Shielding Patents (Class 361/816)
  • Patent number: 8923014
    Abstract: A display device having a touch panel which effectively intercepts noise generated from a display panel to prevent the touch panel from malfunctioning. The display device having the touch panel includes a display panel, a touch panel attached to the display panel through an adhesion layer, a noise interception layer over an entire rear surface of the touch panel to prevent electrical noise from the display panel from being introduced into the touch panel, a metal ring pattern on the noise interception layer to surround the edge of the noise interception layer and having lower electrical resistance than the noise interception layer, and a ground terminal electrically connected to the noise interception layer and the metal ring pattern.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: December 30, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: Jong-Hyuk Kim, Joong-Lok Song
  • Patent number: 8917525
    Abstract: An insertion member provided with a male thread on the peripheral surface thereof is inserted through an opening of a receiving member. The insertion member is fastened by a fastening member provided with a female thread on the inner surface thereof. A first O-ring is provided between the insertion member and the fastening member, and a second O-ring is provided between the fastening member and the receiving member. When viewing each circular cross-section of the first and second O-rings along a surface parallel to a moving direction of the fastening member at the point of fastening the insertion member by rotating the fastening member, a first point of each circular cross-section is pressed against a surface perpendicular to the moving direction, and a position displaced from a second point opposite to the first point of each circular cross-section is pressed against an inclined surface inclined to the moving direction.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 23, 2014
    Assignee: JVC KENWOOD Corporation
    Inventor: Sachiyo Miyoshi
  • Patent number: 8913403
    Abstract: A power converter is described which is comprised of a filter circuit component including a reactor and capacitor wherein the reactor includes a core which consists of a magnetic substance which is disposed around a conductive wiring member, a noise generating component which radiates noise wherein the noise generating components are disposed adjacently to the filter circuit component and a shielding plate which shields out the radiating noise. The shielding plate is disposed between the filter circuit component and the noise generating component. The conductive wiring member and the shielding plate are composed as one body electrically insulated from each other.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: December 16, 2014
    Assignee: Denso Corporation
    Inventor: Shinya Goto
  • Patent number: 8913397
    Abstract: In a power source control circuit module, switching regulator devices and a linear regulator device are mounted on a surface of a laminated body so as to be spaced from each other. In an interface between dielectric layers of the laminated body, first to fifth internal ground electrodes separated by an electrode non-formation portion are provided. The first, second, fourth, and fifth internal ground electrode are connected to the respective switching regulator devices. The third internal ground electrode is connected to the linear regulator device. The first to fifth internal ground electrodes are connected to respective different external ground terminals.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: December 16, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masato Yoshida, Tomohiro Nagai, Hiroshi Matsubara
  • Patent number: 8897019
    Abstract: There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: November 25, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Eiji Mugiya, Tetsuo Saji, Atsushi Tsunoda, Hiroshi Nakamura
  • Patent number: 8891241
    Abstract: An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the heat dissipation fin set. The filter circuit board includes a metal layer, an electromagnetic band gap structure layer, an insulation layer disposed between the metal layer and the electromagnetic band gap structure layer and plural first thermal vias. The heat dissipation fin set is disposed on the heat generating element and directly contacts the metal layer. The electromagnetic band gap structure layer has plural conductive patterns arranged in the same pitches. The heat generating element directly contacts at least one of the conductive patterns. The first thermal vias pass through the insulation layer, the metal layer and the conductive patterns. Two ends of each first thermal via respectively connect the metal layer and the corresponding conductive pattern.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 18, 2014
    Assignee: Tatung Company
    Inventors: Shih-Chieh Chao, Chih-Wen Huang
  • Patent number: 8885360
    Abstract: An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: November 11, 2014
    Assignee: Lear Corporation
    Inventors: Slobodan Pavlovic, Nadir Sharaf, Dilip Daftuar
  • Patent number: 8885333
    Abstract: A mobile terminal includes a terminal body, a case defining an appearance of the terminal body, the case formed of a non-metal, and a metal frame formed of a metal, at least part of the metal frame extending through the case from inside to outside of the terminal body so as to be externally exposed, wherein the case and the metal frame are integrally formed with each other. Accordingly, a specific pattern can be realized at the appearance of the terminal body to arouse distinctive attraction to the appearance, thereby providing a terminal with such attractive appearance.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: November 11, 2014
    Assignee: LG Electronics Inc.
    Inventors: Seunggeun Lim, Kyuho Lee, Dongguk Kang, Zhimin Choo
  • Patent number: 8881387
    Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: November 11, 2014
    Assignee: Apple Inc.
