Abstract: A spin current magnetization rotational element includes: a magnetization free layer including a synthetic structure consisting of a first ferromagnetic metal layer, a second ferromagnetic metal layer and a first non-magnetic layer sandwiched by the first ferromagnetic metal layer and the second ferromagnetic metal layer; and an antiferromagnetic spin-orbit torque wiring that extends in a second direction intersecting with a first direction that is a lamination direction of the synthetic structure and is joined to the first ferromagnetic metal layer, wherein the spin current magnetization rotational element is configured to change a magnetization direction of the magnetization free layer by applying current to the antiferromagnetic spin-orbit torque wiring.

Abstract: A semiconductor structure is provided. The semiconductor structure includes: a substrate; a magnetic layer over the substrate; a magnetic tunnel junction (MTJ) cell over the magnetic layer; and a non-magnetic conductive layer between the magnetic layer and the MTJ cell. An associated method for fabricating the semiconductor structure is also disclosed.

Abstract: Disclosed are methods, systems and devices for operation of dual non-volatile memory devices. In one aspect, a pair of non-volatile memory device coupled in series may be placed in complementary memory states any one of multiple memory states in write cycles by controlling a current and a voltage applied to terminals of the non-volatile memory device.

Abstract: A magnetic memory device includes a substrate, a landing pad on the substrate, first and second magnetic tunnel junction patterns disposed on the interlayer insulating layer and spaced apart from the landing pad when viewed from a plan view, and an interconnection structure electrically connecting a top surface of the second magnetic tunnel junction pattern to the landing pad. A distance between the landing pad and the first magnetic tunnel junction pattern is greater than a distance between the first and second magnetic tunnel junction patterns, and a distance between the landing pad and the second magnetic tunnel junction pattern is greater than the distance between the first and second magnetic tunnel junction patterns, when viewed from a plan view.

Abstract: A method is presented for integrating a resistive random access memory (ReRAM) device with vertical transistors on a single chip. The method includes forming a vertical field effect transistor (FET) including an epitaxial tip defining a drain terminal and forming the ReRAM device in direct contact with the epitaxial tip of the vertical FET such that a current conducting filament is formed at the epitaxial tip due to electric field enhancement.

Abstract: Techniques and circuits for testing and configuring bias voltage or bias current for write operations in memory devices are presented. Registers and nonvolatile storage is included on the memory devices for storing values used to control testing of the memory devices as well as for configuring parameters related to both testing and normal operation.

Abstract: An MRAM device includes a lower electrode on a substrate, an MTJ structure on the lower electrode, a metal oxide pattern on the MTJ structure, a conductive pattern on at least a portion of a sidewall of the metal oxide pattern, and an upper electrode on the metal oxide pattern and the conductive pattern. The conductive pattern has a thickness varying along the sidewall of the metal oxide pattern in a plan view.

Abstract: A magnetoresistance effect element includes a reference layer made of a ferromagnetic material, a recording layer made of a ferromagnetic material, and a barrier layer disposed between the reference layer and the recording layer. The reference layer and the recording layer have an in-plane magnetization direction parallel to a surface of the layers. The recording layer has a shape that has short axis and long axis perpendicular to the short axis in plan view. A first value obtained by dividing a thickness of the recording layer by a length of the short axis of the recording layer is greater than 0.3 and smaller than 1.

Abstract: A method is provided for a reading memory even if there is a threshold voltage in an overlapped threshold voltage (VTH) region between a first state distribution and a second state distribution. The method includes ramping a bias on a memory cell a first time to determine a first threshold voltage (VTH1) of the memory cell and determining whether the VTH1 is within the overlapped VTH region. Upon determination that the memory cell is within the overlapped VTH region, the method further includes applying a write pulse to the memory cell; ramping a bias on the memory cell a second time to determine a second threshold voltage (VTH2); and determining the state of the memory cell prior to receiving the write pulse based on a comparison between the VTH1 and the VTH2.

Abstract: High density resistive memory structures, integrate circuits with high density resistive memory structures, and methods for fabricating high density resistive memory structures are provided. In an embodiment, a high density resistive memory structure includes a semiconductor substrate and a plurality of first electrodes in a first plane in and/or over the semiconductor substrate. Further, the high density resistive memory structure includes a plurality of second electrodes in a second plane in and/or over the semiconductor substrate. The second plane is parallel to the first plane, and each second electrode in the plurality of second electrodes crosses over or under each first electrode in the plurality of first electrodes at a series of cross points. Each second electrode in the plurality of second electrodes is non-linear and the series of cross points formed by each respective second electrode is non-linear.

