Abstract: A patient monitoring system detects physiological signals from a patient during an MRI examination. The patient monitoring system wirelessly transmits data associated with the physiological signals to a remote base unit. The wireless transmission of data is carried out in a manner to not be disruptive to the MRI examination. Data can be uploaded to or downloaded from the patient monitoring system and remote base unit using a magnet-friendly electronic storage device, such as a flash memory drive.

Abstract: An energy transfer apparatus with a magnetic shield is configured to magnetically couple energy from a fixed location to a mobile or moveable device within a field-activated space of the energy transfer apparatus. Apparatuses include a location sensing surface and a drive coil arranged in relation to a periphery of the location sensing surface. A magnetic shield plate is disposed below the location sensing surface and the drive coil. The shield plate includes a number of radially oriented slots originating at, and distributed about, a periphery of the shield plate.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: Disclosed is a high frequency wave tuner module including a circuit board having an approximately rectangular shape, which is made of ceramic material and a shield cover to shield an interfering wave by covering a circuit part mounted on a board surface of the circuit board, and a position of the shield cover in a height direction with respect to the board surface is determined by fixing the shield cover to the board surface at four corner positions of the circuit board, and a position of the shield cover in a board surface direction with respect to the circuit board is determined by engaging at least two side walls of the shield cover which extend in a thickness direction of the circuit board, with end surfaces of the circuit board, which correspond to the two side walls.

Abstract: An apparatus includes a portable electronic device and an article of manufacture. The article of manufacture includes a first mechanism for securing the article of manufacture to the portable electronic device. The article of manufacture also includes a second mechanism for defining a slot. The second mechanism is coupled to the first mechanism. The slot is shaped and sized to receive and securely hold a contactless integrated (IC) identification card. The card in question has no more than half of the planar extent defined for a standard ID-1 identification card.

Abstract: An RF/EMI shield has a planar conductive element and a plurality of solder spheres extending around the edges making electrical and mechanical contact with the conductive element to form a shield which can be soldered in a surface mount process directly over components needing shielding. The solder spheres have a diameter sufficient to provide the desired clearance between the shielding element and the component being shielded and a melting temperature equivalent to existing solder contacts to which the shield is bonded.

Abstract: An EMI shielding assembly includes a bracket and a resilient shield. The bracket includes a top wall, a bottom wall, and a pair of sidewalls connected between the top wall and the bottom wall. A first and second opening are defined at opposite sides of the bracket and surrounded by the walls. Two face-to-face L-shaped plates extend from the pair of sidewalls respectively at the second opening. The shield is mounted between the L-shaped plates and covering the second opening.

Abstract: A disk drive cage comprises a bracket (3) and a shielding member (1). The bracket comprises a top wall (31) and a securing wall (32) parallel to the top wall. The securing wall defines a plurality of securing holes (321) therein. The shielding member comprises a shielding cover (20) and a bezel (10) attached to the shielding cover. The shielding cover defines a plurality of cross-shaped slots (23). Each cross-shaped slot comprises a first slot (231) and a second slot (232) crossing the first slot. A receiving area (236) is defined in a crossing portion formed by the first and second slots. The bezel comprises a plurality of securing posts (12) interferentially engaging with the plurality of cross-shaped slots, and a plurality of hooks (162) engaging with the securing holes of the securing wall of the bracket. Each securing post comprises a securing portion (124). The securing portion is larger in cross-section than the receiving area. The shielding member is mounted between the top wall and the securing wall.

Abstract: An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap.

Abstract: A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

Abstract: An image display apparatus is provided. At least one heat radiating frame is stacked in a heat radiating frame coupled between a circuit board and a panel, a heat radiating frame to which the circuit board is fixed can secure a space by a height of a protruded part as the protruded part is formed by drawing the frame itself, and thus fastening means for fixing the circuit board without a PEM nut can be fastened, and as a sound absorbing material is filled within a protruded part formed in a heat radiating frame opposite to the panel, vibration noise generating when driving the panel can be reduced.

Abstract: A shield case is fixed to a surface of a circuit board with a conductive joining material so as to cover a shielded portion on the circuit board surface. The shield case includes joint terminals extending outward and inclined upward from a lower edge thereof that is in contact with the circuit board surface. The joint terminals are joined to the circuit board surface with the conductive joining material provided therebetween. The shield case can thereby be fixed to the circuit board surface, and grounded to a ground portion provided on the circuit board.

Abstract: An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.

