Abstract: Technologies are generally described herein for a non-volatile static random access memory device with multiple storage states. In some examples, the multi-storage state non-volatile random access memory device has two or more memory cells. Each memory cell may include a pair of programmable resistive devices that may be dynamically programmed to configure the memory cell in a particular logic state.

Abstract: Write assist circuitry is disclosed to assist a memory device in changing logical states during a write operation. The write assist circuit includes write assist circuits which can be coupled to a shared boost capacitor to provide write assistance to the memory device. The write assist circuit includes boost switch circuit to selectively couple one or more of the write assist circuits and the shared boost capacitor. The one or more write assist circuits, when coupled to the shared capacitor, provide negative bitline assistance by selectively driving one of its corresponding bitlines pairs to be negative during a write operation.

Abstract: A fine grained negative wordline scheme for SRAM memories is disclosed. The scheme includes a circuit having a static random access memory (SRAM) cell including at least a wordline coupled to a plurality of NFETs of a transistor array. The circuit further includes a wordline driver including a plurality of inverters coupled between a wordline group decode node, a power supply and the wordline. Overvoltage on the wordline driver and NFETs of the SRAM cell are eliminated by applying a power gating mode and lowering the power supply voltage.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a static random access memory assist circuit and methods of implementation and manufacture. The structure includes at least one static random access memory (SRAM) cell and a read assist circuit structured to apply a negative voltage to the at least one SRAM cell upon asserting of a wordline of the at least one SRAM cell.

Abstract: A physically unclonable function (PUF) is implemented in a plurality of SRAM cells. In a method for generating a PUF response, a logic zero is first written to all the SRAM cells of the PUF. A bit line coupled to the storage node that stores the logic zero of each SRAM cell is biased to a predetermined voltage. The bit lines are then selected for an evaluation read operation. During the evaluation read, a read current of one of the bit lines from one column is converted to a first voltage and a read current of another bit line of another column is converted to a second voltage. The first voltage is then compared to the second voltage. A logic state of a bit of the PUF response is determined as a result of the comparison. The logic bit may be provided to the input of a parallel-in serial-out shift register. There may be a comparator for each logic bit, or a few comparators may be shared between the logic bits. The PUF response may be used to provide a signature for the data processing system.

Abstract: The present invention generally relates to a method of operating a MEMS DVC while minimizing impact of the MEMS device on contact surfaces. By reducing the drive voltage upon the pull-in movement of the MEMS device, the acceleration of the MEMS device towards the contact surface is reduced and thus, the impact velocity is reduced and less damage of the MEMS DVC device occurs.

Abstract: A memory device includes a first memory array comprising a first bit cell configured to store a first logical state; and a reference signal provision (RSP) unit, coupled to the first memory array, and configured to provide a first reference signal that represents an average of a discharging rate and a leakage rate of a second memory array. In an embodiment, the first logical state stored by the first bit cell is read out using the first reference signal.

Abstract: Disclosed is a memory unit that includes a sector of memory cells. The sector includes a first memory cell configured to selectively take on a state representation of a first plurality of state representations and a second memory cell configured to selectively take on at least one of a second plurality of state representations. The second plurality of state representations is different than the first plurality of state representations. An apparatus includes a processing unit and a memory unit coupled to the processing unit. The memory unit includes a sector of memory cells. Further disclosed are a method of operating a memory unit sector and a method of controlling a sector of a memory unit.

Abstract: Read stability of a memory is enhanced in low voltage operation mode by selectively boosting a cell supply voltage for a row of memory cells. The boosted voltage results from a capacitive coupling to the word line in that row. The capacitive coupling is implemented by running the metal line of the power supply line for the cell supply voltage and the metal line for the word line adjacent to each other in a common metallization level. The selective voltage boost is controlled in response to operation of a modified memory cell exhibiting a deteriorated write margin. An output of the modified memory cell is compared to a threshold to generate a signal for controlling the selective voltage boost. Word line under-voltage circuitry is further provided to control application of an under-voltage to the word line.

Abstract: A memory circuit includes plurality of bit-cells organized in a column, each bit-cell of the plurality is coupled to a first voltage supply terminal and a second voltage supply terminal. A word-line control circuit is coupled to each bit-cell of the plurality by way of a local bit-line. The word-line control circuit is configured to operatively couple the local bit-line with a global bit-line during a read operation. A first voltage generation circuit is coupled to the first voltage supply terminal. The first voltage generation circuit is configured to provide a first reduced voltage at the first voltage supply terminal during a first write operation. A second voltage generation circuit is coupled to the second voltage supply terminal. The second voltage generation circuit is configured to provide a second reduced voltage at the second voltage supply terminal during the first write operation.

