Shielding Patents (Class 361/816)
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Patent number: 8749991Abstract: An audio amplifier assembly connected to an automotive vehicle media system by a wiring harness is provided. The audio amplifier assembly includes an amplifier having a chassis, an electronic module attached to the chassis, and a cover attached to the chassis to cover the electronic module. A bracket having a base portion composed of a non-conductive material and a grounding portion composed of a conductive material. The base portion being attached to the amplifier at a first end and attached to the automotive vehicle at a second end to mount the amplifier to the automotive vehicle. The grounding portion extends between the first end and the second end to provide an electrically conductive grounding path between the amplifier and the automotive vehicle.Type: GrantFiled: May 10, 2010Date of Patent: June 10, 2014Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Eric John Zielinski, Erik Benavides
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Patent number: 8748754Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.Type: GrantFiled: November 22, 2011Date of Patent: June 10, 2014Assignee: General Electric CompanyInventors: Christopher James Kapusta, Donald Paul Cunningham
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Patent number: 8743536Abstract: Embodiments disclose a conversion sleeve for connecting smaller form factor drives to a receptacle of a larger form factor drive. The conversion sleeve has an outer frame shaped to fit within the receptacle of the larger form factor drive. Within the conversion sleeve is at least one channel for receiving a smaller form factor drive. The smaller form factor drive is hot swappable. On a side of the conversion sleeve, a spring-locking mechanism is design to lock into an existing aperture of the receptacle. The conversion sleeve also includes an interposer to bring the smaller form factor drive to the receiving end of the conversion sleeve for easy access.Type: GrantFiled: May 24, 2011Date of Patent: June 3, 2014Assignee: International Business Machines CorporationInventors: Roland Kamakau Alo, William Beauchamp, Timothy Andreas Meserth, Walter Adrian Goodman
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Publication number: 20140146510Abstract: Systems and methods for providing security for authentication devices—such as electronically readable cards or ID badges with embedded RFID chips or NFC capability—may include an envelope or pocket-like case for carrying an electronically readable card, having an electrically conductive, non-opaque sleeve that can be moved to cover or expose the electronically readable card and that prevents information on the card from being electronically read when covered yet still allows the card to be seen when covered. In one or more embodiments, the sleeve may be a wire mesh that is flexible enough to be compressed to expose the card yet stiff (or rigid) enough to be extended to cover the card and that is transparent enough to allow reading visual information on the surface of the card when covering the card. Protection can be switched off by a mechanical switch that leaves the protection normally on.Type: ApplicationFiled: November 29, 2012Publication date: May 29, 2014Applicant: eBay Inc.Inventor: Matthew Wilczynski
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Publication number: 20140146511Abstract: An optronic porthole comprises a substrate with two faces. It comprises on one of the faces of the substrate or on both faces, a stack of several hetero-structures, each hetero-structure being composed of at least two semi-conducting layers SC1, SC2, the layer SC1 being doped, the layer SC2 itself comprising a two-dimensional electron gas layer formed at the interface with the layer SC1. It furthermore comprises an electrode in contact with all the electron gas layers, a bi-periodic metallic grid buried in the stack, in contact with the electrode. The substrate and the layers are transparent in the 0.4 ?m-5 ?m band.Type: ApplicationFiled: November 15, 2011Publication date: May 29, 2014Applicant: THALESInventors: Romain Czarny, Jean-Luc Reverchon, Michel Pate, Brigitte Loiseaux, Gérard Berginc
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Patent number: 8736107Abstract: Disclosed are various embodiments of power source redundancy in a power supply for a rack mounted computing device. The power supply includes a plurality of AC power converters configured to receive power from corresponding power sources. A first AC power converter provides DC power to a common DC bus of the power supply. A second AC power converter provides DC power to the common DC bus in response to a change in the voltage level provided by the first AC power converter.Type: GrantFiled: December 28, 2010Date of Patent: May 27, 2014Assignee: Amazon Technologies, Inc.Inventors: Darin Lee Frink, Peter G. Ross