    Inventors: Gloria Lin, Wyeman Chen, Michael Nikkhoo, Michael Rosenblatt, Hammid Mohammadinia, Ziv Wolkowicki, Amir Salehi
  • Patent number: 8873248
    Abstract: A decoration plate and an electronic apparatus having the same are provided. The decoration plate includes a cover plate, a conductive ring, an insulating layer, and a conductive element. The conductive ring is disposed on a surface of the cover plate. The insulating layer is disposed on the surface of the cover plate and covers the conductive ring, and the insulating layer has at least one opening. The conductive element is disposed in the opening.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: October 28, 2014
    Assignees: Dongguan Masstop Liquid Crystal Display Co., Ltd., Wintek Corporation
    Inventors: Fu-Min Hsu, Chih-Jung Teng, Kuo-Chang Su, Chin-Liang Chen
  • Patent number: 8873238
    Abstract: A chassis system includes a body, a lid, a cavity, a backplane, and an electrically conductive connector. The lid is removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid. The lid and the body are made of at least one material that does not allow electromagnetic waves to enter the cavity. The backplane is attached to the body or the lid. The electrically conductive connector is attached to the body or lid. The connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane. The chassis system may be used to environmentally protect one or more electronic modules inserted into the cavity of the chassis system.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: October 28, 2014
    Assignee: The Boeing Company
    Inventor: Donald Frank Wilkins
  • Publication number: 20140313687
    Abstract: A printed circuit board assembly comprises a PCB and a shielding structure. The PCB comprises a top surface, a bottom surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A signal transmission line is laid in the top surface. The shielding structure is attached to the PCB and securely contacts the first side surface, the second side surface, the third side surface, and the fourth side surface. Edges of the top surface and the bottom surface are configured to shield EMI in the signal transmission line when transmitting high-speed differential signals.
    Type: Application
    Filed: November 29, 2013
    Publication date: October 23, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: YU-HSU LIN, GUANG-FENG OU
  • Patent number: 8867233
    Abstract: A smart meter protection system for decreasing intensity of radiation going into one's home from a smart meter associated with the building structure includes a redirection mechanism operably associable with the smart meter to partially enclose a smart meter so as to redirect radiation emitted from the smart meter away from the interior of the building structure.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: October 21, 2014
    Assignee: EMF Safety, LLC
    Inventors: Holly Ellen Manion, Alfredo Rodriguez Pacheco, Jr., John O'Melveny Woods, James Joseph Fraley
  • Patent number: 8861221
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: October 14, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventor: Reza Argenty Pagaila
  • Patent number: 8861227
    Abstract: A smart meter protection system for decreasing intensity of radiation going into an interior of a building structure, living area, or where people frequent from a smart meter includes a redirection mechanism operably associable with the smart meter to substantially enclose an outer surface area of the smart meter so as to redirect radiation emitted from the smart meter away from the interior of the building structure, living area, or where people frequent.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: October 14, 2014
    Assignee: EMF Safety, LLC
    Inventors: Holly Ellen Manion, Alfredo Rodriguez Pacheco, Jr., John O'Melveny Woods, James Joseph Fraley
  • Patent number: 8854835
    Abstract: An electromagnetic shield comprises a single sheet of metal having outer and inner peripheries. The outer periphery forms a plurality of outer deflectable fingers extending outward from a bent edge of the outer periphery for contacting a surface of a faceplate. The plurality of outer deflectable fingers is deflectable to allow for installation and removal of the faceplate. The inner periphery has an opening for receiving an HDMI connector and forming a plurality of inner deflectable fingers extending inwardly from a bent edge of the inner periphery. The plurality of inner deflectable fingers is deflectable to allow for insertion and removal of the HDMI connector.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 7, 2014
    Assignee: Crestron Electronics Inc.
    Inventors: Wendy Feldstein, Gregory Sorrentino, Esteban Dragonanovic
  • Patent number: 8852728
    Abstract: There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 ?m, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to ? of the designed width.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: October 7, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Toyomi Matsuda, Makoto Sutou, Tomonori Baba, Daisuke Mitsuhashi
  • Patent number: 8854826
    Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: October 7, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Tetsuya Ohsawa
  • Patent number: 8854836
    Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: October 7, 2014
    Assignee: Finisar Corporation
    Inventors: Hongyu Deng, Yunpeng Song, Maziar Amirkiai, Martin Kalberer
  • Patent number: 8848394
    Abstract: A radio frequency (RF) circuit is configured for impedance matching, such as for mitigating noise. In connection with an example embodiment, an RF circuit includes a transceiver in a substrate, and a conductive ring-type of material in the substrate and around at least a portion of the transceiver circuit. An upper conductive ring material is over the substrate and separated from the conductive ring-type material by an insulating layer. The upper conductive ring material is configured to generate an inductance that matches input impedance characteristics of the transceiver circuit. In some implementations, the upper conductive ring material connects a gate input pin of the circuit with the gate of an input transistor of an amplifier in the transceiver, and exhibits an impedance that matches the impedance of the input transistor.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 30, 2014
    Assignee: NXP B.V.
