Abstract: A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, a side surface arranged between the first main surface and the second main surface, and a magnetic storage device, a first magnetic shield overlaying on the first main surface, a second magnetic shield overlaying on the second main surface, and a third magnetic shield overlaying on the side surface. The first and second magnetic shields are mechanically connected via the third magnetic shield.

Abstract: A method for forming conductive vias in a substrate of a semiconductor device component includes forming one or more holes, or apertures or cavities, in the substrate so as to extend only partially through the substrate. A barrier layer, such as an insulative layer, may be formed on surfaces of each hole. Surfaces within each hole may be coated with a seed layer, which facilitates adhesion of conductive material within each hole. Conductive material is introduced into each hole. Introduction of the conductive material may be effected by deposition or plating. Alternatively, conductive material in the form of solder may be introduced into each hole.

Abstract: According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening member. The circuit substrate includes a first side and a second side adjacent to the first side, and overlaps a second face of the display. The connector terminals are disposed at a vicinity of each of the first side and the second side. The first cover includes a first opening exposing the connector terminals therethrough, and covers the second face. The second cover includes a linking portion and a noncircular through hole, and covers the first opening across the first side and the second side. The linking portion is positioned in between the first side and the second side. The fastening member is inserted through the through hole so as to fix the second cover, the circuit substrate, and the display.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite.

Abstract: A holding frame and a housing assembly for an electronic device. The holding frame is used to hold a motherboard and at least one peripheral device. The holding frame includes a main holder, a linkage member, and a rotational holder. The motherboard is mounted onto the main holder via the linkage member. The peripheral device is mounted onto the rotational holder. The rotational holder is pivoted to the main holder to rotate on the main holder. The installation of the motherboard or the peripheral device will not be interfered by the structure of the holding frame. The housing assembly includes a case body and the holding frame. The holding frame is disposed within the case body. The installation of mounting the motherboard and the peripheral device onto the holding frame can be performed outside the case body without being interfered by the case body.

Abstract: An electrically-conducting assembly for conducting a first housing and a second housing of an electronic device. The first housing is detachably combined with the second housing. The electrically-conducting assembly includes a retaining wall and a lapping part. The retaining wall is perpendicularly provided at the first housing, and a surface of the retaining wall has an electrically-conducting layer. The lapping part is perpendicularly provided at the second housing, and a surface of the lapping part has another electrically-conducting layer. The lapping part and the retaining wall contact with each other when the first housing and the second housing are combined so that the electrically-conducting layer and the another electrically-conducting layer are mutually conductive.

Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.

Abstract: A hard disk securing structure for an industrial computer is disclosed. The industrial computer includes a case, the hard disk securing structure is served to accommodate a hard disk and includes a securing member and a tray. The securing member is installed in the case and includes a buckling unit; the tray is installed in the case and includes a carrying plate and a pair of lateral plates respectively extended from two ends of the carrying plate, an accommodation space used for accommodating the hard disk is defined by the carrying plate and the pair of lateral plates, a locking unit is extended from one end of the carrying plate which is adjacent to the pair of the lateral plates, and the locking unit is mutually locked with the buckling unit. Accordingly, an advantage of easily installing/detaching the hard disk from the case is achieved.

Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive, fluid-permeable planar core layer defined between generally parallel first and second surfaces and a first face sheet laminated to the first surface of the core layer with rigidity properties superior to the rigidity properties of the core layer. The thickness of the first face sheet is substantially less than the thickness of the core layer. The core layer is made of metallic foam or a metal coating on an electrically-nonconductive, porous, nonmetallic substrate chosen from among nonwoven fibrous matting, paper, and open-cell nonmetallic foam. Also, the core layer may also may be made up of liberated branching metal nanostrands or a plurality of electrically-coupled, electrically-conductive particles, each taking the from of an electrically-nonconductive, nonmetallic substrate with a metal coating.

Abstract: A manufacturing method for a non-contact power receiving/transmitting device that transmits or receives electric power in a non-contact manner and that includes a coil unit and an electromagnetic shield, wherein the coil unit includes a self-resonance coil that is configured to receive or transmit electric power via an electromagnetic field generated through electromagnetic resonance and an adjusting unit that adjusts a resonance frequency of the self-resonance coil, the manufacturing method including: installing the coil unit; arranging the electromagnetic shield around the self-resonance coil except a direction in which electric power is received or transmitted; and adjusting the adjusting unit in accordance with a distance between the coil unit and a surface of the electromagnetic shield vertical to a direction of the electromagnetic field inside the self-resonance coil so that the resonance frequency becomes a predetermined frequency.

Abstract: A flexible printed circuit connector structure and assembly method. A panel with a back side that is parallel to a first plane and a flexible printed circuit backer that has a base and a backing structure. The base is attached to the back side of the panel. The backing structure depends from the base and extends along a second plane that forms an angle with the first plane. A first flexible circuit side of the flexible printed circuit is attached to a first side and an opposite second side of the backing structure. The flexible printed circuit has exposed conductors on a second flexible circuit side that is opposite the first flexible circuit side.