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Patent number: 8736033Abstract: An embedded-electronic-device package includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer, a shielding-metal layer and conductive vias. The core layer includes a first surface, a second surface opposite to the second surface and a cavity penetrating the core layer. The electronic device is disposed in the cavity including an inner surface. The first dielectric layer disposed on the first surface is filled in part of the cavity and covers part of the electronic device. The second dielectric layer disposed on the second surface is filled in rest of the cavity, covers rest of the electronic device. The first and second dielectric layers cover the electronic device. The shielding-metal layer covers the inner surface. The conductive vias are respectively disposed in the first and second dielectric layers and extended respectively from outer surfaces of the first and second dielectric layers to the shielding-metal layer.Type: GrantFiled: March 13, 2013Date of Patent: May 27, 2014Assignee: Unimicron Technology Corp.Inventors: Yu-Chen Chuo, Wei-Ming Cheng
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Patent number: 8724334Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.Type: GrantFiled: July 12, 2012Date of Patent: May 13, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Hiroshi Nishikawa, Makoto Fujita, Fumikiyo Kawahara
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Patent number: 8724342Abstract: A cover shield for a circuit board having a body. A peripheral wall is disposed about an edge of the body. First and second slots each include a first portion that extends through the body and a second portion that extends through the peripheral wall. A barbed tab is disposed between the first and second slots. A notch extends through a portion of the barbed tab. A distinct abutting member is disposed on the peripheral wall.Type: GrantFiled: March 21, 2012Date of Patent: May 13, 2014Assignee: Gentex CorporationInventor: Lucas G. Schrab
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Patent number: 8724335Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.Type: GrantFiled: May 24, 2012Date of Patent: May 13, 2014Assignee: Delphi Technologies, Inc.Inventors: Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Allen E. Oberlin
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Patent number: 8717778Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.Type: GrantFiled: May 1, 2012Date of Patent: May 6, 2014Assignee: Fujitsu LimitedInventors: Tadanori Tachikawa, Masuo Ohnishi
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Patent number: 8711574Abstract: According to one embodiment, an electronic device includes a printed circuit board includes a plurality of circuit parts, a conductive shield case provided on the printed circuit board, a tuner provided on the printed circuit board and inside the shield case, a first ground portion provided on the printed circuit board and outside the shield case and a second ground portion provided on the printed circuit board and inside the shield case. The first ground portion is electrically connected to the second ground portion via the shield case.Type: GrantFiled: February 22, 2012Date of Patent: April 29, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Masahiro Kobayashi, Noriaki Sakamoto
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Publication number: 20140104807Abstract: A very small form factor consumer electronic product includes at least a single piece housing having an integral front and side walls that cooperate to form a cavity in cooperation with a front opening where an edge of the side walls define a rear opening and at least some of the edges have flanges. The consumer electronic product also includes an user input assembly having a size and shape in accordance with the front opening and a clip assembly having a size and shape in accordance with the rear opening and having an external user actionable clip, a plurality of internal hooking features, and a plurality of internal latching features. The clip assembly is secured by engaging at least some of the hooking features and the flanges on the edges of the housing and engaging the latching features and corresponding attachment features on the internal support plate.Type: ApplicationFiled: December 20, 2013Publication date: April 17, 2014Applicant: Apple Inc.Inventors: Teodor DABOV, Kyle YEATES, Anthony MONTEVIRGEN
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Patent number: 8699235Abstract: The Mobile Phone/PDA Security Masking Box is a sound insulated box for use as a temporary storage location for cellular and other mobile devices in locations at which confidential and sensitive conversations and discussions are being conducted. A pink/white noise generating device within the box generates a masking noise such that the cellular or other mobile devices inside the box are unable to pick up or record conversations outside the box.Type: GrantFiled: February 11, 2011Date of Patent: April 15, 2014Assignee: CDD Ventures LLCInventor: Ali H Soufan
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Patent number: 8694102Abstract: A radiation protected active implantable medical device includes an ionizing radiation shield disposed over at least one major surface of an electronics package, a microprocessor, or both contained within an AIMD housing. The ionizing radiation shield is made from a high atomic number, high atomic weight, high density material such as led, gold, platinum, iridium, tungsten or tantalum and has an atomic weight of at least 180 and a density of at least 11 grams per cubic centimeter. The ionizing radiation shield has a thickness of at least 0.25 millimeters and is preferably no thicker than 1.05 millimeters and has an overall attenuation of ionizing radiation of at least 0.5 HVL.Type: GrantFiled: February 7, 2012Date of Patent: April 8, 2014Assignee: Greatbatch Ltd.Inventors: Ryan A. Stevenson, Robert A. Stevenson
