Abstract: A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module.

Abstract: A shield case includes a first shield member and a second shield member coupled to the first shield member to form the shield case. A concave portion is capable of accommodating a sealing member for sealing inner space of the shield case by contacting the first shield member and the second shield member, and is formed on the second shield member. On each of the first shield member and the second shield member, a paint film portion is formed on an area of the shield case external to the concave portion. On the first shield member or the second shield member or combination thereof, a convex portion is formed on the area of the shield case on the inner space side and internal to the concave portion. The surfaces of the first shield member and the second shield member contact each other at the convex portion.

Abstract: A device for improving antenna receiving sensitivity in a portable terminal includes an antenna in a low-frequency band of less than 900 MHz which is mounted on a predetermined position in a body housing and a touch pad unit connected to the vicinity of the antenna through a FPCB (Flexible Printed Circuit Board), in which the touch pad unit is grounded to a nearby body in the vicinity of the touch pad unit by using a conductive portion to block noise generated in the touch pad unit, thereby improving the antenna receiving sensitivity.

Abstract: In an electronic device according to the present invention, a shield case is disposed at a surface of a main board so as to cover at least a part of a region of the surface of the main board; and an auxiliary board is disposed at a surface of the shield case. The shield case is comprised of a metallic frame that is fixed at the surface of the main board and extends in such a manner as to surround at least the part of the region, and a metallic cover fitted into the metallic frame to cover at least the part of the region. A projecting piece is formed in the metallic frame of the shield case, and penetrates the metallic cover and projects toward the auxiliary board. An end face of the auxiliary board abuts against the projecting piece, so as to position the auxiliary board.

Abstract: An electronic device includes an upper shield arranged on a front side of a circuit board, and a lower shield arranged on a back side thereof. The lower shield includes a contact portion at an edge thereof. The contact portion is in contact with a lower surface of the circuit board. A plate spring portion is formed in the contact portion. An end portion of the plate spring portion abuts on the upper shield.

Abstract: The display device includes: a panel module 4 that includes a display panel 16 and a driving circuit for driving the display panel 16; a metallic front housing 11 that partially covers the panel module 4 from a display surface side of the display panel 16; and a metallic back housing 12 that covers the panel module 4 from a back surface side of the display panel 16. A conductive cloth 24 is disposed between the panel module 4, and the front housing 11 and the back housing 12, the conductive cloth 24 continuously covering a circumferential edge portion of the panel module 4 on the display surface side, a side surface portion of the panel module 4 and a circumferential edge portion of the panel module 4 on the back surface side and being connected electrically to the front housing 11 and the back housing 12.

Abstract: An electromagnetically shielded power module and data center including such a module are disclosed. In one example, the electromagnetically shielded power module includes an electromagnetically shielded enclosure including a shell and at least one door, the enclosure surrounding and providing electromagnetic shielding for an interior volume. The electromagnetically shielded power module also includes a power delivery control module positioned within the interior volume and configured to monitor filtered power received into the interior volume of the electromagnetically shielded enclosure. The electromagnetically shielded power module further includes a plurality of power distribution units positioned within the interior volume and configured to receive filtered power from the power delivery control module and route power to one or more computing systems.

Abstract: A structure for fixing a backplate includes a main body having at least one extended portion, on which at least one retaining arm and at least one locating post are provided. The locating post is located near an outmost portion of an end of the extended portion opposite to the main body, and the retaining arm is located near an outer periphery of the locating post. The backplate can be attached to one face of a motherboard via the locating post and the retaining arm of the structure for fixing a backplate to increase the structural strength of the motherboard without the need of using any bonding material or other adhesive medium to thereby reduce the cost of manufacturing and mounting the backplate.

Abstract: The invention relates to improved techniques for manufacturing power conditioning units (inverters) for use with photovoltaic (PV) modules, and to inverters manufactured by these techniques. We describe a solar photovoltaic inverter, comprising: a power conditioning circuit mounted on a circuit board, the power conditioning circuit having a dc power input to receive dc power from one or more photovoltaic panels and an ac power output to deliver ac power to an ac mains power supply; an electrically conductive shield enclosing said circuit board; and a plastic overmould over said conductive shield and said circuit board; wherein said electrically conductive shield has one or more holes to allow said plastic overmould to extend through said shield to cover said circuit board.

Abstract: Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions.

Abstract: An electronic device includes a housing, a fixed frame, a plurality of conductive foam pieces, and a display panel. The fixed frame is assembled and received within the housing. The fixed frame defines a plurality of fixing grooves adjacent to a periphery of the fixed frame. The conductive foam pieces are assembled within the fixing grooves of the fixed frame, respectively, and are coplanar with the fixed frame. The display panel is flatly mounted on the fixed frame and received within the housing together with the fixed frame. The periphery of the display panel tightly contacts with the conductive foam pieces.