Abstract: The disclosed technology generally relates to magnetic devices, and more particularly to magnetic devices configured to generate a stream of domain walls propagating along an output magnetic bus. In an aspect, a magnetic device includes a magnetic propagation layer, which in turn includes a plurality of magnetic buses. The magnetic buses include an output magnetic bus configured to guide propagating magnetic domain walls. The magnetic propagation layer further comprises a central region in which the magnetic buses converge and are joined together. The magnetic buses include at least a first and a second magnetic bus having opposite magnetization orientations with respect to each other, such that a domain wall separating the opposite magnetization states is pinned in the central region.

Abstract: A processor-implemented method, according to one embodiment, includes: activating a subset of a plurality of p-MTJ cells oriented in one or more columns of a MRAM array. Activating the subset of p-MTJ cells includes: applying a first voltage to a gate terminal of the transistor in each of the p-MTJ cells in parallel, applying a second voltage to a first end of the MTJ sensor in each of the p-MTJ cells in parallel, and applying a third voltage to a drain terminal of the transistor in each of the p-MTJ cells in parallel. The processor-implemented method also includes: monitoring the activated subset of p-MTJ cells, determining whether any of the activated p-MTJ cells have failed, and in response to determining that an activated p-MTJ cell has failed, physically locating the failed p-MTJ cell. Other systems, methods, and computer program products are described in additional embodiments.

Abstract: A magnetic memory device includes a semiconductor substrate; a magnetoresistive element provided on the semiconductor substrate. The magnetoresistive element includes a storage layer, a tunnel barrier layer, and a reference layer which are stacked, the reference layer having a magnetization direction perpendicular to a principal surface of the semiconductor substrate. The magnetic memory device further includes a magnetic field generation section provided away from the magnetoresistive element and configured to generate a magnetic field perpendicular to the principal surface of the semiconductor substrate. The semiconductor substrate, the magnetoresistive element and the magnetic field generation section are integrated as one unit.

Abstract: A magnetoresistive effect element according to one embodiment includes: a first magnetic layer; a nonmagnetic layer; a second magnetic layer; a metal layer; and a third magnetic layer. An area of a bottom of the third magnetic layer is larger than an area of a top of the third magnetic layer. An angle between the top of the third magnetic layer and a side of the third magnetic layer is larger than an angle between a top of the second magnetic layer and a side of the second magnetic layer, or an angle between the bottom of the third magnetic layer and a side of the third magnetic layer is smaller than an angle between the bottom of the second magnetic layer and a side of the second magnetic layer.

Abstract: According to one embodiment, an oscillator includes first to third conductive bodies, a first stacked unit, and a magnetic unit. The first conductive body includes first, second region, and third regions. The second conductive body includes a portion separated from the third region. The first stacked unit is provided between the third region and the portion. The first stacked unit includes first to fourth magnetic layers, and first to third intermediate layers. At least a portion of the magnetic unit and at least a portion of the first stacked unit overlap each other. In a first state, the first to fourth magnetizations are aligned with a third direction perpendicular to the first direction and the second direction. The second magnetization has a component in a reverse orientation of the first magnetization. The fourth magnetization has a component in a reverse orientation of the third magnetization.

Abstract: Methods and structures useful for magnetoresistive random-access memory (MRAM) are disclosed. The MRAM device has a magnetic tunnel junction stack having a significantly improved performance of the free layer in the magnetic tunnel junction structure. The MRAM device also utilizes a plurality of orthogonal spin transfer magnetic tunnel junction (OST-MTJ) stacks connected in series, with each OST-MTJ stack capable of selective activation by application of an external magnetic field, thereby allowing efficient writing of the bit without a concomitant increase in read disturb.

Abstract: Voltage-switched magneto-resistive random access memory (MRAM) employing separate read operation circuit paths from a shared spin torque write operation circuit path is disclosed. The MRAM includes an MRAM array that includes MRAM bit cell rows each including a plurality of MRAM bit cells. MRAM bit cells on an MRAM bit cell row share a common electrode to provide a shared write operation circuit path for write operations. Dedicated read operation circuit paths are also provided for each MRAM bit cell separate from the write operation circuit path. As a result, the read operation circuit paths for the MRAM bit cells do not vary as a result of the different layout locations of the MRAM bit cells with respect to the common electrode. Thus, the read parasitic resistances of the MRAM bit cells do not vary from each other because of their different coupling locations to the common electrode.

