Abstract: An electromagnetic shielding device (ESD) is disposed on a PCB and includes a cover and a conductive rubber frame. The cover is made of a conductive material. and a through hole. The conductive rubber frame encloses the periphery region of the cover, and the partial conductive rubber frame fills in the through hole to affix the conductive rubber frame onto the cover. The conductive rubber frame contacts the PCB and is electrically connected to a ground end of the PCB. The cover and the conductive rubber frame enclose an electronic component disposed on the PCB.

Abstract: A shield casing, which is configured to surround an electronic component mounted on a circuit board, includes a frame body including an engagement recess and a lid body including a hook unit configured to engage with the engagement recess. The lid body is fitted to the frame body to cover the frame body. The hook unit is elastically deformable in a second direction that is opposite to a first direction in which the lid body is fitted to the frame body as the lid body is fitted to the frame body, and then snaps into mating engagement in the engagement recess.

Abstract: A planar circuit housing (300) for containing a planar circuit (120) is disclosed. The planar circuit housing (300) comprises a support portion (341) for supporting edges of the planar circuit (120), the support portion (341) being provided on at least one housing internal surface substantially perpendicular to the planar circuit substrate (120); an upper cavity (380) in the housing (300) above the planar circuit (120); and a lower cavity (382) in the housing (300) below the planar circuit (120), the lower cavity (382) having the same sizes as the upper cavity (380) in directions parallel with the planar circuit substrate (120).

Abstract: A detector includes a scintillator, a light guide, at least one photomultiplier, and a shield for the at least one photomultiplier. The at least one photomultiplier may be supported by a non-magnetic material. The shield includes a magnetic shield in front of the scintillator and a magnetic shield enclosing the at least one photomultiplier.

Abstract: A mounting assembly for shielding EMI, the mounting assembly includes a drive bracket (10) and a shielding apparatus (30). The drive bracket includes a bottom wall (11), a first retaining wall (16), a second retaining wall (18), and a dividing wall (15), the first retaining wall defines a first hole (161), the second retaining wall defines a second hole (181), the dividing wall defines an upper hole (153) and a lower hole (151). The shielding apparatus includes a shielding cover (31) and a bezel (33), the shielding cover has a first flange (36) and a second flange (38), the first flange has a protuberance (361) engaged in the first hole, the second flange has a protuberance (381) engaged in the lower hole, the second shielding apparatus (40) engaged in the upper hole of the dividing wall and the second hole of the second retaining wall.

Abstract: An electronic apparatus includes: a first circuit board having a mounting surface; a shield casing disposed so as to face the mounting surface of the first circuit board and cover an electronic component mounted on the mounting surface; a battery disposed so as to face the shield casing at a position next to the first circuit board in a first direction which is parallel to the mounting surface of the first circuit board; and a first rib provided on a surface of the shield casing so as to extend in the first direction, one end of the first rib being disposed at a position corresponding to the first circuit board in a second direction, the other end of the first rib being disposed at a position corresponding to the battery in the second direction, the second direction being perpendicular to the mounting surface.

Abstract: An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height similar to a height of the surface mount devices.

Abstract: Various arrangements of carrier trays and carriers for data storage devices, such as disk drives, are disclosed. The arrangements of carrier trays and carriers are arranged to be rigid, and therefore more resistant to vibration arising from operation of the data storage device in the tray and neighboring data storage devices, and/or easier to use.

Abstract: The invention relates to an electrical device comprising a supporting substrate (1) which supports electronic components (2) as well as a strip conductor structure for connecting the electronic components (2) and on which an electrically conducting shielding element is disposed that surrounds the strip conductor structure and the components (2). The shielding element is composed of a first pot-type shielding part (7), the edge region of the hole of which rests upon contact areas (5) of a first surface (8) of the supporting substrate (1), said contact areas (5) being connected to a fixed electrical potential, and a second pot-type shielding part (9), the edge region of the hole of which rests upon a second surface (10) of the supporting substrate (1). The shielding parts (7 and 9) can be fastened to the supporting substrate (1) by means of fastening attachments which engage into first recesses (6) of the supporting substrate (1).

Abstract: A shielding case for accommodating a wiring board includes a board mounting member with a fitting member formed at an outer frame thereof so that the wiring board is fixed and held to the board mounting member through fitting of the fitting member into a through hole formed at the wiring board.

Abstract: In a medical implantable device having a hermetically sealed, radio shielded encapsulations containing an RF circuit therein and having an antenna located outside of the encapsulation, and in a method for connecting the RF circuit to the antenna, at least one hermetical feedthrough connection is provided in the form of at least one conductor passing through a wall portion of the encapsulation in a liquid-tight and gas-tight manner, with the feedthrough being electrically insulated from the encapsulation. At least one connector pin is provided on an RF circuit board, which is resiliently mounted on the RF circuit board. The RF circuit is mounted in the encapsulation so as to cause the connector pin to resiliently engage the conductor and to electrically connect the conductor with the RF circuit board.

