Abstract: Disclosed is a semiconductor memory device. The semiconductor memory device includes: a first memory block; and a second memory block sharing a block word line with the first memory block, in which the block word line includes a first block word line disposed so as to overlap the first memory block and a second block word line disposed so as to overlap the second memory block. According to the present disclosure, it is less likely to have an operation failure.

Abstract: Multi-level cell (MLC) static random access memory (SRAM) (MLC SRAM) cells configured to perform multiplication operations are disclosed. In one aspect, an MLC SRAM cell includes SRAM bit cells, wherein data values stored in SRAM bit cells correspond to a multiple-bit value stored in the MLC SRAM cell that serves as first operand in multiplication operation. Voltage applied to read bit line is applied to each SRAM bit cell, wherein the voltage is an analog representation of a multiple-bit value that serves as a second operand in the multiplication operation. For each SRAM bit cell, if a particular binary data value is stored, a current correlating to the voltage of the read bit line is added to a current sum line. A magnitude of current on the current sum line is an analog representation of a multiple-bit product of the first operand multiplied by the second operand.

Abstract: SRAM structures are provided. A first SRAM cell is adjacent to a second SRAM cell in the same row. A third SRAM cell is adjacent to the first SRAM cell in the same column. A fourth SRAM cell is adjacent to the second SRAM in the same column. First fins are parallel to a first direction and positioned within the first and third SRAM cells. Second fins are parallel to the first direction and positioned within the second and fourth SRAM cells. A contact bar extends parallel to a second direction to across the first fins and extends parallel to a third direction to across the second fins. A contact plug is formed on the contact bar. VSS line is electrically coupled to the contact bar through the contact plug. The first direction is perpendicular to the second direction. The second direction is opposite to the third direction.

Abstract: The present invention provides a layout pattern of a static random access memory (SRAM). The layout pattern includes a first inverter and a second inverter constituting a latch circuit, wherein the latch circuit includes four transistors, a first access transistor (PG1) and a second access transistor (PG2) being electrically connected to the latch circuit, wherein the first access transistor is electrically connected to a first word line and a first bit line, and the second access transistor is electrically connected to a second word line and a second bit line, the first access transistor has a first gate length, the first access transistor has a second gate length, and the first gate length is different from the second gate length, and two read transistors series connected to each other, wherein one of the two read transistors is connected to the latch circuit.

Abstract: In some examples, an apparatus includes a plurality of first transistors coupled to a first input terminal and a first output terminal. The apparatus also includes a plurality of second transistors coupled to a second input terminal and a second output terminal. The apparatus further includes a plurality of first dummy transistors coupled to the first input terminal and the second output terminal. The apparatus also includes a plurality of second dummy transistors coupled to the second input terminal and the first output terminal.

Abstract: Power switch devices and methods are provided where an undervoltage event in a supply voltage is detected. Information regarding the undervoltage event is stored in a memory element. The memory element is supplied by a control signal.

Abstract: A multi-bit computing circuit for computing-in-memory applications is controlled by an input port and includes a memory cell array and a capacitor sharing unit. The memory cell array includes a plurality of memory cells connected to the input port. The memory cells store a weight which is formed in two's complement. The capacitor sharing unit includes a plurality of switches, a plurality of capacitors and a sense amplifier. The switches are electrically connected to the memory cells, respectively. The capacitors are electrically connected to the switches, respectively. The sense amplifier is electrically connected to the capacitors and generates a total operational value. The capacitors are located among the switches and the sense amplifier, and the switches are switched to enable the total operational value to be equal to the input value multiplied by the weight. The present disclosure utilizes 8T SRAM cells without an extra DAC structure.

Abstract: An integrated circuit includes a plurality of first memory cells and a plurality of second memory cells. Each cell of the plurality of first memory cells includes a first inverter, a second inverter, a first pass-gate (PG) transistor and a second PG transistor. Each inverter of the first and second inverters includes a P-type single FinFET transistor and an N-type single FinFET transistor. The first PG transistor and the second PG transistor each are an N-type single FinFET transistor. Each cell of the plurality of second memory cells includes a third inverter, a fourth inverter, a third PG transistor and a fourth PG transistor. Each inverter of the third and fourth inverters includes a P-type single FinFET transistor and an N-type transistor. Each transistor of the third and fourth PG transistors include at least two FinFET transistors electrically coupled in a parallel configuration.

