Abstract: The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiment, a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry.

Abstract: An improved printed circuit board assembly is disclosed. The printed circuit board assembly comprises a first plate, a second plate attachably coupled to the first plate, and at least one printed circuit board sandwiched between the first plate and the second plate, the at least one printed circuit board extending over the entire area of the first and second plate. By utilizing an assembly in accordance with the present invention, the available space on each of the plurality of printed circuit boards is maximized. By maximizing the available space, more electronic circuitry can be incorporated onto the board. Furthermore, the exterior spacer design together with interior spacer elements firmly secures each printed circuit board while maintaining a constant separation between each board.

Abstract: A hard disk drive assembly is electrically connected to a printed circuit board assembly motherboard using a connector on the hard disk drive assembly connected with a mating connector mounted on the motherboard. The hard disk drive assembly is secured to standoffs that allow sufficient space between the hard disk drive assembly and the motherboard for an integrated circuit package to be positioned between the hard disk drive assembly and the motherboard.

Abstract: Disclosed is a method of removably mounting a planar electrical component, such as a computer motherboard, to a chassis. The method comprises positioning a first fastener of a mounting device adjacent a mounting slot in the chassis, inserting the first fastener of the mounting device through the mounting slot in the chassis, releasing the mounting device so that the first fastener clamps onto the chassis through the mounting slot, positioning a second fastener of the mounting device adjacent a mounting hole on the planar electrical component, and inserting the second fastener of the mounting device into the mounting hole until the second fastener clamps onto the planar electrical component through the mounting hole.

Abstract: An improved securement device aligns adjacent printed circuit boards (“PCBs”) while simultaneously connecting all external hardware so as to prevent overcompression of elastomeric contacts positioned therebetween during assembly. The device supports a connector between a pair of PCBs in spaced parallel relation, wherein the connector itself supports a plurality of elastomeric contacts thereon for establishing electrical engagement between the PCBs. The PCBs and the connector each include aligned securement openings. The device includes an elongate fastener having a substantially cylindrical section positioned in the connector opening. The cylindrical section defines a pair of opposed, substantially planar spaced apart component landings for support of a similarly planar component thereupon. The landings are spaced apart a distance sufficient to place the PCBs in communication with the connector without overcompressing the elastomeric contacts therebetween.

Abstract: A spacer (100 or 600/1000A/1000B) situated between a faceplate structure (301) and a backplate structure (302) of a flat panel display is configured to be self standing. In one implementation, a pair of spacer feet (111 or 113 and 112 or 114) are located over the same face surface, or over opposite face surfaces, of a spacer wall (101) near opposite ends of the wall. An edge electrode (121 or 122) is located over an edge surface of the spacer adjacent to the faceplate structure or the backplate structure. In another implementation, a spacer clip (1000A or 1000B) clamps opposite face surfaces of a spacer wall (600) largely at one end of the wall.

Abstract: The present invention relates to a structure for fixing an element to a printed wiring board. The fixing structure includes a spacer, the printed wiring board, and a sealant. The spacer has a first end to which the element is to be fixed and a second end to be fixed to the printed wiring board. The printed wiring board has a hole having a shape determined in relation to the shape of the second end of the spacer. The sealant is filled in the hole of the printed wiring board to fix the second end of the spacer to the printed wiring board. The second end of the spacer has a projection having a length smaller than the thickness of the printed wiring board and located in the hole of the printed wiring board.

Abstract: A board mount assembly. The assembly comprises a panel, a board mount and a circuit board. The panel is generally arranged in a plane. The board mount has an attachment portion operably connected to the panel and parallel thereto, and has a support portion extending from the first portion at a non-perpendicular angle relative to the plane of the panel. The circuit board has a first standoff engaged with the board mount.

Abstract: Disclosed is a device for mounting a planar electrical component, such as a computer motherboard, to a chassis. In one embodiment, the device includes a spacer including a coiled wall configured to be positioned between the board and the chassis, and an elongated clip coupled to the spacer. The elongated clip including an upper fastener extending in a first direction from the spacer. The upper fastener is configured to removably clamp onto the board and secure the board to the spacer. The elongated clip further comprises a lower fastener extending in a second direction from the spacer. The lower fastener is configured to removably clamp onto the chassis and secure the chassis to the spacer.

