Abstract: To provide a printed board fixing device capable of reducing the thickness and size with a simple structure. The printed board fixing device includes a coupling member which two-folds a flex rigid printed board that includes one and the other rigid printed boards via a flexible part and mutually couples and fixes the one and the other boards. The length of the coupling member is set to be within a range of entire thickness including the one and the other rigid printed boards. The coupling member is provided at two points on the one and the other rigid printed boards.

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness.

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.

Abstract: A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing. A sacrificial material is disposed between the housing and heat sensitive memory device. The sacrificial material having a lower melting temperature than the first material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and heat sensitive memory device. The first material includes nickel and the sacrificial material includes aluminum. A heat insulating layer is disposed between the sacrificial material and heat sensitive memory device. A second sacrificial material is disposed between the heat insulating layer and heat sensitive memory device.

Abstract: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.

Abstract: A base plate for a heat sink comprises a cooling plate and spacer elements, which are arranged on the surface of the cooling plate. The spacer elements and the cooling plate are made as one piece and the material in the surface region of the cooling plate and of the spacer elements being the same and formed in the same process.

Abstract: A meter spacer unit includes a dial spacer, a lateral spacer flexibly connected to the dial spacer by a joint, and a rear connecting member flexibly connected to the lateral spacer by a joint. The lateral spacer includes a connection member adapted to connect to a printed circuit board.

Abstract: An electronic device structure includes an upper case, a lower case, a main board, a suspending member, and a fixing member. The upper case and the lower case respectively have an upper combining column and a lower combining column. The main board has a through hole, the upper combining column passes through the through hole, and a size of the through hole is larger than a size of the upper combining column, such that a moving gap is kept between the upper combining column and the through hole. The suspending member is combined with a side of the main board and spaced with the main board by a suspending distance. The fixing member passes through the lower combining column and the suspending member and is fixed on the upper combining column, such that the main board is disposed on the lower combining column through the suspending member.

Abstract: A guide module is provided for connecting a primary circuit board and a secondary circuit board to a common backplane circuit board. The primary and secondary boards are in a tiered arrangement with both the primary and secondary circuit boards having interface connections on the backplane circuit board. The guide module includes a body having a height between opposite top and bottom surfaces. The height of the body establishes a stack height between the primary and secondary boards. Locating elements are formed on the top and bottom surfaces to locate and align the primary and secondary boards with respect to one another.

Abstract: A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate.

Abstract: There is provided a control apparatus capable of simply supporting/fixing a board by a board support, reducing a number of integrating steps, reducing cost and downsizing a board size. In a control apparatus constituted by attaching a board to a board support provided at a base attachably and detachably, the board support is constituted by a resin, and includes a guide having a section in an L-like shape provided at one side end portion of the board support, a hook having a section in an L-like shape provided at other side end portion of the board support, and a board mounting portion provided between the guide and the hook for supporting a lower face of the board. The guide includes an engaging portion engaged with one side end portion of the board mounted to the board mounting portion at an upper portion thereof.

Abstract: An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remove the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.

Abstract: A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion being disposed a second surface of the substrate. The transmitter receives an input signal and couples a signal derived from the input signal to the first portion. The receiver is connected to the second portion of the circuit element and generates an output signal that is coupled to an external circuit. The galvanic isolator can be economically fabricated on conventional printed circuit board substrates and flexible circuit substrates.

Abstract: A printed circuit board unit includes a printed wiring board. A socket supports one end of a module substrate. A fixation member is spaced from the socket at a predetermined distance. A movable member is connected to the fixation member for relative horizontal movement in parallel with the surface of the printed wiring board. The movable member receives the other end of the module substrate. A first restriction member is connected to the movable member. The first restriction member is configured to restrict horizontal movement of the module substrate in parallel with the surface of the printed wiring board. A second restriction member connected to the movable member. The second restriction member is configured to restrict perpendicular movement of the module substrate in the direction perpendicular to the surface of the printed wiring board.

Abstract: Embodiments of the present invention provide a fastening support assembly configured to securely connect a first panel above a second panel. The fastening support assembly includes a shaft having a cap at a first end and a distal tip at a second end. The shaft defines an internal chamber. The distal tip is configured to secure to the first panel. A pin is positioned within the internal chamber, wherein movement of the pin into the internal chamber radially expands the shaft. A portion of the shaft and the pin proximate the cap are configured to substantially fill a hole formed through the second panel when the second panel is secured to the fastening support assembly.