Abstract: A memory includes a global reference circuit for generating a signal that controls the resistance of a plurality of reference devices used to read data in memory cells by sense amplifiers of the memory. The signal is generated by an output of an operational amplifier of the global reference circuit. The operational amplifier includes a first input whose voltage is set by flowing current through a reference circuit and a second input whose voltage is set by flowing current through a master reference device. The signal controls the resistance of the master reference device such that the voltages of the inputs of the operational amplifier match.

Abstract: Apparatuses, systems, and methods are disclosed for a chip with phase change memory (PCM) and magnetoresistive random access memory (MRAM). An apparatus includes a semiconductor circuit formed over a substrate of a chip. An apparatus includes a PCM array formed over a semiconductor circuit. An apparatus includes an MRAM array formed over a semiconductor circuit.

Abstract: A magnetic device and method for providing the magnetic device are described. The magnetic device includes magnetic junctions and spin-orbit interaction (SO) active layer(s). The magnetic junction includes free and pinned layers separated by a nonmagnetic spacer layer. The free layer has a free layer perpendicular magnetic anisotropy (PMA) energy greater than a free layer out-of-plane demagnetization energy. The free layer also includes a diluted magnetic layer that has a PMA greater than its out-of-plane demagnetization energy. The diluted magnetic layer includes magnetic material(s) and nonmagnetic material(s) and has an exchange stiffness that is at least eighty percent of an exchange stiffness for the magnetic material(s). The SO active layer(s) are adjacent to the free layer. The SO active layer(s) carry a current in-plane and exert a SO torque on the free layer due to the current. The free layer is switchable between stable magnetic states using the SO torque.

Abstract: A multi-state MRAM device comprises N overlapping ovals defining a free ferromagnetic region. The size of the free ferromagnetic region is controlled the shape anisotropy of the configuration via at least a aspect ratio greater than 2, of the free ferromagnetic region. The free ferromagnetic region has a magnetic moment spontaneously aligned along the long axis in each oval outside the center region. A center magnetic moment has a multitude of exactly 2*N stable orientations determined by the magnetic moments in the segments of the ovals outside the center region. An embodiment is an MRAM device using tunneling junctions to achieve a multi-state memory configuration. Certain embodiments includes an electrically conducting heavy-metal layer disposed adjacent to and connected with the free ferromagnetic region. Some embodiments include a topological insulating material, such as Bi2Se3.

Abstract: A magnetic device comprising having a first magnetic layer having a first magnetization direction, a second magnetic layer having a second magnetization direction, a first coupling layer interposed between the first and second magnetic layers, a third magnetic layer having a third magnetization direction, a first magnetoresistive layer interposed between the third magnetic layer and the second magnetic layer, and a circuit connected to one or more of the layers of the magnetic device by at least a pair of leads. The circuit is configured to determine a change in resistance between the pair of leads. The change in resistance is based at least in part on a change in an angular relationship between the third magnetization direction and the second magnetization direction caused by an external magnetic field or a current passing through at least a portion of the device.

Abstract: A memory device includes a plurality of resistive memory cells and a plurality of word lines. Each resistive memory cell includes a resistive memory element, a first switching element electrically coupled in series with the resistive memory element, and a second switching element electrically coupled in series with the first switching element. The first switching element and the second switching element in each resistive memory cell is coupled to different ones of the word lines.

Abstract: A magnetoresistive magnetic tunnel junction (MTJ) stack includes a free magnetic region, a fixed magnetic region, and a dielectric layer positioned between the free magnetic region and the fixed magnetic region. In one aspect, the fixed magnetic region consists essentially of an unpinned, fixed synthetic anti-ferromagnetic (SAF) structure which comprises (i) a first layer of one or more ferromagnetic materials, including cobalt, (ii) a multi-layer region including a plurality of layers of ferromagnetic materials, wherein the plurality of layers of ferromagnetic materials include a layer of one or more ferromagnetic materials including cobalt, and (iii) an anti-ferromagnetic coupling layer disposed between the first layer and the multi-layer region. The free magnetic region may include a circular shape, the one or more ferromagnetic materials of the first layer may include cobalt, iron and boron, and the dielectric layer may be disposed on the first layer.