Abstract: A multilayer printed circuit board includes a first conductive layer including (i) a first signal ground, (ii) a first frame ground mounted on an external interface component, (iii) a first slit portion that separates the first signal ground and the first frame ground from each other, and (iv) a signal wiring arranged to extend over the first slit portion. A second conductive layer is laminated on the first conductive layer through a dielectric layer. The second conductive layer includes (i) a second signal ground, (ii) a second frame ground, and (iii) a second slit portion that separates the second signal ground and the second frame ground from each other. A first connecting member and a second connecting member connect the second signal ground and the second frame ground to each other.

Abstract: A hermetically sealing device includes a conductive seal member (2) which is integrated with a conductive member (1) extending into a casing (3) and seals a space between the conductive member (1) and an inserting section for the conductive member (1) on the casing (3). In the conductive member (1), an electromagnetic wave shield layer (11) is laminated on a cover film which protects the surface of a base film having a circuit pattern, an insulating layer (12) is laminated on the electromagnetic wave shield layer (11), the insulating layer (12) has an opening section (12a) such that a part of the flat section of the electromagnetic wave shield layer (11) is exposed, and the seal member (2) is integrated with the conductive member (1) to cover the opening section (12a) and is brought into contact with the electromagnetic wave shield layer (11) through the opening section (12a).

Abstract: The invention discloses a capacitance standard box output device. The number of standard capacitors is reduced, so that the structure of a changeover switch is simplified, and the number of connection wires is reduced, so as to improve the shield effect and reduce uncertainty. The technical proposal of the invention is as follows: The capacitance standard box output device comprises a changeover switch and precision capacitors, wherein the changeover switch is placed in a shield box; the shield box has an input terminal and an output terminal; the input terminal is connected to the changeover switch and the precision capacitor; the output is connected to the changeover switch and outputs the capacitance selected by the changeover switch; the selected capacitance is a product of a unit capacitance and an arbitrary integer value between 0 and 10; the number of the precision capacitors is from 4 to 9, and at least one capacitor is of a unit capacitance.

Abstract: Seal surfaces in three directions of a base and a cover are mutually fitted as a first seal part in combination of concave threads and convex threads, and sandwich three sides of a circuit board between an innermost peripheral part convex thread at the base side and an innermost peripheral part concave thread at the cover side. A connector member having a second seal part is fixed to one side of the circuit board, a concavo-convex seal surface between the base and the connector member is located on a low step surface, and the concave and convex threads on the seal surface of the connector member provided on the base pass the concave and convex threads of the seal surface in the three directions each other to be continuous.

Abstract: A shield case includes at least one tongue piece which is formed of a conductor and protrudes to an outside of the shield case. Further, the shield case is formed of a conductor, and an element is housed inside the shield case.

Abstract: A shielding assembly comprises a pair of covers. Each cover comprises a body, an overlapping portion, and a plurality of sidewalls. The body comprises a first engaging portion, a second engaging portion and a slot defined at one end of the second engaging portion neighboring to the first engaging portion. The overlapping portion comprises a joint portion extending from the first engaging portion, a extending portion extending from the joint portion and parallel to the body, and a latching portion shaped on one end of the extending portion neighboring to the second engaging portion. The extending portion of one of the covers overlaps the second engaging portion of another one of the covers, and the latching portion of one of the covers is latched in the slot in another one of the covers.

Abstract: A shielding assembly includes a frame including a main body, the main body defining at least one retaining hole; and a cover including a main board, the main panel including retaining elements and rims. The number of the retaining elements is the same as the number of the retaining holes, each rim protruding outwardly from a distal end of one of retaining elements. Each retaining element passes through one of the retaining holes, and each rim is latched with the portions of the frame surrounding the retaining holes.

Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

Abstract: The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.

Abstract: An electronic device includes an EMI shielding board, two electronic components and a flat cable. The EMI shielding board includes a first side and a second side opposite to the first side. The two electronic components are arranged at the first side of the EMI shielding board. The flat cable is connected between the two electronic components. The EMI shielding board further includes a first through slot and a second through slot both configured therein. The flat cable passes through the EMI shielding board via the first and second through slots. A part of the flat cable is on the first side of the EMI shielding board, and the remaining part of the flat cable is on the second side of the EMI shielding board.

Abstract: An optical transceiver module is provided that has an EMI absorbing assembly that comprises an EMI absorbing device that is electrically grounded rather than standing in free space in the transceiver module so that the assembly absorbs both the magnetic and electrical components of the EMI. In accordance with an embodiment, the EMI absorbing assembly includes a leadframe about which an EMI absorbing material is cast. The leadframe preferably is shaped in a way that prevents or lessens the occurrence of resonant EMI modes in the transceiver module housing.