Abstract: An apparatus and method, for use with a data processing system having an architecture, which provide for the possibility of smart card use without unduly impacting the data processing system's architecture. An enclosure, having at least one PC card acceptor and at least one smart card acceptor, is created. A suspension mechanism is operably connected to enclosure in a fashion such that suspension mechanism is capable of physically connecting enclosure to a motherboard such that enclosure is suspended above a component of motherboard. The method and system give rise to several advantages. One advantage is that board space is saved in that the enclosure is suspended over existing board components. A second advantage is that the method and system allow original equipment manufactures to make the provision of smart card usage optional, in that smart card usage can be provided by a simple add-on to lower-end systems.

Abstract: An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

Abstract: A circuit board standoff including a body for disposition between first and second boards so as to maintain a predetermined minimum spacing between substantially parallel facing inner surfaces thereof; the body having at one end a first abutment surface for engaging an inner surface portion of the first board and at an opposite end a second abutment surface for engaging an inner surface portion of the second board. A longitudinal axis of the body is aligned with the first abutment surface and the second abutment surface. Extending from the first abutment surface is a first latch shaped and arranged to project through an opening in the first board and into latching engagement therewith and extending from the second abutment surface is a second latch shaped and arranged to project through an opening in the second board and into latching engagement therewith.

Abstract: A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.

Abstract: An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

Abstract: A stacked memory module having alternating layers of printed circuit boards and spacers. Connections between a given circuit board surface and an adjacent (facing) stacked printed circuit board surface, are made using at least one conductive pad incorporated into the electrical circuitry printed on and within the perimeter of each of the adjacent pair of board surfaces; together with means for interconnecting these conductive pads. The spacers can, for example, take the form of standoffs, spacer boards provided with clearance cutouts for components on the printed circuit boards, etc. The printed circuit boards and spacers are then aligned and fastened together using, for example, one or more alignment rods. According to a preferred embodiment of the invention, the fastened assembly is placed in a hollow memory module housing (e.g., a metal cylinder) to complete the fabrication of the memory module.

Abstract: In order to provide an improved hybrid IC having a high density, compact in size, capable of being manufactured with a reduced cost, a hybrid IC of the present invention, comprises: a circuit board 2 having formed on the surface thereof a plurality of electrode patterns, and mounting on the same surface a plurality of electronic elements 3; a plurality of connection terminals 4 each formed into a generally rectangular frame structure including mutually facing first and second lateral plates, and mutually facing first and second longitudinal plates. In particular, one of the first and second lateral plates of each connection terminal 4 is fixedly connected to a connection electrode 2a on the circuit board 2. With the use of such structure, it is allowed to dispense with a process of solely connecting the connection terminals, thereby reducing the time and hence the cost for manufacturing a hybrid IC.

Abstract: A standoff for mounting two or more printed circuit boards to a chassis in which one keyhole cut printed circuit board may be slidably mounted on the keyhole mount of the standoff and a second printed circuit board may be mounted on the top portion of the standoff spaced away from the first printed circuit board. The second printed circuit board may be affixed to the standoff by either a screw mount, snap lock mount, adhesive, bolt and nut, clamp or other method.

Abstract: There is disclosed a fastener useful for the precise positioning of a plurality of plates in a parallel, spaced-apart array. The fastener has a cylindrical standard with distal fixed abutments and carries a plurality of spacers that are axially adjustable on the standard. At least one spacer is axially extendable, and has a user-adjustable cam to control its axial length, thereby accommodating for variable thicknesses of the intermediate plates. The fastener is disclosed as particularly useful for the precise orientation of the parallel plates of a fixture used in equipment for automated testing of printed circuit boards.

