Abstract: A nonvolatile memory apparatus includes a memory cell array and a memory control circuit. The memory cell array includes a plurality of sub arrays each including a plurality of memory cells coupled to a plurality of bit lines. The memory control circuit sequentially couples thereto, based on a single read command signal, at least a single bit line disposed on the respective sub arrays to sequentially access a memory cell coupled to the at least single bit line.

Abstract: A semiconductor device includes a substrate; first conductive lines extending in a first direction; second conductive lines extending in a second direction; memory cell structures between the first conductive lines and the second conductive lines; and dummy cell structures that are electrically isolated and between the first conductive lines and the second conductive lines. The memory cell structures include a data storage material pattern including a phase change material layer; and a selector material pattern overlapping the data storage material pattern in a vertical direction. The dummy cell structures include a dummy pattern including a phase change material layer. The phase change material layer of the dummy pattern includes a crystalline phase portion and an amorphous phase portion. At a cross section of the phase change material layer of the dummy pattern, an area of the crystalline phase portion is larger than an area of the amorphous phase portion.

Abstract: Methods, systems, and devices for adjustable programming pulses for a multi-level cell are described. A memory device may modify a characteristic of a programming pulse for an intermediate logic state based on a metric of reliability of associated memory cells. The modified characteristic may increase a read window and reverse a movement of a shifted threshold voltage distribution (e.g., by moving the threshold voltage distribution farther from one or more other voltage distributions). The metric of reliability may be determined by performing test writes may be a quantity of cycles of use for the memory cells, a bit error rate, and/or a quantity of reads of the first state. The information associated with the modified second pulse may be stored in fuses or memory cells, or may be implemented by a memory device controller or circuitry of the memory device.

Abstract: A multi-level cell (MLC) one-selector-one-resistor (1S1R) three-dimensional (3D) cross-point memory system includes at least one MLC 1S1R structure including a stacked arrangement of a phase change memory (PCM) cell and a threshold switch selector. An electrically conductive bit line is in electrical communication with the OTS selector, and an electrically conductive word line is in electrical communication with the PCM cell. A controller is in electrical communication with the bit line and the word line. The controller is configured to select at least one voltage pulse from a group of different voltage pulses comprising a read pulse, a partial set pulse, a set pulse, a partial reset pulse, and a reset pulse, and configured to deliver the selected at least one voltage pulse to the at least one MLC 1S1R structure.

Abstract: According to one embodiment, a method, computer system, and computer program product for increasing linearity of a weight update of a phase change memory (PCM) cell is provided. The present invention may include applying a RESET pulse to amorphize the phase change material of the PCM cell; responsive to applying the RESET pulse, applying an incubation pulse to the PCM cell; and applying a plurality of partial SET pulses to incrementally increase the conductance of the PCM cell.

Abstract: Various embodiments of the present application are directed towards a memory cell, an integrated chip comprising a memory cell, and a method of operating a memory device. In some embodiments, the memory cell comprises a data-storage element having a variable resistance and a unipolar selector electrically coupled in series with the data-storage element. The memory cell is configured to be written by a writing voltage with a single polarity applying across the data-storage element and the unipolar selector.

Abstract: A method is disclosed that includes causing a first set of a plurality of voltage pulses to be applied to memory cells of a memory device, a voltage pulse of the first set of the voltage pulses placing the memory cells of the memory device at a voltage level associated with a defined voltage state. The method also includes determining a set of bit error rates associated with the memory cells of the memory device in view of a data mapping pattern for the memory cells of the memory device, wherein the data mapping pattern assigns a voltage level associated with a reset state to at least a portion of the memory cells of the memory device. The method further includes determining whether to apply one or more second sets of the voltage pulses to the memory cells of the memory device in view of a comparison between the set of bit error rates for the memory cells and a previously measured set of bit error rates for the memory cells.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a memory array including a plurality of memory cells, each memory cell having an impedance that varies in accordance with a respective data value stored therein; and a tracking memory cell having an impedance based on a tracking data value stored therein; and a read circuit coupled to the memory array, the read circuit configured to determine an impedance of a selected memory cells with respect to the impedance of the tracking memory cell; read a data value stored within the selected memory cell based upon a voltage change of a signal node voltage corresponding to the impedance of the selected memory cell.