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Patent number: 8692133Abstract: Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.Type: GrantFiled: March 9, 2010Date of Patent: April 8, 2014Assignee: Samsung Electronics Co., Ltd.Inventor: Yeoung-Jun Cho
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Publication number: 20140092543Abstract: A metal baseboard with a planar shape which is placed close to a Near Field Communication (NFC) radio antenna may be configured with a number of slots in the metal. These slots may disrupt the eddy current that would otherwise be induced in the metal by magnetic emissions emanating from the NFC antenna. The reduction in eddy current that results from these slots may reduce the severe attenuation of the signal that would otherwise be caused by the metal. In general, each slot may run approximately perpendicular to the direction of the expected eddy current. This may be approximated by having many of the slots each run perpendicular to the nearest part of the antenna wiring.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Inventors: Songnan Yang, Hong Wong, Ulun Karacaoglu, Bin Xiao, Changsong Sheng
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Patent number: 8674231Abstract: Provided is an endoscope in which the work of connecting cables to a circuit board in the distal end of an insertion part can be easily performed. When a bundle-wire cable obtained by bundling a plurality of single-wire cables and a plurality of coaxial cables are connected to a circuit board arranged at the distal end of an insertion part, terminals that connect cores of the single-wire cables, terminals that connect cores of the coaxial cables, terminals that connect shields of the coaxial cables, and terminals that connect the shield of the bundle-wire cable are arranged in tandem at predetermined intervals on the common plane of the circuit board.Type: GrantFiled: June 14, 2012Date of Patent: March 18, 2014Assignee: Fujifilm CorporationInventor: Masaki Takamatsu
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Patent number: 8669646Abstract: Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.Type: GrantFiled: May 31, 2011Date of Patent: March 11, 2014Assignee: Broadcom CorporationInventors: Mohammad Tabatabai, Abbas Amirichimeh, Lorenzo Longo
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Computers including an undiced semiconductor wafer with Faraday Cages and internal flexibility sipes
Patent number: 8670246Abstract: A computer including an undiced semiconductor wafer having a multitude of microchips. The computer also including an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. The multitude of microchips on the wafer are configured to allow the microchip to function independently and including independent communication capabilities.Type: GrantFiled: February 24, 2012Date of Patent: March 11, 2014Inventor: Frampton E. Ellis -
Patent number: 8670236Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.Type: GrantFiled: August 3, 2011Date of Patent: March 11, 2014Assignee: Tyco Electronics CorporationInventors: David Szczesny, Michael Eugene Shirk
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Publication number: 20140063773Abstract: Electronic devices may be provided with conductive structures and antennas mounted near a gap between the conductive structures. A conductive member may be used to at least partially fill the gap in order to prevent emission from the antenna from entering the gap and interfering with the operation of the antenna. The conductive gap-filling member may include a conductive outer layer and a non-conductive inner layer. The inner layer may have opposing edge portions that are attached to each other or may be a continuous tubular insulating layer. The outer layer may be a layer of conductive fabric having opposing edge portions that are attached to each other or to opposing edge portions of the inner layer. An edge portion of the outer layer may be attached to a conductive structure. An insulating material may be formed between another edge portion of the outer layer and a second conductive structure.Type: ApplicationFiled: August 31, 2012Publication date: March 6, 2014Inventors: Taylor H. Gilbert, Derek W. Wright
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Patent number: 8665607Abstract: An anti-eavesdropping device is described. The device comprises a receiving compartment for receiving an electronic device, a noise generator, and an EMI filter. The receiving compartment is sealable to minimize signal emissions from the interior to the exterior and from the exterior to the interior, and the noise generator is coupled with the receiving compartment and the EMI filter. The EMI filter is operatively coupled with the noise generator.Type: GrantFiled: May 23, 2012Date of Patent: March 4, 2014Assignee: Vector Technologies, LLCInventors: Jose M. Bouza, II, Salvador Aguirre, Jr., Daniel Ashley McDonnell, Timothy Wayne Eaton, Stephen Robert Woodruff, Frank Augustine Mason