Abstract: A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs (2) arranged at the ends of the lower surface of the substrate (1), each insulating leg extending in parallel to the lower surface of the substrate (1); and a plurality of terminal electrodes (5) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (1). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes.

Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.

Abstract: A stud is a structure for supporting, on a printed circuit board, a mounting component such as another printed circuit board or a device. This structure is surface-mounted on the printed circuit board by soldering or press-fitting. The structure is a constituted by a columnar-shaped structure and the like. One end of the columnar-shaped structure is surface-mounted on the printed circuit board, and the other end thereof is fixed to the mounting component.

Abstract: A spacer or retainer secures two circuit boards in a back-to-back configuration. The spacer has opposite first and second sides, each having a peripheral rim against which the circuit boards fit. Each side is recessed to a depth enabling any component terminals or connections from rear surfaces of the circuit boards to be received in the recesses. Pins on ends of the spacer are received in apertures in the circuit boards to guide the circuit boards into position on the spacer. Two clips are positioned next to each other on one wall forming the peripheral rim. Each clip extends beyond an opposite side, and the clips have resilient tabs biased to press the circuit boards against the rims. The circuit boards are connected by electrical wire extending around an opposite wall of the peripheral rim. The spacer and circuit boards form a subassembly, such as for a vehicle instrument cluster.

Abstract: A spacing device for adapting electronic modules for insertion into a system is disclosed. In one embodiment, the spacing device includes a body and guide features configured to align the body with mating guide features of electronic modules. The spacing device also includes a coupling portion having coupling arms, which is configured to secure the electronic modules to the body.

Abstract: A stand-off having a flange and a projecting portion extending from the flange is integrated with a first substrate, for example, a printed circuit board (PCB), by forming a hole in the PCB, inserting the projecting portion of the stand-off through the hole, and attaching a second substrate to the first substrate with the flange therebetween. The flange can be at least partially received by a relief formed in one of the substrates or in an aperture in an adhesive layer between the two substrates. The stand-off can be further secured to the PCB using one or more of adhesives, interference fit techniques, snap-assembly features, and other applicable techniques. Alternatively, the stand-off can be attached to a substrate using a sliding snap feature or sliding interference fit. An attachable component can be attached to the projecting portion of the stand-off.

Abstract: An electronic circuit device includes at least two circuit substrates for mounting electronic components and a flexible board for external electrical connection disposed between the circuit substrates. The flexible board is electrically connected to at least the surface of one circuit substrate opposed to another circuit substrate.

Abstract: Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell.

Abstract: A receiving apparatus according to the present invention comprises: a first board including a mount surface whose outer edge is substantially quadrilateral; and a board installation member including a plate portion that has an installation surface whose outer edge is substantially quadrilateral, the first board is installed on the installation surface (called a front surface) side and the surface (called a rear surface) of the rear side of the installation surface is installed on a given second board, the apparatus applies a predetermined processing to a received broadcast signal using a circuit disposed on the first board, and the board installation member includes a connecting terminal to electrically connect the first board with the second board and a leg portion used for the installation on the second board, the connecting terminal protrudes from the plate portion in the direction substantially perpendicular to the plate portion on the front surface side and on the rear surface side, and comes into contac

Abstract: A fixing device for securing a circuit board to a plate member includes a spacer, a nut member, and a fastener. A coupling hole is defined through the spacer. A female thread is formed on a part of an interior surface of the coupling hole at an end thereof. A nut member comprises a pressing portion and a coupling portion extending from the pressing portion. A male thread is formed on a part of an exterior surface of the coupling portion at a free end thereof, corresponding to the female thread of the coupling hole of the spacer such that the coupling portion is capable of being movably retained in the coupling hole. A threaded hole is defined in the nut member. A fastener includes a head and a threaded rod extending from the head for being screwed in the threaded hole of the nut member.

Abstract: Polyimide is used as a spacer that also bonds together the elements that it is spacing apart. This is achieved by constructing the spacer on at least one of the wafers as is conventionally done, except that prior to performing the final curing of the polyimide precursor to form the final polyimide, the elements are aligned in a bonder and placed in contact with a pressure of 40 grams per square millimeter at a temperature slightly higher than the soft-bake temperature, as specified by the manufacturer of the polyimide precursor, for few minutes to promote tackiness. This holds the elements together, and the combined structure is then baked to fully cure the polyimide precursor into polyimide and complete the bonding.