Abstract: Ultra dense and stable 4T SRAM designs are provided. In one aspect, a 4T SRAM bitcell includes: two NFETs cross-coupled with two PFETs, wherein the NFETs are both connected directly to a word line, wherein a first one of the PFETs is connected to a first bit line via a first one of the NFETs and a second one of the PFETs is connected to a second bit line via a second one of the NFETs, and wherein the PFETs are each separately connected to ground. An SRAM device including the present 4T SRAM bitcell as well as a method of operating the SRAM device are also provided.

Abstract: A fine grained negative wordline scheme for SRAM memories is disclosed. The scheme includes a circuit having a static random access memory (SRAM) cell including at least a wordline coupled to a plurality of NFETs of a transistor array. The circuit further includes a wordline driver including a plurality of inverters coupled between a wordline group decode node, a power supply and the wordline. Overvoltage on the wordline driver and NFETs of the SRAM cell are eliminated by applying a power gating mode and lowering the power supply voltage.

Abstract: A dual port static random access memory (DPSRAM) cell includes a first power line, a first bit line and a second bit line. The first power line is disposed between a first word line and a second word line. The first bit line is disposed between the first word line and the first power line. The second bit line is disposed between the second word line and the first power line.

Abstract: This invention relates to a semiconductor device that reduces energy consumed to write data to a nonvolatile storing section. A write control circuit 34 stores the same data as that held in MTJ elements MTJ1 and MTJ2. In a store operation storing the data held in a slave latch 32 into the MTJ elements MTJ1 and MTJ2, the write control circuit 34 compares the data stored therein with the data held in the slave latch 32 to control whether or not to write the data to the MTJ elements MTJ1 and MTJ2. If the internally stored data coincides with the data held in the slave latch 32, the write control circuit 34 performs control not to write the data to the MTJ elements MTJ1 and MTJ2.

Abstract: Disclosed aspects relate to a first-in-first-out (FIFO) buffer. The FIFO buffer may include an input interface to receive a set of data payloads. The FIFO buffer may include a set of buffer entry elements to store the set of data payloads. The FIFO buffer may include a set of status indicators to indicate a set of statuses of the set of buffer entry elements with respect to the set of data payloads. The FIFO buffer may include an output interface for release of the set of data payloads.

Abstract: A method, of writing to a memory cell, includes: causing a pulling device of the memory cell to pull a voltage level at a first data node of the memory cell toward a first supply voltage level responsive to a voltage level at a second data node of the memory cell; causing a pass gate of the memory cell to pull the voltage level at the first data node of the memory cell toward a second supply voltage level responsive to a word line signal, the second supply voltage level being different from the first supply voltage level; and limiting a driving capability of the pulling device by a resistive device, the resistive device being electrically coupled between the pulling device and a supply voltage source configured to provide a first supply voltage, the first supply voltage having the first supply voltage level.

Abstract: A first memory section is disposed on a substrate. A second memory section is vertically stacked on the first memory section. The first memory section is provided between the substrate and the second memory section. The first memory section includes a flash memory cell structure, and the second memory section includes a variable resistance memory cell structure. The flash memory cell structure includes at least one cell string comprising a plurality of first memory cells connected in series to each other and a bit line on the substrate connected to the at least one cell string. The bit line is interposed vertically between the at least one cell string and the second memory section and connected to the second memory section.

Abstract: An SRAM cell with dynamic split ground (GND) and split wordline (WL) for extreme scaling is disclosed. The memory cell includes a first access transistor enabled by a first wordline to control access to cross coupled inverters by a first bitline. The memory cell further includes a second access transistor enabled by a second wordline to control access to the cross coupled inverters by a second bitline. The memory cell further includes a split ground line comprising a first ground line (GNDL) separated from a second ground line (GNDR). The GNDL is connected to a transistor of a first inverter of the cross coupled inverters and the GNDR is connected to a first transistor of a second inverter of the cross coupled inverters.