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Patent number: 8659912Abstract: A shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding includes an electrically and/or magnetically conductive material and the bottom shielding is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) embedded between at least two insulating layers (126; 124) and includes at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component. The top shielding and the conductive metal sheet layer are electrically isolated from the electronic component. The bottom shielding integrated into the printed circuit board and the top shielding and the bottom shielding designed such when they are attached to each other, they completely envelope the electronic component.Type: GrantFiled: April 11, 2011Date of Patent: February 25, 2014Assignee: Biotronik SE & Co. KGInventors: Singjang Chen, Jonathan Benson, Erica L. McCay
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Patent number: 8659913Abstract: The invention relates to an electromagnetic limiter. The limiter comprises a multilayer having an electrically conducting pattern superposed on a dielectric structure. Further, the multilayer is provided with at least one electromagnetically transparent aperture that is electromagnetically transparent for plane wave incidence. In addition, the limiter comprises a non-controlled non-linear structure interconnecting opposite edges of the electromagnetically transparent aperture.Type: GrantFiled: May 28, 2009Date of Patent: February 25, 2014Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoekTNOInventors: Raymond van Dijk, Frank Edward van Vliet, Stefania Monni
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Patent number: 8658908Abstract: A multiple patterning wiring board includes a base substrate including a plurality of wiring board regions arranged in rows and columns, the wiring board regions each including an electronic component mounting region in a center portion thereof, a dividing groove at borders between wiring board regions in one main face of the base substrate, a lid member bonding region being formed between the electronic component mounting region and the dividing groove in the main face of the base substrate, and the lid member bonding region 1c including a groove, the groove having a width less than or equal to the width of the region and a depth that is less than a depth of the dividing groove.Type: GrantFiled: June 23, 2010Date of Patent: February 25, 2014Assignee: Kyocera CorporationInventor: Shuzou Nakashima
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Publication number: 20140049934Abstract: A voltage conversion circuit such as a buck regulator circuit has a plurality of switches coupled to a voltage source; a slab inductor having a length, a width and a thickness, where the slab inductor is coupled between the plurality of switches and a load and carries a load current during operation of the plurality of switches. The voltage conversion circuit can also include means to reduce or cancel a detrimental effect of other wires on same chip, such as a power grid, that conduct a return current and thereby degrading the functionality of this slab inductor. In one embodiment the wires can be moved further away from the slab inductor and in another embodiment magnetic materials can be used to shield the slab inductor from at least one such interfering conductor.Type: ApplicationFiled: August 20, 2012Publication date: February 20, 2014Applicant: International Business Machines CorporationInventors: Leland Chang, David Goren, Naigang Wang
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Patent number: 8653633Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.Type: GrantFiled: July 5, 2011Date of Patent: February 18, 2014Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Kuo-Hsien Liao, Chi-Tsung Chiu, Chih-Pin Hung
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Patent number: 8654537Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.Type: GrantFiled: December 1, 2010Date of Patent: February 18, 2014Assignee: Apple Inc.Inventors: Joseph Fisher, Jr., Sean Mayo, Dennis R. Pyper, Paul Nangeroni, Jose Mantovani
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Publication number: 20140043785Abstract: A shielding device and an electronic device having the same are disclosed. The shielding device is disposed on a circuit board for covering an electronic component. The shielding device comprises a first case and a second case. The first case comprises a first limiting structure and a second limiting structure. The second case is mounted on the circuit board and includes a frame and a first slot. The frame forms an opening. When the first case is connected with the second case, the second limiting structure can move along a first direction to a bottom of the frame and is prevented from moving along a second direction. The first slot corresponds to the first limiting structure to allow the first limiting structure to be inserted into the first slot along the first direction and the first limiting structure is prevented from moving along the second direction.Type: ApplicationFiled: June 6, 2013Publication date: February 13, 2014Inventors: Hou-Chun HUANG, Tzu-Chieh HUANG
