Abstract: A permeable conductive shield providing protection from electromagnetic interference and electrostatic discharge has a laminated structure suitable for application to the foil side or the component side of a circuit board. The laminated structure includes an array of foam spacers arranged with spaces between them, a layer of foam attached to the top of the spacers, a first insulating sheet on the layer of foam spacers; a conductive sheet on the first insulating sheet, and a second insulating sheet on the conductive sheet. Each of the layers has a multiplicity of through holes aligned with corresponding through holes in the other layers and with the spaces between the foam spacers so as to allow airflow through the structure. The layers are bonded together with intervening adhesive layers. A pressure-sensitive adhesive is applied to the bottom of the spacers for attaching the permeable conductive shield to the circuit board.

Abstract: A system for providing dual 10 GB uplinks in the front side of a single rack unit switch that stacks two MSA X2 I/O devices in a limited space. In one embodiment the two X2 I/O devices are mounted on opposite sides of a single circuit board positioned above the motherboard.

Abstract: Mounting structures for facilitating fast and easy installation and/or removal of electronics components into or out of a computer system are disclosed. The mounting structures include a base and a stackable mounting structure. Each mounting structure generally includes generally parallel and opposing spacers, tapered supports extending from the spacers to engage holes defined on a surface of an electronics component, and a base portion extending between being generally orthogonal to the spacers. The spacers may define orifices to facilitate securing the mounting structure and the electronics component to an electronics base via, e.g., a hook and loop material. The stackable mounting structure may include sharp points and angled legs to also engage the electronics component below.

Abstract: An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remove the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.

Abstract: A circuit board holder includes a base portion, and a mounting portion coupled to the base portion. The mounting portion is configured to actuate with a first circuit board when the circuit board holder attaches to the first circuit board. The circuit board holder further includes a capturing portion coupled to the base portion. The capturing portion is configured to capture an edge of a second circuit board when the circuit board holder attaches to the first circuit board and when the second circuit board electrically connects with the first circuit board. Such a holder alleviates the need to consume a large amount of circuit board space on the second circuit board. Furthermore, the use of such a circuit board holder enables the first and second circuit boards to maintain reliable electrical connectivity even when exposed to heavy shock or vibration.

Abstract: A composite flexible wiring board comprises a first flexible wiring board and a second flexible wiring board on which a surface-mounted part is provided. The second flexible wiring board is disposed on the first flexible wiring board in its predetermined area. The first flexible wiring board and the second flexible wiring board are electrically connected to each other through an interlayer contact portion provided in a predetermined position. The first flexible wiring board has an input terminal region and an output terminal region with a power IC chip mounted on the first flexible wiring board.

Abstract: An electronic apparatus includes a first assembly and a second assembly. Each assembly has a circuit board defining a front side and a back side, a set of connectors mounted to the front side of that circuit board, and a heat sink disposed over the front side of that circuit board. The heat sink is configured to provide cooling to that assembly. The electronic apparatus further includes a coupling mechanism that couples the first and second assemblies together in a substantially parallel manner. The sets of connectors of the assemblies form a connection interface to concurrently connect the first and second assemblies to a backplane.

Abstract: A circuit board assembly includes a circuit board which defines circuit board pads, a set of surface mount electronic components soldered to a first set of the circuit board pads using a surface mount soldering process, and a set of surface mount coupling devices soldered to a second set of the circuit board pads using the surface mount soldering process. Each surface mount coupling device is configured to couple at least a portion of an object to the circuit board. Each surface mount coupling device includes a set of surface mount pads connected to the second set of the circuit board pads by solder joints resulting from the surface mount soldering process, a set of legs extending from the set of surface mount pads, and a body portion connected to the set of legs, the body portion providing a fixed structure relative to the circuit board for securing the object.

Abstract: A circuit component has an elastically deformable first structure, a second structure, and a support structure coupling the first and second structures, wherein the support structure acts a fulcrum about which the first structure can be variably deformed in response to a variable force, to provide either a variable capacitor or a variable tank circuit having a variable capacitor and an inductor. In one particular embodiment, the circuit component includes a zipper actuator for elastically deforming the first structure. A method of making a circuit component includes forming an elastically deformable first structure, forming a second structure, and forming a support structure coupling the first and second structures, to provide either a variable capacitor or a variable tank circuit having a variable capacitor and an inductor. In one particular embodiment, the method includes forming a zipper actuator for elastically deforming the first structure.