Abstract: Cache mode for word lines where the cache mode utilizes an internal timer for a memory cell to disable connection of a voltage to a transistor of a word line driver of the memory cell before an end of a specified end of period. By early disconnection, the local controls of the memory cell may provide additional time to settle after disconnection of the voltage without interfering with operations (e.g., read, write, activate) of the memory cell, since the internal timer may be programmed to be greater than or equal to a worst case scenario for the operations.

Abstract: Apparatus and methods for protection against inadvertent programming of fuse cells are provided herein. In certain configurations, a fuse system includes a fuse protection diode, a fuse programming transistor, and a fuse cell electrically connected in series between a first pad and a second pad. The fuse system further includes a bias generator that biases a gate of the fuse programming transistor to control an amount of current provided to the fuse cell. The fuse protection diode helps prevent inadvertent programming of the fuse cell by blocking current from flowing through the fuse cell in response to a decrease in voltage of the first pad relative to the second pad.

Abstract: A configuration memory circuit according to an embodiment includes: a first and second wirings; and a first to eighth transistors, the first and fourth transistors having a first-conductive-type, the second, third, fifth, and sixth transistors having a second-conductive-type, the first to third transistors being connected in series, the fourth to sixth transistors being connected in series, gates of the first and third transistors being connected to the first wiring, one of a source and a drain of the seventh transistor, and the first wiring, a gate of the second transistor being connected to a third wiring, gates of the fourth and sixth transistors being connected to the second wiring, one of a source and a drain of the eighth transistor, and the second wiring, a gate of the fifth transistor being connected to the third wiring, gates of the seventh and eighth transistors being connected to a fifth wiring.

Abstract: A memory system includes dynamic random-access memory (DRAM) component that include interconnected and redundant component data interfaces. The redundant interfaces facilitate memory interconnect topologies that accommodate considerably more DRAM components per memory channel than do traditional memory systems, and thus offer considerably more memory capacity per channel, without concomitant reductions in signaling speeds. Each DRAM component includes multiplexers that allow either of the data interfaces to write data to or read data from a common set of memory banks, and to selectively relay write and read data to and from other components, bypassing the local banks. Delay elements can impose selected read/write delays to align read and write transactions from and to disparate DRAM components.

Abstract: Memory structures are provided, where a fast SRAM in an mNVSRAM block may serve as the buffer for a large block NVM memory to increase the data exchange rate between computing units or processor cores and the large NVM memory. The mNVSRAM blocks may also provide a fast boot function, where a boot code may be stored in the NVM parts of the mNVSRAM block, and due to the high bandwidth communication between fast SRAM part and the associated NVM memories, the boot code may be transferred into the fast SRAM in one or a few clock cycles enabling fast boot up function. Similarly, code stored in the NVM parts of an mNVSRAM block may be transferred into fast SRAM rapidly at wake-up time enabling fast wake up and voiding a need to wake up any other memory part, which may also result in energy savings for the computing system.

Abstract: A storage bitcell comprising a first inverter cross-coupled with a second inverter, both the first and second inverter being in a path between a first potential and a second potential; wherein a first isolator is connected in the path between the first inverter and the first potential. The storage bitcell has particular application as Static Random-Access Memory (SRAM) circuitry.

Abstract: Methods, systems, and devices for polarity-conditioned memory cell write operations are described. A memory cell may be written with a logic state by performing a write operation that includes applying a first write voltage across the memory cell with a first polarity, and applying a second write voltage across the memory cell after applying the first write voltage of the write operation, the second write voltage of the write operation having a second polarity that is different than the first polarity. In some examples, performing a write operation on a memory cell having different voltage polarities across the memory call may allow such a write operation to be completed in a shorter time than a write operation having a voltage of a single polarity.