Abstract: An embodiment non-volatile memory device includes an array of memory cells in rows and columns; a plurality of local bitlines, the memory cells of each column being coupled to a corresponding local bitline; a plurality of main bitlines, each main bitline being coupleable to a corresponding subset of local bitlines; a plurality of program driver circuits, each having a corresponding output node and injecting a programming current in the corresponding output node, each output node coupleable to a corresponding subset of main bitlines. Each program driver circuit further includes a corresponding limiter circuit that is electrically coupled, for each main bitline of the corresponding subset, to a corresponding sense node whose voltage depends, during writing, on the voltage on the corresponding main bitline. Each limiter circuit turns off the corresponding programming current, in case the voltage on any of the corresponding sense nodes overcomes a reference voltage.

Abstract: The present disclosure includes apparatuses and methods for material implication operations in memory with reduced program voltages. An example apparatus can include an array of memory cells that further includes a first memory cell coupled to a first access line and to a first one of a plurality of second access lines and a second memory cell coupled to the first access line and to a second one of the plurality of second access lines. The circuitry can be configured to apply, across the second memory cell, a first voltage differential having a first polarity and a first magnitude. The first voltage differential reduces, if the second memory cell is programmed to a first data state, a magnitude of a drifted threshold voltage for programming the second memory cell to a second data state. The circuitry is further configured to apply, subsequent to the application of the first voltage differential, a first signal to the first access line.

Abstract: A semiconductor memory device and methods of manufacturing and operating the same are set forth. The semiconductor memory device includes a stack structure including a plurality of interlayer insulating layers and a plurality of gate electrodes, which may be alternately stacked on a substrate, and a plurality of channel structures penetrating the stack structure in a vertical direction. Each of the plurality of channel structures includes a channel layer, a tunnel insulating layer, an emission preventing layer, and a charge storage layer, each of which vertically extends toward the substrate.

Abstract: The present invention relates to a method of operating memory cells, comprising reading a previous user data from the memory cells; writing a new user data and merging the new user data with the previous user data into write registers; generating mask register information, and wherein the mask register information indicates bits of the previous user data stored in the memory cells to be switched or not to be switched in their logic values; counting numbers of a first logic value and a second logic value to be written using the mask register information, respectively; storing the numbers of the first logic value and the second logic value into a first counter and a second counter, respectively; and applying a programming pulse to the memory cells according to the mask register information.

Abstract: An indication that one or more program operations have been interrupted as a result of a read operation can be received at a first controller component associated with a memory sub-system. Context data associated with interrupted program operations can be received at the first controller component. A control sequence based on the context data can be generated at the first controller component. The control sequence can indicate how a second controller component associated with the memory sub-system interacts with a memory component of the memory sub-system to perform the read operation and to resume the interrupted program operations. The control sequence can further specify one or more additional operations that are associated with copying data of the interrupted program operations between first and second memory locations of the memory component. The control sequence can be provided to the second controller component.

Abstract: An actuating unit, for a memory that includes at least one memory cell in which one of a plurality of discrete storable values is encodable as an electrical resistance value of a memristor, includes: a measuring device configured to measure the resistance value of the memristor; a discretizer configured to allocate to the measured resistance value one of the plurality of discrete storable values as the read value; a comparator unit configured to ascertain the difference between the nominal resistance value of the memristor that corresponds to the read value and the measured resistance value of the memristor; and a driver configured to apply, to the memristor on the basis of the ascertained difference, a current-time profile that drives the actual resistance value of the memristor in the direction of the nominal resistance value that corresponds to the read value, so that the memory cell is refreshed.

Abstract: A resistive memory storage apparatus including a memory cell, a selecting transistor and a memory controller is provided. The memory cell outputs a writing current during a writing pulse width period. The selecting transistor is coupled to the memory cell. The memory controller is coupled to the selecting transistor and the memory cell. The memory controller is configured to apply a control voltage that gradually changes to a predetermined voltage level to a control end of the selecting transistor during a resistance transition phase of the writing pulse width period and set the control voltage to the predetermined voltage level during a filament stabilization phase after the resistance transition phase, so as to limit the writing current to a predetermined current value. In addition, an operating method for a resistive memory storage apparatus is also provided.