Abstract: Methods and apparatus for creating a physically unclonable function for SRAM are disclosed. An example method includes after applying a voltage to a memory array: determining a first duration between the applying of the voltage and a first output of a first bit cell, the first output corresponding to a first value stored in the first bit cell, and determining a second duration between the applying of the voltage and a second output of a second bit cell, the second output corresponding to a second value stored in the second bit cell. The example method further includes determining a function based on a comparison of the first duration and the second duration, the function to establish an identification of a circuit that includes the memory array.

Abstract: An SRAM cell with dynamic split ground (GND) and split wordline (WL) for extreme scaling is disclosed. The memory cell includes a first access transistor enabled by a first wordline to control access to cross coupled inverters by a first bitline. The memory cell further includes a second access transistor enabled by a second wordline to control access to the cross coupled inverters by a second bitline. The memory cell further includes a split ground line comprising a first ground line (GNDL) separated from a second ground line (GNDR). The GNDL is connected to a transistor of a first inverter of the cross coupled inverters and the GNDR is connected to a first transistor of a second inverter of the cross coupled inverters.

Abstract: A memory circuit includes a plurality of bit-cells organized in a column. Each bit-cell of the plurality is coupled to first and second voltage supply terminals, and first and second bit-lines. A word-line is coupled to a bit-cell of the plurality and configured to receive a first voltage during a first write operation. A first voltage generation circuit is coupled to the first voltage supply terminal and is configured to provide a first reduced voltage during the first write operation. A second voltage generation circuit is coupled to the second voltage supply terminal and is configured to provide a second reduced voltage during the first write operation.

Abstract: A memory circuit includes a plurality of memory cells and a tracking circuit. Each memory cell of the plurality of memory cells includes a cell transistor corresponding to a predetermined transistor configuration. The tracking circuit includes a first tracking bit line, a first tracking word line, a reference voltage node, and a first plurality of tracking cells. Each tracking cell of the first plurality of tracking cells includes a cell transistor corresponding to the predetermined transistor configuration. The cell transistors of the first plurality of tracking cells are electrically coupled in series between the first tracking bit line and the reference voltage node, and gate terminals of the cell transistors of the first plurality of tracking cells are electrically coupled with the first tracking word line.

Abstract: A memory device comprises a plurality of word lines elongated along a first direction, and at least one memory unit. The at least one memory unit comprises a plurality of memory cells arranged along a second direction different from the first direction; at least one bit line elongated along the second direction, and configured to transmit data of a selected memory cell; and at least one column word line elongated along the second direction; wherein the memory cell comprises a storage cell configured to store data and at least two access transistors; wherein a control terminal of one of the at least two access transistors of the memory cell is coupled to the at least one column word line, and a control terminal of another one of the at least two access transistors of the memory cell is coupled to the corresponding word line.

Abstract: A memory macro includes a plurality of columns and a plurality of switching circuits. A column of the plurality of columns has a plurality of voltage supply nodes corresponding to a plurality of memory cells in the column. A switching circuit of the plurality of switching circuits corresponds to a column of the plurality of columns and is configured to selectively provide a first voltage value of a first voltage source or a second voltage value of a second voltage source to the voltage supply nodes. The first voltage value and the second voltage value differ by a predetermined voltage value.

Abstract: A static random access memory (SRAM) chip includes a first and second conductor, a set of SRAM cells and a set of first and second tracking cells. The first conductor extends in a first direction, is coupled to a first supply voltage, and on a first metal layer. The second conductor extends in a second direction, is coupled to a second supply voltage, and on a second metal layer. A first cell of the set of first tracking cells includes a first tracking bit line conductor, first and second CMOS, and a first and second pass gate device. A first cell of the set of second tracking cells includes a third pass gate device, a third PU device, and a third PD device having a source configured to be electrically floating. A gate of the first PD device or the first PU device is electrically coupled to the first conductor.

Abstract: An SRAM cell structure. In one embodiment, a bit cell first level contacts formed at a first and a second CVdd node, a first and a second CVss node, at a bit line node, at a bit line bar node, at a data node and at a data bar node; and second level contacts formed on each of the first level contacts at the first and second CVdd nodes, the first and second CVss nodes, the bit line node and the bit line bar node; wherein the first level contacts formed at the data node and the data bar node do not have a second level contact formed thereon. In another embodiment, a word line is formed and bit lines and a CVdd and a CVss line are formed overlying the SRAM cell and coupled to the corresponding ones of the nodes. Methods are disclosed for forming the cell structure.