Abstract: A method and apparatus for reading data from a memory is disclosed. A particular data storage cell may generate a voltage difference between a true bit line and a complement bit line coupled to the data storage cell. A selection circuit may generate a voltage level on a true data line and a complement data line using the voltage levels of the true and complement bit lines. An amplifier circuit may amplify a voltage difference between the true data line and the complement data line to generate a full-swing voltage difference between the true and complement data lines, and may preset the voltage levels of the true and complement data lines to a ground potential based on a reset timing signal.

Abstract: An SRAM cell with dynamic split ground (GND) and split wordline (WL) for extreme scaling is disclosed. The memory cell includes a first access transistor enabled by a first wordline to control access to cross coupled inverters by a first bitline. The memory cell further includes a second access transistor enabled by a second wordline to control access to the cross coupled inverters by a second bitline. The memory cell further includes a split ground line comprising a first ground line (GNDL) separated from a second ground line (GNDR). The GNDL is connected to a transistor of a first inverter of the cross coupled inverters and the GNDR is connected to a first transistor of a second inverter of the cross coupled inverters.

Abstract: A semiconductor device includes a substrate, at least one gate, and an insulating structure. The substrate includes at least one semiconductor fin. The gate is disposed on the semiconductor fin. The gate has at least one end sidewall. The insulating structure is disposed adjacent to the gate. The insulating structure has a sidewall facing the gate, and the end sidewall of the gate is in contact with a portion of the sidewall of the insulating structure while leaves another portion of the sidewall of the insulating structure uncovered.

Abstract: IC device structures including a lateral compound resistor disposed over a surface of a substrate, and fabrication techniques to form such a resistor in conjunction with fabrication of a transistor. Rather than being stacked vertically, a compound resistive trace may include a plurality of resistive materials arranged laterally over a substrate. Along a resistive trace length, a first resistive material is in contact with a sidewall of a second resistive material. A portion of a first resistive material along a centerline of the resistive trace may be replaced with a second resistive material so that the second resistive material is embedded within the first resistive material.

Abstract: A bias circuit is provided that is configure to control the bias for a diode-connected transistor operating in the sub-threshold region to produce a gate-to-source voltage. A differential tuning voltage derived from the gate-to-source voltage tunes a plurality of varactors.

Abstract: A semiconductor device includes a logic circuit, a memory circuit having a plurality of first static memory cells formed by a transistor on the semiconductor substrate, a monitor circuit having a second static memory cell formed by a transistor on the semiconductor substrate, the monitor circuit being configured to apply stress to the second static memory cell during a period in which the semiconductor device operates so that a state of the second static memory cell can be notified, and a bus coupled with the logic circuit, the memory circuit and the monitor circuit, wherein a size of the transistor of one cell of the first static memory cells is substantively the same as that of the transistor of the second static memory cell.

Abstract: A resistive memory cell is connected in circuitry which has a first input terminal for applying neuron input signals including a read portion and a write portion. The circuitry includes a read circuit producing a read signal dependent on resistance of the memory cell, and an output terminal providing a neuron output signal, dependent on the read signal in a first state of the memory cell. The circuitry also includes a storage circuit storing a measurement signal dependent on the read signal, and a switch set operable to supply the read signal to the storage circuit during application of the read portion of each neuron input signal to the memory cell, and, after application of the read portion, to apply the measurement signal in the apparatus to enable resetting of the memory cell to a second state.

Abstract: Disclosed is an SRAM cell capable of performing a differential operation. An SRAM cell according to an embodiment of the present disclosure may include a data node portion including four transistors constituting first and second data nodes; a data controller including first and second pass-gate transistors configured to control read and write of data in the first and second data nodes; and a control transistor connected to the data node portion through the second data node and configured to be controlled based on a driving voltage of a second word line having an opposite polarity to a first word line transmitting a driving voltage to the data controller.

Abstract: Control circuits for memory devices are described. The control circuits may be configured such that the duration of the pulses delivered to the sense amplifiers increases with increasing parasitic RC delays. That is, the larger the parasitic RC delay along a line connecting a drive circuit to the sense amplifiers, the larger the duration of the pulses delivered. In some embodiments, a feedback line may be inserted between the end of the output signal line and the drive circuit to route the control pulses back to the drive circuit. The drive circuit may be arranged such that the duration of the pulses with which the sense amplifiers are driven depends on the delay experienced along the feedback line. In this way, the longer the RC delay arising along the feedback line, the larger the durations of the pulses.