Abstract: A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the first and second set of traces when sandwiched between the first circuit board and the second circuit board in a predetermined manner; and fastened to the first and second circuit boards together with the interconnect mechanism sandwiched between such that there is electrical contact between the first and second predetermined set of conductive traces. The interconnect mechanism can be either single sided flex connector cable, double sided flex connector cable, or Cinch connectors. The fastening mechanism can be snaps fittings or screw setups without or without resilient washers.

Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.

Abstract: A mezzanine connector assembly includes connectors engageable to a mating connector assembly such as a motherboard. It includes a circuit card having a surface on which a connector is mounted as well as a mezzanine card having a surface on which another connector is mounted. A mounting member is attached for connection between the cards in order to establish relative positions of the card surfaces. The distance between the card surfaces is set at least in part by the distance between end portions of the mounting member. The distance between the card surfaces is independent of the thickness of the cards so that a variation of the thickness of the cards will not result in a variation of the distance between the card surfaces.

Abstract: The disclosed invention relates to the employment of a spacer element for mounting, aligning and spacing a computer chip relative to a PCB. The spacer element is formed and dimensioned to engage the chip in a manner to assure that the pins of the chip are properly aligned relative to openings in the PCB and to assure that the chip is centered and maintained parallel to the PCB and each of its pins maintained equal distance from the underneath side of the PCB during the wave soldering process for electrically connecting the chip and PCB.

Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board.

Abstract: A stackable data carrier arrangement including a cardshaped carrier element, at least one integrated semiconductor circuit arranged on the carrier element, at least one external terminal arranged on the carrier element and connected to the semiconductor circuit for making electrical contact therewith, the external terminal being formed so as to circumscribe an edge area of the carrier element and having a respective terminal area on the edge area and adjoining opposite main areas of the carrier element, the terminal areas being electrically connected to one another, includes means defining two slots provided in the carrier element, the slots extending parallel to one another from the edge area into the carrier element to approximately the same extent as the external terminal arranged between the slots, so that a contact tooth bendable perpendicularly to the main areas of the carrier element is formed by the region of the carrier element situated between the slots.

Abstract: IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

Abstract: A stacked memory module having alternating layers of printed circuit boards and spacers. Connections between a given circuit board surface and an adjacent (facing) stacked printed circuit board surface, are made using at least one conductive pad incorporated into the electrical circuitry printed on and within the perimeter of each of the adjacent pair of board surfaces; together with means for interconnecting these conductive pads. The spacers can, for example, take the form of standoffs, spacer boards provided with clearance cutouts for components on the printed circuit boards, etc. The printed circuit boards and spacers are then aligned and fastened together using, for example, one or more alignment rods. According to a preferred embodiment of the invention, the fastened assembly is placed in a hollow memory module housing (e.g., a metal cylinder) to complete the fabrication of the memory module.

Abstract: A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

Abstract: Two hybrid circuit components are connected to one another by a ceramic block. Electrical connections are made between the hybrid components by conductive vias through the ceramic block. The ceramic block is disposed toward an edge of the hybrid components so that integrated circuits and/or discrete electrical components may be attached to a major portion of both surfaces of each hybrid substrate. The interconnected hybrid components form a compact electrical device, for example, a hearing aid.

Abstract: An electrical connection system includes a frame, a main printed circuit "mother board", a series of secondary printed circuit "daughter boards", and interconnecting spacers formed of an insulative material plate with holes in it into each of which is inserted a buffer that is a good conductor of electricity. The frame includes a support plate with series of slides, the mother board resting on the support plate and receiving the interconnecting spacer. The daughter boards are slid into the slides and include, along an edge which cooperates with the interconnecting spacer, a heel-piece on which is mounted and to which is fixed a flexible printed circuit the tracks of which are connected to those of the daughter board and cooperate with the buffers. Arrangements are provided to fix the daughter boards to the frame.

Abstract: An electronics assembly is described which allows three-dimensional movement of a printed wiring board (PWB) relative to an attached electronics subassembly. The subassembly is attached to the PWB by a coupling device which is capable of resilient deflection responsive to mechanical agitation while maintaining effective electrical and thermal communication between the subassembly and the PWB. The coupling device includes contact surfaces which enhance the reliability of the overall electronics assembly by minimizing the potential for detachment of the subassembly from the PWB.

