Abstract: A magnetoresistive element (e.g., a spin-torque magnetoresistive memory element) includes a fixed magnetic layer, a free magnetic layer, having a high-iron alloy interface region located along a surface of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition, and a first dielectric, disposed between the fixed magnetic layer and the free magnetic layer. The magnetoresistive element further includes a second dielectric, having a first surface that is in contact with the surface of the free magnetic layer, and an electrode, disposed between the second dielectric and a conductor. The electrode includes: (i) a non-ferromagnetic portion having a surface that is in contact with a second surface of the second dielectric, and (ii) a second portion having at least one ferromagnetic material disposed between the non-ferromagnetic portion of the electrode and the conductor.

Abstract: In the method for stabilizing a spin element according to an aspect of the disclosure, the spin element includes a current-carrying part extending in a first direction, and an element part laminated on one surface of the current-carrying part and including a ferromagnetic material, a current pulse having a predetermined current value or higher is applied at a predetermined temperature in the first direction of the current-carrying part such that a total pulse application time is equal to or longer than a predetermined time.

Abstract: The present invention is directed towards a tubular nanosized magnetic wire, wherein the nanosized magnetic wire comprises: a tubular magnetic shell surrounding a longitudinal axis of the wire, at least one region of the tubular magnetic shell is capable of providing a 360° magnetic domain wall, wherein the 360° magnetic domain wall is self-stabilizing and has a magnetization going from a parallel alignment to a perpendicular alignment and to a parallel alignment with regards to the wire axis. The present invention also provides a practical method capable of making a tubular nanosized magnetic wire with a self-stabilizing, 360° magnetic domain wall. The present invention also relates to the use of the tubular nanosized magnetic wire in a racetrack memory device.

Abstract: Embodiments of the present invention disclose an MRAM cell layout for 32 nm, 45 nm, and 65 nm CMOS process technology.

Abstract: A magnetic domain wall displacement type magnetic recording element including a first ferromagnetic layer including a ferromagnetic material, a magnetic recording layer configured to extend in a first direction crossing a laminating direction of the first ferromagnetic layer and including a magnetic domain wall, and a nonmagnetic layer sandwiched between the first ferromagnetic layer and the magnetic recording layer, wherein the first ferromagnetic layer has a magnetic flux supply region at least at a first end in the first direction.

Abstract: The present disclosure relates to a semiconductor storage device, a driving method, and an electronic device capable of suppressing a layout area and improving reliability. A semiconductor storage device is provided with one or more selection transistors, a resistance change element one end of which is connected to a bit line and the other end of which is connected to a drain terminal of a selection transistor, the resistance change element a resistance value of which changes by a current of a predetermined value or larger allowed to flow, and a write control unit connected to a connection point between the selection transistor and the resistance change element and controls the current flowing through the resistance change element when data is written in the resistance change element. The present technology is applicable to, for example, a non-volatile memory provided with a storage element configured by a magnetic tunnel junction.

Abstract: Techniques for reading a Multi-Bit Cell (MBC) can include sensing a state parameter value, such as source line voltage, and applying a successive one of N programming parameter values, such as successive programming currents, between instances of sensing the state parameter values. The N successive programming parameter values can be selected to switch the state of a corresponding one of N cell elements of the MBC. Successive ones of the sensed state parameter values can be compared to determine N state change results, which can be used to determine the read state of the MBC.

Abstract: Spin-orbit-torque (SOT) control strip lines are provided along the sides of free layers in perpendicular magnetic tunnel junction devices. Current flowing through such SOT control strip lines injects spin current into the free layers such that spin torque is applied to the free layers. The spin torque can be used to force the magnetic state of the free layer to a particular state based on the direction of the current through the SOT control strip line. In other embodiments, the SOT provides an assist to spin-transfer torque generated by current flowing vertically through the magnetic tunnel junction. Some embodiments have dedicated strip lines for a single magnetic tunnel junction such that a three-terminal device results.

