Abstract: An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate.

Abstract: A shield shell 40 is composed of a tubular shell body 41 made of a conductive resin and a metallic conductive body 46 mounted in the shell body 41. The conductive body 46 is capable of, in the base end part, connecting with a shielding member 22 by being exposed on the surface of the shell body 41, while in the tip part, connecting with a shield case 11 by being exposed on the surface of the shell body 41. The shielding member 22 and the shield case 11 are connected via the metallic conductive body 46 of a low electric resistance, and thereby achieving excellent shielding performance in a low-frequency region in the shield shell 40.

Abstract: To effectively suppress an adverse effect of radiation of electrical noise on other electronic circuits and increase the mounting strength of the electronic part on the substrate, where the electrical noise is noise emitted from an electronic part installed on a substrate. The tip of a nozzle for filling with a reinforcing resin is protruded into a noise shielding case through an elongated hole formed in the top board part of the noise shielding case, and the reinforcement resin is placed between the lower surface of the electronic part and the upper surface of the substrate. This realizes the noise shielding case in which a peripheral wall part surrounding the outer surfaces of the electronic part and the top board part covering the upper surface of the electronic part are integrated together. The noise shielding case prevents leakage of radiation of electrical noise from the electronic part.

Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.

Abstract: The present invention is directed to an apparatus for reducing and constraining EMI (electronic magnetic radiation) emissions without affecting the internals of data storage system components. A baffle is attached to the exterior of the housing of a data storage system component by baffle mounts. The baffle is operable between a closed position, where the baffle blocks EMI emitted by connectors on the data storage system component, and an open position, where the connectors are not blocked allowing for servicing and cable management. The baffle may comprise an EMI absorbing material and be tuned to meet specific EMI requirements. The baffle mounts offsets the baffle from the data storage system component and the baffle includes a number of holes to allow airflow. The adjustable EMI baffling apparatus does not interfere with other mounted components while the data storage system component is mounted in a cabinet.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is neatly finished, and the display screen looks bigger than it actually is.

Abstract: A shielding enclosure (70) includes a cover (72) and a plurality of flanges (74) extending from the cover. At least one flange defines a fixing piece (76). The fixing piece has at least one retaining portion (764), and the retaining portion provides a space (78) allowing a tool is inserted in a generally perpendicular direction relative to the cover of the shielding enclosure.

Abstract: A highly reliable covered multilayer module includes a plurality of side electrodes extending in a lamination direction of ceramic layers are provided at least at one of side surfaces of a multilayer module body. At least one of inner conductor layers is exposed at the side surface provided with the side electrodes, in a region interposed between an adjacently arranged pair of the side electrodes. A claw portion of a metal case is soldered to the side electrodes and the inner conductor layer. The plurality of inner conductor layers may be exposed at the side surface of the multilayer module body in the region interposed between the adjacently arranged pair of side electrodes such that at least a part of the inner conductor layer is superposed on the other inner conductor layer when seen in the lamination direction of the ceramic layers.

Abstract: An electromagnetic shield comprising an electrically conductive frame for establishing electrical contact between a chassis wall and an expansion card mounting bracket. The frame has a plurality of spring fingers interconnected about a perimeter of a central opening in the frame, wherein each spring finger defines a central axis that extends outwardly away from the central opening. The frame may include a substantially planar portion adjacent the central opening in the frame, wherein the plurality of spring fingers incline along the central axis to extend out of the plane defined by the substantially planar portion. The incline of the spring fingers allows a mounting bracket to slide laterally without jamming against the side of a spring finger during installation, removal or side-to-side shifting of the mounting plate.

Abstract: A sensing unit comprising sensor means enclosed in a casing made of a ferromagnetic material, to achieve a ferromagnetic shield. The sensing unit may further include signal processing means, also enclosed in the ferromagnetic casing. A distributed system for measuring, processing and displaying information from a plurality of sensors comprises a plurality of sensor units. A method for quick detection of offenders of oil, gas or other pipes, by monitoring the protective cathodic voltage and detecting quick changes in the voltage. A method for detecting leakage from a pipe using multiple channels/inputs, wherein a low frequency range input measures seismic noises, and a high frequency range input measures cavitation noises, and wherein a leakage indication is issued if both the low frequency and high frequency noises are simultaneously detected.