Abstract: A standoff connector for fastening two plates in spaced relation, including a body and a stud for insertion into the body. The body has a base and a trunk projecting upward from the base, and also has a central opening for receiving the stud, with a sleeve carried in the central opening with a plurality of spaced resilient fingers having upper ends fixed in the trunk and lower ends spaced from the trunk for outward radial movement, the lower ends of the fingers having inwardly directed tips for gripping the stud. The stud has a shaft for positioning in the body opening and a handle at one end for rotating the stud, with a shaft having a major diameter adjacent the other end and a minor diameter between the major diameter and the handle for receiving the tips of the body sleeve, with the body and stud having interengaging elements for limiting rotation of the stud in the body.

Abstract: Disclosed is a backplane assembly that includes stiffeners to provide both mechanical stiffening and electrical power distribution. In particular, the present invention provides a power distribution system that comprises a backplane, a power stiffener having alternate layers of dielectrics and conductors proximately located to the backplane, and removable connection to electrically connect the conductors in the stiffener to the backplane. Because power can be transferred directly to the backplane from the stiffener via the connection, the need for power cables and bus bars on the backplane is eliminated. In addition, noise suppressing capacitors may be located on the power stiffener, close to the load source.

Abstract: A control circuit arrangement for an electric motor drive unit includes a circuit board (10), a heat conductive substrate (12) carrying power semiconductors (13), a heat absorbing mounting structure (14) disposed in heat transferring contact with the heat conductive substrate (12), and a clamping structure (20) for clamping the circuit board (10) and the heat conductive substrate (12) to the mounting structure (14). A number of electrically conductive distance or spacer tube elements (22) are disposed between the circuit board (10) and the heat conductive substrate (12) for distributing the clamping force of the clamping structure (20) from the circuit board (10) to the heat conductive substrate (12) while forming electrically conductive leads between the circuit board (10) and the heat conductive substrate (12).

Abstract: A sensor unit for controlling an occupant protection system has a sensor which is held in its position on a printed circuit board through the use of an elastic damping holder. The damping holder is soldered onto the printed circuit board together with the sensor. In addition, the damping holder protects the sensor during the production and mounting of the sensor unit.

Abstract: An electronic circuit board enclosure comprised of a planar member having dimensions at least equal to dimensions of the circuit board, first pillars fixed to at least one side of the planar member and extending orthogonally to the planar member above the planar member, apparatus for aligning and fixing bottoms of second pillars of another circuit board enclosure to tops of the first pillars, apparatus for fastening a first circuit board to and above the planar member, and locating apparatus for precisely locating the fastening position of the circuit board to the planar member relative to the first pillars, whereby the position of the first circuit board can be located precisely relative to another circuit board fastened to another circuit board enclosure.

Abstract: A circuit board locating device for fastening a circuit board to a frame, having two pairs of symmetrical flat legs at four sides inserted through a cross slot in a frame, a screw hole at the top connected to a circuit board by a screw, four pairs of side boards respectively raised from two opposite lateral sides of each leg and stopped at the top side of the frame, four horizontal bottom plates respectively outwardly extend from the legs at the bottom and stopped at the bottom side of the frame, and two inward projecting portions respectively raised from two opposite legs and stopped against the periphery of the screw to hold it in the screw hole.

Abstract: An apparatus for containing and supporting electronic components includes a first housing portion having a first support, and a second housing portion having a second support. The apparatus further includes an elastomeric isolating member being secured between the first support and the second support so as to position the isolating member within the apparatus. Moreover, the apparatus further includes a base upon which electronic components are mounted, the base being attached to the elastomeric isolating member.