Abstract: A memory device structure includes a wafer substrate and a magnetic tunnel junction (MTJ) positioned above an upper surface of the wafer substrate. The MTJ includes a first magnetic layer, a second magnetic layer laterally adjacent the first magnetic layer, and a nonmagnetic layer interposed between the first and second magnetic layers, wherein the first magnetic layer, the nonmagnetic layer and the second magnetic layer comprise a substantially vertical layer stack that extends along a first direction that is substantially perpendicular to the upper surface of the wafer substrate. A first contact is electrically coupled to the first magnetic layer and a second contact is electrically coupled to the second magnetic layer.

Abstract: Techniques for reading a Multi-Bit Cell (MBC) can include sensing a state parameter value, such as source line voltage, and applying a successive one of N programming parameter values, such as successive programming currents, between instances of sensing the state parameter values. The N successive programming parameter values can be selected to switch the state of a corresponding one of N cell elements of the MBC. Successive ones of the sensed state parameter values can be compared to determine N state change results, which can be used to determine the read state of the MBC.

Abstract: Magnetic field assisted magnetoresistive random access memory (MRAM) structures, integrated circuits including MRAM structures, and methods for fabricating integrated circuits including MRAM structures are provided. An exemplary integrated circuit includes a magnetoresistive random access memory (MRAM) structure and a magnetic field assist structure to generate a selected net magnetic field on the MRAM structure.

Abstract: A spin current magnetization rotational element includes: a first ferromagnetic metal layer for a magnetization direction to be changed; and a spin-orbit torque wiring. The spin-orbit torque wiring has a structure in which a spin conduction layer and an interfacial spin generation layer are alternately laminated in the first direction, the number of a plurality of the interfacial spin generation layers is two or greater, and in the spin-orbit torque wiring, one of the plurality of interfacial spin generation layers is closest to the first ferromagnetic metal layer.

Abstract: A spin current magnetization rotational element includes: a first ferromagnetic metal layer having a variable magnetization direction; and a spin orbital torque wiring which is joined to the first ferromagnetic metal layer and extends in a direction crossing a direction perpendicular to a plane of the first ferromagnetic metal layer, wherein the spin orbital torque wiring is constituted of a non-magnetic material composed of elements of two or more kinds and a compositional proportion of the non-magnetic material has a non-uniform distribution between a first surface joined to the first ferromagnetic metal layer and a second surface located on a side opposite to the first surface.

Abstract: An electronic synapse is disclosed, comprising a heavy metal layer having a high spin orbit coupling, a domain wall magnet layer having a bottom surface adjacent to a top surface of the heavy metal layer, the domain wall magnet layer having a perpendicular magnetic anisotropy, the domain wall magnet layer having a domain wall, the domain wall running parallel to a longitudinal axis of the domain wall magnet layer, a pinned layer having perpendicular magnetic anisotropy, and an oxide tunnel barrier connected between the domain wall magnet layer and the pinned layer, wherein the pinned layer, the oxide tunnel barrier, and the free layer form a magnetic tunnel junction.

Abstract: A memory control circuitry has a write destination selector to select either a volatile memory or a non-volatile memory in a first storage as a write destination, for an address area in the first storage written by a processor, a write controller to write data in the write destination selected by the write destination selector, and an access information register to register information selecting the volatile memory or the non-volatile memory as the write destination, and number-of-times information indicating how many times a page of successive addresses for the address area is switched, as both information being associated with each other. When there is a write request from the processor, the write destination selector selects the write destination based on the information registered in the access information register.

Abstract: To accurately read data in a storage device provided with a cell having a variable resistance value. In a reference cell circuit, a resistance value changes to a predetermined initial value when an initialization signal exceeding a predetermined reversal threshold is input. A reference side signal source inputs a reference side read signal of a predetermined value not exceeding the predetermined reversal threshold to the reference cell circuit after the initialization signal is input to the reference cell circuit when there is an instruction to read with respect to a memory cell. A cell side signal source inputs a cell side read signal of the predetermined value to the memory cell after the initialization signal is input. A comparison unit compares a reference signal output from the reference cell circuit into which the reference side read signal has been input, and a cell signal output from the memory cell into which the cell side read current has been input, and acquires the comparison result as read data.