Abstract: A memory device includes a memory array comprising a first number of planes, a second number of independent plane driver circuits, wherein the second number is less than the first number, and a plane selection circuit to couple the second number of independent plane driver circuits to the first number of planes of the memory array. The memory device further includes control logic, to perform receive a first read command and identify, among the first number of planes, a first plane to which the first read command is directed. The control logic further configures the plane selection circuit to couple a first independent plane driver of the second number of independent plane drivers to the first plane and causes the first independent plane driver to perform a first read operation corresponding to the first read command on the first plane.

Abstract: In an example, a method may include comparing input data to stored data stored in a memory cell and determining whether the input data matches the stored data based on whether the memory cell snaps back in response to an applied voltage differential across the memory cell.

Abstract: A memory device having memory cells, voltage drivers, and a controller configured to determine, based on an attribute of a memory cell, whether to apply a drift cancellation pulse that is in the opposite polarity of a programming pulse configured to place the memory cell in a state to represent a bit of data. If the drift in the state of the memory cell from a previous programming operation to write data into the memory cell is predicted to be insufficient to prevent the selection of the memory cell during the application of the programming pulse, the drift cancellation pulse is skipped. Otherwise, the drift cancellation pulse is applied in the opposite polarity of the programming pulse.

Abstract: A method includes receiving a write request for writing incoming data to a target memory line and, in response to the write request, comparing the incoming data with existing data in the target memory line to determine a number of a first type of state transition. The method further includes, in response to determining that the number of the first type of state transition for the write request exceeds a threshold, prior to writing the incoming data to the target memory line, storing adjacent data from each of a set of memory lines adjacent to the target memory line, and after writing the incoming data to the target memory line, writing the stored data to the set of adjacent memory lines.

Abstract: Methods, systems, and devices for a refresh operation of a memory cell are described. A memory device may include a plurality of rows of memory cells. Each row of memory cells may undergo a quantity of access operations (e.g., read operations, write operations). During a read operation, a logic state of one or more memory cells may be determined by applying a read pulse having a first polarity. Based on the one or more memory cells storing a particular logic state (e.g., a first logic state), a refresh operation may be performed. During a refresh operation, a refresh pulse having a second polarity (e.g., a different polarity than the first polarity) may be applied to the one or more memory cells.

Abstract: A memory circuit includes a bias voltage generator, a drive circuit, and a resistive random-access memory (RRAM) device. The bias voltage generator includes a first transistor configured to generate a voltage difference based on a first current and an activation voltage, and is configured to output the activation voltage and a bias voltage based on the voltage difference. The drive circuit is configured to receive the bias voltage and output a drive voltage having a voltage level based on the bias voltage, and the RRAM device is configured to receive the activation voltage and conduct a second current responsive to the drive voltage and the activation voltage.

Abstract: A memory device can include a plurality of memory cells including a first group of memory cells and a second group of memory cells programmed to a predefined logic state. The plurality of memory cells includes a memory controller configured to apply a reading voltage to at least one selected memory cell of the first group during a reading operation, apply the reading voltage to the memory cells of the second group, and responsive to the logic state of at least one memory cell of the second group being assessed to be different from the predefined logic state perform a refresh operation of the memory cells of the first group by applying a recovery voltage higher than the reading voltage to assess the logic state thereof and reprogramming the memory cells of the first group to the logic state assessed with the recovery voltage.

Abstract: A phase-change material based resistive memory contains a resistive layer and two electrical contacts. After fabrication the memory is subjected to thermal treatment which initiates a transition toward a crystalline state favoring in this way the subsequent obtaining of a large number of resistive memory states.

Abstract: A semiconductor memory device includes a resistive change memory device including a control circuit block and a plurality of memory decks electrically connected with the control circuit block. The semiconductor memory device includes a pattern generation block, a position correction block and a position decision block. The pattern generation block receives a row address, a column address and a deck selection signal to generate a plurality of pattern generation signals to select a plurality of memory cells in the memory deck in various patterns. The position correction block receives a temporary code for classifying the memory cells into a temporary near cell region and a temporary far cell region and for reflecting a position of the memory deck in the temporary code to output a correction code.