Abstract: Exemplary embodiments disclosed herein may include two layers with a crystal positioned therebetween. Electromagnetic radiation sources may be positioned adjacent the crystal layer. A thin shield may then enclose this entire assembly. A small flat magnet may be positioned adjacent to the shield, with the opposite side of the magnet adjacent a sealed barrier. The item to be protected may be adjacent the opposite side of the barrier.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly prior to bonding of a core member and a second skin member to the first skin member and frame assembly.

Abstract: An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly prior to bonding of a core member and a second skin member to the first skin member and frame assembly.

Abstract: An isolating cover includes a cover plate and a base integrally coupled with each other. The base comprises a base body formed by four inverted-L-shaped frame members, at least one small protruded dot disposed at each external side of the frame members, and at least one pair of soldered pins disposed at the lower edge of the base, wherein a rectangular or wide L-shaped hole is disposed in the middle of the base body and some grooves are disposed at four corners, at two internal edges, or at each internal edge of the rectangular or wide L-shaped hole. The cover plate is a plate body, wherein some protruded boards are disposed at four corners, at two external edges or at each external edge thereof, and a notch is disposed at an external edge thereof for prying open the plate body.

Abstract: The present invention provides a shield structure for an electronic device allowing conductive members to be connected electrically to each other at low impedance while preventing the leakage of electromagnetic waves effectively. The first conductive member and the second conductive member for enclosing the electronic device respectively have laid portions that are laid one on the other and fastened to each other at plural positions by means of screw members. Through-holes into which the screw members are to be inserted are formed on both of the laid portions. Protruding portions, which protrude toward the laid portion of the second conductive member, each are formed between the adjacent through-holes on the laid portion of the first conductive member. The protruding portions each have a shape extending in the direction connecting the adjacent through-holes and bulging from both ends toward the center thereof in a smooth curve.

Abstract: A system for protecting electronic components to be disposed inside a computer housing comprising a gliding connector aligner for disposing inside the housing. The aligner has a central flat surface to be disposed over electronic components and a plurality of appendages with at least one nub each disposed at an opposing end to that of the central surface. The appendages are substantially perpendicular to the flat surface. An EMC gasket is also provided around the housing. The gasket in one embodiment has a plurality of portions with each portion having a central support line from which a plurality of complementary spring fingers emanates. The portions are connected to one another via a tab such that said gasket can be stretched around all housing corners such that said spring fingers from different portions are placed in a substantially perpendicular direction to one another.

Abstract: Magnetic shielding for surrounding a magnet generating a magnetic field of maximum magnetic flux density substantially in excess of 5 Gauss, so as to reduce the magnetic flux density outside the shielding to no more than 5 Gauss wherein at least part of the shielding is composed of sheets of grain-oriented steel.

Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.

Abstract: A plasma display device is disclosed. In one embodiment, the plasma display device includes a plasma display panel (PDP), a chassis base having one side for supporting the PDP, and a printed circuit board assembly (PBA) mounted on another side of the chassis base. The chassis base includes a main frame mounted on the PDP, a bracket mounted on the main frame, a sub-frame mounted on at least one of the main frame, the bracket, and the PDP, and a shield box that is mounted to at least one of the main frame, the bracket, and the sub-frame, and that includes the PBA. One embodiment reduces weight of a chassis base and manufacturing cost, and improves impact resistance of a PDP.

Abstract: A shielded stacked integrated circuit package system is provided including forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Abstract: Remote enclosure systems have now been designed and are described herein that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups.

Abstract: A grounding structure of a liquid crystal module is disclosed. The grounding structure is adapted for protecting a control printed circuit board of the liquid crystal module from electro-magnetic interference. In one embodiment, the grounding structure comprises: i) a frame configured to receive the control printed circuit board, ii) a grounding conductive sheet, wherein one end of the grounding conductive sheet is electrically connected to the control printed circuit board, and the other end comprises a first engaging member and iii) a metal bezel configured to lock around the frame, the metal bezel including a second engaging member, wherein the second engaging member engages with the first engaging member.

Abstract: Disclosed herein is a shield for electrically shielding an electronic device. The shield includes a molded base and a first coating layer. The molded base includes a first portion and a second portion. The second portion comprises a resilient material connected to the first portion by being molded or extruded onto the first portion. The first coating layer is deposited on the second portion. The first coating layer includes an electrically conductive material.