Abstract: Systems and methods are directed to managing signals in a dual voltage domain comprising a high voltage domain and a low voltage domain. A write bitline driver circuit receives complementary global write bitline signals as input signals from a global write bitline driver in the low voltage domain, and a write enable signal as an input signal in the high voltage domain. The write bitline driver circuit generates complementary local write bitline signals as output signals in the high voltage domain for activating bitlines of a memory bank in the high voltage domain. The complementary local write bitline signals are based on the complementary global write bitline signals, voltage level shifted from the low voltage domain to the high voltage domain and gated by the write enable signal.

Abstract: A multiple-port memory cell includes first conductive lines in a first metal layer, second conductive lines in a second metal layer, third conductive lines a third metal layer, and fourth conductive lines in a fourth metal layer. The first conductive lines include a write bit line electrically coupled with a write bit line node; a first read bit line electrically coupled with a first read bit line node; and a second read bit line electrically coupled with a second read bit line node. The second conductive lines include a write word line electrically coupled with a write word line node. The fourth conductive lines include a first read word line electrically coupled with a first read word line node; and a second read word line electrically coupled with a second read word line node.

Abstract: A circuit includes a tracking bit line, a first capacitive circuit, a tracking circuit and a detection circuit. The first capacitive circuit is coupled to the tracking bit line. The first capacitive circuit has a capacitive load on the tracking bit line. The tracking circuit is coupled to the tracking bit line. The tracking circuit being configured to charge or discharge a voltage on the tracking bit line based on a first control signal or the capacitive load. The detection circuit is coupled to the tracking bit line, and is configured to generate a SAE signal responsive to the voltage of the tracking bit line and an inverted first control signal.

Abstract: A dual port static random access memory cell includes a write port portion and a read port portion. The write port further includes a WPU1 and a WPU2; a WPD1 and a WPD2; and a WPG1 and a WPG2. The WPU1, WPU2, WPD1 and WPD2 are configured to form two cross-coupled inverters for data storage, wherein the WPG1 and WPG2 are connected to the two cross-coupled inverters for writing. The read port portion further includes a read pull down device (RPD) and a read pass gate device (RPG) connected to the two cross-coupled inverters for reading. Each of the WPU1 and WPU2 includes a single FinFET. Each of the WPD1, WPD2, WPG1, WPG2, RPD and RPG includes multiple FinFETs. The WPD1, WPD2, WPG1 and WPG2 include a same number of FinFETs. The RPD includes a number of FinFETs greater than a number of FinFETs in the RPG.

Abstract: The present invention discloses a static RAM for defensive differential power consumption analysis, comprising a replica bit-line circuit, a decoder, an address latch circuit, a clock circuit, n-bit memory arrays, n-bit data selectors, n-bit input circuit and n-bit output circuits; the output circuits comprises a sensitivity amplifier and a data latch circuit; the 1st PMOS tube, the 2nd PMOS tube, the 3rd PMOS tube, the 4th PMOS tube, the 5th PMOS tube, the 6th PMOS tube, the 7th PMOS tube, the 1st NMOS tube, the 2nd NMOS tube, the 3rd NMOS tube, the 4th NMOS tube and the 5th NMOS tube constitute the sensitivity amplifier; two NOR gates, the 8th PMOS tube, the 9th PMOS tube, the 10th PMOS tube, the 11th PMOS tube, the 6th NMOS tube, the 7th NMOS tube, the 8th NMOS tube, the 9th NMOS tube and the 10th NMOS tube constitute the data latch circuit; the present invention is characterized in that energy consumption in each working cycle is basically identical, which is provided with higher capability in defense of

Abstract: A negative bit line boost circuit for a memory is configured to control a write multiplexer and a write assist transistor so that charge from a boost capacitor positively charges a bit line following a write assist period.

Abstract: A SRAM module and a writing control method of the SRAM module are disclosed. The writing control method of the SRAM module is applied to a SRAM module that includes a plurality of memory cells and a bit line. The method includes: providing a first voltage as a supply voltage of the plurality of memory cells during a data retention time; decreasing a first voltage level corresponding to the data retention time of the memory cells to a second voltage level by discharging the memory cells; and performing a write process to the memory cells through the bit line. The discharge time from the first voltage level to the second voltage level is related to the number of the memory cells.