Abstract: A method for detecting a code word is proposed, wherein the code word is a code word of one of at least two codes, wherein n states are read from memory cells of a memory, respectively. The n states are determined in a time domain for each of the at least two codes, wherein additionally n states are read from further memory cells and at least one reference value is determined therefrom and wherein the at least one reference value is taken as a basis for determining which of the at least two codes is the correct code. A corresponding device is furthermore specified.

Abstract: A semiconductor memory system including a resistive variable memory device and a driving method thereof are provided. The semiconductor memory system includes a memory controller including a scheduler configured to determine a generation period of a write command; a memory device including a memory cell array, the memory device being configured to write data input from the memory controller in the memory cell array in response to the write command; and a data determination circuit configured to output a change signal to the scheduler when all logic levels of the input data are equal to each other, the scheduler changing the generation period of the write command in response to the change signal.

Abstract: This spin current magnetization rotational type magnetoresistive element includes a magnetoresistive effect element having a first ferromagnetic metal layer having a fixed magnetization orientation, a second ferromagnetic metal layer having a variable magnetization orientation, and a non-magnetic layer sandwiched between the first ferromagnetic metal layer and the second ferromagnetic metal layer, and spin-orbit torque wiring which extends in a direction that intersects the stacking direction of the magnetoresistive effect element, and is connected to the second ferromagnetic metal layer, wherein the electric current that flows through the magnetoresistive effect element and the electric current that flows through the spin-orbit torque wiring merge or are distributed in the portion where the magnetoresistive effect element and the spin-orbit torque wiring are connected.

Abstract: A phase-change memory device and method of manufacturing the same, the memory device including: a substrate; a bottom electrode disposed over the substrate; a top electrode disposed over the bottom electrode; and a phase-change layer disposed between the top and bottom electrodes. The phase change layer includes a chalcogenide Ge—Sb—Te (GST) material that includes at least 30 at % Ge and that is doped with a dopant including N, Si, Sc, Ga, C, or any combination thereof.

Abstract: An electronic device including a semiconductor memory is provided. The semiconductor memory includes a plurality of first lines extending in a first direction; a plurality of second lines disposed over the first lines, the second lines extending in a second direction crossing the first direction; a plurality of memory cells disposed between the first lines and the second lines at intersection regions of the first lines and the second lines; first liner layer patterns positioned on both sidewalls of each memory cell in the second direction; a first insulating layer pattern positioned between adjacent first liner layer patterns in the second direction; second liner layer patterns positioned on both sidewalls of each memory cell in the first direction; a second insulating layer pattern positioned between adjacent second liner layer patterns in the first direction; and a third insulating layer positioned between adjacent second liner layer patterns in the second direction.

Abstract: Techniques are provided for accessing two memory cells of a memory tile concurrently. A memory tile may include a plurality of self-selecting memory cells addressable using a row decoder and a column decoder. A memory controller may access a first self-selecting memory cell of the memory tile using a first pulse having a first polarity to the first self-selecting memory cell. The memory controller may also access a second self-selecting memory cell of the memory tile concurrently with accessing the first self-selecting memory cell using a second pulse having a second polarity different than the first polarity. The memory controller may determine characteristics of the pulses to mitigate disturbances of unselected self-selecting memory cells of the memory tile.

Abstract: An embodiment voltage generation circuit, for a memory having a memory array with a plurality of memory cells coupled to respective wordlines and local bit-lines, each having a storage element and selector element, a bipolar transistor being coupled to the storage element for selective flow of a cell current during reading or verifying operations, and a base terminal of the selector element being coupled to a respective wordline; associated to each bit-line is a biasing transistor having a control terminal, and the circuit generates a cascode voltage for this control terminal; a driver stage is coupled to one end of each wordline. The circuit generates the cascode voltage based on a reference voltage, which is a function of the emulation of a voltage drop on the driver stage, on the wordline, and on the memory cell as a result of a current associated to the corresponding selector element.

Abstract: A phase change material switch includes a phase change layer disposed on a metal liner. A gate dielectric layer is disposed on the phase change layer. A metal gate liner is disposed on the gate dielectric layer.

Abstract: The present disclosure includes apparatuses, methods, and systems for three-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of three possible data states by applying a voltage pulse to the memory cell, determining whether the memory cell snaps back in response to the applied voltage pulse, and applying an additional voltage pulse to the memory cell based on the determination of whether the memory cell snaps back.