Abstract: A system having a heat exchanger with a bottom side, a first nonconductive layer coupled to the bottom side of the heat exchanger, a heat shield made of an electrically conductive material and being coupled to the first nonconductive layer, and an electrical connector electrically coupled to the heat shield, the electrical connector being capable of being connected to an electrical ground.

Abstract: A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.

Abstract: An object of the invention is to provide a communication terminal capable of keeping the reception sensitivity good if the communication terminal is placed on a metal plate with the communication terminal laid on its side without the need for changing the size or the design of the main body of the communication terminal. A board (125) to which an antenna (107) is connected is provided inside a lower casing (105). The board (125) is provided with a GND plane to which a radiating element (121) is connected. An auxiliary bottom board (123) is joined to the radiating element (121) in a roughly perpendicular direction thereto. The radiating element (121) and the auxiliary bottom board (123) are conductors. A high-frequency current (131) flows into the board (125).

Abstract: A shielding apparatus is provided. The shielding apparatus comprises a substrate on which an electronic device is mounted, a molding layer on the substrate, a conductor layer on a surface of the molding layer, and a ground member electrically connecting a ground terminal of the substrate with the conductor layer.

Abstract: A conductive shield for surrounding a high efficiency light bulb such as a spiral fluorescent bulb is described. A conductive curtain having apertures through which light may pass is connected to the threaded grounded base of the bulb. The apertures in the curtain present high impedance to stray electrical energy (SEE) from the bulb thereby reducing SEE.

Abstract: Disclosed herein is an electromagnetic wave shield box for shielding a wireless terminal received therein from external electromagnetic waves.

Abstract: A folded EBG structure has a plurality of cells arranged in a two-dimensional array. Each of the cells has an electrically conductive patch and an electrically conductive via coupled between the patch and a ground plane. In one dimension of the folded EBG structure, at least one patch in that dimension is folded into three sections located in different planes. In general, both ends of the folded EBS structure have folded patches. Via walls having electrically conductive vias are provided on both ends of a folded EBG structure for connecting the cell vias to the ground plane. The distance between each via wall and the folded EBGs is substantially equal to the length of the vias connected to patches.

Abstract: A handheld electronic device may include a portable housing and a shielding container within the portable housing. The shielding container may include a shielding frame and a shielding lid carried thereby. A printed circuit board may be within the shielding container. The shielding frame may include a planar base with at least one opening therein, a pair of opposing side walls integrally formed with the base and extending upwardly therefrom, and a pair of opposing end walls integrally formed with the base and extending upwardly therefrom. Also, the shielding frame may include at least one intermediate partition wall integrally formed with the base and extending upwardly therefrom to define a plurality of container compartments. The partition wall may also extend only partway between the opposing side walls to define at least one partition end gap therewith.

Abstract: Methods and apparatus for providing electromagnetic interference (EMI) shielding for a module receiving area within a computer server housing configured to receive an input/output (IO) module are disclosed. The module receiving area is covered with a door. EMI shielding is provided by transitioning the door from a closed position to an open position in response to a force applied by the IO module, maintaining contact between the IO module and the door while the door is open to provide EMI shielding for the module receiving area when the IO module is present, and transitioning the door from the open position to the closed position in response to removal of the force applied by the IO module when the IO module is withdrawn from the module receiving area to provide EMI shielding for the module receiving area when the IO module is not present.

Abstract: A housing combination includes a housing (51) and a shielding enclosure (55). The housing has a peripheral wall and a receiving hole (511). The peripheral wall surrounds the receiving hole configured for receiving a surface contact card. A guiding element (52) is positioned in at least one part of the peripheral wall of the receiving hole. The shielding enclosure is disposed at one side of the housing, one part of the shielding enclosure exposed from the receiving hole configured for supporting the surface contact card.

Abstract: To reduce cross-talk between adjacent hot electrodes, the present invention provides a ground plane, which extends beneath each side of a MEMS mirror platform covering opposite edges of a hot electrode along each side thereof. The ground plane includes an overhang section extending between the mirror platform and the hot electrode forming a first gap between the hot electrode and the overhang section, and a second gap between the overhang section and the mirror platform. The method of the present invention enables highly accurate construction using lithographic patterning and deep reactive ion etching (DRIE).

Abstract: A device has a magnetically shielded component that is magnetically shielded from an external magnetic field, and a housing. The housing is made from a ferritic stainless steel that has an austenitized surface layer rendered on the surface, and an internal layer portion having an internal ferrite phase that functions as a magnetic shield for the magnetically shielded component.

