Abstract: An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to at least one metal trace on the first surface of the substrate. A non-conductive coating covers exposed active surfaces on the first surface of the substrate. A conductive coating is applied to the non-conductive coating, and electrically contacting ground pads exposed on the substrate.

Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.

Abstract: A novel information storage device is disclosed and claimed. The information storage device includes a disk drive, a disk drive printed circuit board, and a first conductive shield over the disk drive printed circuit board and electrically coupled to the disk drive. The information storage device also includes a bridge controller printed circuit board and a second conductive shield over and electrically coupled to the bridge controller printed circuit board. The first and second conductive shields are in direct contact with each other. A disk drive interface connector electrically couples the bridge controller printed circuit board with the disk drive printed circuit board. A third conductive shield is attached to the disk drive interface connector and is in direct contact with both the first and second conductive shields.

Abstract: Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.

Abstract: A device may include a connector receptacle coupled to a motherboard; a connector hold-down disposed adjacent to the connector receptacle; and/or a connector cage coupled to the motherboard and covering the connector receptacle and connector hold-down. Additionally, a computer system utilizing a connector hold-down and a method utilizing a connector hold-down are disclosed.

Abstract: A display device includes a display panel, and a chassis supporting the display panel, and including a conductive material. The display device includes a circuit board including a signal wiring connected to the display panel to apply a driving signal to the display panel, and a grounding wiring for grounding. The display device includes a connector connected with a signal cable that applies an external signal and is connected to the signal wiring and the grounding wiring of the circuit board. The display device includes an exposed grounding unit exposing part of the grounding wiring on the circuit board, wherein the exposed grounding unit is disposed adjacent to the connector. The display device includes a conductive member which connects the exposed grounding unit with the chassis.

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

Abstract: A shielding assembly (10) for electronic device is provided. The shielding assembly (10) comprises a plastic layer (12), a metal foil (16) mounted to the plastic layer (12), and a coolant (14) is formed between the plastic layer (12) and the metal foil (16). An electronic device using the shielding assembly is also provided.

Abstract: The present invention provides a configuration of an electronics enclosure, including a computer chassis in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic “patterns” may be stamped, molded, cut, or extruded into a lid and a five-sided “box” to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.

Abstract: A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested.

Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.

Abstract: Shielding structure for use in an electronic device comprising a housing and an electronic substrate which is arranged in the housing and which includes electronic parts, wherein the housing includes at least a surface facing the electronic parts, the surface being made of an electrically conductive substance. There is disposed a shielding member made of electrically conductive material comprising a frame-shaped section disposed on the printed board to surround a periphery of the electronic parts and a leaf spring section disposed to project from an upper-edge section of the frame-shaped section toward the inside of the frame-shaped section and upwardly in an inclined direction. The shielding member is disposed on the electronic substrate, and the surface made of an electrically conductive substance of the housing pushes the leaf spring section to be brought into contact therewith.

Abstract: A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

Abstract: A method and system for protecting a user from exposure from radio waves emitted from a wireless transmitter include at least a layer of dielectric material to operate on the radio wave through reflection, refraction, diffraction, absorption, polarization and/or scattering of the wave. The characteristics and arrangement of multiple layers of shielding on portions of or all of a face plate may significantly reduce exposure to electromagnetic waves and the deleterious effects associated with over exposure. The shielding can be applied subsequent to manufacture, during manufacture or incorporated into structures which may form the transmitting device.

Abstract: According to various aspects, exemplary embodiments are provided of slide assemblies for slidably opening and closing portable communications terminals, which also are configured to provide electromagnetic interference (EMI) shielding for electronic components of a substrate, such as board-mounted electronic components on a printed circuit board (PCB) of a cellular phone, etc. In one exemplary embodiment, a slide assembly generally includes first and second slide members slidably coupled so as to allow the first slide member to be slidably moved relative to the second slide member. EMI shielding structure is along at least one surface of at least one of the first and second slide members.