Abstract: Cell layouts for a memory cell, such as for ternary content addressable memory (TCAM), are disclosed. Some cell layouts include a well strap structure. A cell layout may include a p-doped well, an n-doped well, and a p-doped well sequentially along a layout. Another cell layout may include a p-doped well, an n-doped well, a p-doped well, and an n-doped well sequentially along a layout. A well strap structure may be in a p-doped well or an n-doped well. Various metallization layers having a mesh may be used with a memory cell layout. In some disclosed examples, a first metallization layer may have one, two, or four ground traces, and a second metallization layer may have two ground traces. These various ground traces may be electrically coupled together to form a mesh.

Abstract: Stable SRAM cells utilizing Independent Gate FinFET architectures provide improvements over conventional SRAM cells in device parameters such as Read Static Noise Margin (RSNM) and Write Noise Margin (WNM). Exemplary SRAM cells comprise a pair of storage nodes, a pair of bit lines, a pair of pull-up devices, a pair of pull-down devices and a pair of pass-gate devices. A first control signal and a second control signal are configured to adjust drive strengths of the pass-gate devices, and a third control signal is configured to adjust drive strengths of the pull-up devices, wherein the first control signal is routed orthogonal to a bit line direction, and the second and third control signals are routed in a direction same as the bit line direction. RSNM and WNM are improved by adjusting drive strengths of the pull-up and pass-gate devices during read and write operations.

Abstract: An SRAM cell includes first and second inverters which are cross-coupled to one another to establish first and second data storage nodes, which are complementary. A first access transistor includes a first source/drain region coupled to the first data storage node, a first drain/source region coupled to a first bitline, and a first gate region coupled to a wordline. A second access transistor includes a second source/drain region coupled to the second complementary data storage node, a second drain/source region coupled to a second bitline, and a second gate region coupled to the wordline. A first dummy transistor has a first dummy source/drain region coupled to the first source/drain region of the first access transistor. A second dummy transistor has a second dummy source/drain region coupled to the second source/drain region of the second access transistor.

Abstract: An apparatus includes a memory, a timing circuit configured to emulate a first operation of the memory to activate a second operation of the memory, a sensor configured to emulate a portion of the timing circuit, and a controller configured to adjust an operating parameter of the memory based on the sensor emulating the portion of the timing circuit. A method is presented. The method includes at least operating a timing circuit to emulate a first operation of the memory, activating a second operation of the memory based on the emulating the first operation of the memory, emulating, by a sensor, a portion of the timing circuit. Another apparatus is presented. The apparatus includes at least a memory, a timing circuit, and means for tracking a performance of the memory based on the timing circuit tracking a memory operation.

Abstract: Systems and methods are disclosed for open block stability scanning. When a solid state memory block remains in an open state, where the block is only partially filled with written data, for a prolonged period of time, a circuit may perform a scan on the block to determine the stability of the stored data. When the scan indicates that the data is below a stability threshold, the data may be refreshed by reading the data and writing it to a new location. When the scan indicates that the data is above a stability threshold, the circuit may extend the time period in which the block may remain in the open state.

Abstract: Provided is a semiconductor device having a memory cell array, which is capable of existing in three power-gating states depending on a non-access period to the memory cell array. The memory cell array includes a plurality of memory cells which each have an SRAM and a nonvolatile memory portion having a transistor with an oxide semiconductor in a channel region. The three power-gating states includes: a first state in which a power-gating to the memory cell array is performed; a second state in which the power-gating is performed on the memory cell array and peripheral circuits which control the memory cell array; and a third state in which, in addition to the memory cell array and the peripheral circuits, a power supply voltage supplying circuit is subjected to the power gating.

Abstract: A semiconductor memory device includes a normal memory block including a plurality of normal memory cells, a redundant memory block including a plurality of redundant memory cells used to replace defective cells among the normal memory cells, a normal buffer block configured to sense and amplify data stored in the normal memory block, a redundant buffer block configured to sense and amplify data stored in the redundant memory block, a normal latch block configured to fetch data from the normal buffer block and store the data based on a normal control signal, and a redundant latch block configured to selectively fetch data from the redundant buffer block and store the data based on a redundant control signal.

Abstract: The present disclosure relates to a memory cell, a memory array, and methods for writing a memory cell. In an example embodiment, a memory cell comprises a first transistor, a second transistor, and a differential sense amplifier. The first transistor is a Vt-modifiable n-channel transistor and the second transistor is a Vt-modifiable p-channel transistor, each transistor having first and second main electrodes. The first main electrodes of the first and second transistors are connected together. The differential sense amplifier is connected to the second main electrodes of the first and the second transistor. The differential sense amplifier is adapted for sensing the current difference between the first transistor and the second transistor.