Abstract: According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the integral top surface. The interlock releasably attaches the integral top surface and upper sidewall portions to the lower sidewall portions. By disengaging the interlock, the integral top surface and upper sidewall portions may then be completely separated from the lower sidewall portions. The integral top surface and upper sidewall portions may also be reattached to the lower sidewall portions by engagement of the interlock.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Abstract: A gasket includes a body, a projection and a conductive fiber member. The body includes: a PDP-side face facing an electrode face of a PDP; and a chassis-side face facing a grounding electrode face of a chassis. The projection is raised from a first end of the body upward to an inner surface of a front case. The conductive fiber member is continuously formed to cover the PDP-side face, a connecting face and the chassis-side face of the body.

Abstract: A shielded high-frequency circuit module includes a conductive frame electrically coupled to a top surface of a printed circuit board and a lid. The conductive frame includes inner walls, which define a circuit region, at least a portion of which includes a circuit on the top surface of the printed circuit board. The shielded high-frequency circuit module also includes a connector for interfacing the circuit region with high-frequency signals outside the conductive frame, at least a portion of the connector being electrically coupled to the conductive frame. The inner walls of the conductive frame, the top surface of the printed circuit board and the lid define a shield surrounding the circuit region.

Abstract: According to one embodiment, a shield case device includes: a shield case; a heating element that is mounted on a circuit board housed in the shield case; and a heat conducting member that is provided between the shield case and the heating element, the heat conducting member thermally conducted to the shield case and the heating element, wherein the heat conducting member includes a first contact portion which is in contact with the shield case and a second contact portion which is in contact with the heating element, wherein the shape of the heat conducting member is a chimney structure having a ventilation duct.

Abstract: According to one embodiment, a capacitor arrangement support system includes a resonance analysis module configured to perform a resonance analysis based on data of a component producing electromagnetic radiation, a resonance point extraction module configured to extract a resonance point from an analysis result of the resonance analysis module, an electromagnetically radiated energy analysis module configured to analyze the ease of collection of electromagnetically radiated energy with respect to a resonance point extracted by the resonance point extraction module, a determination module configured to determine whether or not an absolute value of a value showing the ease of collection of electromagnetically radiated energy is larger than a preset absolute value, and a capacitor arrangement module configured to arrange a capacitor for suppressing electromagnetic radiation at a resonance point where the determination module determines that data of the component is larger the preset absolute value.

Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.

Abstract: Insulated conducting devices and related methods are disclosed. An insulated conducting device for a voltage structure comprises: a conductor connected to a voltage; and multiple insulation segments enclosing the conductor, the multiple insulation segments interfacing with one another.

Abstract: An inverter (10) includes a circuit board (20) including a transformer (40) disposed thereon, and a shield cage assembly (60) for enclosing the transformer. The shield cage assembly includes an insulative cage (602) defining an inner receiving space (6028) for receiving the transformer, a first conductive cage (604) defining a first receiving space (6048) for receiving the insulative cage, and a second conductive cage (606) defining a second receiving space (6068) for receiving the first conductive cage. The shield cage assembly blocks EMI emitted by the transformer from interfering with electronic components out of the shield cage assembly, thus enabling the electronic components to perform more reliably.

Abstract: Disclosed is an apparatus for improving server electromagnetic shielding at high and low frequencies, including a metallic plate in fixed association with a surface of a server casing, the metallic plate defining a plurality of openings, and a substantially plastic shield including conductive metal fibers and defining a plurality of bosses extending from a boss surface of the plastic shield, the bosses configured to be insertable within the plurality of openings to allow the boss surface to be disposed adjacent to the metallic plate, each of the plurality of bosses defining a boss cavity that extends entirely through the plurality of bosses and the plastic shield.

Abstract: A system including an EMI shield. In an embodiment, the system includes a chassis with at least one bay for receiving a replaceable unit and a lip. The replaceable unit includes a housing and a faceplate. Further, a gasket is operationally coupled to the replaceable unit housing and the replaceable unit faceplate for reducing electromagnetic radiation emissions from the replaceable unit and chassis interface. The gasket may include four sides which are configured to provide a varying force-compression curve along the length of the gasket. Upon installation of the replaceable unit, the lip defined within the chassis compresses the gasket to provide a constant force per unit length and form an electromagnetic interference shield with uninterrupted electrical conductivity.

Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.

Abstract: An exemplary flat panel display (1) includes a display panel (20), a circuit board (30) and a metal shield (40). The display panel includes a first back (200). The metal shield is secured at the first back of the display panel, including a first housing (45) portion adjacent the first back of the display panel. The circuit board including a power unit (302), a display unit (304) and a switch unit (306) integrated on the circuit board that is accommodated in the first housing portion. An area of the metal shield is smaller than that of the display panel. The flat panel display is convenient for assembly in a reduced weight and a lowered cost.