Abstract: A shield assembly useful in the attenuation of electronic noise or spurious electric signals. In one embodiment, the shielding assembly comprises a metallic component that is encapsulated with an electronic component to be shielded, such as an integrated circuit. A conductive coating is applied to an exterior surface of the encapsulated metallic and electronic components so that it is in contact with the metallic component. The metallic component is formed using a selective metal deposition process (e.g., electroforming) and a laser-cutting process that increase manufacturing efficiency and provide enhanced mechanical and structural features, including especially the ability to make the shield very thin, have a high degree of co planarity, and maintain a low profile for the shielded electronic component as a whole (i.e., add very little height to that of the electronic component). Methods of manufacturing and utilizing the shielding assembly in designs are also disclosed.

Abstract: Apparatus for protecting a multi-surface housing from mechanical vibration (shock) and electromagnetic interference (EMI). A protection assembly incorporates an EMI shield member with a base portion configured to extend adjacent a first surface of the housing. A tab portion extends from an edge of the base portion adjacent a second surface of the housing. An elastomeric member extends adjacent the second surface and encapsulates the tab portion. The protection assembly preferably forms a tub-shaped recess to receivingly nest the housing. A host device interconnect feature preferably extends from the base portion to facilitate an electrical interconnection of the shield member with a host device. The protection assembly is preferably formed by molding the elastomeric member onto the shield member using an injection molding process. The housing is preferably characterized as a data storage device housing which encloses at least one data storage medium.

Abstract: An optical filter 17 is attached to the display screen surface of a flat display panel 3 of a flat display apparatus. The optical filter 17 is constituted of a lamination of an electromagnetic-wave blocking sheet 17A, an infrared-radiation absorbing and color-tone correcting sheet 17B and an ambient light antireflective sheet 17C.

Abstract: The present invention provides methods and devices for protecting electronic components of handheld electronic devices from electrostatic discharge. An electronic device in accordance with the present invention includes an enclosure having first and second housing portions, a mating edge connection between the first and second housing portions, an electronic component, and an electrically insulating frame. The electrically insulating frame is positioned within the enclosure and surrounds at least a portion of the electronic component thus providing an electrostatic discharge barrier between the mating edge connection and the electronic component.

Abstract: In order to detachably mount a module to a plug-in unit while reliably realizing electromagnetic shielding of the plug-in unit in a communication apparatus having a sub-rack and the plug-in unit electrically connected to the sub-rack, the present invention provides a second shield cover member covering a portion protruding from a front end surface of a printed board in an interface part and having a first opening to expose a connection with an outside provided at a front end of the interface part to the outside, the first opening being in contact with a circumferential surface of the interface part and a shield mechanism interposed between the second shield cover member and a front cover member to cover a gap between a second opening of the front cover member and an outer circumferential surface of the second shield cover member.

Abstract: A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.

Abstract: An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.

Abstract: Safety devices and methods of use thereof are provided for improving electrical safety of insulative tools. In particular, the present invention provides a safety device for improving safety of an elongated insulative tool of a certain length with a substantially circular cross section having a cross sectional diameter and outer circumference, the device comprising a substantially circular disc with an inner opening for said elongated insulative tool to position therethrough, and said inner opening having a bore diameter that is substantially the same as or greater than the diameter of the elongated insulative tool. The present invention further provides novel methods of using through specific arrangement of the safety devices of the present invention on an elongated insulative tool.

Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.

Abstract: A method of manufacture of an integrated circuit package system which includes providing a substrate and attaching a first device to the substrate. Attaching a shield to the substrate. Processing the shield to form apertures and configuring the shield to block electromagnetic energy that passes through the apertures.

Abstract: An electronic device, like a mobile telephone, has a first section and a second section. The first section and second section are coupled together by a mechanical connection, for example a hinge, swivel or sliding connector. Electronic components in the first section are coupled to electronic components in the second section by conductors capable of transferring power between the first and second sections. A current detector is capable of detecting currents, like surface currents, while a controller is responsive to the current detector. A plurality of reactive elements, like capacitors for example, are coupled to a plurality of switches such that the controller may selectively couple any of the plurality of reactive elements to the conductors by actuating a corresponding switch.

Abstract: A printed circuit board unit is configured so that, when a charged electrical circuit unit is electrically connected to the printed circuit board unit, first, the ground potential of the electrical circuit unit is dropped to the frame ground potential, and next, the ground potential of the electrical circuit unit is dropped to the ground potential of an electrical circuit on the printed circuit board unit.