Abstract: Bi-stable static random access memory (SRAM) bit cells that facilitate direct writing for storage are disclosed. In one aspect, a bi-stable SRAM bit cell includes source and drain regions, and a gate region formed over a well region between the source and drain regions, which results in two (2) bipolar junction transistors (BJTs) formed within a bi-stable SRAM bit cell. A base tap region and a collector tap region are employed to provide voltages for read and write operations. The base tap region is formed beside a shallow trench isolation (STI) region having a bottom surface higher in a Y-axis direction in the well region than a bottom surface of the well region. The collector tap region is formed on one side of an STI region having a bottom surface lower in the Y-axis direction in the substrate than the bottom surface of the well region.

Abstract: The disclosed computer-implemented method for storing data may include (i) identifying a request to backup a set of data according to a storage-as-a-service configuration that stores data into cloud storage, (ii) dividing the set of data to be backed up into chunks of data, (iii) dividing, for each of the chunks of data, a respective chunk into blocks of data, (iv) generating, for each of the chunks of data, at least one block of parity bits for the respective chunk of data based on applying an erasure code to the blocks of data, and (v) splitting, during backing up the chunks of data according to the storage-as-a-service configuration, the respective blocks of data and the generated block of parity bits into heterogeneous storage media targets such that the storage-as-a-service configuration benefits from the heterogeneous storage media targets. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A system and method for floorplanning a memory. A computing system includes a processing unit which generates memory access requests and a memory. The size of each memory line in the memory includes M bits. A memory macro block includes at least a primary array and a sidecar array. The primary array stores a first portion of a memory line and the sidecar array stores a second smaller portion of the memory line being accessed. The primary array and the sidecar array have different heights. The height of the sidecar array is based on a notch height in at least one corner of the memory macro block. The notch creates on-die space for s reserved area on the die. The notches result in cross-shaped, T-shaped, and/or L-shaped memory macro blocks.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: The present invention relates generally to the field of semiconductor memories and in particular to memory cells comprising a static random access memory (SRAM) bitcell (100). Leakage current in the read path is reduced by connecting a read access transistor terminal either to GND or VDD during read access or write access and idle state. The SKAM cell inverters may be asymmetrical in size. The memory may comp rise various boost circuits to allow low voltage operation or application of distinguished supply voltages.

Abstract: A method and apparatus for writing data to a memory device are provided that do not change the precharge states for a bit line pair in a current write cycle if the current data bit is unchanged from the preceding write cycle.

Abstract: Arrays of static random access memory (SRAM) cells and methods of fabricating the same are provided. A first communication path is disposed a first distance from an edge of the array and is operable to control access to SRAM cells of a first row of the array for write operations. A second communication path is disposed a second distance from the edge of the array and is operable to control access to SRAM cells of a second row of the array for write operations. The second distance is different than the first distance. A first conductive structure is disposed a third distance from the edge of the array and is operable to control access to the SRAM cells of the first row for read operations. A second conductive structure is disposed the third distance from the edge of the array and is operable to control access to the SRAM cells of the second row for read operations.

Abstract: The present invention provides a semiconductor memory circuit, the semiconductor memory circuit includes a static random access memory (SRAM), having a first storage node and a second storage node, a dynamic oxide semiconductor random access memory (DOSRAM), electrically connected to the SRAM, wherein the DOSRAM includes a first oxide semiconductor field effect transistor (OSFET) and a capacitor, wherein a source of the first OSFET is electrically connected to the first storage node, and a drain of the first OSFET is electrically connected to the capacitor, and a second transistor and a third oxide semiconductor field effect transistor (OSFET), wherein a drain of the second transistor is electrically connected to the second storage node, a source of the third OSFET is electrically connected to the capacitor, and a drain of the third OSFET is electrically connected to a gate of the third transistor.