Abstract: Structures for a non-volatile memory and methods for forming and using such structures. A bitcell of the non-volatile memory includes a nonvolatile memory element and a field-effect transistor having a drain region coupled with the nonvolatile memory element, a source region, and a gate electrode. A word line is coupled with the gate electrode of the field-effect transistor, a bit line is coupled with the nonvolatile memory element, and a source line is coupled with the source region of the field-effect transistor. A power supply is configured to supply a negative bias voltage to the bit line in order to provide a first state for writing data to the nonvolatile memory element or to supply the negative bias voltage to the source line in order to provide a second state for writing data to the nonvolatile memory element.

Abstract: Memory cells are disclosed. Magnetic regions within the memory cells include an alternating structure of magnetic sub-regions and coupler sub-regions. The coupler material of the coupler sub-regions antiferromagnetically couples neighboring magnetic sub-regions and effects or encourages a vertical magnetic orientation exhibited by the neighboring magnetic sub-regions. Neighboring magnetic sub-regions, spaced from one another by a coupler sub-region, exhibit oppositely directed magnetic orientations. The magnetic and coupler sub-regions may each be of a thickness tailored to form the magnetic region in a compact structure. Interference between magnetic dipole fields emitted from the magnetic region on switching of a free region in the memory cell may be reduced or eliminated. Also disclosed are semiconductor device structures, spin torque transfer magnetic random-access memory (STT-MRAM) systems, and methods of fabrication.

Abstract: A storage element includes a layer structure including a storage layer having a direction of magnetization which changes according to information, a magnetization fixed layer having a fixed direction of magnetization, and an intermediate layer disposed therebetween, which intermediate layer contains a nonmagnetic material. The magnetization fixed layer has at least two ferromagnetic layers having a direction of magnetization tilted from a direction perpendicular to a film surface, which are laminated and magnetically coupled interposing a coupling layer therebetween. This configuration may effectively prevent divergence of magnetization reversal time due to directions of magnetization of the storage layer and the magnetization fixed layer being substantially parallel or antiparallel, reduce write errors, and enable writing operation in a short time.

Abstract: A magnetoresistive random-access memory (MRAM) is disclosed. The MRAM bit cell consists of a magnetic tunnel junction stack having a significantly improved performance of the magnetic storage layer. The MRAM device utilizes a polarizer layer with a magnetic vector that can switch between a stabilizing magnetic direction and a programming magnetic direction.

Abstract: A spin current magnetization rotational element including a first ferromagnetic metal layer in which a magnetization direction is variable, and a spin-orbit torque wiring that extends in a second direction intersecting a first direction that is a plane-orthogonal direction of the first ferromagnetic metal layer, and is joined to the first ferromagnetic metal layer. The first ferromagnetic metal layer has a lamination structure including a plurality of ferromagnetic constituent layers and a plurality of nonmagnetic constituent layers which are respectively interposed between the ferromagnetic constituent layers adjacent to each other.

Abstract: In a spin-torque magnetic random access memory (MRAM) that includes local source lines, auto-booting of the word line is used to reduce power consumption by reusing charge already present from driving a plurality of bit lines during writing operations. Auto-booting is accomplished by first driving a global word line to a first voltage. Driving the global word line to a first voltage results in a second voltage passed to the word lines. Subsequent driving of the plurality of bit lines that are capacitively coupled to the word line causes the word line voltage to be increased to a level desired to allow sufficient current to flow through a selected memory cell to write information into the selected memory cell.

Abstract: A TMR element includes a reference layer, a tunnel barrier layer, a perpendicular magnetization inducing layer, and a magnetization free layer stacked along a stack direction between the tunnel barrier layer and the perpendicular magnetization inducing layer. The perpendicular magnetization inducing layer imparts magnetic anisotropy along the stack direction to the magnetization free layer. The width of the magnetization free layer is smaller than any of the width of the tunnel barrier layer or the width of the perpendicular magnetization inducing layer.

Abstract: Magnetic tunnel junction devices are provided. A magnetic tunnel junction device includes a pinned layer. The magnetic tunnel junction device includes a free layer on the pinned layer. The free layer includes a first layer, a second layer that is on the first layer, and a third layer that is between the first layer and the second layer. A Curie temperature of the third layer is lower than a Curie temperature of the first layer and lower than a Curie temperature of the second layer. Moreover, the magnetic tunnel junction device includes an insulating layer that is between the pinned layer and the free layer. Related magnetoresistive memory devices are also provided.