Abstract: A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

Abstract: A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer. In signal redistribution caposer, conductors within the caposer redistribute signals between die micro-bumps and package landing pads. In an impedance matching caposer, termination structures within the caposer provide impedance matching to a printed circuit board trace.

Abstract: An device including a fastener. In some embodiments, the device is an electronic device that includes a circuit board, a support structure, and a resilient conductive clip. The circuit board may include a slot extending between opposite faces. The resilient conductive clip may couple to the support structure and be removably inserted through the slot so that it is disposed at least partially about the opposite faces. The resilient conductive clip may include lower and upper grounding portions engaged against the opposite faces of the circuit board.

Abstract: The flexible circuit board according to the present invention includes a plurality of mounting portions which are mounted with electronic circuits respectively, a connector portion that performs signal transmission between the electronic circuit mounted on each of the mounting portions and the electronic circuit device, and coupling portions that couple the respective mounting portions to the connector portion in different directions. The flexible circuit board is mounted on the electronic circuit device in a state of being folded at a predetermined part of one of the coupling portions.

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.

Abstract: The present invention generally relates to providing a controlled impedance connection between two PCBs. A connector may connect a first PCB to a second PCB. The connector may comprise of a body made from a dielectric material and a plurality of conductive lines defined in the dielectric material. One or more of the conductive lines may transfer one or more signals between the PCBs. A return path may be provided for each signal line. Furthermore, the width, length, and the proximity of a signal line and its associated return line may be selected to match the impedance of the connector to the impedance of the PCB. The connector may also contain one or more ferrite layers to suppress electromagnetic radiation caused by common mode currents.

Abstract: Providing a method for manufacturing a multilayer wiring board and a touch panel, which does not cause decreasing of yields, reliabilities and productivities even though the materials of each board to be stacked are different, and which manufactures the multilayer wiring board and the touch panel at low cost with high productivities. A multilayer wired board constituting at least part of a electrical circuit board in which a plurality of wired boards are stacked so as to face their wired surfaces each other, wherein: electrical connection parts between the multilayer wired boards are connected through an elastic conductive material part adhered to one of the wired boards; and at least part of a peripheral edge portion of the elastic conductive material part is adhered by a double-sided adhesive material part to seal the plurality of multilayer wired boards.

Abstract: An electrical connector (100) comprises a frame (12) having a center opening (122) thereof and a bearing surface (1211) on a top end thereof, a housing (11) engaging with the opening (122) of the frame (11) having a top surface (111) and a bottom surface (112), and defining a plurality of passageways (113), a plurality of terminals (114) received in the passageways (113) of the housing (11), wherein in assembly, the housing (11) is interfering engaging with inner sides of the opening (122) with the top surface (111) higher than the bearing surface (1211).

Abstract: A device for coupling a printed circuit board assembly to a computer chassis is described. The device may include a base. The device may include at least two posts. The posts may be located on opposite sides of the base. The posts may couple the device to the computer chassis. The device may include at least one prong. The prong may extend upward from the base. The prong may couple the device to the printed circuit board assembly.

Abstract: A fixing structure including a fixing part, an elastic member disposed on the fixing part, a first element disposed on the fixing part by the elastic member, and a second element connected to the first element is provided. When the first element and the second element are not in a same height level, one may force the first element to be adjusted within the elastic deformation range of the elastic member until the first element is in the same height level with the second element, such that the first element and the second element are connected and fixed together.

Abstract: A fixing structure of a circuit board for fixing the circuit board in a case is proposed. The fixing structure includes a first limiting portion, a first fixing portion and a post of a first attaching portion retained in the case; and a second limiting portion, a second fixing portion and a second attaching portion formed on the circuit board. The second limiting portion and the second fixing portion are respectively located corresponding to the first limiting portion and the first fixing portion for preventing the circuit board and the case from moving to all directions. Furthermore, the second attaching portion can be attached to the first attaching portion to fix the positions of the circuit board and the case. By such arrangement, the number of locking elements can be decreased to reduce time consumed for assembly and detachment.

Abstract: A board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in the model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) have one end(s) and are brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) are brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42). Each support pin is held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin (42), held in the direction substantially perpendicular to the surface of the support table (27), is brought into contact with the bottom face of the circuit board (14), and thereby, the support pins support the circuit board (14).

Abstract: A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract: A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may include one or more support members extending across at least a portion of the carrier card. One or more rollers may be supported on the support member(s) in a manner that allows rotation to facilitate insertion and/or extraction of mezzanine cards from the carrier card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.