Abstract: Embodiments include apparatuses, methods, and systems for a circuit to shift a voltage level. The circuit may include a first inverter that includes a first transistor coupled to pass a low voltage signal and a second inverter coupled to receive the low voltage signal. The circuit may further include a second transistor coupled to receive the low voltage signal from the second inverter to serve as a feedback device and produce a high voltage signal. In embodiments, the first transistor conducts asymmetrically to prevent crossover of the high voltage signal into the low voltage domain. A low voltage memory array is also described. In embodiments, the circuit to shift a voltage level may assist communication between a logic component including the low voltage memory array of a low voltage domain and a logic component of a high voltage domain. Additional embodiments may also be described.

Abstract: An integrated circuit for storing data comprises a memory cell array comprising a plurality of bit cells (BC1, . . . , BCn) comprising a first and a second one of the bit cells (BC1, BC2) having a static random access memory architecture. The first and the second bit cells (BC1, BC2) are coupled to a common wordline (WL_TOP) and are arranged in different columns (C1, C2) of the memory cell array (100). During a write access to the first bit cell (BC1), the first bit cell (BC1) undergoes a write operation, whereas the second bit cell (BC2) is a half-selected bit cell which undergoes a pseudo read operation. The integrated circuit uses a two-phase write scheme to improve the write-ability in low operating voltage environment.

Abstract: Write-assist circuits for memory bit cells (“bit cells”) employing a P-type Field-Effect transistor (PFET) write port(s) are disclosed. Related methods and systems are also disclosed. It has been observed that as node technology is scaled down in size, PFET drive current (i.e., drive strength) exceeds N-type Field-Effect transistor (NFET) drive current for like-dimensioned FETs. In this regard, in one aspect, it is desired to provide bit cells having PFET write ports, as opposed to NFET write ports, to reduce memory write times to the bit cells, and thus improve memory performance. To mitigate a write contention that could otherwise occur when writing data to bit cells, a write-assist circuit provided in the form of negative wordline boost circuit can be employed to strengthen a PFET access transistor in a memory bit cell having a PFET write port(s).

Abstract: A memory circuit includes a set of subarrays of memory cells and a set of write assist circuits for generating negative voltages on bitlines pertaining to the set of subarrays, respectively. A set of distinct signals initiate the write assist circuits in generating the negative voltages for subarrays, respectively. The distinct signals may have particular state to cause a subset of the write assist circuits to generate the negative voltages if the corresponding subarrays are target of a writing operation, and another state to cause another subset of the write assist circuits to not generate the negative voltages if the corresponding subarrays are not target of the writing operation. This avoids the unnecessary generation of negative voltages for subarrays that are not the target of a writing operation so as to reduce power consumption. The generation of the distinct signals may be based on a set of write mask signals.

Abstract: In accordance with some embodiments of the present disclosure, a circuit structure is provided. The circuit structure comprises a first transistor, a second transistor, a storage node and a word-line. Each of the two transistors comprises a gate, a source and a drain. The storage node is connected to the gate of the first transistor. The word-line is connected to the gate of the second transistor. The first and second transistors are serially connected. The first and second threshold voltages are respectively associated with the first and second transistors, and the first threshold voltage is lower than the second threshold voltage.

Abstract: Systems and methods described herein provide a memory cell circuit. The memory cell circuit includes a first internal node communicatively coupled to a first write bit line via a first write pass gate, and a second internal node communicatively coupled to a second write bit line via a second write pass gate. The memory cell circuit further includes a first read bit line connected to a first read pass gate and a first transistor, and a second read bit line connected to a second read pass gate and a second transistor. The first internal node is decoupled from the first read bit line by the first transistor, and the second internal node is decoupled from the second read bit line by the second transistor when a write operation and a read operation occur at the same time.

Abstract: A write tracking circuit includes a dummy memory cell coupled to a first dummy bit line, a second dummy bit line, and a dummy word line, a logic operation unit coupled to the dummy word line and to the first dummy bit line and configured to output a write feedback signal based on a logic operation of a signal on the dummy word line and a signal on the first dummy bit line, and a delay unit coupled to the dummy memory cell at a storage node. The write tracking circuit provides a correct feedback signal to the clock generation module to ensure normal operation of the peripheral circuit, when a data write operation to the dummy memory cell failed.