Abstract: Memory devices and methods of forming the same are provided. A memory device includes a substrate, a first conductive layer, a phase change layer, a selector layer and a second conductive layer. The first conductive layer is disposed over the substrate. The phase change layer is disposed over the first conductive layer. The selector layer is disposed between the phase change layer and the first conductive layer. The second conductive layer is disposed over the phase change layer. In some embodiments, at least one of the phase change layer and the selector layer has a narrow-middle profile.

Abstract: Examples may include techniques to implement a SET write operation to a selected memory cell include in a memory array. Examples include selecting the memory cell that includes phase change material and applying various currents over various periods of time during a nucleation stage and a crystal growth stage to cause the memory cell to be in a SET logical state.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a word line, a bit line, and a memory cell coupled to and disposed between the word line and the bit line, the memory cell including a variable resistance layer that remains in an amorphous state regardless of a value of data stored in the memory cell. In a reset operation, the memory cell is programmed to a high-resistance amorphous state by applying, to the memory cell, a sub-threshold voltage that is greater than 0.7 time of a threshold voltage of the memory cell and is smaller than 0.95 time of the threshold voltage.

Abstract: Various embodiments of a three-dimensional cross-point (3D X-point) memory cell design include one or more electrodes having an increased resistance compared to existing memory cell designs or compared to other electrodes within a same memory cell. A memory device includes an array of memory cells with each memory cell arranged between a word line and a bit line of the memory device. Some embodiments include additional material layers to increase memory cell resistance. Some embodiments include electrodes having an increased thickness to increase the resistance. Some embodiments include electrodes having a composition with a higher resistivity. Some embodiments include electrodes with increased interface resistance. Some embodiments include a combination of such features. In any case, the resulting increased memory cell resistance causes a reduction in the transient selection current for the given memory cell.

Abstract: A semiconductor storage device includes a first wiring, a second wiring, a memory cell including a first element configured to store data and a second element connected to the first element, the memory cell having a first end connected to the first wiring and a second end connected to the second wiring, and a control circuit configured to apply a voltage that increase with a first slope and then with a second slope that is smaller than the first slope, to the memory cell using the first wiring and the second wiring.

Abstract: Architectures of 3D memory arrays, systems, and methods regarding the same are described. An array may include a substrate arranged with conductive contacts in a geometric pattern and openings through alternative layers of conductive and insulative material that may decrease the spacing between the openings while maintaining a dielectric thickness to sustain the voltage to be applied to the array. After etching material, a sacrificial layer may be deposited in a trench that forms a serpentine shape. Portions of the sacrificial layer may be removed to form openings, into which cell material is deposited. An insulative material may be formed in contact with the sacrificial layer. The conductive pillars extend substantially perpendicular to the planes of the conductive material and the substrate, and couple to conductive contacts. A chalcogenide material may be formed in the recesses partially around the conductive pillars.

Abstract: A switching element includes a lower barrier electrode on a substrate, a switching pattern on the lower barrier electrode, and an upper barrier electrode on the switching pattern. The lower barrier electrode includes a first lower barrier electrode layer, and a second lower barrier electrode layer interposed between the first lower barrier electrode layer and the switching pattern and whose density is different from the density of the first lower barrier electrode.

Abstract: Methods, systems, and devices that support techniques for programming self-selecting memory are described. Received data may include a first group of bits that each have a first logic value and a second group of bits that each have a second logic value. The first and second group of bits may be stored in a first set of memory cells and a second set of memory cells, respectively. A first programming operation for writing the second logic value to both the first and second set of memory cells and verifying whether the second logic value is written to each of the first set of memory cells, the second set of memory cells, or both may be performed. A second programming operation may write the first logic value to either the first set of memory cells or the second set of memory cells based on a result of the verification.

Abstract: An apparatus and method are provided for memory programming, including receiving a first write data unit including a plurality of data bits; programming by at least one pulse the plurality of data bits to the plurality of memory cells; determining if a number of cells successfully programmed by the at least one pulse is less than a threshold; and if the number of cells successfully programmed by the at least one pulse is less than the threshold, compressing a sparse vector of unsuccessfully programmed data bits, receiving another write data unit, concatenating the vector based on the other write data unit, and programming the concatenated vector to another plurality of memory cells.