Abstract: A very light enclosure for electronic systems incorporates a rigid core enclosure structure formed with forward and rearward rigid, zig-zag configured, generally open mesh structure stabilization frames extending between oppositely disposed connection ends. The connection ends are rigidly attached to oppositely disposed sheet metal side assemblies to complete the core enclosure structure. The structure stabilization frames directly support card guides and power supply modules on oppositely disposed sides of a backplane tray.

Abstract: A high frequency unit (e.g., an RF signal selection switch) includes, as its external terminals, a terrestrial input terminal, a CATV input terminal, an RF output terminal, a selection signal terminal, a power supply terminal and a ground potential terminal. The external terminals are attached to a shielding case surrounding the peripheral edge of a wiring substrate. The shielding plate is disposed in contact with the rear face of the wiring substrate.

Abstract: A retention device for computer expansion cards, a system including the device, a method of manufacture of the device, and a method of using the device, where the retention device includes a retention clip configured to engage the bracket of the expansion card to reduce flex and rotation of an expansion card when the expansion card and the retention device are installed in an expansion card bay of a computer system, and wherein the retention clip is configured to contact the proximal end of the expansion card.

Abstract: The invention provides an electronic device that is environment-friendly and capable of achieving satisfactory noise prevention effect at low cost, and a housing implementing such electronic device. The housing has an electronic circuit disposed therein, and includes a component exposure section in which part of a conductive component disposed in the housing is exposed outward, a plate section made of a conductive material having a predetermined thickness, and spreading at a distance from the component exposure section, and a bridge section with the overall thickness thereof larger than the thickness of the plate section, extending along the component exposure section and electrically connecting the plate section and the conductive component.

Abstract: A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly.

Abstract: A system and method for misbalancing or suppressing spinning atmospheric phenomena such as tornadoes, landspouts, waterspouts, gustnadoes and whirlwinds. The systems and methods misbalance or suppress such phenomena utilizing electromagnetic fields; irradiation; neutralizing charges; or chemical reactions, thus destabilizing or disrupting the phenomenon.

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract: A front bezel includes a main body (10) defining a light-pervious area (142) therein, a light-directing member (20) secured to the main body, a shielding plate (30) pivotably secured on the light-directing member, and a gear member (40) rotatably secured on the light-directing member. The light-directing member has a light-directing portion (22) defining a space for securing a light source (60) therein. The space communicates and aligns with the light-pervious area. The light-directing portion defines an installing opening (226) communicating with the space. A plurality of teeth is formed on the shielding plate. The gear member has a plurality teeth (41) meshing with the teeth of the shielding plate, and is rotatable to pivot the shielding plate to cover one portion of the space in which light source is secured, and thereby prevent the light emitting out of the space.

Abstract: An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.

Abstract: A shielding device (10) and method are provided. The shielding device (10) includes a frame (21) and an enclosure (22). The enclosure (22) includes a cover portion (221) and a first peripheral wall (222) connecting to the cover portion (221). The frame (21) includes a second peripheral wall (21) and a plurality of guiding sheets (215) connected to the second peripheral wall (211). The first peripheral wall (222) is detachably received in the frame (21). A gap (23) is formed between the first peripheral wall (222) and the guiding sheets (215), used to detach the enclosure (22) from the frame (21).

Abstract: An enclosure is formed by folding an FPC board having, on the top face thereof, electronic components and, on the back face thereof, a ground conductor pattern in such a way that the electronic components mounted thereon are housed inside the enclosure. The electronic components housed inside the enclosure are covered with the ground conductor pattern. This means that the enclosure serves as a shield enclosure that electromagnetically shields at least part of the electronic components from the outside. In this way, the shield enclosure is formed by folding the FPC board. This makes it possible to realize an electromagnetic shield structure without using an extra shield case as used in the conventional modules.