Abstract: A resilient element includes interconnected lower and upper parts. The lower part includes a planar bottom segment having front and rear ends, a first curved segment that curves upwardly and rearwardly from the front end of the planar bottom segment, and a second curved segment that curves upwardly and forwardly from the rear end of the planar bottom segment. The upper part includes a planar top portion having front and rear ends, a first curved portion that curves downwardly and rearwardly from the front end of the planar top portion, and a second curved portion that curves downwardly and forwardly from the rear end of the planar top portion. The first curved segment and the second curved portion have interconnected distal ends.

Abstract: A guidance electronics unit is provided for an explosively-launched vehicle, e.g., a projectile or missile, comprising a plurality of circuit card assemblies, each circuit card assembly containing a plurality of electronic components and interconnections, each circuit card assembly maintained in a housing and spaced apart. All spaces surrounding each circuit card assembly are filled with a granular material to provide support for each circuit card assembly during explosive launch. Further, a method for supporting circuit card assemblies in the guidance electronics unit is provided. The problem of enabling guidance electronics to survive the large loads encountered during an explosive launch out of a gun, such as a howitzer, or missile launch tube is thereby solved.

Abstract: A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.

Abstract: An electronics chassis box includes a pair of opposing sidewalls, a pair of opposing end walls, a bottom surface, a top cover, and ring connectors assemblies mounted in selective ones of the walls of the electronic box. Boss members extend from the bottom surface at different heights upon which circuit cards are mounted in spatial relationship to each other. A flex interconnect substantially reduces and generally eliminates the need of a motherboard by interconnecting the circuit cards to one another and to external connectors mounted within the ring connector assemblies.

Abstract: A resilient contact element includes a unitary conductive contact strip that has a strip axis and that is configured with a mounting section, a curved section, a resilient section and a contact section. The mounting section is to be disposed on a mounting plane, and has opposite front and rear end portions along the strip axis. The curved section includes a first curved segment that curves rearwardly from the rear end portion away from the mounting plane, and a second curved segment that curves rearwardly from the first curved segment toward the mounting plane. The resilient section curves forwardly from the second curved segment away from the mounting plane, and has a first end connected to the second curved segment, and an opposite second end. The contact section extends forwardly from the second end of the resilient section, and is generally parallel to the mounting section.

Abstract: A connector for attaching a printed circuit board to other apparatus is formed as a separate connector body with a plurality of pins projecting from one end surface that are attached to the printed circuit board by being secured in vias through the board and a threaded opening at the end surface opposite the one end surface from which the pins project. When a bolt is received in the connector threaded opening and drawn tight to secure the printed circuit board to other apparatus, the stresses and material deformation induced by the securing bolt are isolated from the printed circuit board. Further, the attachment of the pins to the printed circuit board rather than the use of screws extending through holes in the circuit board reduces the size of ‘keep out’ zones that must be avoided by the wiring paths on each wiring surface of the printed circuit board through which mounting holes extend.

Abstract: A circuit board clip apparatus having a base wherein the base includes a first end and a second. The clip apparatus also includes a bore that extends between the first and second ends of the base. The clip apparatus additionally includes a first leg coupled to the base. The first leg extends along the base and has an indent wherein the indent comprises a first finger portion and a second finger portion.

Abstract: A circuit board support assembly includes a frame, an electronic component and a circuit board. The circuit board and the electronic component are each coupled to the frame along a common axis.

Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.

Abstract: An adjustable circuit sled module for a mass storage device has a housing, a mass storage device, a circuit board, a cover and spacers. The spacers position the mass storage device to align the power and data interface ports of the mass storage device with corresponding power and data interface connectors of the circuit board. The resulting sled module can be adjusted to accommodate a variety of brands and sizes of mass storage devices.

Abstract: A transmitter includes an RF board having a circuit for processing high frequency signals, an IF board having a circuit for processing intermediate frequency signals, a shield plate formed of a conductive material arranged between the boards for shielding electromagnetic waves generated from the circuits, a board-to-board connecting wire inserted to a through hole based by a gap sufficient to avoid electric influence from an inner wall surface of the through hole provided in the shield plate, to be connected to through hole lands provided on the RF board and a IF board, respectively, and connectors formed of an insulating material and attached near opposite ends of the board-to-board connecting wire and sandwiching the shield plate, for fixing the board-to-board connecting wire to the shield plate. This provides a wiring connection structure that facilitates connection between circuit boards with each other and stably realizes normal signal transmission.