Abstract: A portable computer having a partially sealed cooling system is disclosed. The portable computer contains heat transfer materials that function to remove heat from a sealed area of the portable computer to an unsealed area where the heat may be more effectively dissipated. A portable computer having a power source shield is also disclosed. The shield may be formed to partially surround a portion of the power source, and may be formed by partially enclosing a power source in a conductive material; forming an opening in the conductive material on one side of the power source; installing the power source near an edge of the electronic device; and orienting the power source so that the opening faces the edge of the electronic device.

Abstract: An exemplary display apparatus (2) includes a front cover (21) having an opening (210) and a peripheral side (211) beside the opening; an on screen display button board (22) having a main body (223) with locating holes (2234); and a display panel (23) having a display area (231) corresponding to the opening of the front cover and a peripheral area (232) around the display area. Locating pins (216) are provided on a rear face (215) of the peripheral side, and the locating pins pass through the locating holes of the main body, as well as part of the peripheral area of the display panel is overlapped with the main body, thereby, the main body of the on screen display button board is sandwiched between the rear face of the peripheral side of the front cover and the display panel.

Abstract: Apparatus includes a chassis assembly, a computing device configured to connect to a housing of the chassis assembly, and a line cord supplying power to the chassis assembly. The line cord has a first portion external to the chassis assembly and a second portion internal to the chassis assembly. The second portion has a shielding member that is in conductive contact with the housing to provide electromagnetic interference (EMI) shielding for the chassis assembly.

Abstract: According to one embodiment, a USB port for connecting a note PC to an external device includes a rib structure that faces an opening formed in a side wall of the housing of the note PC and receives a gasket. The rib structure includes a frame member surrounding the gasket, and a plurality of ribs. The frame member has a cutout formed in a portion thereof remote from the side wall. When the gasket is pressed and elastically deformed by the receptacle of a connector, the deformed portion of the gasket escapes through the cutout.

Abstract: A digital camera contains a circuit board and a battery box inside a housing. The housing and the battery box are made of plastic. The housing is fixed to the battery box with a tapping screw. A conductive plate for preventing the tapping screw from being charged is arranged between the housing and the battery box. Projections of the conductive plate penetrate into thread grooves of the tapping screw. The conductive plate transmits static electricity of the tapping screw to a grounding member of the circuit board.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.

Abstract: A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can.

Abstract: An electronic module (10) includes a housing having outer surface, a metal gasket (5) attached to the housing and covering the outer surface. The gasket (5) has a set of first detents (53) and a set of second detents (52). The set of first detents (53) are spaced apart from each other and the set of second detents (52) substantially cover seams between the set of the first detents (53).

Abstract: A shield case includes a first shield member and a second shield member coupled to the first shield member to form the shield case. a concave portion is capable of accommodating a sealing member for sealing inner space of the shield case by contacting the first shield member and the second shield member, and is formed on the second shield member. On each of the first shield member and the second shield member, a paint film portion is formed on an area of the shield case external to the concave portion. On the first shield member or the second shield member or combination thereof, a convex portion is formed on the area of the shield case on the inner space side and internal to the concave portion. The surfaces of the first shield member and the second shield member contact each other at the convex portion.

Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.

Abstract: An electromagnetic interference shield system is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.

Abstract: An anti-electromagnetic interference (anti-EMI) shielding device for fastening to a PC board is disclosed. The anti-EMI shielding device includes a frame having an upper lid closed onto an open top thereof, the frame including a plurality of side walls sequentially connected to one another to enclose a space therein and having a receiving hole formed on one of the side walls at a predetermined position; a connector including an annular ring portion, a body portion, and a tubular portion following the body portion, the annular ring portion being located at a front end of the connector for engaging with the receiving hole on the side wall of the frame; and a sealing structure forming a 360-degree sealing between the frame and the connector to effectively prevent electromagnetic wave from leaking out of and entering into the shielding device.

Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.

Abstract: An electromagnetic interference shielding device includes a printed circuit board, a metal member and an elastic member. The elastic member includes a first resisting portion which contacts the printed circuit board and a second resisting portion which contacts the metal member, and the second resisting portion is saw-toothed, and is capable of piercing an oxidized layer of the metal member. Thus, the elastic member keeps contacting the metal member maximally no matter the metal member is oxidized or not, and reduces the electromagnetic interference effectively.

Abstract: An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap.