Abstract: A synthetic antiferromagnetic (SAF) structure for a spintronic device is disclosed and has an FL2/AF coupling/CoFeB configuration where FL2 is a ferromagnetic free layer with intrinsic PMA. In one embodiment, AF coupling is improved by inserting a Co dusting layer on top and bottom surfaces of a Ru AF coupling layer. The FL2 layer may be a L10 ordered alloy, a rare earth-transition metal alloy, or an (A1/A2)n laminate where A1 is one of Co, CoFe, or an alloy thereof, and A2 is one of Pt, Pd, Rh, Ru, Ir, Mg, Mo, Os, Si, V, Ni, NiCo, and NiFe, or A1 is Fe and A2 is V. A method is also provided for forming the SAF structure.

Abstract: According to one embodiment, a magnetoresistive memory device includes a first magnetic layer, a second magnetic layer on one major surface side of the first magnetic layer via a first nonmagnetic layer, a third magnetic layer on the second magnetic layer via a first Ru layer, a sidewall insulating film on sides of the layers, a fourth magnetic layer on an other major surface side of the first magnetic layer via a second nonmagnetic layer, and a fifth magnetic layer on the fourth magnetic layer via a second Ru layer. The reversed magnetic field of the second magnetic layer is smaller than that of the third and fourth magnetic layers, and the reversed magnetic field of the fifth magnetic layer is smaller than that of the third and fourth magnetic layers.

Abstract: The present invention is directed to a method for manufacturing a memory cell that includes a magnetic memory element electrically connected to a two-terminal selector. The method includes the steps of depositing a magnetic memory element film stack on a substrate; depositing a selector film stack on top of the magnetic memory element film stack; etching the selector film stack with an etch mask formed thereon to remove at least a switching layer in the selector film stack not covered by the etch mask, thereby forming a selector pillar; depositing a first conforming dielectric layer over the selector pillar and surrounding surface; etching a portion of the first conforming dielectric layer covering the surrounding surface to form a first protective sleeve around at least the switching layer of the selector pillar; and etching the magnetic memory element film stack using the etch mask and the first protective sleeve as a composite mask to form a memory cell pillar.

Abstract: The semiconductor memory device includes: a memory unit having a plurality of memory blocks; a voltage supply circuit configured to generate a plurality of operating voltages and transmit the operating voltages to global word lines; and a pass unit coupled between respective local word lines of the plurality of memory blocks and the global word lines, and configured to couple the local word lines of a selected memory block to the global word lines in response to block select signals corresponding to the respective memory blocks, wherein the pass unit couples local word lines of an unselected memory block to the global word lines for a preset time and then isolates local word lines of the unselected memory block from the global word lines in response to the block select signals while coupling local word lines of the selected memory block to the global word lines.

Abstract: A sensor module, in some embodiments, comprises a sensor configured to capture data and a sensor interface coupled to the sensor and configured to process the data captured by the sensor to form processed data. The sensor module may also comprise a current consumption configuration component and a transistor coupled to the current consumption configuration component and configured to control the current consumption configuration component to output the processed data.

Abstract: A pre-processing circuit is used for pre-processing a data-line voltage representative of a data output of a memory device. The pre-processing circuit includes a pre-charging circuit and a clamping circuit. The pre-charging circuit pre-charges a data line to adjust the data-line voltage at the data line that is coupled to the memory device. The clamping circuit clamps the data-line voltage to generate a clamped data-line voltage when the data-line voltage is pre-charged to a level that enables a clamping function of the clamping circuit, wherein the clamped data-line voltage is lower than a supply voltage of the pre-processing circuit. The clamping circuit includes a feedback circuit that feeds back a control voltage according to the data-line voltage at the data line, and further reduces its direct current (DC) leakage when the data-line voltage is clamped, wherein the clamping function of the clamping circuit is controlled by the control voltage.

Abstract: A magnetic memory of an embodiment includes: a first conductive layer, which is nonmagnetic and includes at least a first element, the first conductive layer including a first to fifth regions; a first magnetoresistive element disposed corresponding to the third region and including a first magnetic layer, a second magnetic layer including at least a second element, a first nonmagnetic layer disposed between the first magnetic layer and the second magnetic layer, a second nonmagnetic layer disposed between the second magnetic layer and the first nonmagnetic layer and including at least a third element, and a third magnetic layer disposed between the second nonmagnetic layer and the first nonmagnetic layer; a second conductive layer disposed corresponding to the second region and including at least the first to third elements; and a third conductive layer disposed corresponding to the fourth region, and including at least the first to third elements.