Abstract: A mounting structure of a ball grid array type IC includes resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC, engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board, springs in which the guide ribs are inserted respectively, and height adjusting ribs provided at places slightly inwardly distant from the guide ribs respectively so as to protrude from the body portion. The springs prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board. The height adjusting ribs adjust the ball grid array type IC to a predetermined height relative to the board.

Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

Abstract: A fastening assembly, used for fixedly fastening a first and a second structure (1100, 1200) of a device together, comprises an anchoring block (1500), an insert plate (1400), and a screw (1300). The first structure is provided with a hole (1110). The anchoring block, fixedly arranged on the second structure, includes two parallel holding flanges (1510, 1512) and two parallel protruding ribs (1520), wherein the holding flange (1510) further includes a slot (15101). The protruding ribs extend approximately perpendicular to the two holding flanges on two sides thereof. The insert plate is held between the holding flanges, and is provided with a threaded hole (1410) and a pair of hooked clamping members (1420) that respectively tightly clamp the protruding ribs. The screw extends through the hole of the first structure and engages in the threaded hole of the insert plate to fixedly fasten the first and second structures of the device together.

Abstract: A mounting apparatus includes a plurality of standoffs (1) bent from a bottom plate (10) a computer enclosure (5). Each standoff includes a support body (12) bent perpendicularly from the bottom plate, and a mounting body (14) bent perpendicularly from a distal end of the support body. A rib (122) is formed by stamping the support body at a bottom portion thereof adjacent the bottom plate. The rib has a generally triangular pyramidal configuration. The mounting body includes a connection (16) bent perpendicularly from a distal end of the support body, a bent position (18) bent upwardly from a distal end of the connection portion, and fixing portion (20) bent horizontally from a distal end of the bent portion away from the connection portion. A mounting hole (22) is defined in the fixing portion. A circuit board (2) is fixed to the standoffs with screws.

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

Abstract: A printed circuit board unit has smaller number of pins in connectors for connection of wiring (signal lines and power source lines) between a plurality of printed circuit boards for increasing mounting space of the board and interconnection method of wiring between printed circuit boards. The printed circuit board unit includes a plurality of printed circuit boards having wiring formed thereon, a part of the wiring on the printed circuit boards electrically connected through connectors, a screw formed of electrically conductive body and fixing the plurality of printed circuit boards with preventing the connectors from disengaging from each other, and remaining part of the wiring on the printed circuit boards electrically connected through the screw.

Abstract: A connector for joining items such as electronic circuit boards in a spaced relation within a housing of an electronic device includes an elongated post, a plurality of wings, and a raised surface or a plurality of fingers. The wings are arranged around the post in a substantially symmetrical manner and have a length that is shorter than the length of the post. The raised surface or fingers are mounted near the tips of the post, between the wings and the ends of the post. The raised surface or fingers engage the circuit board and/or the housing when inserted into openings or receptacles in the circuit board and housing.

Abstract: A circuit board mount is provided for mounting a circuit board in an electronic equipment housing. The mount is mountable on a surface within the housing and includes a slot for receiving and supporting the circuit board at a first height with respect to the housing surface. The mount further comprises at least one upstand of a second height higher than that of the circuit board, whereby a component can be supported on the upstand without contacting the circuit board. The mount is thus able to support the circuit board and to protect the circuit board during handling of other components within the housing.

Abstract: A method and apparatus to support varying sizes of memory cards against shock and vibration. One embodiment of the invention involves a method to assemble a support clip to one or more cards attached on a substrate by a connector. A second embodiment of the invention involves a method to fabricate a support clip. A third embodiment of the invention involves an assembled substrate with a plurality of cards secured by one or more support clips to the substrate.

Abstract: A memory module having series-connected printed circuit boards is provided. The memory module comprises a plurality of printed circuit boards, each comprising a plurality of memory chips mounted thereon, and signal lines and connection means for electrically connecting the printed circuit boards to one another. The connection means electrically series-connects the signal lines of each of the printed circuit boards. Preferably, an end termination circuit is formed on a terminal of the signal line of the farthest printed circuit board from a connector of a mother board, and the memory chip performs at a speed of approximately 150˜300 MHz. The connection means is a flexible jumper assembly having a flexible film and a jumper line formed on the flexible film. Each of the printed circuit boards further comprises a jumper pad connected with the signal lines. The flexible jumper assembly interconnects the jumper pads of each of the printed circuit boards to one another.