Abstract: There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at least one inductor formed of a conductive pattern and provided between the conductive shield patterns.

Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

Abstract: An electromagnetic shield is for covering an electronic component on a printed circuit board. The electromagnetic shield includes a frame and a lid. The frame is welded onto the printed board and surrounds the electronic component. The frame defines a slot near the top of the frame. The lid passes through the slot and seals the top of the frame.

Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.

Abstract: A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.

Abstract: An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.

Abstract: A shield case includes at least one tongue piece which is formed of a conductor and protrudes to an outside of the shield case. Further, the shield case is formed of a conductor, and an element is housed inside the shield case.

Abstract: A shield for electronic elements of a circuit board includes a frame and a cover, the frame including a peripheral wall comprising a plurality of fixed portions thereon, wherein the fixed portion includes a protrusion and a gap, the protrusion formed on the inner side of the peripheral wall, and the cover has a plurality of folding pieces corresponding to the fixed portions, the folding pieces defines an aperture, and the cover is mounted on the frame, the folding pieces match with the fixed portions correspondingly, the protrusion passes the aperture and locks with the aperture. When the cover is detached, the folding pieces are resisted via the gap to make the protrusion to break away from the aperture of the folding piece, enabling the cover to be opened.

Abstract: An energy transfer apparatus with a magnetic shield is configured to magnetically couple energy from a fixed location to a mobile or moveable device within a field-activated space of the energy transfer apparatus. Apparatuses include a location sensing surface and a drive coil arranged in relation to a periphery of the location sensing surface. A magnetic shield plate is disposed below the location sensing surface and the drive coil. The shield plate includes a number of radially oriented slots originating at, and distributed about, a periphery of the shield plate.

Abstract: A communication device includes a first printed circuit board (PCB), a second PCB disposed parallel to the first PCB, a first shielding cage and a second shielding cage. The first and second shielding cages are fixed to the first and second PCBs and define at lease one first and second receiving space to receive at least one transceiver modules, respectively. The first and second shielding cages include at least one first and second retaining tabs, respectively. Each of the transceiver modules received in the first and second shielding cages includes a release mechanism configured with a release portion and a trigger. The release portions can match one corresponding first and second retaining tabs to release the corresponding transceiver module. The triggers are disposed on one side of the transceiver modules close to the first and the second PCBs.

Abstract: A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.

Abstract: A display device includes a panel assembly which forms an image, an accommodating member which accommodates the panel assembly, at least one printed circuit board (“PCB”) installed on a back side of the accommodating member, and an electromagnetic wave shielding member disposed between the accommodating member and the PCB, and including a plurality of protrusions.

Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.

Abstract: A handheld electronic device including a first body, a second body, a sliding module, and a shielding member is provided. The sliding module drives the first body and the second body transforming between a retracting state and a spreading state. The sliding module includes a sliding member, a fixing member and a driving member. The sliding member has an opening and when the first body and the second body configure in the spreading state, a part of the opening is exposed. The shielding member is coupled to the driving member. When the first body and the second body are transformed from the retracting state to the spreading state, the driving member drives the shielding member sliding with respect to the sliding member to shield the part of the opening.

Abstract: The present invention provides a card case that can prevent skimming, when a noncontact IC card is sent to a card user from an issuer of it, or carried by the card user. Since metal films, which shield from an electromagnetic wave, are provided in a card main body, it makes prevention of skimming possible, when the noncontact IC card is sent to the card user from the card issuer. The card user peels off a peeling the section by taking off the seal of openings from an adhesive section, and then insert the card main body having the exposed the adhesive section into a card storing section formed in his wallet or commuter pass holder. As a result, skimming of the IC card can be prevented even when it is carried by the card user in his wallet or the commuter pass holder.

Abstract: A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.

Abstract: A shielding cage for receiving a plurality of electronic modules includes a bottom cage portion and a plurality of independent upper cage portions each one of which comprising a top wall and two lateral walls adapted to cooperate with the bottom cage portion. Furthermore, each of said upper cage portions defines with the bottom cage portion a respective compartment having an inner cavity for receiving an electronic module, and a subdivision of said bottom cage portion provides for a bottom wall of said compartment.

Abstract: Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.

Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.