    Inventor: Cristian Andrei
  • Patent number: 8848368
    Abstract: A computer comprising at least one outer chamber, compartment, or bladder, at least one inner chamber, compartment, or bladder inside said outer chamber, compartment, or bladder, at least one internal sipe separating at least a part of said outer chamber, compartment, or bladder and at least a part of said inner chamber, compartment, or bladder, at least one Faraday cage; and the computer being configured to connect to at least one network of computers and comprising at least a first internal hardware firewall configured to deny access to at least a first protected portion of said computer from said network. At least a portion of an outer surface of said outer chamber, compartment, or bladder is proximate to an outer surface of said computer.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: September 30, 2014
    Inventor: Frampton E. Ellis
  • Patent number: 8844126
    Abstract: Electrical resistance between a male part and a female part through a canted spring is disclosed using mathematical modeling. Increase or decrease in resistance can be quickly analyzed by looking at the equivalence resistance and the number of contacts at the input side, the output side, or both. The number of contacts may also be created by forming a dimple having a discontinuity.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: September 30, 2014
    Assignee: Bal Seal Engineering, Inc.
    Inventors: Jeff Frederick, Steve Rust
  • Patent number: 8848387
    Abstract: The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 30, 2014
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: 8835762
    Abstract: An apparatus for electrical isolation of metallic hardware is provided and includes an item of hardware and an isolation sheet disposed in contact with the item of hardware. The isolation sheet includes first and second opposing sides at least one of which is anodized.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: September 16, 2014
    Assignee: Aerojet Rocketdyne of DE, Inc
    Inventors: Leo Gard, Karl Wefers
  • Patent number: 8837169
    Abstract: An electromagnetic interference (EMI) shielding device includes first and second housing portions assembled along an assembly direction, at least two spaced-apart female fasteners fixed to one of the first and second housing portions, a plurality of male fasteners corresponding in number to the female fasteners and spacedly fixed to the other one of the first and second housing portions, and at least one grip member connected to one of the first and second housing portions. The grip member is applied with a force along the assembly direction or along a direction opposite to the assembly direction to engage or disengage the male and female fasteners.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 16, 2014
    Assignee: Wistron Corporation
    Inventors: Fu-Lung Lu, Yi-He Huang
  • Patent number: 8830033
    Abstract: An active EMI shield for protecting medical instruments from mobile RF emitters uses RFID tags and tag readers to facilitate identification of an RF emitter entering the EMI shield. Clinicians and mobile RF emitters are tagged with RFIDs that indicate their identity, and possibly RF power level. Medical instruments are either tagged with RFIDs that indicate their identity and susceptibility to EMI, or equipped with RFID readers/EMI sensors. The proximity of the RF emitter relative to the medical instrument in terms of power density can then be determined by either position-sensitive RFID readers or the EMI sensors affixed to the medical instruments. The shield is executed by signaling to the tagged RF emitter when it reaches a predetermined proximity relative to the medical instrument.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: September 9, 2014
    Assignee: Avaya Inc.
    Inventors: Guy Michael Anyon Farguharson Duxbury, Alan Graves, Brian Johnson, Jeffrey Fitchett, Peter Ashwood Smith
  • Patent number: 8830697
    Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: September 9, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Wook Kim, Byung Kuk Ko
  • Patent number: 8830687
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: September 9, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Allen E. Oberlin
  • Patent number: 8824166
    Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: September 2, 2014
    Assignee: Apple Inc.