Abstract: A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.

Abstract: A connector includes an electromagnetic shield formed of conductive material with at least two depending, conductive, reinforcement sidewalls that each have a plurality of conductive depending sidewall legs distributed about a periphery of the shield and extending upwardly. The shield includes at least one conductive ground tab extending from an edge such that the shield provides a ground path directly from a circuit board to a connector housing. The shield defines at least one opening for receiving an alignment post and at least one additional rectangular opening to permit access to an electrical terminal positioned below the sheet. The rectangular opening may be aligned with terminals positioned within connector housing.

Abstract: A power supply cable including high voltage wires and connectors for a traction motor, charger, upper battery pack and lower battery pack. The power supply cable includes a clamshell shield housing that protects the cable as it is routed over a rear seat pedestal. A two-piece grommet is provided to seal between the passenger compartment and the underbody of the vehicle and includes a rigid attachment ring and a seal that seals the passenger compartment from the environment below the vehicle.

Abstract: This invention is directed to several mechanical features of an electronic device. The electronic device may include a spring for simultaneously grounding several components. The electronic device may include several interlocking fences for protecting electronic device components from RF radiation. The electronic device may include an antenna assembly that includes distinct components for functional and aesthetic purposes. The electronic device may include a window for permitting RF transmissions. The electronic device may include a metal frame for stiffening the electronic device. The electronic device may include a bezel used for aesthetic purposes and to support numerous electronic device components. The electronic device may include a flexible housing operative to elastically deform to assemble the electronic device. The electronic device may include an unsupported button.

Abstract: A driving device including a board on which a timing controller for signal processing and a memory are mounted, the board having a conductive field, in which the conductive field has a non-contact region which is coated with an insulating material, and an exposed contact region which is not covered with the insulating material, the exposed contact region formed adjacent to the timing controller or the memory, a conductive member disposed in the exposed contact region, and a shield covering the board and electrically connected to the conductive field via the conductive member.

Abstract: An electronic component includes a substrate, first electronic components mounted on a first principle surface of the substrate, a first resin layer that covers the first principal surface of the substrate and the first electronic components, a second electronic component mounted on a second principle surface of the substrate, a second resin layer that covers the second principal surface of the substrate and the second electronic component, an electrically conductive shield layer, and a ground electrode arranged in the substrate so as to reach a side surface of the substrate. The shield layer is a single continuous layer that covers the first resin layer, the side surface of the substrate, and a portion of the second resin layer adjacent to the substrate. The shield layer is in contact with and electrically connected to the ground electrode.

Abstract: A gas insulated switchgear includes a transformer mounting body; a bushing mounted on the transformer mounting body; and a main circuit conductor. The main circuit conductor includes a first main circuit conductor which is connected to a circuit breaker and is located in the bushing and a second main circuit conductor which is connected to the first main circuit conductor. An insulator extends below the lower end of the transformer mounting body and toward the vicinity of the connection between the first main circuit conductor and the second main circuit conductor, in a region where the first main circuit conductor is located in the transformer mounting body. A ground shield is arranged in the insulator, and extends below the lower end of the transformer mounting body and above a coupling portion between the transformer mounting body and the bushing.

Abstract: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.

Abstract: A shielding assembly comprises a pair of opposite first sidewalls, a pair of opposite second sidewalls, a pair of opposite first covers, a pair of latching portion and a pair of opposite second covers. The first sidewalls and the second sidewalls are connected with each other to collectively form a hollow frame. The first covers are resiliently connected to the first sidewalls, respectively, and suitable to be bent to collectively cover the hollow frame. The pair of latching portions extend the first covers and are bent perpendicular to the first covers, respectively. A pair of gaps are defined respectively on two tail ends of each of the latching portions. The second covers are resiliently connected to the second sidewalls, respectively, and are bent to cover on the first covers and latched in corresponding gaps.

Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.

Abstract: There is disclosed a method of shielding a circuit board, a circuit board, an electromagnetic shield and a method of manufacturing an electromagnetic shield. In an aspect, the method comprises placing a first electromagnetic shield over a first area of the circuit board and placing a second electromagnetic shield over a second area of the circuit board. At least one of the electromagnetic shields has at least one projection therefrom that contacts and makes electrical connection with a surface of the other electromagnetic shield when the shields are placed on the circuit board.

Abstract: A casing includes a main body made of a conductive composite material and a local portion located adjacent to a wireless device. The local portion has a non-conductive layer and a conductive composite material layer. The thickness of the conductive composite material layer is thinner than that of the main body that is immediately adjacent to the conductive composite material layer. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. The part of the local portion that has a thickness thinner than a thickness of the adjacent main body is installed with the non-conductive layer. The non-conductive layer is tightly connected with the conductive composite material layer of the local portion and the main body that is immediately adjacent to the non-conductive layer.