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Patent number: 8642900Abstract: An electromagnetically shielded enclosure is disclosed. One such system includes a continuously welded shell having a top, a bottom, and a plurality of side walls cooperating to enclose an interior volume, the interior volume sized to receive electronic equipment and allow human entry. The enclosure is constructed from electromagnetically conductive materials and includes continuous welds along seams joining each material. The enclosure includes a sally port located within the enclosure. The sally port includes a first door in one of the plurality of side walls and constructed from electromagnetically conductive materials. The sally port also includes a second door constructed from electromagnetically conductive materials. The sally port defines a secondary interior volume within the enclosure sized to allow human entry through either the first or second door.Type: GrantFiled: October 18, 2010Date of Patent: February 4, 2014Assignee: Emprimus, LLCInventors: Gale Nordling, David Blake Jackson, Frederick R. Faxvog, James Nicholas Ruehl, Wallace Jensen, Greg Fuchs, George Anderson
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Patent number: 8644034Abstract: A shield is adapted be locked to a casing. The casing is formed with an inserting space, an opening, and two engaging holes. The shield includes a shell body, two engaging members and two biasing springs. The shell body is inserted into the inserting space, and shields the opening. The shell body includes a base plate formed with a slot, and two side plates each formed with a through-hole. Each of the engaging members is slidable relative to the base plate, and includes an engaging portion extending through the corresponding through-hole and releasably engageable with the corresponding engaging hole. Each of the biasing springs biases the corresponding engaging member to move in a direction toward the corresponding through-hole.Type: GrantFiled: April 27, 2012Date of Patent: February 4, 2014Assignee: Wistron CorporationInventor: Yong-Liang Zheng
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Patent number: 8644033Abstract: A handheld electronic device may include a portable housing and a shielding container within the portable housing. The shielding container may include a shielding frame and a shielding lid carried thereby. A printed circuit board may be within the shielding container. The shielding frame may include a planar base with at least one opening therein, a pair of opposing side walls integrally formed with the base and extending upwardly therefrom, and a pair of opposing end walls integrally formed with the base and extending upwardly therefrom. Also, the shielding frame may include at least one intermediate partition wall integrally formed with the base and extending upwardly therefrom to define a plurality of container compartments. The partition wall may also extend only partway between the opposing side walls to define at least one partition end gap therewith.Type: GrantFiled: September 26, 2011Date of Patent: February 4, 2014Assignee: BlackBerry LimitedInventors: Chao Chen, Douglas Fregin, Jana Lynn Papke
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Patent number: 8638570Abstract: An electromagnetic interference (EMI) shield apparatus includes a shell, a hub, a shield member, a partition plate, a resilient member, and a cover. The hub is rotatably mounted within the shell. The shield member is wrapped around the hub. The partition plate is fastened to and rotatable together with the hub. The cover covered on an open end of the shell. The resilient member is connected between the partition plate and the cover to drive the hub to rotate to reel the shield member. The shield member is made of EMI shield material.Type: GrantFiled: June 30, 2011Date of Patent: January 28, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Lei Liu
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Patent number: 8634195Abstract: A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench.Type: GrantFiled: September 1, 2011Date of Patent: January 21, 2014Assignee: International Business Machines CorporationInventor: Don A. Gilliland
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Patent number: 8634204Abstract: A memory unit for a computing device is described. The memory device can include a number of memory chips, such as flash nand chips, linked together via a flexible circuit connector. During installation of the memory device, portions of the flexible circuit connector can be bent or folded in different locations to allow an orientation of the memory chips to be changed relative to one another. In one embodiment, a memory device with a number of chips can be provided in a flat configuration and then can be folded to allow the chips to be installed in a stacked configuration. In another embodiment, the flexible circuit connector can be grounded to other conductive components to allow the flexible circuit connector to be used as part of a faraday cage surrounding the memory chips.Type: GrantFiled: August 19, 2010Date of Patent: January 21, 2014Assignee: Apple Inc.Inventors: Fletcher R. Rothkopf, Phillip M. Hobson, Adam Mittleman, Anna-Katrina Shedletsky