Abstract: An SRAM circuit that includes a biasing circuit adapted to selectively bias the transistors of the SRAM array to lower the threshold voltage of selected transistors. The SRAM circuit includes well voltages and positive voltages that are selectively different, and substrate voltages and ground voltages that are selectively different.

Abstract: Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.

Abstract: Various implementations described herein are directed to an integrated circuit. The integrated circuit may include precharge circuitry for precharging bitlines to a source voltage level. The integrated circuit may include write assist circuitry having a charge storage element for providing a write assist signal to at least one of the bitlines. The integrated circuit may include read assist circuitry having a switching element for providing charge sharing between the bitlines, the precharge circuitry, and the charge storage element of the write assist circuitry.

Abstract: Apparatuses included a single-ended main input/output line in a semiconductor device are described. An example apparatus includes: a pair of differential data lines coupled to a sense amplifier; a single-ended data line; a first transistor coupled between the one of the pair of differential data lines and the power line and coupled to the single-ended data line at a control node thereof; a second transistor coupled between the single-ended data line and the power line and coupled to the one of the pair of differential data lines at a control node thereof; and a third transistor coupled between the single-ended data line and the other of the pair of differential data lines.

Abstract: To provide a semiconductor device including a plurality of circuit blocks each of which is capable of performing power gating by setting off periods appropriate to temperatures of the respective circuit blocks. Specifically, the semiconductor device includes an arithmetic circuit, a memory circuit configured to hold data obtained by the arithmetic circuit, a power supply control switch configured to control supply of the power supply voltage to the arithmetic circuit, a temperature detection circuit configured to detect the temperature of the memory circuit and to estimate overhead from the temperature, and a controller configured to set a period during which supply of the power supply voltage is stopped in the case where a power consumption of the arithmetic circuit during the period is larger than the overhead period and to control the power supply control switch.

Abstract: A chip includes a semiconductor substrate, and a first N-type Metal Oxide Semiconductor Field Effect Transistor (NMOSFET) at a surface of the semiconductor substrate. The first NMOSFET includes a gate stack over the semiconductor substrate, a source/drain region adjacent to the gate stack, and a dislocation plane having a portion in the source/drain region. The chip further includes a second NMOSFET at the surface of the semiconductor substrate, wherein the second NMOSFET is free from dislocation planes.

Abstract: A system and method communicates with one of two or more secure digital input output (SDIO) units that only one SDIO unit responds when it is being addressed. The SDIO unit has an SDIO clock input port, an SDIO data bus output port, and an SDIO bidirectional command port. Each SDIO unit has an address indicator within it associated with each SDIO unit. An SDIO unit will not respond to an SDIO command unless an SDIO unit address encoded in the SDIO command matches its address indicator.

Abstract: The present disclosure provides a cell structure, a random access memory and operation methods. The cell structure with four transistors, including a first N-type transistor, a first P-type transistor, a second N-type transistor and a second P-type transistor, in which an absolute value of a threshold voltage of the first N-type transistor is greater than an absolute value of a threshold voltage of the second N-type transistor, and an absolute value of a threshold voltage of the first P-type transistor is greater than an absolute value of a threshold voltage of the second P-type transistor. The random access memory, including: two identical memory cell arrays including the cell structure with four transistors, a data write circuit and a data read circuit, by using Two Modular Redundancy harden method, and thus reading correctly and avoiding the mistake reversal caused by the single event upset effect.

Abstract: A method of screening complementary metal-oxide-semiconductor CMOS integrated circuits, such as integrated circuits including CMOS static random access memory (SRAM) cells, for transistors susceptible to transistor characteristic shifts over operating time. For the example of SRAM cells formed of cross-coupled CMOS inverters, separate ground voltage levels can be applied to the source nodes of the driver transistors, or separate power supply voltage levels can be applied to the source nodes of the load transistors (or both). Asymmetric bias voltages applied to the transistors in this manner will reduce the transistor drive current, and can thus mimic the effects of bias temperature instability (BTI). Cells that are vulnerable to threshold voltage shift over time can thus be identified.

Abstract: A static random access memory (SRAM) including at least a memory cell array, a first data line, a second data line, a third data line and a driver circuit. The first data line is electrically coupled with the memory cell array. The second data line is electrically coupled with the memory cell array. The driver circuit is electrically coupled with the first data line, the second data line and the third data line. The driver circuit includes a recovery circuit electrically coupled with the first data line, the second data line and the third data line. During a write operation of the SRAM, the recovery circuit is configured to pull a voltage level of the first data line to a first voltage level when the recovery circuit is enabled.