Abstract: A method for producing a 3D memory device, the method including: providing a first level including a single crystal layer and first alignment marks; forming memory control circuits including first single crystal transistors, where the first single crystal transistors include portions of the single crystal layer; forming at least one second level above the first level; performing a first etch step including etching lithography windows within the at least one second level; performing a first lithographic step over the at least one second level aligned to the first alignment marks; and performing additional processing steps to form a plurality of first memory cells within the at last one second level, where each of the plurality of first memory cells include one of a plurality of second transistors, and where the plurality of second transistors are aligned to the first alignment marks with a less than 40 nm alignment error.

Abstract: Methods, systems, and devices supporting a socket design for a memory device are described. A die may include one or more memory arrays, which each may include any number of word lines and any number of bit lines. The word lines and the bit lines may be oriented in different directions, and memory cells may be located at the intersections of word lines and bit lines. Sockets may couple the word lines and bit lines to associated drivers, and the sockets may be located such that memory cells farther from a corresponding word line socket are nearer a corresponding bit line socket, and vice versa. For example, sockets may be disposed in rows or regions that are parallel to one another, and which may be non-orthogonal to the corresponding word lines and bit lines.

Abstract: The present disclosure relates to a method of programming resistive memory cells of a resistive memory, the method comprising: applying, by a programming circuit based on a first target resistive state, an initial resistance modification to a first cell of the resistive memory to change its resistance from an initial resistive state to a first new resistance; comparing, by the programming circuit, the first new resistance of the first cell with a resistance range of the first target resistive state and with a target resistance range associated with the first target resistive state; and if it is determined that the first new resistance is outside the resistance range of the target resistive state and inside the target resistance range, applying by the programming circuit one or more further resistance modifications to the first cell to increase or decrease its resistance.

Abstract: A method of operating a synapse array includes applying a pulse sequence to a resistor coupled between a row and a column of the synapse array, and in response to the applying the pulse sequence, lowering a conductance level of the resistor. Each pulse of the pulse sequence includes a pulse number, an amplitude, a leading edge, a pulse width, and a trailing edge, the trailing edge having a duration longer than a duration of the leading edge, and applying the pulse sequence includes increasing the pulse number while increasing one of the amplitude, the pulse width, or the trailing edge duration.

Abstract: A memory device includes first conductive lines extending in a first direction, second conductive lines extending in a second direction, and a plurality of memory cells each arranged between the first and second conductive lines and each including a variable resistance memory layer and a switch material pattern. The switch material pattern includes an element injection area arranged in an outer area of the switch material pattern, and an internal area covered by the element injection area. The internal area contains a first content of at least one element from arsenic (As), sulfur (S), selenium (Se), and tellurium (Te), the element injection area contains a second content of the at least one element from As, S, Se, and Te, and the second content has a profile in which a content of the at least one element decreases away from the at least one surface of the switch material pattern.

Abstract: One example provides a memory cell including a node, and a layer stack including a first electrode, a second electrode connected to the node, and a polarizable material layer disposed between the first and second electrodes and having at least two polarization states. A first transistor includes a source, a drain, and a gate terminal, with the gate terminal connected to the node. A selector element includes at least a first terminal and a second terminal, with the second terminal connected to the node.

Abstract: Methods of manufacturing memory devices having memory cells and corresponding selectors, and associated systems and devices, are disclosed herein. In one embodiment, a method of manufacturing a memory device includes (a) removing a protection layer formed over the memory cells and (b) forming a cap layer over the memory cells before forming a conductive via through the memory device. The cap layer is configured to protect the memory cells during operation and can comprise a resistive material. The protection layer can be more efficiently removed with improved process margin and less device health impact using a polishing process before the conductive via is formed, thus increasing the manufacturing margin of the memory device.

Abstract: A current-generator circuit includes an output-current generator circuit having a control branch to be coupled to a control current generator and adapted to provide a control current pulse and a driver electrically coupled between the control branch and the output leg. A compensation circuit includes a first compensation branch configured to generate a compensation current pulse that is a function of the control current pulse and a second compensation branch coupled in a current mirror configuration with the first compensation branch to receive the compensation current pulse. The second compensation branch includes a resistive block having an electrical resistance that is a function of a resistance of an output load. The second compensation branch is electrically coupled to the control branch and the driver is electrically coupled to the control branch and to the output leg.