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Patent number: 8629355Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.Type: GrantFiled: December 23, 2010Date of Patent: January 14, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Oh Hyuck Kwon, Kyung Jin Oh
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Patent number: 8625293Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.Type: GrantFiled: August 12, 2011Date of Patent: January 7, 2014Assignee: Delphi Technologies, Inc.Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Donald G. Moeschberger, Allen E. Oberlin, John Michael Matly, Kip R. Piel, Jerry J. Wendling
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Patent number: 8625301Abstract: An electronic device includes a housing, a connecting sheet, a display panel and a fixing module. The display panel is fixed on the connecting sheet. The fixing module includes a first latching member formed on the housing and a second latching member formed on the connecting sheet. The first latching member is detachably latched with the second latching member, such that the connecting sheet adhered to the display panel is detachably fixed on the housing.Type: GrantFiled: April 11, 2011Date of Patent: January 7, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Zi-Ming Tang, Qiong Huang
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Patent number: 8625306Abstract: An electromagnetically-countered display system includes at least one wave source and at least one counter unit. The wave source irradiates harmful electromagnetic waves and the counter unit emits counter electromagnetic waves for countering the harmful waves therewith. Examples of the various counter units for the electromagnetically-countered display system and various mechanisms to counter the harmful waves with the counter units include by matching configurations of the counter units with those of the wave sources, and by matching wavefronts of the harmful waves with those the counter waves. Various methods of countering the harmful waves with such counter waves include by source and/or wave matching. Various methods of providing the counter units for emitting the counter waves defining desired wave characteristics. Various electric and magnetic shields can be employed either alone or in conjunction with the counter units for minimizing irradiation of the harmful waves from the display system.Type: GrantFiled: September 23, 2011Date of Patent: January 7, 2014Inventor: Youngtack Shim
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Patent number: 8619435Abstract: An external EMI diverting structure to electrically shield an electronic device from EMI is presented. The electronic device is physically isolated from the case ground which interrupts the EMI or lightning fault path. This shield provides a return path to ground for the EMI away from the electronic device and replaces conventional EMI filter capacitors, which are not connected to case ground. The external EMI diverter comprises a first conducting enclosure enclosing the electrical circuit and is electrically coupled to the electric circuit and a second conducting enclosure enclosing the first conducting enclosure and being electrically isolated from the first conducting enclosure and the electric circuit. The diverter is physically and electrically connected to the case ground at an attachment point.Type: GrantFiled: July 6, 2010Date of Patent: December 31, 2013Assignee: Honeywell International Inc.Inventor: John Kenneth Tillotson
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Patent number: 8605457Abstract: An integrated antenna and electromagnetic (EM) noise shield apparatus for use with a radio frequency communicating device and EM noise generating electronic equipment housed within a generally cylindrical outer glass enclosure or bezel of wireless utility meter. A flexible printed circuit (PC) board has an upper region and a lower ground plane region. A radiating element is defined on the PC board in the upper region. A metal ground plane component has a first portion having the shape of a circle segment and a second orthogonal portion. The ground plane component is mechanically fixed and electrically connected to the ground plane region of the PC board, with the orthogonal second portion being proximate to and shielding the radiating element. The ground plane component and the ground plane portion of the PC board define an electromagnetic shield for electromagnetic emissions between EM noise generating electronic equipment housed within said outer bezel and the radiating element.Type: GrantFiled: December 23, 2010Date of Patent: December 10, 2013Assignee: Itron, Inc.Inventor: Zafarullah Khan
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Patent number: 8599574Abstract: An exemplary display unit includes a rear cover, a bracket disposed on the rear cover, a display mounted on the bracket, and a front cover secured to the rear cover to sandwich the display and the bracket between the front cover and the rear cover. The bracket includes a plate supporting the display, a pair of bulges protruding upwardly from two opposite sides of the plate and a pair of tabs extending upwardly from the bulges, respectively. The pair of tabs press against two opposite lateral faces of the display to dissipate static electricity on the display to ground.Type: GrantFiled: April 5, 2011Date of Patent: December 3, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Ke-Hui Peng, Xue-Dong Tang, Ren-Wen Wang, Ping Li