Abstract: A circuit package with improved heat dissipation properties for high-power circuits. In one embodiment, the circuit package comprises two circuit boards positioned in different planes, at least one brace affixed between the two circuit boards, a molded housing enclosing an area between the circuit boards, and a plurality of electrically conductive leads extending from the sides of the circuit package. The molded housing is configured to expose at least one surface of the circuit boards to the exterior surface of the circuit package. The leads are configured in a J-shape, which allows the circuit package to be mounted in an upright position. The brace functions as a flexible spacer for holding the two circuit boards in position during the application of the molded housing. In one embodiment, a H-bridge circuit is configured on the first and second circuit boards of the circuit package.

Abstract: A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.

Abstract: A connector for joining items such as electronic circuit boards in a spaced relation within a housing of an electronic device includes an elongated post, a plurality of wings, and a raised surface or a plurality of fingers. The wings are arranged around the post in a substantially symmetrical manner and have a length that is shorter than the length of the post. The raised surface or fingers are mounted near the tips of the post, between the wings and the ends of the post. The raised surface or fingers engage the circuit board and/or the housing when inserted into openings or receptacles in the circuit board and housing.

Abstract: An spacer assembly for spacing a circuit board from a chassis includes a plug that is adapted to extend through a mounting aperture in the chassis and a cap that is adapted to receive the plug in locking engagement for sandwiching the chassis therebetween. The cap has an upper wall that supports the circuit board and a skirt that extends from the upper wall to form a hollow interior that is sized to receive the plug. First cooperating structure on the plug and cap hold the plug within the hollow interior of the cap, while second cooperating structure on the plug and cap hold the chassis therebetween.

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.

Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

Abstract: Disclosed is a method of removably mounting a planar electrical component, such as a computer motherboard, to a chassis. The method comprises positioning a first fastener of a mounting device adjacent a mounting slot in the chassis, inserting the first fastener of the mounting device through the mounting slot in the chassis, releasing the mounting device so that the first fastener clamps onto the chassis through the mounting slot, positioning a second fastener of the mounting device adjacent a mounting hole on the planar electrical component, and inserting the second fastener of the mounting device into the mounting hole until the second fastener clamps onto the planar electrical component through the mounting hole.

Abstract: An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.

Abstract: An electrical connector is shown for stacking a plurality of printed circuit boards one above the other, where some of the terminals extending from the lower portion of the housing include both printed circuit board contacts as well as mating contacts for the next adjacent connector. The connector housing includes integral stand-offs for maintaining the parallel nature of the stacked boards, as well as a precise spacing between the boards. The connector housings can include stand-off members which are frangible and can be used to maintain the parallel nature of the boards when other connector housings of a similar height are not used.

Abstract: An adjustable height spacer for providing rigid support and insulation between the bus bars of an electrical panel. The spacer is adjustable in height to provide various distances between the bus bars. The spacer includes a pair of body members that are axially aligned. A repeating series of teeth of various heights is defined around the margin of each body member at one end. The teeth are configured such that when the toothed ends of two body members having identical tooth patterns are mated, the teeth operatively engage each other to provide a secure coupling when the body member is placed under a compressive force. The height of the body member is varied by rotating one body member with respect to the cooperating body member such that a selected set of teeth within the series is engaged.

Abstract: Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first solder bumps between the first and second microelectronic substrates, adjacent an edge of the second microelectronic substrate, that connect the second microelectronic substrate to the first microelectronic substrate and that are confined to within the edge of the second microelectronic substrate. The edge of the second microelectronic substrate is adjacent the vertex of the acute angle. A third microelectronic substrate also may be provided on the first microelectronic substrate that laterally overlaps the second microelectronic substrate. Second solder bumps connect the third microelectronic substrate to the first microelectronic substrate. The second and third microelectronic substrates may be oriented parallel to one another at the acute angle relative to the first microelectronic substrate.