Abstract: An electromagnetic interference (EMI) shield is provided. The EMI shield may include a frame and a cover operative to be placed over the frame. The cover may include snaps or tabs extending from the surface of the cover and operative to engage side walls of the frame. At least one edge of the cover, for example an edge operative to be placed near an electronic device housing, may not include snaps or tabs to reduce the size of the EMI shield near the housing. Instead, the frame may include one or more stepped returns, the top-most of which may be operative to be placed in contact with the cover. The cover may include a spring, an emboss and one or more grounding points to ensure that the cover remains in contact with the frame despite the absence of snaps or tabs securing the cover to the frame.

Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.

Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Abstract: An EMI shielding device (1) is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: On a circuit board to be mounted on a metal chassis, a tuner having a metal sleeve protruding from a side of its case is mounted, with the sleeve protruding beyond an edge of the circuit board. A metal ground plate is fitted on the sleeve. With a flexible leg portion formed at a lower portion of the ground plate disposed on the chassis, the circuit board is fixed to the chassis with screws, thereby the leg portion comes into elastic contact with the chassis.

Abstract: An objective of the present invention is to form a hyper-elastic flange integrally within a shield case body around a periphery thereof while decreasing an occupied area for grounding. The shield case 2 according to the present invention is disposed to cover electronic parts 6 on a circuit board 1, and which has a flange 7 formed integrally therewith so as to contact with a metallic ground line 3 on the circuit board 1. The flange 7 is elastically deformed to be grounded, thus a leakage of electromagnetic waves to the outside of the shield case 2 is prevented. The flange 7 is made of metallic glass. By forming the flange 7 from metallic glass, a displacement due to viscous flowing on the atomic level, which is different from a plastic deformation, can be utilized, and thus a high precision flange can be formed without a spring-back.

Abstract: A shield structure having a plurality of hollow columnar base members arranged with intervals therebetween along the periphery of a section to be shielded on a surface of a circuit board, and a shield cover with a peripheral wall having insertion pieces arranged along the edge thereof at positions corresponding to the positions where the base members are arranged. Each base member has a cut in at least a top surface thereof. The cut forms an elastically deformable tongue portion having a free end at a position where the corresponding insertion piece of the shield cover is inserted. The tongue portion is elastically deformed toward the inner space of the base member by an insertion force applied when the corresponding insertion piece of the shield cover is inserted into the cut at the free end.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.

Abstract: A tuner device comprising: a tuner module, disposed on a surface of a substrate and comprising: a circuit component adapted to demodulate a signal received from an antenna device; a printed circuit board mounted with the circuit component and a plurality of connector pins extending perpendicular to the surface of the substrate; and a metallic case, housing the printed circuit board so as to shield the circuit component, and made of an unsolderable material; and a bracket made of a solderable material, and fixed to the metallic case while holding the tuner module so as to dispose the tuner module on the surface of the substrate.

Abstract: The invention relates to a Subassembly (1) with at least two component parts (2, 3), as well as a sealing module (4). To improve the exchangeability of seals (5, 6) for a subassembly comprising at least two component parts (2, 3), especially when complex seal geometries are involved, it is proposed that the subassembly (1) with at least two component parts (2, 3) which can be assembled to form the subassembly, features at least one sealing module (4) to accept at least one seal (5,6), which can be used between two component parts (2, 3) in each case.

Abstract: A shielding assembly (100) for protecting several modules from electromagnetic interference, includes a cage (40) installable on a circuit board (200), a first gasket (20), and a second gasket (50). The cage includes a front end portion (41), a cover (42), a base (48), and at least one interior wall (44). The cover, the at least one interior wall and the base cooperatively define at least two spaces (400) for receiving the modules. The first gasket encircles the front end portion of the cage. The first gasket electrically and mechanically contacts the cover and the base to provide an electromagnetic interference seal between the cage and a device in which the cage is mounted. The second gasket attaches against the cage and the circuit board respectively so as to electrically shield the modules in the cage from electromagnetic interference.