Abstract: Disclosed herein are a magnetic tunnel junction (MTJ) structure with perpendicular magnetic anisotropy (PMA) and a magnetic element including the same. The MTJ structure with PMA includes a substrate, a perpendicular magnetic anisotropic inducing layer configured to be disposed on the substrate and including an oxide-based material, a perpendicular antiferromagnetic layer configured to be disposed on the perpendicular magnetic anisotropic inducing layer and including an antiferromagnetic material, a first ferromagnetic layer configured to be disposed on the perpendicular antiferromagnetic layer and having PMA, a tunneling barrier layer configured to be disposed on the first ferromagnetic layer, and a second ferromagnetic layer configured to be disposed on the tunneling barrier layer and having PMA.

Abstract: Techniques for reading a Multi-Bit Cell (MBC) can include sensing a state parameter value, such as source line voltage, and applying a successive one of N programming parameter values, such as successive programming currents, between instances of sensing the state parameter values. The N successive programming parameter values can be selected to program the state of a corresponding one of N cell elements of the MBC to a respective state parameter value. Successive ones of the sensed state parameter values can be compared to determine N state change results, which can be used to determine the read state of the MBC.

Abstract: Methods and apparatus for complex number generation and operation on a chip are disclosed. A disclosed logic device includes a first magnet with a first preferred direction of magnetization to polarize a spin of electrons in the first direction. The example logic device includes a second magnet with a second preferred direction of magnetization that polarizes a spin of electrons in the second direction. The example logic device includes a third magnet providing a free layer without a preferred direction of magnetization that is connected to the first and second magnets, wherein the third magnet encodes a vector based on a flux of electrons spin polarized in the first direction and a flux of electrons spin polarized in the second direction.

Abstract: A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the

Abstract: A phase change memory device may include a cross point array and a sensing circuit block. The cross point array may include a plurality of word lines, a plurality of bit lines and phase change memory cells. The word lines and the bit lines may intersect each other. The phase change memory cells are positioned at intersection points between the word lines and the bit lines. The sensing circuit block reads data in the phase change memory cells. The sensing circuit block may include a first sensing unit and a second sensing unit. The first sensing unit senses the data using a first voltage. The second sensing unit senses the data using a second voltage, which may be higher than a threshold voltage of the phase change memory cell, when the data in the phase change memory cell read by the first sensing unit is determined to be abnormal.

Abstract: A Magnetoresistive Random Access Memory (MRAM) assembly includes a substrate, a plurality of MRAM cells, a plurality of bit lines, each bit line magnetically coupled to one of the plurality of MRAM cells, a plurality of word lines, each word line magnetically coupled to one of the plurality of MRAM cells, a first planar ferromagnetic shielding component located vertically above the substrate such that the plurality of bit lines and the plurality of word lines are located between the first planar ferromagnetic shielding component and the substrate, and a first insulating layer located between the first ferromagnetic shielding component and one of the bit lines or word lines such that the bit lines or word lines are not electrically connected to the first ferromagnetic shielding component.

Abstract: A resistive memory device includes a memory cell array in which a plurality of memory cells are arranged. Each of the plurality of memory cells includes a variable resistor comprising a first end connected to a bit line, and a second end, a row transistor connected between a row source line and the second end of the variable resistor, the row transistor being selectable by a row word line, and a column transistor connected between a column source line and the second end of the variable resistor, the column transistor being selectable by a column word line. Based on the row transistor being selected, first data is written or second data is read in a row direction of the memory cell array, and based on the column transistor being selected, the first data is written or the second data is read in a column direction of the memory cell array.

Abstract: An error management system for a data storage device can generate soft-decision log-likelihood ratios (LLRs) using multiple reads of memory locations. 0-to-1 and 1-to-0 bit flip count data provided by multiple reads of reference memory locations can be used to generate probability data that is used to generate possible LLR values for decoding target pages. Possible LLR values are stored in one or more look-up tables.