Abstract: A buffering and supporting device for a circuit board is provided. The device includes a lower flexible supporter and an upper buckle head. The upper buckle head engages a hole of the circuit board, and is formed with a plurality of forked elastic wings for abutting against a surface of the circuit board. The flexible supporter has a plate and at least one flexible support portion that is formed, alternatively, by a single integrally formed flexible supporter or a pair of cambered or straight flexible supporting pieces. The upper end of each flexible supporting piece is connected to the bottom of the plate. Where the flexible support portion is formed by a pair of flexible supporting pieces, each flexible supporting piece is connected to a bottom plate. The buffering end supporting device guards the circuit board against ill effects when subjected to vibration, shock, or other vertical source of vertical force.

Abstract: Apparatus for mounting a circuit board within the chassis of an electronic device are disclosed. The chassis of an electronic device includes a mounting panel assembly having at least one slot for receiving a standoff mounted to the circuit board. Each slot includes a first end suitable for allowing insertion and removal of the standoff through the slot and a second end suitable for engaging the standoff to retain the standoff in the slot for securing the circuit board to the mounting panel assembly. A ramp member extends beneath the slot adjacent to the first end for urging the standoff toward the second end when the standoff is inserted in the slot through the first end.

Abstract: An EMI shield device is used for shielding electronic components on a printed circuit board (PCB) (13) of a mobile phone (1). The shield device comprises an upper cover (11), a lower cover (14), an EMI shield (12) and a fastening portion (2) releasably securing the shield onto the upper cover. The shield has a top wall (121) and side flanges (122) downwardly depending from edges of the top wall for shielding the electronic components on the PCB. The fastening portion includes a plurality of internal latches (21) downwardly depending from a lower surface (113) of the upper cover, and a plurality of holes (22) defined in the shield to engage with the latches. The upper and lower covers are attached together to enclose the shield and the PCB in a space therebetween. An alternative fastening portion comprises use of screws and an upper cover with internally threaded posts downwardly depending from the lower surface of the upper cover.

Abstract: When a sub board is detached from a main board, a movable part is slid toward the main board. At this time, a wedge part of the movable part intrudes between a main part and an engagement part to cause elastic deformation to an extending part of the engagement part, thereby releasing engagement between the engagement part and an engagement receiving part. Even if an operator removes his/her hands from the movable part, the movable part is not displaced away from the main board, and the state in which the engagement part is disengaged from the engagement receiving part is thus maintained. Consequently, after sliding the movable part to release the engagement between the engagement part and the engagement receiving part, the operator can proceed to the next operation of pulling out the sub board.

Abstract: In order to secure a circuit board or the like in a housing, the board is provided with a through-hole, and the housing is provided with a mounting stud that protrudes into the housing from an outer wall thereof. A securing pin simultaneously passes through the through-hole of the board and into a hollow space or bore of the mounting stud. The securing pin is preferably conically tapered so that it exerts a wedging and spreading force radially outwardly against the inner surface of the hollow bore of the securing stud, and directly or indirectly against the inner surface of the through-hole of the board. Thereby, the board is securely fastened to the stud, and the pin is secured in the stud, by the wedging effect. An end portion of the stud may also be received in the through-hole of the board, and the pin may be integrally formed as a protrusion of a lid for the housing.

Abstract: An enclosure arrangement includes a chassis, and a central electronics complex. The central electronics complex has a cage removably positioned within the chassis. The cage has an open top providing access into the interior of the cage. The central electronics complex also includes a backplane arranged in a horizontal position, and forming a floor of the cage. The backplane has at least one card slot on a surface thereof. The central electronics complex further includes at least one circuit board disposed in the interior of the cage and being removably received by the card slot. The circuit board is arranged in a vertical position so that a gravitational force helps retain the circuit board in the card slot. The cage is removably positioned within the chassis. At least one rail connects the cage to the chassis. The cage is disposed on the rail, and is guidable into the chassis using the rail.

Abstract: A mounting device for supporting a printed circuit board on a carrier includes a spacing element attached onto the carrier and an electrically conducting mounting element coupled to the spacing element for forming a mechanical and electrically conducting connection between the printed circuit board and the carrier. The spacing element has a sleeve-type spacing section and a mounting section attached to the spacing sections. Preferably, the section is formed by elastic, finger-type or wing-type mounting sections that are provided for engagement in corresponding recesses of the carrier. The mounting element is preferably a screw that is screwed into the carrier when tightened.