Abstract: Rigid flex printed circuit boards are formed with great efficiency and high yield in an assembly process wherein each circuit layer is punched in peripheral regions with alignment slots along two orthogonal radii and all layers are assembled without any acrylic bonding in a single hot press operation. A central flex layer spans a window defined in the rigid boards, and is covered with an insulating layer that overshoots the window and underlaps a rigid layer. At least the first rigid layer extends inwardly past the edge of the window, and provides a cantilevered edge support ribbon at the flex region boundary. Preferably the rigid and flex layers are all formed with a glass/epoxy material.

Abstract: A power semiconductor device having power chips mounted on a metal insulating substrate and terminal plates corresponding to inner connection wiring for a main circuit of the device. Electronic parts forming a control circuit are mounted on a second substrate disposed over the first substrate and supported by the terminal plates. Additionally, it is preferable to use a copper plate as wiring material for the main circuit.

Abstract: A printed circuit board modular assembly is disclosed. The disclosed invention comprises a first printed circuit board having an electronic terminal portion for providing electrical connection to the first printed circuit board; a second printed circuit board having an electrical terminal portion for providing electrical connection to the second printed circuit board; a spacing member disposed between the first and second printed circuit boards; and electrical signal transmission contacts situated on the spacing member for providing electrical connection between the first printed circuit board and the second printed circuit board.

Abstract: Interior circuit card supports and a method that facilitate fast and simple Assembly and disassembly of the circuit cards, and provide both interior and peripheral card support, are disclosed. A plurality of circuit cards 32a-32n, each having at least one interior hole 36, are positioned substantially parallel to each other with the holes of the various cards collinear. A plurality of grommets 38 are secured in the holes, with each grommet providing a first coupling. A rod 42 having a plurality of second couplings 44 is inserted through the grommets such that the second couplings mate with the grommets' first couplings to provide an interior support that maintains the spacing between the circuit cards. In the preferred embodiment the grommets are internally threaded with a groove that extends their entire length, and the rod has deformable inserts that form an interference fit with the grommets' threads. The rod is inserted and then rotated, causing the inserts to deform and grip the threads.

Abstract: A fastener for securing a printed circuit board to a chassis includes a body portion, legs depending from the body portion, the legs being adapted for removable attachment within holes in the chassis, a hook for slidably engaging a slot on a printed circuit board inserted thereon, and a grounding element for providing an electrical connection between the printed circuit board and a shield on the chassis. The fastener described herein enables one chassis design to accommodate a variety of sizes of printed circuit boards merely by forming holes at particular points on the chassis, thereby avoiding the expense of redesigning a chassis to accommodate a new printed circuit board.

Abstract: A large-current circuit board having a plurality of fasteners positioned and secured beforehand to the circuit board, and a plurality of busbars for electrically connecting the plurality of fasteners. Each of the plurality of busbars has a strip-like planar plate shape. Various ones of the plurality of fasteners may have the same or different distances from the surface of the circuit board. Specifically, the portions of the fasteners that are connected with the busbars may be at different heights so that plural busbars connecting the fasteners can cross each other at plural levels. A variety of fasteners and busbar securing boards may be used for electrically connectibly holding and securing the plurality of busbars with the plurality of fasteners on the circuit board.

Abstract: An extensible bus assembly provides very short, uniform stub lengths from a bus transceiver to the bus assembly. The extensible bus assembly includes a bus termination cap, a plurality of extenders and an anchor. Each bus assembly element is L-shaped so that the bus transceiver, or some similar bus driver, may be positioned in close proximity to the bus assembly by placing the bus transceiver in the "corner" of the L; this ensures short, uniform stub lengths. Conductive surfaces are vertically positioned within the termination cap and plurality of extenders. The conductive surfaces may be compliant pins and/or spring-loaded wire conductors.

Abstract: A semiconductor integrated circuit of the laminated type having a large circuit capacity includes an upper silicon tip and a lower silicon tip as essential components and a layer of electrical insulative material is interposed between the upper silicon tip and the lower silicon tip both of which are electrically connected to each other via a number of lead wires extending therebetween. An assembly of the upper silicon tip, the electrical insulative material layer and the lower silicon tip is fixedly mounted on a base board, and the foregoing assembly is then covered with a cap.