Abstract: An exemplary flat panel display (200) includes a display module (210), a printed circuit board (220), and a shield member (230). The display module includes a rear surface (212) and a side surface 214 adjacent to the rear surface. The printed circuit board is electrically coupled to the display module. The shield member is configured to protect the printed circuit board from electromagnetic interference, and includes a shield cover (236) and a fixing member (232). The shield cover and the fixing member are separate parts. The printed circuit board is received in the shield cover, the fixing member is fixed onto the side surface of the display module, and the shield cover is fixed onto the rear surface of the display module via the fixing member.

Abstract: In one embodiment, an air guiding plate is attached to an enclosure with a plurality of vents defined therein. The air guiding plate includes a plurality of guiding holes defined therein. Each of the guiding holes is surrounded by a plurality of walls and includes an inlet with a large size, and an outlet with a small size. The outlets are in alignment with the vents of the enclosure. A size in cross section of each of the walls gradually decreases along a direction from the inlet to the outlet.

Abstract: A conductive elastomeric shielding device (400) for use with an electronic device includes a raised surface (401) and a sidewall (405) formed with the raised surface (401). A turret section (406) is formed with the sidewall (405) where an engagement member (407) projects from the turret section (406) for frictional engagement with an aperture (408) in a printed circuit (PC) board (410). The raised surface and sidewall are manufactured of an elastomeric shielding material for shielding radio frequency (RF) radiation for electronic components used therewith.

Abstract: The invention relates to an apparatus and arrangement for shielding a light emitting diode against electrostatic discharges during usage. On a printed circuit board (103, 203) there is placed a light emitting diode (108, 208), and on the component side of the circuit board (103, 203), there is arranged a photoconductor layer (102, 202). In the photoconductor layer (102, 202), there is induced electroconductive material (110, 210), and the electroconductive material is connected to the ground plane (111) of the circuit board in order to conduct the electrostatic discharge from the photoconductor layer (102, 202) to the ground plane.

Abstract: A shielding device (10) and method are provided. The shielding device (10) includes a frame (21) and an enclosure (22). The enclosure (22) includes a cover portion (221) and a first peripheral wall (222) connecting to the cover portion (221). The frame (21) includes a second peripheral wall (21) and a plurality of guiding sheets (215) connected to the second peripheral wall (211). The first peripheral wall (222) is detachably received in the frame (21). A gap (23) is formed between the first peripheral wall (222) and the guiding sheets (215), used to detach the enclosure (22) from the frame (21).

Abstract: A head or bottom element of a component support, having guide rails arranged side-by-side and aligned in an insertion direction for receiving a printed circuit board of a plug-in module, wherein the guide rails are formed by one-piece guide elements of the head or bottom element. The guide elements can be formed of two rows of several guide strips per guide rail, each of which extends in the insertion direction, which strips are punched out of a plate-shaped head or bottom element and are projectingly beveled in the direction toward an underside of the head element or a top of the bottom element. A distance of the guide strips of the guide rails is matched to the thickness of the printed circuit boards of the plug-in modules. The head or bottom element forms guide paths for the printed circuit boards of the plug-in modules between the rows of guide strips of the guide rails.

Abstract: A panel and housing assembly includes a housing provided with a locking slot, a panel provided with a receiving space, and a locking tenon mounted between the housing and the panel and having a first end provided with an elastic portion received in the receiving space of the panel and a second end provided with a locking portion inserted into and locked in the locking slot of the housing. Thus, the panel is locked onto the housing by compressing the locking tenon and unlocked from the housing by pressing the press plate of the locking tenon so that the panel and housing assembly is assembled and disassembled easily and quickly without needing aid of any hand tool, thereby facilitating a user assembling and disassembling the panel and housing assembly.

