaining the configuration of the mounting insertion portion.

Abstract: A backplane electronic circuit board of an electronic apparatus (10) comprises an interface connector with an external system and two interface boards (22, 23) connected to one another, a first interface board (22) being connected to the said interface connector and a second interface board (23) being intended for the connection of a set of electronic circuit boards of the said electronic apparatus (10). The backplane electronic circuit board (20) comprises reinforcement means (30, 40) installed between the said two interface boards (22, 23). Use in particular in an electronic apparatus on board an aircraft.

Abstract: A blade for a chassis-based system includes a printed circuit board (PCB) mounted at a tilt angle within the blade. The tilt angle provides space above or below the PCB at the front end of the blade, such that media interface modules can be flexibly positioned within the blade. A tilt angle that positions the PCB higher near the front end of the blade may enable media interface modules mounted in a belly-to-belly configuration on the PCB to be fitted within the front end of the blade. A tilt angle that positions the PCB lower near the front end of the blade may enable media interface modules mounted on the upper surface of the PCB to be fitted within the first end of the blade. The tilt angle also positions a backplane connector mounted on the PCB to properly engage a backplane when the blade is inserted into a slot.

Abstract: Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.

Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

Abstract: A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.

Abstract: A fixing apparatus for a circuit board includes a bottom plate, a number of supporting posts, a number of sleeves, and a number of fasteners. The supporting posts are formed on the bottom plate. The sleeves are detachably installed on the supporting posts, respectively. The fasteners extend through the circuit board and the corresponding sleeves, to engage in the supporting posts, respectively.

Abstract: Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.

Abstract: An electronic device is provided, the electronic device includes a printed circuit board (PCB) having a mounting point. The computer system also includes a chassis having a mounting post. The mounting point and the mounting post are flexibly connected.

Abstract: A mezzanine board alignment and mounting device includes a multi-stage pin connected to a main board near a mezzanine board connector disposed on the main board. The multistage pin includes a base adapted to connect to the main board, a point distal to the base adapted to pass through an opening on a mezzanine board, and a support disposed between the base and the point. A diameter of the point widens towards the support. A diameter of the support is wider than a diameter of the opening. When the point is fully inserted through the opening in the mezzanine board, the mezzanine board is aligned properly to connect with the mezzanine board connector on the main board.

Abstract: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.

Abstract: A standoff device and a concomitant method of attaching the same to a printed wiring board, comprising inserting into an opening in the printed wiring board a standoff device comprising a threaded body, a neck region narrower and atop the body, and a hexagonal head atop the neck and comprising one or more anti-turn features, and threading a nut onto the body to contact a side of the printed wiring board opposite that contacted by the hexagonal head.

Abstract: A heat sink assembly is provided for a pluggable module. The heat sink assembly includes a heat sink having a module side and an end surface that intersects the module side. The module side is configured to thermally communicate with the pluggable module. A holder extends from the end surface of the heat sink. A thermal interface material (TIM) layer extends on the module side of the heat sink. The TIM layer is configured to engage the pluggable module. The TIM layer includes an end that is engaged between the end surface and the holder of the heat sink.

Abstract: In a method for fixing an electrical or an electronic component, particularly a printed-circuit board, in a housing used to accommodate the component, and a fixing element for fixing the component by clamping it in place, the component is fitted with at least one fixing element, which includes an elastically yielding press-on part which, during the clamping in place of the component in the housing, is brought to lie against a part of the housing and is pressed against it while being deformed.

Abstract: Printed circuit board (PCB) positioning spacers in an optoelectronic module. In one example embodiment, an optoelectronic module includes a housing comprising a top shell and a bottom shell, top and bottom printed circuit boards (PCBs) at least partially enclosed within the housing, and a spacer positioned between the first and second PCBs. The spacer includes top and bottom surfaces, a plurality of top posts extending from the top surface, and a bottom post extending from the bottom surface. The top posts extend through openings in the top PCB to contact one or more inside surfaces of the top shell. The bottom post extends through an opening in the bottom PCB to contact an inside surface of the bottom shell.

Abstract: An electrical socket assembly including a socket housing having coupling and flange portions and a contact cavity that extends through the coupling and flange portions along a central axis. The coupling and flange portions have different peripheral contours that extend about the central axis. The peripheral contour of the flange portion being sized and shaped to prevent the flange portion from advancing through a thru-hole of a circuit board. The socket assembly also includes a fastener that is configured to be secured to the coupling portion. The fastener and the flange portion have respective mating surfaces that face each other in opposite directions along the central axis. The respective mating surfaces are configured to grip the circuit board therebetween such that the socket housing has a fixed position relative to the circuit board. A conductive path exists between the power contact and the circuit board.

Abstract: A technique is provided for improvement in convenience and in cost reduction of a fixing part of a printed board unit. A printed board unit includes a plurality printed board including a first printed board and a second printed board; and at least one fixing part, interposed between the first printed board and the second printed board, fixing the first printed board and the second printed board such that the first printed board and the second printed board overlap and keep a predetermined space between the first printed board and the second printed board, and the fixing part variably determines the predetermined space.

Abstract: A fastener includes a cylinder and a draw hook. The cylinder includes a main body, two resilient arms extending from an end of the main body, and a flange extending from a circumference of an opposite end of the main body. A number of protrusions spaced in the axial direction of the main body extends from an inside surface of each of the resilient arms. The draw hook includes a post slidably received in the cylinder, a taper-shaped engaging portion extending from an end of the post and exposed out of distal ends of the resilient arms, and a handle extending from an opposite end of the post. A diameter of the engaging portion gradually grows larger along a direction away from the post.

Abstract: A circuit board fixing element is provided. The circuit board fixing element is used for fixing a circuit board on a sheet, and includes a fixing portion, a buckling portion, and a connecting portion. The buckling portion is made of a resilient material. The connecting portion is connected between the fixing portion and the buckling portion, and has two opposite ends and a side surface connected to the ends. The fixing portion and the buckling portion are respectively located on the ends and protrude from the side surface.