Abstract: Techniques are described that enable a high-capacity memory chip based on three-dimensional SpinRAM cells and modules, and support electronics, at least some of which, are implemented with all-metal solid-state components.

Abstract: A memory cell includes an input coupled to a read line, an output coupled to a circuit ground, a bi-polar memristor, and at least one address switch coupled to an address line to select the memory cell. A memory includes the bi-polar memristor and a one-way current conducting device, wherein the one-way current conducting device is positioned between the memristor cell output and the circuit ground, or between the read line and the memristor cell input.

Abstract: According to embodiments of the present invention, a magnetoresistive device is provided. The magnetoresistive device includes a free magnetic layer structure having a variable magnetization orientation, a fixed magnetic layer structure having a fixed magnetization orientation, and a tilting magnetic layer structure configured to provide an interlayer exchange biasing field to tilt, at equilibrium, the fixed magnetization orientation or the variable magnetization orientation relative to the other to be along a tilting axis that is at least substantially non-parallel to at least one of a first easy axis of the fixed magnetization orientation or a second easy axis of the variable magnetization orientation. According to further embodiments of the present invention, a method of forming a magnetoresistive device is also provided.

Abstract: A semiconductor memory device includes a memory cell including a memory magnetic tunnel junction (MTJ) configured to be coupled to a first sensing node and a reference cell including a first resistance element and a second resistance element configured to be coupled in parallel to a second sensing node, the first resistance element including a first number of reference MTJs and the second resistance element including a second number of reference MTJs different from the first number of reference MTJs. The memory device further includes a sensing circuit configured to be coupled to the first and second sensing nodes and to detect a difference in resistance between the memory cell and the reference cell. In some embodiments, the first number of reference MTJs includes first reference MTJs connected in series and the second number of reference MTJs includes second reference MTJs connected in series.

Abstract: A first lower interconnection structure and a second lower interconnection structure are formed using a first design rule on a first region of a substrate and a second region of the substrate, respectively. A memory element is formed on the first lower interconnection structure. The memory element includes a bottom electrode, a magnetic tunnel junction and a top electrode stacked on each other. An upper conductive line and an upper interconnection line are formed using a second design rule larger than the first design rule on the first lower interconnection structure and the second lower interconnection structure, respectively. The first lower interconnection structure, the memory element and the upper conductive line are stacked on each other so that the memory element is interposed between the first lower interconnection structure and the upper conductive line.

Abstract: A ReRAM device is provided. The ReRAM device comprises a bottom electrode, a resistance switching layer disposed on the bottom electrode, a top electrode disposed on the resistance switching layer, a metal layer disposed on the top electrode, and a blocking layer covering the metal layer, wherein the blocking layer surrounds the metal layer and the top electrode.

Abstract: Techniques are disclosed for forming integrated circuit structures including a magnetic tunnel junction (MTJ), such as spin-transfer torque memory (STTM) devices, having magnetic contacts. The techniques include incorporating an additional magnetic layer (e.g., a layer that is similar or identical to that of the magnetic contact layer) such that the additional magnetic layer is coupled antiferromagnetically (or in a substantially antiparallel manner). The additional magnetic layer can help balance the magnetic field of the magnetic contact layer to limit parasitic fringing fields that would otherwise be caused by the magnetic contact layer. The additional magnetic layer may be antiferromagnetically coupled to the magnetic contact layer by, for example, including a nonmagnetic spacer layer between the two magnetic layers, thereby creating a synthetic antiferromagnet (SAF).

Abstract: Apparatuses, systems, and methods are disclosed for non-volatile memory. A plurality of layers of planar non-volatile memory cells forms a three-dimensional memory array. A plurality of word lines are coupled to planar non-volatile memory cells. Word lines may extend horizontally across layers of memory cells. A plurality of selector columns are coupled to planar non-volatile memory cells. Selector columns extend vertically through layers of memory cells, and may include central conductors surrounded by one or more concentric selective layers. One or more selective layers may permit an electrical current through a cell, between a word line and a central conductor, in response to a voltage satisfying a threshold.