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Patent number: 8599576Abstract: Equipment and systems for protecting electronics against damage or upsets from electromagnetic pulse (HEMP or EMP), intentional electromagnetic interference (IEMI), and high power RF weapons are disclosed. This equipment can include a shielding arrangement includes a metallic enclosure having an interior volume defining a protected portion and an unprotected portion separated by an electromagnetically shielding barrier, and having a portal providing access to the protective portion and including an access opening, a shielding cover sized to cover the access opening, and an electromagnetically sealing gasket positioned around a perimeter of the access opening. The shielding arrangement also includes one or more filters positioned at least partially within the unprotected portion and along the electromagnetically shielding barrier to dampen electromagnetic signals and/or power signals outside a predetermined acceptable range.Type: GrantFiled: October 31, 2011Date of Patent: December 3, 2013Assignee: Emprimus, LLCInventors: Frederick R. Faxvog, Greg Fuchs, Wallace Jensen, David Blake Jackson, Bill Volna, Gale Nordling, James Nicholas Ruehl
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Patent number: 8599575Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.Type: GrantFiled: January 31, 2011Date of Patent: December 3, 2013Assignee: DJM Electronics, IncInventor: Stephen D. McNally
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Patent number: 8588437Abstract: Various electromagnetically-countered systems are provided and include at least one wave source irradiating harmful electromagnetic waves and at least one counter unit emitting counter electromagnetic waves for countering the harmful waves. Various generic counter units of such systems and various mechanisms are provided to counter the harmful waves by the counter units by matching configurations of the counter units with those of the wave sources, matching shapes of such counter waves with shapes of the harmful waves, etc. Various methods are provided for countering the harmful waves with the counter waves by such source or wave matching. Various methods are also provided for the counter units as well as counter waves. Various processes are provided for providing such systems and counter units. Various electric and/or magnetic shields may be used alone or in conjunction with such counter units to minimize irradiation of the harmful waves from the system.Type: GrantFiled: January 5, 2011Date of Patent: November 19, 2013Inventor: Youngtack Shim
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Patent number: 8587953Abstract: A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.Type: GrantFiled: August 29, 2008Date of Patent: November 19, 2013Assignee: Apple Inc.Inventors: John Brock, Brett William Degner, Dinesh Mathew, Thomas W. Wilson, Jr., Chris Ligtenberg, Keith Hendren, Steven Keiper, Eugene Kim
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Patent number: 8588436Abstract: Various electromagnetically-countered systems are provided and include at least one wave source irradiating harmful electromagnetic waves and at least one counter unit emitting counter electromagnetic waves for countering the harmful waves. Various generic counter units of such systems and various mechanisms are provided to counter the harmful waves by the counter units by matching configurations of the counter units with those of the wave sources, matching shapes of such counter waves with shapes of the harmful waves, etc. Various methods are provided for countering the harmful waves with the counter waves by such source or wave matching. Various methods are also provided for the counter units as well as counter waves. Various processes are provided for providing such systems and counter units. Various electric and/or magnetic shields may be used alone or in conjunction with such counter units to minimize irradiation of the harmful waves from the system.Type: GrantFiled: January 5, 2011Date of Patent: November 19, 2013Inventor: Youngtack Shim
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Patent number: 8587960Abstract: A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device.Type: GrantFiled: December 22, 2010Date of Patent: November 19, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Kwang Sung Hwang, Hyung Suk Park
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Patent number: 8578982Abstract: A device for protecting one or more credit or charge cards from radio frequency scanning is disclosed. The device comprises a planar element sized for fitting within a card slot of a personal carrying accessory, wherein the planar element is composed of an uncharged, conductive material and wherein the planar element inhibits the transmission of radio frequency signals.Type: GrantFiled: August 25, 2011Date of Patent: November 12, 2013Inventors: Victor Lee, Eric Cohen