Abstract: A device including a memory cell and write assist circuit is disclosed. The memory cell includes a first inverter and a second inverter cross-coupled with the first inverter. The write assist circuit is coupled to the memory cell. During a write operation of the memory cell, the write assist circuit is configured to adjust a voltage level of an operational voltage provided to the first inverter or the second inverter by a bias voltage difference.

Abstract: A memory cell of a static random access memory based on DICE structure, which includes a redundant information latch circuit and a redundant bit selection circuit. The redundant information latch circuit is formed by four MOS transistors and includes four data storage nodes, the redundant bit selection circuit is formed by four MOS transistors M0, M1, M2 and M3, with their drains connected to the four data storage nodes X0, X1, X2 and X3. Sources of M0 and M2 are connected to each other and are connected to a bit line BL, sources of M1 and M3 are connected to each other and are connected to a bit line BLB; and gates of the four MOS transistors are connected to each other and are connected to a word line WL.

Abstract: In some examples, a device includes at least two integrated circuits (ICs) and a first multi-chip module (MCM) substrate coupled to the at least two ICs, the first MCM substrate comprising a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA. The device further includes a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, and wherein the second pitch is greater than the first pitch. The device further includes a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA, wherein the first MCM substrate and the second MCM substrate comprise organic, non-silicon insulating material.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: A volatile memory device includes a memory cell array configured to be supplied with a first power supply voltage through a first power supply line, and configured to store data based on the first power supply line; and a peripheral circuit configured to be supplied with a second power supply voltage through a second power supply line, and configured to control the memory cell array based on the second power supply line, the peripheral circuit including a self timing pulse circuit configured to determine an operation timing of the peripheral circuit, the self timing pulse circuit configured to be supplied with the first power supply voltage through the first power supply line, and the self timing pulse circuit being configured to adjust the operation timing of the peripheral circuit according to the voltage level of the first power supply voltage.

Abstract: Semiconductor memory devices and methods for writing data in memory cells are provided. An exemplary method for writing data in a memory cell includes providing the memory cell with a first pull-up transistor, a first power supply line coupled to the first pull-up transistor, a second pull-up transistor, and a second power supply line coupled to the second pull-up transistor. The method further includes applying a primary voltage from the first power supply line to the first pull-up transistor. The method also includes applying a secondary voltage from the second power supply line to the second pull-up transistor, wherein the secondary voltage is higher than the primary voltage. Further, the method includes performing a write operation to save a selected value in the memory cell.

Abstract: A memory device includes a local bit line coupled to a plurality of memory cells and a global bit line through first and second selectable parallel paths having first and second impedances, respectively. The first path is active in at least one of a set operation or a forming operation and the second path is active in a reset operation. A select device to select a memory element includes a drain having a first doping level and a source having a second doping level lower than the first doping level, wherein the device is configured to provide a first on impedance or a second on impedance to the resistive memory element in response to a control signal.

Abstract: A system to enable detection of the process corner of each of the P and N devices of an SRAM array (of bitcells) and of peripheral devices. This permits more focused (optimized and compensated) design of non-SRAM peripheral circuits and of read and write assist circuits for better handling of process distribution impact on circuits improving functionality and yield.

Abstract: An apparatus and method are provided for implementing write assist with boost attenuation for static random access memory (SRAM) arrays. The apparatus includes a memory array comprising a plurality of SRAM cells. The apparatus further includes a write driver connected to each of a differential pair of bit lines in each of the plurality of SRAM cells of the memory array. The apparatus further includes a write assist attenuation circuit connected to the write driver, the write assist attenuation circuit comprising a clamping device configured to modify a control signal as a function of supply voltage and process to attenuate an amount of boost applied to pull one of the bit lines below ground in an active phase of a write cycle.

Abstract: Various implementations described herein are directed to an integrated circuit having a memory cell array disposed in a first area of the integrated circuit. The memory cell array may include memory cells with first transistors of multiple types. The integrated circuit may include a process sensor disposed in a second area of the integrated circuit that is different than the first area. The process sensor may include a process detector having second transistors of the multiple types that are separate from the first transistors. The second transistors of the process detector may be arranged for detecting process variation of the memory cells of the memory cell array.