Abstract: A spin-orbit torque MRAM is provided. The spin-orbit torque MRAM includes a spin Hall metal layer, a free magnetic layer disposed on the spin Hall metal layer, a barrier layer, and a pinned layer. The free magnetic layer includes a first area and a second area located on both sides thereof. The barrier layer includes a first area and a second area located on both sides thereof. The first area of the barrier layer is disposed on that of the free magnetic layer, and the second area of the barrier layer is disposed on that of the free magnetic layer. The pinned layer is disposed on the first area of the barrier layer.

Abstract: According to one embodiment, a controller executes first refreshing in a case where a first value of a first block is larger than a first threshold and less than a second threshold. The first refreshing includes reprogramming a plurality of second memory cells among a plurality of first memory cells included in the first block.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.

Abstract: Provided is a magnetic memory including: a first bit line, a second bit line, and a third bit line; a word line; a first magnetoresistance effect element; a first transistor; a second magnetoresistance effect element; and a second transistor, wherein free layers of the first and second magnetoresistance effect elements and the second bit line are connected, a fixed layer of the first magnetoresistance effect element and a source terminal of the first transistor are connected, a drain terminal of the first transistor and the first bit line are connected, a fixed layer of the second magnetoresistance effect element and a drain terminal of the second transistor are connected, a source terminal of the second transistor and the third bit line are connected, and the word line is connected to each of a gate terminal of the first transistor and a gate terminal of the second transistor.

Abstract: According to one embodiment, a PCM memory device includes a memory matrix having memory cells of the phase-change type organized in a plurality of word lines and bit lines. Each memory cell has a storage element and an access element including at least one MOS transistor, which is controlled to allow access to the storage element and to carry out read/programming storage operations, in which source terminals of the MOS transistors of access elements of the memory cells of the same word line are connected to the same source line. The source lines of the memory matrix are electrically short-circuited in groups. A single source line driver element for each group of source lines is configured in such a manner as to generate a respective source line driver signal in order to bias in a corresponding manner all the source lines of the respective group.

Abstract: A magnetic tunnel junction (MTJ) is disclosed wherein a free layer (FL) interfaces with a metal oxide (Mox) layer and a tunnel barrier layer to produce interfacial perpendicular magnetic anisotropy (PMA). The Mox layer has a non-stoichiometric oxidation state to minimize parasitic resistance, and comprises a dopant to fill vacant lattice sites thereby blocking oxygen diffusion through the Mox layer to preserve interfacial PMA and high thermal stability at process temperatures up to 400° C. Various methods of forming the doped Mox layer include deposition of the M layer in a reactive environment of O2 and dopant species in gas form, exposing a metal oxide layer to dopant species in gas form, and ion implanting the dopant. In another embodiment, where the dopant is N, a metal nitride layer is formed on a metal oxide layer, and then an anneal step drives nitrogen into vacant sites in the metal oxide lattice.

Abstract: A matrix-vector multiplication device includes a memory crossbar array with row lines, column lines, and junctions. Each junction comprises a programmable resistive element and an access element. A signal generator is configured to apply programming signals to the resistive elements to program conductance values for the matrix-vector multiplication and a readout circuit is configured to apply read voltages to the row lines and to read out current values of the column lines. Control circuitry is configured to control the signal generator and the readout circuit and to select, via the access terminals, a plurality of resistive elements in parallel according to a predefined selection scheme which applies the signals and/or the read voltages in parallel to resistive elements which do not share the same row and column line and applies the programming signals and/or the read voltages to at most one resistive element per row line and column line.

Abstract: A magnetic tunnel junction (MTJ) is disclosed wherein a free layer (FL) interfaces with a first metal oxide (Mox) layer and second metal oxide (tunnel barrier) to produce perpendicular magnetic anisotropy (PMA) in the FL. In some embodiments, conductive metal channels made of a noble metal are formed in the Mox that is MgO to reduce parasitic resistance. In a second embodiment, a discontinuous MgO layer with a plurality of islands is formed as the Mox layer and a non-magnetic hard mask layer is deposited to fill spaces between adjacent islands and form shorting pathways through the Mox. In another embodiment, end portions between the sides of a center Mox portion and the MTJ sidewall are reduced to form shorting pathways by depositing a reducing metal layer on Mox sidewalls, or performing a reduction process with forming gas, H2, or a reducing species.