Abstract: A container data center includes a container, a shield, a screen, and a hollow fixing frame. The container includes a sidewall defining a vent. The shield and the fixing frame are selectively mounted to the sidewall of the container such that the vent is covered by the shield or the screen sandwiched between the sidewall and the fixing frame.

Abstract: An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.

Abstract: A high voltage shielding device including a main body having an enclosing outer solid insulating wall, an outer electrode arranged on the solid insulating wall providing a first level of insulation to the outer electrode, and a first inner electrode which is uninsulated or has a coating providing a second level of insulation, which second level of insulation is lower than the first level of insulation. The first inner electrode is oriented relative the outer electrode in such a way that the first inner electrode mainly shields a component of an electric field which is perpendicular to a component of an electric field mainly shielded by the outer electrode.

Abstract: Earpieces and methods of forming earpieces for radio frequency (RF) mitigation are provided. An earpiece is configured to be inserted in an ear canal. The earpiece includes an insertion element and a sealing section disposed on the insertion element and configured to conform to the ear canal. The sealing section is configured to substantially mitigate radio frequency (RF) transmission and to substantially isolate the ear canal from an ambient environment.

Abstract: A security document (1) in the form of a booklet which has a large number of sheets (11, 12, 13) connected to one another to form the booklet. A first sheet (11) of the security document has a carrier layer (20), an antenna structure (21)—arranged in a first region (41)—for RF communication and an electronic circuit (22)—connected to the antenna structure (21)—with a memory device for storing data, and a communication device—connected to the antenna structure—for communicating data stored in the memory device to a reader via a radio interface by means of the antenna structure (21). A second sheet (13) of the security document has a carrier layer (30) and one or more electrically conductive layers shaped in a second region (43) for the formation of at least one LCR resonant circuit (3).

Abstract: A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: An electric power supply includes: a first board on which at least switching elements Q1 to Q3 (semiconductor elements) are disposed; a transformer; a filter device (a filter section and an output stabilizing section) that reduces alternating current components; and a case that houses therein the first board, the transformer, and the filter device. A first shielding section that blocks noise including leakage magnetic flux from the transformer is provided between the transformer and the filter device that are disposed near each other. As a result of the configuration, the first shielding section is interposed between the transformer and the filter device. Therefore, the effects of noise including leakage magnetic flux from the transformer on the filter device are reduced. Unlike in conventional technologies, an expensive heat sink is not required to be used. Therefore, cost can be reduced from that in the past.

Abstract: An electromagnetic wave suppression material is fixed to a case of a communication module. The electromagnetic wave suppression material suppresses radiation of electromagnetic waves by coming into contact with a cage that is a module insertion portion of a chassis when the communication module is inserted into the cage. A piezoelectric element is provided on the case, and located between the case and the electromagnetic wave suppression material. When the communication module is inserted into the cage, the controller applies a voltage to the piezoelectric element to stretch it by the applied voltage, thereby increasing contact pressure between the cage and the electromagnetic wave suppression material.

Abstract: An electronic apparatus includes a front case, a rear case whose peripheral portion is brought into engagement with a peripheral portion of the front case and an electrostatic capacity type sensor portion which is encompassed by the front case and the rear case. A primary conductive portion, which is brought into engagement with the sensor portion for electrical connection, is formed on part of an inner surface of the peripheral portion of one of the cases which extends to the engagement portion. By adopting this configuration, the electronic apparatus can be fabricated easily and the operation of a touch switch provided in the electronic apparatus can be stabilized.

Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.

Abstract: A magnetic shielding arrangement, including: at least one magnetic flux source; a superconductor magnetic shield at least partially surrounding the magnetic flux source; a second shield at least partially surrounding the superconductor magnetic shield.

Abstract: In a flat panel display (FPD), a conductive heat proof plate is inserted between the back surface of a display panel, on which printed circuit boards (PCBs) and signal lines are formed, and signal lines. A back frame positioned on the back surface of the display panel is provided to cover the printed circuit boards and the signal lines. A shield can is formed in the internal surface region of the back frame corresponding to the printed circuit board on which a timing controller is mounted. The shield can is electrically coupled to the heat proof plate to improve resistance against the electromagnetic compatibility of a large flat panel display and to improve a thermal characteristic.

Abstract: A shield for a connector that can provide a card-receiving slot is disclosed. The shield includes sides that provide an enclosure. The shield includes a fastener that is held in place by a retaining notch in a bottom of the shield. The retaining notch is configured to support the fastener in place and restrain it from unintended translation or rotation.

Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.