    Inventor: Matthew D. Rohrbach
  • Patent number: 8822843
    Abstract: A printed wiring board including a conductive layer, the conductive layer including a network of nanotubes with respective longitudinal axes, the nanotubes arranged such that their longitudinal axes are aligned substantially parallel to one another in a configuration such that electrical current passing through the conductive layer along a first axis substantially parallel to the longitudinal axes of the nanotubes experiences one degree of dissipation, and electrical current passing through the conductive layer along a second axis experiences a higher degree of dissipation.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: September 2, 2014
    Assignee: Nokia Corporation
    Inventors: Vladimir Ermolov, Markku Anttoni Oksanen, Martti Voutilainen
  • Patent number: 8817483
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: August 26, 2014
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
  • Patent number: 8817489
    Abstract: A structure for stacking Printed Board Assemblies (PBAs) in an electronic device is provided. The structure for stacking PBAs in an electronic device includes a clip mounted on a main Printed Circuit Board (PCB), a sub-PCB including a ground portion, a sub-PBA including the sub-PCB, and a clip header mounted on a lower part of the sub-PBA, wherein the clip header is inserted into the clip. Therefore, electronic components mounted on a main PCB can be shielded from outer electromagnetic waves while reducing material costs without using a shield can, and a sub-PBA can be stacked on the main PBA.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: August 26, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hyun Mo Yang
  • Patent number: 8809697
    Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: August 19, 2014
    Assignee: CareFusion 303, Inc.
    Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
  • Patent number: 8811018
    Abstract: The inner edge of a hole 23 surrounding the outer circumference of a first heat sink 61 includes two edges 23a and 23b that are positioned on opposite sides to each other with the first heat sink 61 therebetween. An upper frame (shield) 20 includes spring portions 24 on one edge 23a, which is in contact with the first heat sink 61 to push the first heat sink 61 toward the other edge 23b. Further, the upper frame 20 includes, the other edge 23b, a position determining portion 25 to which the first heat sink 61 is pressed. According to the above electronic apparatus, it is possible to define the position of a metallic component by a shield covering a circuit board and to cause the metallic component and the shield to be in contact stably.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: August 19, 2014
    Assignees: Sony Corporation, Sony Computer Entertainment Inc.
    Inventors: Kensuke Ikeda, Yukito Inoue, Keiichi Aoki
  • Patent number: 8809687
    Abstract: [Object]To provide a flexible printed board improved in bendability. [Means for solving]The flexible printed board 2 comprises: an insulating substrate 21; a circuit wiring 22 laid on the insulating substrate 21; a circuit protection layer 23 laid on the circuit wiring 22; a shield conductive layer 24 laid on the circuit protection layer 23; and a shield insulating layer 25 laid on the shield conductive layer 24, and is characterized by meeting the following Expression (1). 0.75?E2/E1?1.29??Expression (1) Note that E1 denotes the tensile elastic modulus of the shield conductive layer 24 and E2 denotes the tensile elastic modulus of the shield insulating layer 25.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: August 19, 2014
    Assignee: Fujikura Ltd.
    Inventor: Hirohito Watanabe
  • Patent number: 8804374
    Abstract: An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: August 12, 2014
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, David B. Johnson, Timothy L. McMillan
  • Publication number: 20140218887
    Abstract: The present invention relates to a high-voltage switching device with energy-supply device according to the preamble of the first claim.
    Type: Application
    Filed: October 18, 2012
    Publication date: August 7, 2014
    Inventors: Wladimir Bauer, Anatoli Saveliev
  • Patent number: 8797750
    Abstract: A first metal sheet and a second metal sheet are arranged opposite a printed circuit board including a second connector that fits into a first connector that is arranged at one end of a cable. A hole section through which the first connector passes is arranged in each of the first metal sheet and the second metal sheet. The first connector fits into the second connector by passing through each of the hole sections of the first metal sheet and the second metal sheet. The first metal sheet and the second metal sheet support a connector case of the first connector, thus improving the load bearing characteristics of the cable connection.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: August 5, 2014
    Assignee: Fujitsu Limited
    Inventors: Hideki Maeda, Akira Shimasaki
  • Patent number: 8797763
    Abstract: A shield structure for an electronic element, includes a ground pattern provided in a board; and a first member having electrical conductivity, covering the electronic element, and connected with the ground pattern.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: August 5, 2014
    Assignee: Fujitsu Limited
    Inventors: Naomi Fukunaga, Hisashi Yoshinaga, Junichi Ogou, Naofumi Kosugi
  • Patent number: 8792246
    Abstract: A device for protecting a circuit board from electromagnetic interference, and which includes shield to be attached to the circuit board. The device includes a metal plate and a plurality of tangs. The metal plate has a perimeter portion. The plurality of tangs are spaced about and extend transversely away from at least a portion of the perimeter portion of the metal plate. Each tang includes a bridge portion and a finger portion. The bridge portion has a first end attached to the perimeter portion and a second end spaced away from the perimeter portion and attached to the finger portion. The finger portion extends away from the second end of the bridge potion and is disposed at an obtuse angle relative to the bridge portion such that the plurality of tangs, in combination, are adapted to receive the circuit board.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: July 29, 2014