Abstract: The present invention relates to a spin logic device and an electronic equipment comprising the same. A spin logic device may include a Spin Hall effect (SHE) layer formed of a conductive material having Spin Hall effect and configured to receive a first logic input current and a second logic input current, the first logic input current and the second logic input current both being an in-plane current, a magnetic tunnel junction provided on the SHE layer comprising a free magnetic layer in contact with the SHE layer, a barrier layer disposed on the free magnetic layer, and a reference magnetic layer disposed on the barrier layer, and a current wiring in connection to the reference magnetic layer side of the magnetic tunnel junction, the current wiring being in cooperation with the SHE layer to apply a read current passing through the magnetic tunnel junction therebetween.

Abstract: According to an example, a method for assigning redundancy in encoding data onto crossbar memory arrays is provided wherein each of said crossbar memory arrays include cells. The data may be allocated to a subset of the cells in multiple crossbar memory arrays. The redundancy for the data may then be assigned based on coordinates of the subset of cells within the multiple crossbar memory arrays onto which the data is allocated.

Abstract: A magnetic memory includes: first to third terminals; a conductive layer including first to fifth regions, the first region being electrically connected to the first terminal, the fifth region being electrically connected to the second terminal, and the third region being electrically connected to the third terminal; a first magnetoresistive element including a first magnetic layer, a second magnetic layer disposed between the second region and the first magnetic layer, and a first nonmagnetic layer disposed between the first and the second magnetic layer; a second magnetoresistive element including a third magnetic layer, a fourth magnetic layer disposed between the fourth region and the third magnetic layer, and a second nonmagnetic layer disposed between the third and the fourth magnetic layer; and a circuit flowing a write current between the first and the second terminal and between the second and the third terminal in a write operation.

Abstract: A method is provided for healing reset errors for a magnetic memory using destructive read with selective write-back, including for example, a self-referenced read of spin-torque bits in an MRAM. Memory cells are prepared for write back by one of identifying memory cells determined in error using an error correcting code and inverting the inversion bit for those memory cells determined in error; identifying memory cells determined in error using an error correcting code and resetting a portion of the memory cells to the first state; and resetting one or more memory cells to the first state.

Abstract: Memory systems and memory programming methods are described.

Abstract: Row electrode drivers and column electrode drivers for a memory device are distributed within a footprint share by a memory cell array.

Abstract: According to one embodiment, a system includes: a device including a memory cell array, the device configured to execute first read operation of a first read method and second read operation of a second read method on the memory cell array; a processor configured to receive a first data from the device, the first data from a selected region in the memory cell array by the first read operation, configured to execute first calculation processing using the first data during the second read operation to the selected region, and configured to acquire a result of the first calculation processing by a first signal based on a comparison result of the first data and a second data, the first signal indicating that the first data is valid, and the second data from the selected region by the second read operation.

Abstract: Apparatuses, systems, and methods are disclosed for magnetoresistive random access memory. A plurality of read lines are in a read line layer, and a plurality of write lines are in a write line layer. A plurality of spin accumulation lines are in a spin accumulation line layer disposed between a read line layer and a write line layer. Spin accumulation lines may horizontally cross read lines and write lines. A plurality of vertical magnetoresistive random access memory (MRAM) cells may include polarizers and magnetic tunnel junctions. A vertical MRAM cell may include a polarizer coupled between a spin accumulation line and a write line. A vertical MRAM cell may further include a magnetic tunnel junction coupled between a spin accumulation line and a read line, such that the magnetic tunnel junction and the polarizer are vertically aligned.

Abstract: Three transistor two junction magnetoresistive random-access memory (MRAM) bit cells provided. An example MRAM bit cell includes a first magnetic tunnel junction, MTJ, connected to a first bit line. The MRAM bit cell also includes a second MTJ connected to a second bit line. In addition, the MRAM bit cell includes a first transistor connected to the first MTJ and to a ground conductor. The MRAM bit cell further includes a second transistor connected to the second MTJ and to the ground conductor. Additionally, the MRAM bit cell includes a third transistor connected to the first transistor and to the second transistor.

Abstract: According to one embodiment, a magnetoresistive memory device includes a magnetoresistive element of a stacked layer structure includes a first magnetic layer, a second magnetic layer, and a nonmagnetic layer between the first and second magnetic layers, and an insulating layer of a group III-V compound provided on a side of the first magnetic layer of the magnetoresistive element, the insulating layer including an chemical element of group II, group IV, or group VI.

Abstract: Provided is a magnetic memory device. The magnetic memory device includes a first magnetization layer, a tunnel barrier disposed on the first magnetization layer, a second magnetization layer disposed on the tunnel barrier, and a spin current assisting layer disposed on at least a portion of a sidewall of the second magnetization layer.