Abstract: Electronic devices can be provided with at least one first circuit component coupled to a first circuit board, at least one second circuit component coupled to a second circuit board, and a mating assembly coupled to the boards for holding them in a vertical stack. The first circuit components can face the second circuit components in the stack. One or more of the first circuit components can be horizontally offset from one or more of the second circuit components in the stack to reduce the thickness of the mated circuit boards. Portions of the circuit boards and the mating assembly can shield the circuit components of the stack from electromagnetic interference.

Abstract: An EMI shield for a transceiver module includes a plurality of collapsible fingers that allow the shield to be sealed at the corners when the transceiver is inserted into a receiving cage. The fingers of the shield are made with a designed interference with the cage, so that the fingers are compressed when the module is inserted into the cage. A pattern of peaks and valleys on the fingers bordering the corners of the shield allows the two adjacent fingers to mesh when the module is inserted into the cage. The meshing of the peaks-and-valleys pattern of the bordering fingers allows the shield to be sealed with a gap width under 0.015?.

Abstract: The present invention relates to a device package, such as an electronic system package, that is suitable for use in harsh military or commercial environments. The package components, including a base enclosure and mating cover, comprise a series of interconnected electrically conductive materials, forming a tortuous electrically conductive path, that advantageously shield electromagnetic interference (“EMI”). The electrically conductive, EMI-shielding layers and other coated layers (e.g., insulative electrocoated paint layers) are smooth layers that provide corrosion resistance to the interior and exterior surfaces of the package. The package is also designed such that its components form a water tight seal. Thus, innovatively, the package comprises a combination of components that synergistically shield electromagnetic interference, resist interior and exterior corrosion, and form a water tight seal. The package is configured to pass military specification EMI and salt fog standard testing.

Abstract: A tuner is disclosed which overcomes a problem related to leakage currents within a tuner associated with increased miniaturization. The tuner includes an oscillator and a cover. The cover includes a barrier region, typically in the form of a slot or an air gap, which impedes the propagation of leakage currents, in the form of eddy currents induced from the oscillator, along the cover from the oscillator region to other components in the tuner, and in particular to the input or output connectors.

Abstract: Certain embodiments relate to electronic devices and methods for forming electronic devices having a component shielded by a reworkable RF shield. The RF shield may be positioned to surround one or more components on a substrate. The RF shield may include a plurality of sidewalls and a top wall, the plurality of sidewalls including bumps extending outward therefrom. A portion of the top wall may be removed from the RF shield. The one or more components positioned under the top wall of the RF shield may be repaired or replaced if necessary. A lid may then be positioned over the removed portion of the top wall and placed so that the bumps engage apertures in the lid and result in the lid being rigidly coupled to the sidewalls. In one aspect of certain embodiments, a groove may be formed on one or more surfaces of the top wall. Other embodiments are described and claimed.

Abstract: A case for an electronic device protects and extends the battery life of the electronic device. The case has a lower case portion and an upper case portion, which assemble together to protect the top, side, and bottom edges of the electronic device. The lower case portion includes a battery to extend the battery life of the electronic device.

Abstract: A structure of mounting a shield cover according to the present invention includes a shield cover having an insertion part which is inserted into a gap formed between a circuit substrate and a shield cover fastening part along the circuit substrate. The insertion part of the shield cover includes a convex part that is elastic and deformable, and the end of the insertion part and the shield cover fastening part come in contact with each other by the elasticity with the convex part being in contact with the circuit substrate as the fulcrum.

Abstract: The present utility model relates to an electromagnetic interference suppressing apparatus for a high-frequency signal generation device. The high-frequency signal generation device includes an inverter means which is used for converting a direct current signal into a high-frequency alternating current signal, wherein the electromagnetic interference suppressing apparatus includes an electric conductor which is in capacitive or inductive coupling with the high-frequency signal generation device and is connected to the reference zero voltage point of the direct current signal. With the present utility model, the electromagnetic interference generated by the high-frequency signal generation device may be effectively suppressed in the case where a reliable earthing is not achievable.

Abstract: The present invention provides a card case that can prevent skimming, when a noncontact IC card is sent to a card user from an issuer of it, or carried by the card user. Since metal films, which shield from an electromagnetic wave, are provided in a card main body, it makes prevention of skimming possible, when the noncontact IC card is sent to the card user from the card issuer. The card user peels off a peeling the section by taking off the seal of openings from an adhesive section, and then insert the card main body having the exposed the adhesive section into a card storing section formed in his wallet or commuter pass holder. As a result, skimming of the IC card can be prevented even when it is carried by the card user in his wallet or the commuter pass holder.

Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.