    Assignee: Fisher Controls International LLC
    Inventors: Scott R. Kratzer, Davin S. Nicholas, Barry L. Gaarder
  • Patent number: 8787038
    Abstract: A chassis for an electronic device includes a main housing and a removable cover. The main housing includes a base plate and two opposite side plates integrally formed together. The removable cover includes a main portion and two opposite side portions. The side portions are latched on the side plates. A space is defined between each side portion of the cover and each side plates of the main housing. A waveguide is formed between each side portion and each side plate to attenuate electromagnetic radiation in the space.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: July 22, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jun-Wei Wang, Qiang Chai
  • Patent number: 8787037
    Abstract: An electronic device includes a shielding member, an electric circuit, and a filter capacitor. The electric circuit has an output line and is arranged inside the shielding member. The filter capacitor is arranged outside the shielding member to be connected to the output line.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: July 22, 2014
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Shimpei Sakoda, Yasuhiro Koike, Hiroaki Asano, Kiminori Ozaki, Sergey Moiseev
  • Patent number: 8780004
    Abstract: An enclosure for an electronic device may include an outer enclosure and an optional metallic cage. The metallic cage may include sides, a bottom and a top that collectively define an enclosed volume, with the top being slanted at a non-zero angle with respect to the bottom. The outer enclosure may at least partially enclose the metallic cage and may define a plurality of structural posts and a top surface that faces the top of the metallic cage. The top surface may define a plurality of recesses, each being configured to receive a wireless antenna of the electronic device. The recesses may be oriented to provide a predetermined angular displacement between the antennas and may be disposed to define a predetermined spacing relative to the metallic cage. A set of beveled through-holes may be defined in the top of the metallic cage, aligned with respective ones of the structural posts.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: July 15, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventor: Kam Cheong Chin
  • Patent number: 8773867
    Abstract: A camera module is disclosed. The camera module in accordance with the present invention includes: a printed circuit board having a grounding pad formed on one surface thereof; a housing mounted on an upper side of the printed circuit board and including a lens inside thereof; a shield covering the housing in order to shield electromagnetic waves from an outside and having an opening cavity formed therein in correspondence with a location of the grounding pad; and a solder formed in the opening cavity and connecting the shield with the grounding pad.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: July 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Yong-Gu Kim
  • Publication number: 20140185265
    Abstract: A structure includes a housing made of a dielectric substance, an electrically conductive member embedded in the housing so as to penetrate the housing, and an electrically conductive pattern which is provided on at least one of surfaces, in which the electrically conductive member lies by penetrating the housing, so that the electrically conductive pattern is electrically connected with the electrically conductive member. The electrically conductive pattern is made up of an electrically conductive film which has no self-shape retention property.
    Type: Application
    Filed: August 9, 2012
    Publication date: July 3, 2014
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Tomofumi Katayama, Nozomu Hikino, Shuhhei Ohguchi, Takashi Naito, Hiroyuki Takebe
  • Patent number: 8767407
    Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: July 1, 2014
    Assignee: LG Electronics Inc.
    Inventors: Gukchan Lim, Hyokune Hwang, Hyunok Lee, Jungwoo Sohn, Jinsu Lee, Taejong Jeong, Dongsu Han, Yongheon He, Hongjo Shim
  • Publication number: 20140177196
    Abstract: The present invention pertains generally to protective cases for laptops which collapses into a rigid pad or lap desk which blocks thermal and/or EMF radiation. Optionally the protective case may have a built-in electromagnetic field (EMF) radiation shield.
    Type: Application
    Filed: August 2, 2013
    Publication date: June 26, 2014
    Inventors: Alaey Kumar, Cary Subel
  • Patent number: 8760886
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture integrally forms a resilient beam portion adjacent an edge thereof carrying a grounding pad.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: June 24, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Edgar Glenn Hassler
  • Patent number: 8760884
    Abstract: The present disclosure provides a portable information apparatus, including, an apparatus main body, an incidental article mounted on the apparatus main body when the portable information apparatus is used, a solid-state magnetic memory provided at a portion of the apparatus main body at which the incidental article is mounted and adapted to retain information in accordance with a magnetization state of a magnetic material, and a magnetic shield provided on the incidental article including a portion opposed to the solid-state magnetic memory when the incidental article is mounted on the apparatus main body.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: June 24, 2014
    Assignee: Sony Corporation
    Inventors: Hiroyuki Ohmori, Masanori Hosomi, Kazuhiro Bessho, Yutaka Higo, Kazutaka Yamane, Hiroyuki Uchida
  • Patent number: 8749988
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: June 10, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Allen E. Oberlin