Abstract: Provided is a resistive memory device configured to output a value stored in a memory cell in response to a read command, the resistive memory device including a cell array including the memory cell and a reference cell; a reference resistance circuit configured to be electrically connected to the reference cell; an offset current source circuit configured to add or draw an offset current to or from a read current provided to the reference resistance circuit; and a control circuit configured to control the offset current source circuit to compensate for a variation of a resistance of the memory cell.

Abstract: According to one embodiment, a magnetic memory device includes a metal-containing layer, a first magnetic layer, a second magnetic layer, a first intermediate layer, a third magnetic layer, a fourth magnetic layer, a second intermediate layer, and a controller. The metal-containing layer includes first, second, third, fourth, and fifth portions. The first magnetic layer is separated from the third portion. The second magnetic layer is provided between the first magnetic layer and a portion of the third portion. The first intermediate layer includes a portion provided between the first and second magnetic layers. The third magnetic layer is separated from the fourth portion. The fourth magnetic layer is provided between the third magnetic layer and a portion of the fourth portion. The second intermediate layer includes a portion provided between the third and fourth magnetic layers. The controller is electrically connected with the first portion and the second portion.

Abstract: A semiconductor device includes metal layers, first dummy conductive cells, and groups of second dummy conductive cells. The metal layers include empty areas and are grouped into pairs of neighboring metal layers. The first dummy conductive cells are each formed in each of the empty areas in each of the pairs of neighboring metal layers that is overlapped by another empty area or a line in the same pair of neighboring metal layers. Each group of the second dummy conductive cells is formed in each of the empty areas in each of the pairs of neighboring metal layers that is overlapped by a signal line in the same pair of neighboring metal layer.

Abstract: This spin current magnetization rotational type magnetoresistive element includes a magnetoresistive effect element having a first ferromagnetic metal layer having a fixed magnetization orientation, a second ferromagnetic metal layer having a variable magnetization orientation, and a non-magnetic layer sandwiched between the first ferromagnetic metal layer and the second ferromagnetic metal layer, and spin-orbit torque wiring which extends in a direction that intersects the stacking direction of the magnetoresistive effect element, and is connected to the second ferromagnetic metal layer, wherein the electric current that flows through the magnetoresistive effect element and the electric current that flows through the spin-orbit torque wiring merge or are distributed in the portion where the magnetoresistive effect element and the spin-orbit torque wiring are connected.

Abstract: Disclosed are methods, systems and devices for operation of non-volatile memory devices. In one aspect, a read operation or a particular write operation may be performed on a correlated electron switch (CES) device by coupling a terminal of the CES device to a particular node through any one of multiple different resistive paths.

Abstract: Approaches and structures for unipolar current switching in perpendicular magnetic tunnel junction (pMTJ) devices through reduced bipolar coercivity are described. In an example, a memory array includes a plurality of bitlines and a plurality of select lines. The memory array also includes a plurality of memory elements located among and coupled to the plurality of bitlines and the plurality of select lines. Each of the plurality of memory elements includes a unipolar switching magnetic tunnel junction (MTJ) device and a select device.

Abstract: Row electrode drivers and column electrode drivers for a memory device are distributed within a footprint share by a memory cell array.

Abstract: According to one embodiment, a magnetic memory device includes a metal-containing layer including a metallic element, a first magnetic layer, a second magnetic layer, and a first intermediate layer. The second magnetic layer is provided between the first magnetic layer and a portion of the metal-containing layer. The first intermediate layer includes a portion provided between the first magnetic layer and the second magnetic layer. The first intermediate layer is nonmagnetic. The first intermediate layer is convex toward the metal-containing layer.

Abstract: Row electrode drivers and column electrode drivers for a memory device are distributed within a footprint share by a memory cell array.

Abstract: In some embodiments, a semiconductor device is provided. The semiconductor device includes a first amorphous switching structure disposed over a first electrode. A buffer structure is disposed over the first amorphous switching structure. A second amorphous switching structure is disposed over the buffer structure. A second electrode is disposed over the second amorphous switching structure, where the first and second amorphous switching structures are configured to switch between low resistance states and high resistance states depending on whether a voltage from the first electrode to the second electrode exceeds a threshold voltage.