Abstract: Housing for shielding from electromagnetic interference, comprising a first housing component with a first VELCRO-type fastening element and a second housing component with a second VELCRO-type fastening element each made of conductive material, wherein an aperture between the first housing component and the second housing component is closed in an electromagnetically-sealing manner by a third VELCRO-type fastening element made of conductive material.

Abstract: A module for containing a circuit is provided that attenuates emitted signals without the use of a cover. The module includes a housing and a receptacle. The housing has a front having a certain thickness and the receptacle is accessible from the front of the housing. The receptacle is shaped to receive a circuit component and forms a waveguide.

Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.

Abstract: A shield structure for information technology equipments includes an opening part provided in a portion of the shield structure and a lid covering the opening part. A signal ground line is provided on a printed circuit board accommodated in the enclosure. An electric connection material extends between the lid and the signal ground line of the printed circuit board and has at least a surface formed by an electrically conductive material. The electric connection material is in contact with the signal ground line of the printed circuit board.

Abstract: An unassembled stacked IC device includes an unassembled tier. The unassembled stacked IC device also includes a first unpatterned layer on the unassembled tier. The first unpatterned layer protects the unassembled tier from ESD events.

Abstract: A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and the shielding cover are disposed on the substrate. The chip is electrically connected to the substrate. The shielding cover covers the chip and has leads connected to the substrate. The leads include a first lead and a second lead. The first lead connected to a portion of the substrate is located between the pair of first passive components and arranged along a first axis with the pair of first passive components. The second lead connected to a portion of the substrate is located between the pair of second passive components and arranged along a second axis with the pair of second passive components.

Abstract: An electrostatic discharge (ESD) protection structure with a ground ring and a plurality of pads are provided, wherein the ground ring has a ring inner area used for disposing an integrated circuit (IC) and the pads are disposed around the outer periphery of the ground ring. The ground ring has a plurality of sawtooth structures, wherein each of the sawtooth structures has a sharp end which is adjacent to the corresponding pad.

Abstract: The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.

Abstract: A receptacle cage (100) for receiving a small form-factor pluggable (SFP) transceiver therein includes a cage body (10) inserted into a passage (201) defined in a chassis (200), and a conductive plate (21) attached to outside of the cage body (10), said conductive plate (21) forming a plurality of resilient fingers (26) for grounding said cage body (10) to said chassis (200). The conductive plate (21) forming a front edge portion (282) closed to the cage body (10), a connection portion (284) extending slantways and rearwardly from the front edge portion (284), and the plurality of resilient fingers (26) being listed side by side in a first direction and extending from the connection portion (284), wherein said connection portion (284) extends continuously in a direction perpendicular to the first direction and parallel to corresponding wall of the cage body (10).

Abstract: An EMI shield apparatus for connecting to a CRU frame, a memory unit emitting EMI through a periphery of the CRU frame, the EMI shield apparatus comprising a shield base, a plurality of sides bordering the shield base for blocking EMI emitted from a portion of the periphery of the CRU frame, and a plurality of tabs connected to at least one of the plurality of sides for blocking EMI emitted from the corners of the periphery of the CRU frame when the plurality of sides are in a compressed condition.

Abstract: A method and associated assembly is provided for a collapsible EMC gasket is provided. In one embodiment, the gasket comprises a flexible conductive sheet disposed between corner of a first and a second surface of a computer frame capable of housing electronic components. The sheet is larger in area than the corner area of the frame such that when disposed, said sheet forms a curved structure. The sheet is being fabricated of a material that can be compressed and then decompressed back to its original shape.

Abstract: An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.

Abstract: A plasma display apparatus comprises a plasma display panel and a chassis disposed on a rear portion of the plasma display panel to support the plasma display panel. The chassis is formed of plastic, and thus the weight of the plasma display apparatus is reduced. A conductive grounding member is disposed between the chassis and the plasma display panel. The apparatus further comprises a circuit unit having a grounding portion electrically connected to the conductive grounding member. A thermal conductive sheet is disposed between the plasma display panel and the chassis.

Abstract: Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.

Abstract: A shield for electronic elements of a circuit board includes a frame and a cover, the frame including a peripheral wall comprising a plurality of fixed portions thereon, wherein the fixed portion includes a protrusion and a gap, the protrusion formed on the inner side of the peripheral wall, and the cover has a plurality of folding pieces corresponding to the fixed portions, the folding pieces defines an aperture, and the cover is mounted on the frame, the folding pieces match with the fixed portions correspondingly, the protrusion passes the aperture and locks with the aperture. When the cover is detached, the folding pieces are resisted via the gap to make the protrusion to break away from the aperture of the folding piece, enabling the cover to be opened.