Abstract: The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibratory environment. These computers generally comprise one or more large electronic cards. To limit the effects of vibrations on the integrity of the electronic components and on the connection system for the card, the invention proposes to place on each face braced structures for reducing the mechanical effects of the vibrations or for shifting the resonant frequencies of the electronic cards so as to avoid high-Q effects.

Abstract: In an active semiconductor backplane for a liquid crystal spatial light modulator, spacers (25) which are distributed over the backplane extend above an array of electrical and/or electronic elements and comprise at least two layers essentially of the same material and occuring in the same order as is found in at least one of the electrical or electronic elements, such as an NMOS transistor (52). The latter is formed from a stack of layers on a silicon substrate (51) comprising polysilicon (56), continuous silicon oxide (57) modified to include gate oxide GOX (55), metallic gate electrode (59), continuous silicon oxide (58) and a metallic drain electrode (60) which is coupled to a spaced mirror electrode over the layer (58). Likewise, spacer (25) comprises the layers (57 and 58) with metallic (67, 68) deposited simultaneously with electrodes (59, 60). The foot of layer (57) is differently modified to include field oxide layer (69) and polysilicon layers thin oxide (71).

Abstract: A circuit board fixer structure, for fixing a circuit board having at least one through hole, includes a carrier for carrying the circuit board, a pillar, and a stud. The pillar is mounted on the carrier and is formed with a first opening and a second opening corresponding to the first opening. The circuit board is fixed in place on the carrier by the pillar penetrating the through hole of the circuit board and the stud penetrating the first and second openings of the pillar to be coupled to the pillar. By the circuit board fixer structure, there is no need to use any tool to assemble and disassemble a circuit board in an electronic device, making the assembly and disassembly of the circuit board convenient to implement.

Abstract: An assembled structure. A first substrate having a base surface is connected to a second substrate by at least one metallic clamping device. The clamping device, vertically disposed on the second substrate, comprises two parts: a first half and a second half having a supporting surface. The first half comprises a main unit and a plurality of spaced arm units disposed on the main unit, and each arm unit comprises a first part extending from the main unit and a second part extending from the first part. When the base surface of the first substrate contacts the supporting surface of the second half, at least one of the second parts of the arm units presses the first substrate on the second half, so that the first substrate is positioned by and electrically connected to the clamping device.

Abstract: An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

Abstract: A cabinet (10) for a television set or an electric apparatus includes a casing having a front wall (11) and a bottom wall (12), a key top (13), guide structures (20a, 20c, 20b) for holding a narrow first printed wiring board (30) provided with a tact switch (30a) and a wide second printed wiring board (130) provided with a tact switch (1301) at different levels, respectively. Either of the first printed wiring board (30) or the second printed wiring board (130) can be held in the casing without changing the design of the cabinet (10).

Abstract: An input/output transition board system for collecting and distributing input/output signals between a backplane board and an I/O board while allowing for additional electronic devices. The input/output transition board system includes a transition board having at least one front connector and at least one rear connector. The front connector is connectable to a corresponding rear panel connector within a backplane board. The rear connector is connectable to a corresponding front I/O connector of an I/O board. The transition board collects and passes the signals between the I/O board and the backplane board. The transition board is also preferably active with additional electronic devices connected to the transition board.

Abstract: One embodiment of a field changeable graphics system for a computing device includes a graphics card and an interface assembly. The interface assembly is adapted to interface the graphics card with the motherboard of a computing device, without directly mounting the graphics card to the motherboard. One advantage of the disclosed graphics system is that it enables a computing device user to upgrade the existing device's graphics system. Thus, the user is not forced to purchase an entirely new computing device in order to take advantage of graphics innovations. This advantage is particularly significant for users of portable computing devices, such as laptop computers and PDAs.

Abstract: A permeable conductive shield providing protection from electromagnetic interference and electrostatic discharge has a laminated structure suitable for application to the foil side or the component side of a circuit board. The laminated structure includes an array of foam spacers arranged with spaces between them, a layer of foam attached to the top of the spacers, a first insulating sheet on the layer of foam spacers; a conductive sheet on the first insulating sheet, and a second insulating sheet on the conductive sheet. Each of the layers has a multiplicity of through holes aligned with corresponding through holes in the other layers and with the spaces between the foam spacers so as to allow airflow through the structure. The layers are bonded together with intervening adhesive layers. A pressure-sensitive adhesive is applied to the bottom of the spacers for attaching the permeable conductive shield to the circuit board.