Abstract: Embodiments of electromagnetic interference (EMI) shielding containers are disclosed according to the present invention. The EMI shielding containers are especially useful for protecting sources of electronic evidence from EMI contamination prior to data extraction. However, the embodiments of EMI shielding containers of the present invention may be used in any context where a wireless device is to be shielded from transmitting or receiving electromagnetic signals. Embodiments of methods of using EMI shielding containers to extract data from electronic devices are also disclosed.

Abstract: A radar electronics module includes a support structure having a first surface having a plurality of recesses with a transmitter circuit board and a receiver circuit board disposed thereon. The transmitter and receiver circuit boards are disposed over the first surface of the supports structure such that transmitter and receive circuits are disposed in cavities on the support structure. The radar electronics module further includes a digital/power supply circuit printed wiring board (PWB) disposed on a second surface of the support structure and a connector disposed on the support structure. The connector is disposed in such a way that it provides electrical connections for at least one of power signals, analog signals or digital signals between at least two of the digital/power supply PWB, the transmitter circuit board and the receiver circuit board.

Abstract: A housing combination includes a housing (51) and a shielding enclosure (55). The housing has a peripheral wall and a receiving hole (511). The peripheral wall surrounds the receiving hole configured for receiving a surface contact card. A guiding element (52) is positioned in at least one part of the peripheral wall of the receiving hole. The shielding enclosure is disposed at one side of the housing, one part of the shielding enclosure exposed from the receiving hole configured for supporting the surface contact card.

Abstract: An air inlet diffuser 10 is disclosed for attachment relative to an air inlet opening 106 of an electronics enclosure 100. The diffuser 10 extends into the electronics enclosure 100 and provides an increased surface area through which EMI attenuating apertures may be formed. The diffuser 10 also reduces the amount of structure that is disposed within the air inlet opening 106 thereby reducing impedance to airflow through the opening 106 into the enclosure 100. The increased surface are of the diffuser 10 allows for increasing the number of EMI attenuating apertures that may be utilized for a given inlet opening 106. In one embodiment, the total open area of the EMI apertures is greater than the open area of the air inlet opening. In such an embodiment, the EMI apertures provide low impedance to airflow through the diffuser 10 and increased airflow in conjunction with EMI attenuation may be realized.

Abstract: A single sheet film filter and a manufacturing method thereof and a plasma display apparatus with the single sheet film filter capable of preventing ground problems, securing ground resistance, and reducing ground processing time. This single sheet film filter includes a conductive layer for shielding EMI arranged on one surface of a transparent base film and having a ground portion at an edge region on the base film and a hard coating layer covering the conductive layer in which the ground portion is exposed through a plurality of apertures in a stripe shape formed in the hard coating layer.

Abstract: A transceiver cage assembly includes a housing (10) and a grounding device (20). The housing includes at least one receiving space for receiving at least one transceiver module. The grounding device mounted on the housing includes a flat main member (200), and at least one resilient member (220) protruding from the main member. The grounding device provides electrical connection between the housing and bezels.

Abstract: A circuit includes a first wiring to transmit a first signal, an alteration element to adjust a delay amount being added to the first wiring, and a shield element to shield the alteration element from a second wiring, the second wiring transmitting a second signal.

Abstract: An electronic apparatus is equipped with housing, a motherboard, a stud, and a lid. The housing constitutes an outer shell of the main body having a shielding property against electromagnetic radiation and an opening located on the bottom wall. The opening is smaller than the total mounting area of a plurality of extension modules which are layered each other. The motherboard is installed in the housing. The stud is attached on the bottom surface side of the motherboard and is fastened by a set of screws together with the plurality of extension modules. The lid has a shielding property against electromagnetic radiation and covers the opening.

Abstract: A mounting apparatus for an expansion card (11) with a shield plate (12) includes a rear plate (10), a locking member (20) and a latch (30). A bent portion (17) extends out of the rear plate for the shield plate being disposed thereon. The locking member is pivotably attached to the bent portion of the rear plate for pressing against the shield plate. The latch is attached to one of the rear plate and the locking member, and capable of being rotated on the rear plate above the bent portion, for preventing the shield plate releasing from between the locking member and the rear plate.

Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.