Abstract: An electronic device includes a housing including an opening-portion and an annular-projection provided in the vicinity of the opening-portion from the housing, the annular-projection projecting so as to surround a periphery of the opening-portion, a frame member including a tubular-portion having an outer surface that faces the annular-projection to be fitted with the annular-projection, a top plate exposed from the opening-portion with the tubular-portion fitted with the annular-projection, an extension-portion extending from the outer surface of the tubular-portion, the tubular-portion being expanded toward the annular-projection when a pressing force is applied to a surface of the top plate exposed from the opening-portion with the annular-projection and the tubular-portion fitted with each other, and an O-ring that contacts entire peripheries of the outer surface of the tubular-portion and an inner surface of the annular-projection.

Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.

Abstract: Electronic module, such as a small footprint pluggable (SFP) connector module, including a housing, an electroconductive cage for shielding the module and a latch for the cage to the housing. The latch includes a separate latch member accommodated between the housing and the cage, and at least one resiliently protruding tip. The cage is provided with an opening for receiving the resiliently protruding tip.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.

Abstract: An enclosure is provided for a device comprising one or more electronic assemblies where the enclosure deforms under a shock in one or more selected manners to dissipate the shock energy. The deformation, which is elastic deformation, occurs at selected parts of the enclosure and/or in selected translations and/or rotations where those selections are made by the designer of the enclosure. By being able to define where and how the deformations will occur, the electronic assemblies can be located, mounted and interconnect within the enclosure such that the deformation does not adversely affect the assemblies or device.

Abstract: An electromagnetically shielded enclosure that is portable and lightweight with a double perimeter entry seal. The electromagnetically shielded enclosure can be used for applications such as testing and security and can be scaled from a bench top unit to a large field deployed enclosure. The electromagnetically shielded enclosure has a novel entry seal that eliminates the electromagnetic leakage that is common around the entry areas of such enclosures. The entry seal of the electromagnetically shielded enclosure is made up of a door having a first perimeter closure material and a second perimeter closure material and an enclosure opening having a first perimeter closure and a second perimeter closure where the first perimeter closure material aligns with the first perimeter closure and the second perimeter closure material aligns with the second perimeter closure. This double perimeter entry seal provides for electromagnetic isolation within the electromagnetically shielded enclosure.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.

Abstract: Provided is an electronic controller which enables visual identification of a portion applied with a small amount of a sealing material, which has a high possibility of air leakage from an area in which a joint is to be established. The electronic controller includes: an electronic circuit board; and a casing including a cover (1), a base (4), and a lid sealed with a sealing material (20) applied to surfaces thereof at which the cover (1), the base (4), and the lid are to be joined together. An area in which the cover (1), the base (4), and the lid are to be joined together is provided with a space (16) thereto for enabling an application state of the sealing material (20) to be observed with a naked eye.

Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.

Abstract: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a third housing between the first housing and the second housing, the third housing being rotatably connected to the first housing and the second housing, and an antenna in the third housing.

Abstract: A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

Abstract: An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).

Abstract: Disclosed is a hard-framed housing that provides a cover for electronic hardware components. According to one example, the housing may include a front cover portion that includes at least two spring loaded friction inducing side arms extending from a faceplate portion of the front cover portion at approximately a 90 degree angle. The housing may also include a rear cover portion that includes at least two receiving plates which provide a planar surface for the at least two spring loaded friction inducing side arms to rest when the front cover portion is engaged with the rear cover portion.

Abstract: One feature pertains to a multi-chip package that includes a substrate and an electromagnetic interference (EMI) shield coupled to the substrate. At least one integrated circuit is coupled to a first surface of the substrate. The EMI shield includes a metal casing configured to shield the package from radio frequency radiation, a dielectric layer coupled to at least a portion of an inner surface of the metal casing, and a plurality of signal lines. The signal lines are coupled to the dielectric layer and electrically isolated from the metal casing by the dielectric layer. At least one other integrated circuit is coupled to an inner surface of the EMI shield, and at least a portion of the inner surface of the EMI shield faces the first surface of the substrate. The signal lines are configured to provide electrical signals to the second circuit component.

Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.

Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Abstract: In an electronic device according to the present invention, a shield case is disposed at a surface of a main board so as to cover at least a part of a region of the surface of the main board; and an auxiliary board is disposed at a surface of the shield case. The shield case is comprised of a metallic frame that is fixed at the surface of the main board and extends in such a manner as to surround at least the part of the region, and a metallic cover fitted into the metallic frame to cover at least the part of the region. A projecting piece is formed in the metallic frame of the shield case, and penetrates the metallic cover and projects toward the auxiliary board. An end face of the auxiliary board abuts against the projecting piece, so as to position the auxiliary board.

Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

Abstract: A shielding element is provided for medium voltage switchgears with vacuum interrupters having at least two contacts, which are movable along a switching path between closed and open contact positions. The shielding element is positioned around the contact position region in the vacuum interrupter. To reduce the use of material and to optimize the energy absorbance behavior of the shielding element, the inner surface of the shielding element is applied with a topographic structure which is aligned parallel to the switching path of the contacts. The present disclosure also provides a method of manufacturing such a shielding element.

Abstract: A security system includes an integrated circuit and a transceiver/transponder circuit. The integrated circuit includes an antenna for communicating with the transceiver/transponder circuit. An inhibiting element is associated with the integrated circuit for inhibiting communications with the transceiver/transponder circuit and for securing the data contained in the integrated circuit. The inhibiting element is an electromagnetic inhibiting element. The security system further includes a coupling element associated with the antenna of the integrated circuit for temporarily deactivating the electromagnetic inhibiting element to allow communications between the integrated circuit and the transceiver/transponder circuit.

Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.

Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.

Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.

Abstract: A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern.

Abstract: There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 401 of the transformer facing the surface of the circuit board. There is provided a display device including such a power module.

Abstract: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh. Regions between the conductive members of the first discontinuous mesh include a phase change material. The phase change material undergoes a phase transition from substantially non-conductive to substantially conductive responsive to a change of energy.

Abstract: A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Abstract: A carrying case having a first compartment and a second compartment for accommodating a plurality of objects; the first object which is embedded with integrated circuits that can process, store and communicate data on radio frequency identification microprocessors; said second object which is configured to process, store and communicate data on radio frequency identification microprocessors; said inner lining of said carrying case configured to include a radio frequency shielding; said shielding material including a layer of conductive material to attenuate interference fields and signals which are transmitted at varying frequencies and wavelengths; and wherein the shielding material is configured to block access to data which is stored on radio frequency identification microprocessors embedded in either the first object or second object.

Abstract: The present invention is directed to an electromagnetic interference (EMI) shielding device. The EMI shielding device may be formed of a material (ex.—Beryllium Copper) having a thickness which allows the shielding device to provide a desired range of compression. Further, the EMI shielding device may be constructed for accommodating tolerances and compression forces which may be encountered in various implementation environments. Further, the EMI shielding device may be sized and shaped for promoting compatibility of the EMI shielding device with Surface Mount Technology (SMT) processes.

Abstract: An electronic device includes a motherboard defining a number of through holes, a bottom wall forming a number of posts, and a fixing member including a fixing body mounted to the bottom wall and a movable body slidably mounted to the fixing body. Each through hole includes a first hole and a second hole communicating with each other. Each post includes a supporting portion, a head, and a neck. The fixing body forms a protrusion. The movable body includes a main portion, a connecting portion connected to the main portion and defining a limiting slot. The heads are extended through the first holes; the necks abut end walls bounding the second holes. The motherboard is sandwiched between the heads and the supporting portions, the protrusion is engaged in the limiting slot, and the main body abuts against an end of the motherboard adjacent to the fixing member.

Abstract: A method is provided for assembling a connector assembly to a case. The case includes an inside surface defining an inside of the case, an outside surface defining an outside of the case, and an aperture therethrough providing communication from the inside surface to the outside surface. The connector assembly includes an outer connector having a body with a passage therethrough, an electromagnetic shield, and an inner connector with a terminal therein with a conductor extending from the inner connector in electrical communication with the terminal. The method includes positioning the outer connector on the outside of the case to align the passage of the outer connector with the aperture of the case. The method also includes positioning the inner connector on the inside of the case. The method also includes inserting the inner connector into the passage of the outer connector from the inside of the case.

Abstract: An electromagnetic shield for a storage device comprising a printed circuit board (PCBA) defining a plated through hole defining a generally cylindrical plated surface. The electromagnetic shield may comprise a top surface and sides oriented generally perpendicular to the top surface. One or more of the sides comprise a press-fit connector configured for removable insertion in the plated through hole. The press-fit connector may comprise at least one resilient member defining a longitudinal axis and configured to resiliently bow out in a direction generally perpendicular to the longitudinal axis during insertion and press against the plated surface of the through hole to displace plating material formed thereon to form a gas-tight seal between the at least one resilient member and the plated surface.

Abstract: Various electromagnetically-countered systems are provided and include at least one wave source irradiating harmful electromagnetic waves and at least one counter unit emitting counter electromagnetic waves for countering the harmful waves. Various generic counter units of such systems and various mechanisms are provided to counter the harmful waves by the counter units by matching configurations of the counter units with those of the wave sources, matching shapes of such counter waves with shapes of the harmful waves, etc. Various methods are provided for countering the harmful waves with the counter waves by such source or wave matching. Various methods are also provided for the counter units as well as counter waves. Various processes are provided for providing such systems and counter units. Various electric and/or magnetic shields may be used alone or in conjunction with such counter units to minimize irradiation of the harmful waves from the system.